CN112837870A - Glass sealing mould of round multi-core microwave insulator and implementation method thereof - Google Patents
Glass sealing mould of round multi-core microwave insulator and implementation method thereof Download PDFInfo
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Abstract
The invention discloses a glass sealing mould of a circular multi-core microwave insulator and an implementation method thereof, relates to the technical field of microwave devices, and solves the mould problem of glass sealing of the circular multi-core microwave insulator, and the technical scheme is characterized in that the mould comprises a supporting mould, a main mould and an auxiliary mould which are sequentially arranged, wherein the main mould is provided with a plurality of first mould units, a first circular groove is arranged in each first mould unit, the auxiliary mould is provided with a plurality of second mould units, a second circular groove is arranged in each second mould unit, and the first circular groove corresponds to the second circular groove; the tolerance of the first circular groove and the second circular groove is limited, so that the size precision in sealing the circular multi-core microwave insulator is improved, the assembly efficiency of parts is improved, and the performance index of the circular multi-core microwave insulator is optimized.
Description
Technical Field
The disclosure relates to the technical field of microwave devices, in particular to a glass sealing mold of a circular multi-core microwave insulator and an implementation method thereof.
Background
The glass sealing microwave insulator is applied to aerospace and military component systems with high sealing requirements, and along with the development of microwave components towards high reliability, high density and light weight, the glass sealing microwave insulator is required to have higher integration level, smaller volume and lighter weight, and simultaneously has excellent microwave performance, air tightness and insulating performance; the reduction of the pole pitch from 2.54mm to 1.27mm, 0.635mm or less is the development direction of the multi-core microwave insulator to adapt to the miniaturization trend.
The design, processing and implementation of the glass sealing mold are important guarantees for realizing the miniaturization and excellent performance of the microwave insulator, and the Chinese patent application with the application number of 202011190037.7 discloses a circular device for sealing a multi-core glass microwave insulator, wherein the circular device has higher integration level, smaller volume and lighter weight on the basis of guaranteeing the microwave performance, the air tightness and the insulating performance, so that the glass sealing mold for implementing the circular multi-core microwave insulator and the implementation method thereof are needed.
Disclosure of Invention
The invention provides a glass sealing mold of a round multi-core microwave insulator and an implementation method thereof, and technically aims to implement the glass sealing mold of the round multi-core microwave insulator.
The technical purpose of the present disclosure is achieved by the following technical solutions:
a glass sealing mold of a circular multi-core microwave insulator comprises a supporting mold, a main mold and an auxiliary mold which are sequentially arranged, wherein a plurality of first mold units are arranged on the main mold, first circular grooves are formed in the first mold units, a plurality of second mold units are arranged on the auxiliary mold, second circular grooves are formed in the second mold units, and the first circular grooves correspond to the second circular grooves;
the diameters of the first circular groove and the second circular groove are matched with the diameter of an outer conductor of the circular multi-core microwave insulator, and the matched positive tolerance is 0.01-0.05 mm; the total depth of the first circular groove and the second circular groove is matched with the height of the outer conductor, and the matched negative tolerance is 0.03-0.05 mm;
n pin inserting holes are formed in the first circular groove and the second circular groove and are arranged in 2-4 rows, the total depth of the pin inserting holes of the first circular groove and the pin inserting holes of the second circular groove is matched with the length of an inner conductor of the circular multi-core microwave insulator, and the matched positive tolerance is 0.01-0.02 mm; the diameter of the pin hole is matched with that of the inner conductor, and the matched positive tolerance is 0.01-0.015 mm; the center distance between any adjacent pin holes is not more than 1.27 mm; n ∈ [3,36 ];
the round multi-core microwave insulator comprises an outer conductor, an inner conductor and an insulator, wherein the outer conductor is a metal ring, the insulator is a glass cylinder, N through holes are formed in the glass cylinder and are arranged in 2-4 rows, the center distances between any adjacent through holes are equal, and the center distances are not more than 1.27 mm; the insulator penetrates through the outer conductor and is connected with the outer conductor; the inner conductors are metal pins, penetrate through the insulator from the through holes and are connected with the insulator, and the length of the inner conductors in each row is different; the insulator is connected to both the outer conductor and the inner conductor.
Further, the depth of the first circular groove is 2/3-3/4 of the outer conductor height, and the depth of the corresponding second circular groove is 1/3-1/4 of the outer conductor height.
Furthermore, the inner conductor comprises a bonding end and an inserting end, the bonding end is a single-step stepped ground plane after side grinding, and the inserting end is a round head; the inner conductors are arranged into 2-4 rows according to the through holes, the lengths of the bonding ends of the inner conductors in each row are different, and the inner conductors in each row are sequentially arranged from low to high according to the lengths of the bonding ends.
Furthermore, the depth of the pin inserting holes in the same row in the second circular groove is the same, the depth of the pin inserting holes in different rows is different, and the depth of the pin inserting holes in each row in the second circular groove is arranged from shallow to deep.
The pin inserting holes in the first circular grooves are pin inserting through holes, and the pin inserting holes in the second circular grooves are pin inserting counter bores.
Furthermore, positioning pins are respectively arranged at two ends of the supporting die, and the main die and the auxiliary die are fixed through the positioning pins; the main mold, the secondary mold and the support mold are made of graphite.
Further, the center-to-center distance includes 1.27mm, 0.635 mm.
The method for realizing the glass sealing mold of the round multi-core microwave insulator comprises the following steps:
s1: connecting a support die with a main die through a positioning pin, and further connecting the main die with a die filling tool, wherein the die filling tool is a long cubic cavity and comprises a first bottom plate, first through holes corresponding to the first die units are distributed on the first bottom plate, and the diameter of each first through hole is matched with the diameter of an outer conductor of the round multi-core microwave insulator;
s2: the method comprises the following steps of (1) loading a metal ring outer conductor into a die loading tool cavity, placing a die and the die loading tool on a vibrating table, and loading the metal ring outer conductor into a first die unit of a main die under the action of vibration force;
s3: loading a glass blank into a die loading tool cavity, wherein the glass blank is provided with N through holes and is an insulator of the round multi-core microwave insulator, placing a die and the die loading tool on a vibrating table, and loading the glass blank into a metal ring outer conductor in a first die unit under the action of vibration force; the through holes are arranged in 2-4 rows, N belongs to [3,36], and the center distance of any adjacent through holes is not more than 1.27 mm;
s4: replacing a first bottom plate of a die filling tool with a second bottom plate, wherein second through holes are distributed in the second bottom plate, the second through holes are matched with the inner conductor of the round multi-core microwave insulator in diameter and are distributed at the same positions as the inner conductors of the short contact pins, the inner conductors of the short contact pins are filled in a die filling tool cavity, a die and the die filling tool are placed on a vibrating table, and the inner conductors of the short contact pins are filled in through holes, corresponding to the short contact pins, of a first round groove of a first die unit from the through holes of the glass blank under the action of vibration force;
s5: replacing a second bottom plate of a die filling tool with a third bottom plate, wherein third through holes are distributed in the third bottom plate, the third through holes are matched with the diameter of an inner conductor of the round multi-core microwave insulator and are distributed at the same positions as the inner conductor of the long insertion pin, the inner conductor of the long insertion pin is filled in a die filling tool cavity, a die and the die filling tool are placed on a vibrating table together, and the inner conductor of the long insertion pin is filled in a through hole, corresponding to the long insertion pin, of a first round groove of a first die unit from the through hole of the glass blank under the action of vibration force;
s6: and removing the die filling tool, checking the outer conductor, the insulator, the long contact pin inner conductor and the short contact pin inner conductor in the first die unit, after the missing parts are filled up, buckling the auxiliary die in the downward direction of the contact pin hole of the second die unit, connecting the auxiliary die with the main die and the supporting die through the positioning pin, and enabling the inserting end of the inner conductor to enter the contact pin hole of the second circular groove of the second die unit of the auxiliary die to finish the whole die filling process.
S7: placing the mold in a sintering furnace, completing workpiece pre-thermal oxidation according to process specifications, and performing primary glass sealing;
s8: demoulding the sintered round multi-core microwave insulator, and grinding the surface of the bonding end of the inner conductor of the round multi-core microwave insulator by using a grinding machine until the requirement of gold wire bonding is met;
s9: and (4) re-molding the ground round multi-core microwave insulator, and carrying out secondary glass sealing according to the process specification to eliminate micro-cracks and internal stress of the glass.
The beneficial effect of this disclosure lies in: compared with a glass sealing single-core microwave insulator, the round multi-core microwave insulator not only improves the integration level, but also occupies smaller space, has lighter weight, meets the development requirements of aerospace and military radars on high reliability, high density, miniaturization and light weight, improves the quality of gold wire bonding with an integrated circuit by the inner conductor, simplifies the bonding process, and improves the efficiency. The glass sealing mold of the circular multi-core microwave insulator and the implementation method thereof improve the size precision of the circular multi-core microwave insulator in sealing, improve the assembly efficiency of parts and optimize the performance index of the circular multi-core microwave insulator.
Drawings
FIG. 1 is a schematic structural diagram of a glass sealing mold of a circular multi-core microwave insulator;
FIG. 2 is a schematic structural diagram of a circular multi-core microwave insulator;
FIG. 3 is a schematic structural view of the first and second mold units;
FIG. 4 is a flow chart of a method for implementing a glass sealing mold of a circular multi-core microwave insulator;
FIG. 5 is a schematic view of a die filling tool;
in the figure: 1-main mould; 2-secondary mould; 3-supporting a mould; 4-positioning pins; 5-a first mould unit; 6-a first circular groove; 7-pin through holes; 8-a second mould unit; 9-a second circular groove; 10-inserting pin counter bore; 11-a base plate; 12-a workpiece entrance; 100-an outer conductor; 200-an inner conductor; 300-a through hole; 400-an insulator; 500-a bond terminal; 600-plug end.
Detailed Description
The technical scheme of the disclosure will be described in detail with reference to the accompanying drawings. In the description of the present disclosure, it should be noted that the terms "upper", "lower", "through", "bottom plate", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. The term "inside" and "outside" refer to the inside and the outside of the contour of each member itself.
In addition, unless expressly stated or limited otherwise, the terms "connected" and "attached" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meaning of the above terms in the present invention can be understood in specific cases for those skilled in the art.
The terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, but merely as differentiating between the different components.
Fig. 1 is a schematic structural diagram of a glass sealing mold of a circular multi-core microwave insulator, and fig. 3 is a schematic structural diagram of a first mold unit and a second mold unit; as shown in fig. 1 and 3, the mold comprises a supporting mold 3, a main mold 1 and a secondary mold 2, which are sequentially arranged, wherein a plurality of first mold units 5 are arranged on the main mold 1, first circular grooves 6 are arranged in the first mold units 5, a plurality of second mold units 8 are arranged on the secondary mold 2, second circular grooves 9 are arranged in the second mold units 8, and the first circular grooves 6 correspond to the second circular grooves 9.
Fig. 2 is a schematic structural diagram of a circular multi-core microwave insulator, which includes an outer conductor 100, an inner conductor 200, and an insulator 400, wherein the outer conductor 100 is a metal ring, the insulator 400 is a glass cylinder, N through holes 300 are provided on the glass cylinder, N is [3,36], the through holes 300 are arranged in 2-4 rows, the center distances between any adjacent through holes 300 are equal, and the center distance is not greater than 1.27 mm. The insulator 400 penetrates the outer conductor 100 and is connected to the outer conductor 100. The inner conductors 200 are metal pins, the inner conductors 200 penetrate the insulator 400 from the through holes 300 to be connected with the insulator 400, and the length of each row of the inner conductors 200 is different. Insulator 400 is connected to both outer conductor 100 and inner conductor 200.
As a specific embodiment, the inner conductor 200 includes a bonding end 500 and a plugging end 600, the bonding end 500 is a single-step stepped ground plane after side grinding, and the plugging end 600 is a round head. The inner conductors 200 are arranged in 2-4 rows according to the through holes 300 on the outer conductor 100, the lengths of the bonding ends 500 of the inner conductors 200 in each row are different, and the inner conductors 200 in each row are arranged in sequence from low to high according to the lengths of the bonding ends 500.
The diameters of the first circular groove 6 and the second circular groove 9 are matched with the diameter of the outer conductor 100 of the circular multi-core microwave insulator, and the positive tolerance of the matching is 0.01-0.05 mm, so that the mold loading and the mold unloading are facilitated. The total depth of the first circular groove 6 and the second circular groove 9 is matched with the height of the outer conductor 100, and the matched negative tolerance is 0.03-0.05 mm, so that parts are fixed in the glass sealing process. Specifically, the depth of the first circular groove 6 is 2/3-3/4 of the height of the outer conductor 100, and the depth of the corresponding second circular groove 9 is 1/3-1/4 of the height of the outer conductor 100; for example, when the depth of the first circular groove 6 is 2/3 the height of the outer conductor 100, the depth of the second circular groove 9 is 1/3 the height of the outer conductor 100; when the depth of the first circular groove 6 is 3/4 the height of the outer conductor 100, the depth of the second circular groove 9 is 1/4 the height of the outer conductor 100.
All be equipped with N contact pin hole in first circular recess 6 and the second circular recess 9, the contact pin hole is arranged into 2 ~ 4 rows, and arbitrary adjacent centre-to-centre spacing between the contact pin hole is not more than 1.27 mm. The total depth of the pin hole of the first circular groove 6 and the pin hole of the second circular groove 9 is matched with the length of the inner conductor 200 of the circular multi-core microwave insulator, and the positive tolerance of the matching is 0.01-0.02 mm, so that the pins are limited from moving up and down in the glass sealing process. The diameter of plug pin hole and the diameter looks adaptation of inner conductor 200, the positive tolerance of adaptation is 0.01 ~ 0.015mm to control the concentricity and the straightness that hangs down of product inner conductor 200, the die filling of being convenient for simultaneously and the drawing of patterns.
In a specific embodiment, the depth of the pin holes in the same row in the second circular groove 9 is the same, the depth of the pin holes in different rows is different, and the depth of the pin holes in each row in the second circular groove 9 is arranged from shallow to deep. In addition, the pin hole in the first circular groove 6 is a pin through hole 7, and the pin hole in the second circular groove 9 is a pin counter bore 10, as shown in fig. 3.
As a specific embodiment, the center distance between the adjacent through holes 300 and the center distance between the adjacent pin holes on the outer conductor 100 may be 1.27mm, 0.635mm, or less.
Fig. 4 is a flowchart of a method for implementing a glass sealing mold for a circular multi-core microwave insulator, which specifically includes:
s1: connecting a support die with a main die through a positioning pin, and further connecting the main die with a die filling tool, wherein the die filling tool is a long cubic cavity and comprises a first bottom plate, first through holes corresponding to the first die units are distributed on the first bottom plate, and the diameter of each first through hole is matched with the diameter of an outer conductor of the round multi-core microwave insulator;
s1: the method comprises the following steps that a supporting die is connected with a main die through a positioning pin, the supporting die is connected with a die filling tool, the die filling tool is a long cubic cavity, the die filling tool comprises a first bottom plate, first through holes corresponding to first die units are distributed on the first bottom plate, and the diameter of each first through hole is matched with the diameter of an outer conductor of the round multi-core microwave insulator.
S2: and (3) loading the metal ring outer conductor into the die loading tool cavity, placing the die and the die loading tool on a vibrating table, and loading the metal ring outer conductor into a first die unit of the main die under the action of vibration force.
S3: loading a glass blank into a die loading tool cavity, wherein the glass blank is provided with N through holes and is an insulator of the round multi-core microwave insulator, placing a die and the die loading tool on a vibrating table, and loading the glass blank into a metal ring outer conductor in a first die unit under the action of vibration force; that is, the insulator is embedded in the outer conductor so that the insulator penetrates the outer conductor to be connected to the outer conductor. The through holes are arranged in 2-4 rows, N belongs to [3,36], and the center distance of any adjacent through holes is not more than 1.27 mm.
S4: replacing a first bottom plate of a die filling tool with a second bottom plate, wherein second through holes are distributed in the second bottom plate, the second through holes are matched with the inner conductor of the round multi-core microwave insulator in diameter and are distributed at the same positions as the inner conductors of the short contact pins, the inner conductors of the short contact pins are filled in a die filling tool cavity, a die and the die filling tool are placed on a vibrating table, and the inner conductors of the short contact pins are filled in through holes, corresponding to the short contact pins, of a first round groove of a first die unit from the through holes of the glass blank under the action of vibration force;
s5: replacing a second bottom plate of a die filling tool with a third bottom plate, wherein third through holes are distributed in the third bottom plate, the third through holes are matched with the diameter of an inner conductor of the round multi-core microwave insulator and are distributed at the same positions as the inner conductor of the long insertion pin, the inner conductor of the long insertion pin is filled in a die filling tool cavity, a die and the die filling tool are placed on a vibrating table together, and the inner conductor of the long insertion pin is filled in a through hole, corresponding to the long insertion pin, of a first round groove of a first die unit from the through hole of the glass blank under the action of vibration force;
s6: and removing the die filling tool, checking the outer conductor, the insulator, the long contact pin inner conductor and the short contact pin inner conductor in the first die unit, after the missing parts are filled up, buckling the auxiliary die in the downward direction of the contact pin hole of the second die unit, connecting the auxiliary die with the main die and the supporting die through the positioning pin, and enabling the inserting end of the inner conductor to enter the contact pin hole of the second circular groove of the second die unit of the auxiliary die to finish the whole die filling process.
The short pin inner conductor and the long pin inner conductor respectively represent inner conductors with different lengths, and the lengths of the inner conductors are different due to the difference of the lengths of the bonding ends. The inner conductor is connected to the outer conductor through a through hole of the glass gob (insulator) and is insulated from the outer conductor.
S7: and placing the die in a sintering furnace, completing workpiece pre-thermal oxidation according to the process specification, and carrying out primary glass sealing.
S8: and (3) demolding the sintered round multi-core microwave insulator, and grinding the surface of the bonding end of the inner conductor of the round multi-core microwave insulator by using a grinding machine until the requirement of gold wire bonding is met.
S9: and (4) re-molding the ground round multi-core microwave insulator, and carrying out secondary glass sealing according to the process specification to eliminate micro-cracks and internal stress of the glass.
Fig. 5 is a schematic diagram of a die filling tool, which is a long cubic cavity, and a bottom plate 11 of the die filling tool is replaced as required, and different workpieces are filled from a workpiece inlet 12 to complete die filling.
The foregoing is an exemplary embodiment of the present disclosure, and the scope of the present disclosure is defined by the claims and their equivalents.
Claims (7)
1. A glass sealing mold of a circular multi-core microwave insulator is characterized by comprising a supporting mold, a main mold and an auxiliary mold which are sequentially arranged, wherein a plurality of first mold units are arranged on the main mold, first circular grooves are formed in the first mold units, a plurality of second mold units are arranged on the auxiliary mold, second circular grooves are formed in the second mold units, and the first circular grooves correspond to the second circular grooves;
the diameters of the first circular groove and the second circular groove are matched with the diameter of an outer conductor of the circular multi-core microwave insulator, and the matched positive tolerance is 0.01-0.05 mm; the total depth of the first circular groove and the second circular groove is matched with the height of the outer conductor, and the matched negative tolerance is 0.03-0.05 mm;
n pin inserting holes are formed in the first circular groove and the second circular groove and are arranged in 2-4 rows, the total depth of the pin inserting holes of the first circular groove and the pin inserting holes of the second circular groove is matched with the length of an inner conductor of the circular multi-core microwave insulator, and the matched positive tolerance is 0.01-0.02 mm; the diameter of the pin hole is matched with that of the inner conductor, and the matched positive tolerance is 0.01-0.015 mm; the center distance between any adjacent pin holes is not more than 1.27 mm; n ∈ [3,36 ];
the round multi-core microwave insulator comprises an outer conductor, an inner conductor and an insulator, wherein the outer conductor is a metal ring, the insulator is a glass cylinder, N through holes are formed in the glass cylinder and are arranged in 2-4 rows, the center distances between any adjacent through holes are equal, and the center distances are not more than 1.27 mm; the insulator penetrates through the outer conductor and is connected with the outer conductor; the inner conductors are metal pins, penetrate through the insulator from the through holes and are connected with the insulator, and the length of the inner conductors in each row is different; the insulator is connected to both the outer conductor and the inner conductor.
2. The glass sealing mold for a circular multi-core microwave insulator according to claim 1, wherein the depth of the first circular groove is 2/3-3/4 of the height of the outer conductor, and the depth of the corresponding second circular groove is 1/3-1/4 of the height of the outer conductor.
3. The glass sealing mold for a circular multi-core microwave insulator according to claim 1, wherein the inner conductor comprises a bonding end and a plugging end, the bonding end is a single-step ground plane after side grinding, and the plugging end is a round head; the inner conductors are arranged into 2-4 rows according to the through holes, the lengths of the bonding ends of the inner conductors in each row are different, and the inner conductors in each row are sequentially arranged from low to high according to the lengths of the bonding ends.
4. The glass sealing mold for a circular multi-core microwave insulator according to claim 3, wherein the depth of the pin insertion holes in the same row in the second circular groove is the same, the depth of the pin insertion holes in different rows is different, and the depth of the pin insertion holes in each row in the second circular groove is arranged from shallow to deep.
The pin inserting holes in the first circular grooves are pin inserting through holes, and the pin inserting holes in the second circular grooves are pin inserting counter bores.
5. The glass sealing mold for a circular multi-core microwave insulator according to claim 1, wherein positioning pins are respectively provided at both ends of the supporting mold, and the main mold and the sub-mold are fixed by the positioning pins; the main mold, the secondary mold and the support mold are made of graphite.
6. The glass sealing mold for circular multi-core microwave insulators as claimed in claim 1, wherein the center-to-center distance comprises 1.27mm and 0.635 mm.
7. The method for implementing a glass sealing mold for a circular multi-core microwave insulator according to any one of claims 1 to 6, comprising:
s1: connecting a support die with a main die through a positioning pin, and further connecting the main die with a die filling tool, wherein the die filling tool is a long cubic cavity and comprises a first bottom plate, first through holes corresponding to the first die units are distributed on the first bottom plate, and the diameter of each first through hole is matched with the diameter of an outer conductor of the round multi-core microwave insulator;
s2: the method comprises the following steps of (1) loading a metal ring outer conductor into a die loading tool cavity, placing a die and the die loading tool on a vibrating table, and loading the metal ring outer conductor into a first die unit of a main die under the action of vibration force;
s3: loading a glass blank into a die loading tool cavity, wherein the glass blank is provided with N through holes and is an insulator of the round multi-core microwave insulator, placing a die and the die loading tool on a vibrating table, and loading the glass blank into a metal ring outer conductor in a first die unit under the action of vibration force; the through holes are arranged in 2-4 rows, N belongs to [3,36], and the center distance of any adjacent through holes is not more than 1.27 mm;
s4: replacing a first bottom plate of a die filling tool with a second bottom plate, wherein second through holes are distributed in the second bottom plate, the second through holes are matched with the inner conductor of the round multi-core microwave insulator in diameter and are distributed at the same positions as the inner conductors of the short contact pins, the inner conductors of the short contact pins are filled in a die filling tool cavity, a die and the die filling tool are placed on a vibrating table, and the inner conductors of the short contact pins are filled in through holes, corresponding to the short contact pins, of a first round groove of a first die unit from the through holes of the glass blank under the action of vibration force;
s5: replacing a second bottom plate of a die filling tool with a third bottom plate, wherein third through holes are distributed in the third bottom plate, the third through holes are matched with the diameter of an inner conductor of the round multi-core microwave insulator and are distributed at the same positions as the inner conductor of the long insertion pin, the inner conductor of the long insertion pin is filled in a die filling tool cavity, a die and the die filling tool are placed on a vibrating table together, and the inner conductor of the long insertion pin is filled in a through hole, corresponding to the long insertion pin, of a first round groove of a first die unit from the through hole of the glass blank under the action of vibration force;
s6: and removing the die filling tool, checking the outer conductor, the insulator, the long contact pin inner conductor and the short contact pin inner conductor in the first die unit, after the missing parts are filled up, buckling the auxiliary die in the downward direction of the contact pin hole of the second die unit, connecting the auxiliary die with the main die and the supporting die through the positioning pin, and enabling the inserting end of the inner conductor to enter the contact pin hole of the second circular groove of the second die unit of the auxiliary die to finish the whole die filling process.
S7: placing the mold in a sintering furnace, completing workpiece pre-thermal oxidation according to process specifications, and performing primary glass sealing;
s8: demoulding the sintered round multi-core microwave insulator, and grinding the surface of the bonding end of the inner conductor of the round multi-core microwave insulator by using a grinding machine until the requirement of gold wire bonding is met;
s9: and (4) re-molding the ground round multi-core microwave insulator, and carrying out secondary glass sealing according to the process specification to eliminate micro-cracks and internal stress of the glass.
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| CN202011609159.5A CN112837870B (en) | 2020-12-30 | 2020-12-30 | Glass sealing mould of round multi-core microwave insulator and implementation method thereof |
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| CN202011609159.5A CN112837870B (en) | 2020-12-30 | 2020-12-30 | Glass sealing mould of round multi-core microwave insulator and implementation method thereof |
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| JP2008270608A (en) * | 2007-04-23 | 2008-11-06 | Asahi-Seiki Mfg Co Ltd | Hermetic sealing ring and manufacturing method thereof |
| CN103985995A (en) * | 2014-05-29 | 2014-08-13 | 泰州市航宇电器有限公司 | Ultra-small connector for bonding of gold wires |
| JP2016178034A (en) * | 2015-03-20 | 2016-10-06 | 株式会社フジ電科 | Method for manufacturing airtight terminal |
| CN104986946A (en) * | 2015-06-17 | 2015-10-21 | 贵州天义电器有限责任公司 | Base plate component glass sintering composite mold |
| CN205621916U (en) * | 2016-04-13 | 2016-10-05 | 四川斯艾普电子科技有限公司 | Radio frequency list core glass insulator connector |
| CN205595595U (en) * | 2016-04-25 | 2016-09-21 | 泰州市航宇电器有限公司 | Rapid Assembly device of radio frequency terminal |
| CN208903760U (en) * | 2018-11-07 | 2019-05-24 | 中江立江电子有限公司 | A kind of insulator green body splendid attire mold |
| CN109510049A (en) * | 2018-12-21 | 2019-03-22 | 西安赛尔电子材料科技有限公司 | A kind of mold and its process for sealing with glass-to-metal seal coaxial radio-frequency connector |
| CN210490062U (en) * | 2019-11-25 | 2020-05-08 | 常熟市建苑电子元件有限公司 | Mould is used in sintering of single core connector of radio frequency |
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| CN112837870B (en) | 2022-11-01 |
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