CN111009793B - Miniature conducting ring assembly and preparation method thereof - Google Patents
Miniature conducting ring assembly and preparation method thereof Download PDFInfo
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- CN111009793B CN111009793B CN201911255263.6A CN201911255263A CN111009793B CN 111009793 B CN111009793 B CN 111009793B CN 201911255263 A CN201911255263 A CN 201911255263A CN 111009793 B CN111009793 B CN 111009793B
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- conducting ring
- miniature
- conducting
- conductive ring
- lead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R39/00—Rotary current collectors, distributors or interrupters
- H01R39/02—Details for dynamo electric machines
- H01R39/08—Slip-rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R39/00—Rotary current collectors, distributors or interrupters
- H01R39/02—Details for dynamo electric machines
- H01R39/34—Connections of conductor to slip-ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/10—Manufacture of slip-rings
Abstract
The invention relates to a miniature conducting ring assembly, the ten-ring length of the miniature conducting ring assembly is not more than 15mm, the outer diameter is not more than 3mm, the miniature conducting ring assembly comprises a conducting ring body, a lead-out wire, an insulating material and a mounting tail shaft, the material of the conducting ring body is 35-5 gold-silver-copper alloy, the lead-out wire is an enameled wire, and the insulating material is glass fiber reinforced polyformaldehyde; the invention also relates to an injection molding process of the forming mold of the miniature conducting ring component and an accurate machining process of the lathe contour dimension. The miniature conducting ring assembly has the characteristic of small volume, is suitable for various miniature precise instruments, is formed by selecting new materials and new processes, improves the manufacturing efficiency and the qualification rate, and has strong practicability.
Description
Technical Field
The invention relates to the field of electrical manufacturing, in particular to a miniature conducting ring assembly and a preparation method thereof.
Background
The conducting rings are also called collector rings, slip rings, collector rings, etc. It can be used in any base point system requiring continuous rotation while requiring power and signals to be transmitted from a fixed location to a rotating location. The conducting ring can improve the system performance, simplify the system structure and avoid the sprain of the lead in the rotating process.
The common conductive ring size in present market is bigger than normal, can't install and use on a lot of exquisite equipment, precision instruments, and traditional epoxy vacuum pouring technology is because the technology is complicated, difficult operation, and epoxy intensity is lower, and is breakable, and bubble scheduling problem appears easily in the pouring process for conductive ring shaping efficiency is very low, and the qualification rate is also very low, leads to the fact the too high problem of manufacturing cost from this.
Disclosure of Invention
The invention aims to provide a novel forming process of a miniature conducting ring assembly and a novel material selection. The miniature conducting ring assembly has the characteristic of small volume, is suitable for a system with small volume, has simple new process, improves the manufacturing efficiency and the qualification rate, and has strong practicability and wider application field.
In order to achieve the above purpose, the invention provides the following technical scheme
The utility model provides a miniature conducting ring subassembly, its characterized in that, this miniature conducting ring subassembly ten ring length is no longer than 15mm, and the external diameter is no longer than 3mm, and this miniature conducting ring subassembly is including conductive ring body, lead out wire, insulating material and installation tail-shaft, a plurality of the coaxial setting that stacks of conductive ring body, the bottom cover is established installation tail-shaft on, all be equipped with one on every conductive ring body and draw out the wire, draw out the wire and pass the conductive ring body of lower part to draw forth from installation tail-shaft center, be insulating material between the conductive ring body, the material of conductive ring body be 35-5 gold-silver-copper alloy, the lead out wire be the enameled wire, insulating material be glass fiber reinforcing polyformaldehyde.
In the miniature conducting ring assembly, the weight ratio of glass fibers to polyformaldehyde in the glass fiber reinforced formaldehyde is 1.
In the miniature conducting ring assembly, in the conducting ring assembly, the outer diameter of the conducting ring body of the rings in the position rows 2-4 is 2mm, the outer diameter of the conducting ring body of the rings in the position rows 5-10 is 2.5mm, and the axial width of the conducting ring body is 0.6-0.8mm.
In the miniature conducting ring assembly, the ring spacing of the conducting ring body is 0.2-0.4mm, the insulation resistance between the conducting ring body and the conducting ring body is more than 100 megaohms, the circuit is 1A, and the voltage resistance between the rings is 250V.
In the miniature conducting ring assembly, the lead-out lead of the conducting ring body is a copper enameled wire, and the calculated sectional area of the enameled wire is 0.049m 2 。
A preparation method of a miniature conducting ring assembly is characterized in that the length of a decaring of the miniature conducting ring assembly is not more than 15mm, and the outer diameter of the miniature conducting ring assembly is not more than 3mm, and the preparation method comprises the following steps:
firstly, processing the used conductive ring material into a conductive ring shape by using a lathe, and finishing a ring and other conductive ring bodies according to the design size;
secondly, connecting each conductive ring body to be formed with a respective lead-out wire in a laser welding mode;
thirdly, coaxially stacking the N conductive ring bodies on the mounting tail shaft to form a bar, wherein a leading-out wire penetrates through one ring, and finally penetrates through the mounting tail shaft from the Nth conductive ring body to extend out;
fourthly, putting the stacked bars and the lead-out wires into a forming die together, and manufacturing by using an injection molding process of the forming die;
fifthly, injecting the prepared insulating material into a forming die at high pressure, vacuumizing to avoid bubbles inside, and finishing primary forming;
and sixthly, after the preliminary forming, machining the formed conducting ring again by using a lathe, cutting off the allowance size, and machining the conducting ring into a preset accurate size to finish the manufacturing of the conducting ring assembly.
According to the above method for manufacturing a miniature conducting ring assembly, the processing of the conducting ring material in the first step is primary processing:
(1) Firstly, processing a solid bar stock into a bar stock with a determined diameter, reserving a processing allowance on the outer diameter of the bar stock, and then cutting the bar stock into flat cylinders with certain thickness;
(2) Then, drilling a through hole on each flat cylinder along the axial lead;
(3) And then a circular groove is processed from one end along the through hole, and the inner diameter of the circular groove is equal to the outer diameter of the subsequently finished conductive ring body.
According to the preparation method of the miniature conducting ring assembly, when the conducting ring bodies are stacked into the bar in the third step, the circular grooves of the adjacent conducting ring bodies are placed in the same direction, so that one circular groove is formed between every two adjacent conducting ring bodies.
According to the preparation method of the miniature conducting ring assembly, in the sixth step, the conducting ring is machined again after being formed, the machining allowance of the conducting ring is cut off, so that the outer diameter of the formed conducting ring is equal to the inner diameter of the original circular groove, and the insulating material injected between the adjacent conducting ring bodies forms the insulating layer positioned between the conducting ring bodies due to the existence of the circular grooves.
Based on the technical scheme, the miniature conducting ring and the preparation method thereof have the following technical advantages:
1. the conducting ring material of the miniature conducting ring in the invention is selected from 35-5 gold-silver-copper alloy, the conducting ring leading-out conductor material is selected from enameled wires, the insulating and ring structure material is selected from glass fiber reinforced polyformaldehyde, and the ratio of the glass fiber to the polyformaldehyde is 1:4.
2. the manufacturing method of the miniature conducting ring adopts a new molding process as a special mold injection molding process, and improves the production efficiency and the qualified rate.
3. The manufacturing method of the miniature conducting ring adopts a twice processing method for conducting ring materials, the processing allowance is ensured by using a primary processing method, the space of the insulating layer is determined by using the circular groove, and the secondary processing is carried out after the insulating material is filled, so that the conducting ring assembly with the determined insulating layer and the accurate overall dimension is formed.
Drawings
Fig. 1 is a schematic structural assembly diagram of a micro conducting ring assembly according to the present invention.
Fig. 2 is a schematic diagram of a conductor ring body after primary processing in a method for manufacturing a micro conducting ring assembly according to the present invention.
Fig. 3 is a schematic diagram of a conductor ring body after being reprocessed in a method for manufacturing a micro conducting ring assembly according to the present invention.
Detailed Description
The following detailed description of the invented miniature conductive ring assembly and its manufacturing process will be made with reference to the accompanying drawings and specific embodiments for better understanding of its structural composition and production method, but not to limit the scope of the invention.
Referring to fig. 1, fig. 1 is a schematic structural assembly diagram of a micro conducting ring assembly. The length of the decaring of the miniature conducting ring assembly is not more than 15mm, the outer diameter of the miniature conducting ring assembly is not more than 3mm, and the miniature conducting ring assembly has the characteristic of small size and is suitable for systems with smaller size, in particular to various miniature precision instruments. In the figure, the miniature conducting ring assembly comprises conducting ring bodies 1, leading-out wires 2, insulating materials 3 and an installation tail shaft 4, the conducting ring bodies 1 are coaxially stacked, the bottom of the miniature conducting ring assembly is sleeved on the installation tail shaft 4, each conducting ring body 1 is provided with one leading-out wire 2, the leading-out wires 2 penetrate through the conducting ring bodies 1 on the lower portion and are led out from the center of the installation tail shaft 4, the insulating materials are arranged among the conducting ring bodies 1, the conducting ring bodies 1 are made of 35-5 gold-silver-copper alloy, the leading-out wires 2 are enameled wires, and the insulating materials 3 are glass fiber reinforced polyformaldehyde.
In one embodiment of the miniature conducting ring assembly, the weight ratio of the glass fiber to the polyformaldehyde in the glass fiber reinforced formaldehyde is 1. The defects of low strength and frangibility of the traditional epoxy resin are avoided, and the defect of easy bubble occurrence is also reduced.
In one embodiment of the miniature conducting ring assembly, the outer diameter of the conducting ring body of the 2-4 rings in the array is 2mm, the outer diameter of the conducting ring body of the 5-10 rings in the array is 2.5mm, and the axial width of the conducting ring body is 0.6-0.8mm. The distance between the rings of the conductive ring body is 0.2-0.4mm, the insulation resistance between the conductive ring body and the conductive ring body is more than 100 megaohms, the circuit is 1A, and the voltage resistance between the rings is 250V. The lead-out wire of the conductive ring body is a copper enameled wire with the calculated sectional area of 0.049m 2 。
The invention also relates to a preparation method of the miniature conducting ring assembly, the length of a ten ring of the miniature conducting ring assembly is not more than 15mm, the outer diameter of the miniature conducting ring assembly is not more than 3mm, and the preparation method comprises the following steps:
firstly, processing the used conducting ring material into a conducting ring shape for the first time by using a lathe, and finishing a ring and other conducting ring bodies according to the design size;
secondly, connecting each conductive ring body to be formed with a respective lead-out wire in a laser welding mode;
thirdly, coaxially stacking the N conductive ring bodies on the mounting tail shaft to form a bar, wherein the leading-out wire penetrates through a ring, and finally penetrates through the mounting tail shaft from the Nth conductive ring body to extend out;
fourthly, the stacked bar stock and the lead-out wire are placed into a forming die together and manufactured by the injection molding process of the forming die;
fifthly, injecting the prepared insulating material into a forming die at high pressure, and then vacuumizing to avoid bubbles inside, thereby completing primary forming;
and sixthly, after the preliminary forming, machining the formed conducting ring again by using a lathe, cutting off the allowance size, and machining the conducting ring into a preset accurate size to finish the manufacturing of the conducting ring assembly.
As shown in fig. 2, in the first step, the processing of the conductive loop material is a primary processing:
(1) Firstly, processing a solid bar stock into a bar stock with the diameter of 3.5mm, reserving a processing allowance on the outer diameter of the bar stock, and then cutting the bar stock into flat cylinders with the thickness of 1.2 mm;
(2) Then, drilling a through hole on each flat cylinder along the axial lead, wherein the diameter of each through hole is 1.5mm;
(3) And processing a circular groove along the through hole from one end, wherein the inner diameter of the circular groove is 2.5mm, the depth of the circular groove is 0.4mm, and the inner diameter of the circular groove is equal to the outer diameter of the subsequent conductive ring body after the second completion.
According to the preparation method of the miniature conductive ring assembly, when the conductive ring bodies are stacked into a bar in the third step, the circular grooves of the adjacent conductive ring bodies are arranged in the same direction, so that a circular groove is formed between each two adjacent conductive ring bodies. Thus, the insulating layers are arranged between the adjacent conductive ring bodies after final forming.
As shown in fig. 3, according to the above method for manufacturing a micro conducting ring assembly, in the sixth step, the conducting ring is machined again after being formed, and the machining allowance of the conducting ring is cut off, so that the outer diameter of the formed conducting ring is equal to the inner diameter of the original circular groove, that is, the diameter is 2.5mm, and due to the existence of the circular groove between adjacent conducting ring bodies, the injected insulating material forms an insulating layer located between the conducting ring bodies, and the thickness of the insulating layer is 0.4mm, which is the depth of the circular groove.
The manufacturing method of the miniature conducting ring adopts a twice processing method for conducting ring materials, the processing allowance is ensured by using a primary processing method, the space of the insulating layer is determined by using the circular groove, and the secondary processing is carried out after the insulating material is filled, so that the conducting ring assembly with the determined insulating layer and the accurate overall dimension is formed. The manufacturing method successfully manufactures the miniature conducting ring, uses novel materials and a novel forming process, and improves the production efficiency and the qualification rate.
Claims (5)
1. A preparation method of a miniature conductive ring assembly is characterized in that the length of a decaring of the miniature conductive ring assembly is not more than 15mm, the outer diameter of the decaring is not more than 3mm, the miniature conductive ring assembly comprises conductive ring bodies, lead-out wires, insulating materials and an installation tail shaft, a plurality of conductive ring bodies are coaxially stacked, the bottom of each conductive ring body is sleeved on the installation tail shaft, each conductive ring body is provided with one lead-out wire, the lead-out wires penetrate through the conductive ring bodies on the lower portion and are led out from the center of the installation tail shaft, the conductive ring bodies are made of 35-5 gold-silver-copper alloys, the lead-out wires are enameled wires, and the insulating materials are glass fiber reinforced polyformaldehyde, and the preparation method comprises the following steps:
firstly, processing the used conductive ring material into a conductive ring shape by using a lathe: (1) Firstly, processing a solid bar stock into a bar stock with a determined diameter, reserving a processing allowance for the outer diameter of the bar stock, and then cutting the bar stock into flat cylinders with a certain thickness; (2) Then, drilling a through hole on each flat cylinder along the axial lead; (3) Then a circular groove is processed from one end along the through hole, and the inner diameter of the circular groove is equal to the outer diameter of the subsequently finished conductive ring body; completing a ring and other conductive ring bodies according to the design size;
secondly, connecting each conductive ring body to be formed with a respective lead-out wire in a laser welding mode;
thirdly, coaxially stacking N conductive ring bodies on the mounting tail shaft to form a bar, wherein the circular grooves of the adjacent conductive ring bodies are arranged in the same direction, so that a circular groove is formed between every two adjacent conductive ring bodies, a lead wire penetrates through one ring, and finally the lead wire penetrates through the mounting tail shaft from the Nth conductive ring body to extend out;
fourthly, the stacked bar stock and the lead-out wire are placed into a forming die together and manufactured by the injection molding process of the forming die;
fifthly, injecting the prepared insulating material into a forming die at high pressure, vacuumizing to avoid bubbles inside, and finishing primary forming;
sixthly, after preliminary forming, the formed conducting ring is machined again by a lathe, the machining allowance of the conducting ring is cut off, the outer diameter of the formed conducting ring is equal to the inner diameter of the original circular groove, the adjacent conducting ring bodies are cut off by the aid of the circular groove, the injected insulating material forms an insulating layer located between the conducting ring bodies to cut off allowance size, the insulating layer is machined to be a preset accurate size, and manufacturing of the conducting ring assembly is completed.
2. The method for preparing a miniature conducting ring assembly as set forth in claim 1, wherein the weight ratio of glass fiber to polyoxymethylene in said glass fiber reinforced polyoxymethylene is 1.
3. The method for manufacturing a conducting micro ring assembly according to claim 1, wherein in the conducting ring assembly, the conducting ring body of the ring at position 2-4 has an outer diameter of 2mm, the conducting ring body of the ring at position 5-10 has an outer diameter of 2.5mm, and the conducting ring body has an axial width of 0.6-0.8mm.
4. The method for manufacturing a miniature conducting ring assembly as claimed in claim 1, wherein the distance between the conducting rings is 0.2-0.4mm, the insulation resistance between the conducting rings is more than 100 megaohms, the circuit is 1A, and the voltage resistance between the conducting rings is 250V.
5. The method for manufacturing a miniature conducting ring assembly as set forth in claim 1, wherein said enameled wire of conducting ring body having a lead wire has a calculated cross-sectional area of 0.049m 2 。
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911255263.6A CN111009793B (en) | 2019-12-10 | 2019-12-10 | Miniature conducting ring assembly and preparation method thereof |
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| CN201911255263.6A CN111009793B (en) | 2019-12-10 | 2019-12-10 | Miniature conducting ring assembly and preparation method thereof |
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| CN111009793A CN111009793A (en) | 2020-04-14 |
| CN111009793B true CN111009793B (en) | 2023-01-13 |
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| CN113752466B (en) * | 2021-09-18 | 2023-08-01 | 徐洪杰 | Injection molding process for middle shaft of conductive slip ring |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1926219A1 (en) * | 1969-05-22 | 1970-11-26 | Teldix Gmbh | Moulded slip ring assembly |
| CN109863652A (en) * | 2016-10-25 | 2019-06-07 | 史莱福灵有限公司 | Slip ring modules |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0785941A (en) * | 1993-09-10 | 1995-03-31 | Tanaka Kikinzoku Kogyo Kk | Manufacture of slip ring assembly |
| CN1178339C (en) * | 2002-05-30 | 2004-12-01 | 武汉华之洋光电系统有限责任公司 | Durable rotary electric contactor |
| CN1614830A (en) * | 2004-12-07 | 2005-05-11 | 刘磊 | Laminated conductive rotary slip ring and producing process |
| CN100492785C (en) * | 2007-04-29 | 2009-05-27 | 北京航天控制仪器研究所 | Radial insulation laminated conductive slip ring |
| JP5999936B2 (en) * | 2012-03-14 | 2016-09-28 | アイチエレック株式会社 | Insulating sheet manufacturing method and insulating sheet manufacturing apparatus |
| US9039423B2 (en) * | 2012-11-01 | 2015-05-26 | Hypertronics Corporation | Rotary electrical interconnect device |
| CN206422356U (en) * | 2016-12-23 | 2017-08-18 | 沈阳航天新乐有限责任公司 | Miniature high reliability conducting ring special purpose device |
| CN108373582A (en) * | 2018-02-24 | 2018-08-07 | 张洁琦 | A kind of conductive slip ring body cast glue and a kind of conductive slip ring body and its pouring procedure |
| CN110416852A (en) * | 2019-08-05 | 2019-11-05 | 东莞市马驰科精密制品有限公司 | Conductive shaft |
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2019
- 2019-12-10 CN CN201911255263.6A patent/CN111009793B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1926219A1 (en) * | 1969-05-22 | 1970-11-26 | Teldix Gmbh | Moulded slip ring assembly |
| CN109863652A (en) * | 2016-10-25 | 2019-06-07 | 史莱福灵有限公司 | Slip ring modules |
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