JPH0785941A - Manufacture of slip ring assembly - Google Patents

Manufacture of slip ring assembly

Info

Publication number
JPH0785941A
JPH0785941A JP24983593A JP24983593A JPH0785941A JP H0785941 A JPH0785941 A JP H0785941A JP 24983593 A JP24983593 A JP 24983593A JP 24983593 A JP24983593 A JP 24983593A JP H0785941 A JPH0785941 A JP H0785941A
Authority
JP
Japan
Prior art keywords
slip ring
epoxy resin
die
ring assembly
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24983593A
Other languages
Japanese (ja)
Inventor
Hiromutsu Satou
啓六 佐藤
Mitsuyoshi Sayama
光義 佐山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP24983593A priority Critical patent/JPH0785941A/en
Publication of JPH0785941A publication Critical patent/JPH0785941A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To manufacture a slip ring assembly with easy operation of injecting and finishing, by forming each slip ring element from a conducting material to whose inside surface of a lead welded, laminating such slip ring elements insulation rings made of epoxy resin alternately in a die in a cylindrical form, injecting epoxy resin into the laminate, and subjecting to a finishing process. CONSTITUTION:Slip ring elements 12 made of conductive material and insulation rings 13 of epoxy resin are alternately inserted in laminate in a die 10 in the form of a cylinder having the same inside diameter, for example 5.0mm, over the whole length, and into this laminate, epoxy resin is injected. This does not require inclusion molding of insulation rings 13, but merely a shaping process of a supporting shaft 14, so that injection of the epoxy resin can be done easily, and further because the outer surface of the molding is equipped with less surface unevenness, the finish trimming with machining and polishing do not require much labor. The die 10 used therein has no ring groove internally to allow use of a simple structure in the form of a cylinder having the same inside diameter over the whole length, which should suppress the cost for dies.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、回転体ジャイロを利用
した各種機器に用いるスリップリングアセンブリの製造
方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a slip ring assembly used in various devices using a rotary gyro.

【0002】[0002]

【従来の技術】回転体ジャイロを利用した各種機器に用
いるスリップリングアセンブリは、円筒周囲を摺動する
縦型スリップリングアセンブリである。縦型スリップリ
ングアセンブリは、導電材よりなるスリップリングと絶
縁材とが交互に積層状態となっているものが多い。この
スリップリングアセンブリを製造するには、個数が少な
い場合は組立式、個数が多い場合はモールド式が採用さ
れる。
2. Description of the Related Art A slip ring assembly used in various devices utilizing a rotary gyro is a vertical slip ring assembly that slides around a cylinder. In many vertical slip ring assemblies, slip rings made of a conductive material and insulating materials are alternately laminated. To manufacture this slip ring assembly, an assembly type is used when the number is small, and a mold type is used when the number is large.

【0003】組立式でスリップリングアセンブリを製造
するには、図2に示すように導電材よりなるスリップリ
ング1と上下両面及び内周面に接着剤を塗布した絶縁リ
ング2を交互にエポキシ樹脂の支持軸3に嵌装して積層
接着すると共にスリップリング1の内周面に溶接された
リード線4を支持軸3の外周の縦溝5を通して外部に導
出し、然る後外表面を切削し、研摩して仕上げている。
In order to manufacture a slip ring assembly by an assembly method, as shown in FIG. 2, a slip ring 1 made of a conductive material and an insulating ring 2 having an adhesive applied to both upper and lower surfaces and an inner peripheral surface are alternately made of epoxy resin. The lead wire 4 which is fitted to the support shaft 3 and laminated and adhered, and which is welded to the inner peripheral surface of the slip ring 1 is led out to the outside through a vertical groove 5 on the outer periphery of the support shaft 3, and then the outer surface is cut. , Polished and finished.

【0004】モールド式でスリップリングアセンブリを
製造するには、図3に示すようにモールド金型6内に一
定間隔に設けられた環状溝7内に、リード線4が内周面
に溶接された導電材よりなるスリップリング1を嵌合の
上、リード線4を集束してモールド金型6外に導出した
後、モールド金型6内にエポキシ樹脂を注入して、絶縁
リング2′を成形すると共に支持軸3′を成形し、然る
後モールド金型6内より取り出して外表面を切削し、研
摩して仕上げている。
In order to manufacture the slip ring assembly by a mold method, as shown in FIG. 3, the lead wire 4 is welded to the inner peripheral surface in the annular groove 7 provided in the molding die 6 at regular intervals. After fitting the slip ring 1 made of a conductive material and concentrating the lead wires 4 and leading them out of the molding die 6, epoxy resin is injected into the molding die 6 to form the insulating ring 2 '. At the same time, the support shaft 3'is molded, and then taken out from the molding die 6 and the outer surface is cut and polished to finish.

【0005】ところで、組立式のスリップリングアセン
ブリの製造方法は、個数が少ないとはいえ、手間隙がか
かって生産性が悪い。他方、モールド式のスリップリン
グアセンブリの製造方法は、モールド金型の内部形状が
複雑である為に、金型費用が高く、またモールド金型6
内にセットしたスリップリング1間に絶縁リング2′を
成形する為に、エポキシ樹脂を密に充填するように注入
することが非常に難しく、さらに金型成形されたモール
ド品の外表面は凹凸が多い為に、仕上げに手間がかか
る。
By the way, in the method of manufacturing the assembly type slip ring assembly, although the number is small, it takes a lot of manual labor and productivity is poor. On the other hand, in the method of manufacturing the mold type slip ring assembly, the mold cost is high because the internal shape of the mold is complicated, and the mold 6 is used.
Since the insulating ring 2'is molded between the slip rings 1 set inside, it is very difficult to inject the epoxy resin so as to be densely packed, and further, the outer surface of the molded product molded by the mold has unevenness. Due to the large number, it takes time to finish.

【0006】[0006]

【発明が解決しようとする課題】そこで本発明は、金型
費用が安く、エポキシ樹脂の注入が容易で、仕上げも容
易なスリップリングアセンブリの製造方法を提供しよう
とするものである。
SUMMARY OF THE INVENTION Therefore, the present invention is intended to provide a method for manufacturing a slip ring assembly which is inexpensive in mold cost, easy to inject epoxy resin, and easy to finish.

【0007】[0007]

【課題を解決するための手段】上記課題を解決するため
の本発明のスリップリングアセンブリの製造方法は、内
径が全長にわたって同径の円筒状のモールド金型内に、
リード線を内周面に溶接した導電材によりなるスリップ
リングとエポキシ樹脂の絶縁リングとを交互に挿入積層
し、次にこの積層体内にエポキシ樹脂を注入して一体化
すると共に支持軸を成形し、然る後モールド金型内より
取り出して、外表面を切削、研摩して仕上げ整形するこ
とを特徴とするものである。
A method of manufacturing a slip ring assembly according to the present invention for solving the above-mentioned problems is achieved in a cylindrical molding die whose inner diameter is the same throughout its entire length.
Slip rings made of a conductive material with lead wires welded to the inner surface and insulating rings of epoxy resin are alternately inserted and laminated, and then epoxy resin is injected into this laminated body to integrate and form a support shaft. After that, it is characterized in that it is taken out from the molding die, and the outer surface is cut and polished to finish and shape.

【0008】[0008]

【作用】上記のように本発明のスリップリングアセンブ
リの製造方法は、モールド金型内に、導電材よりなるス
リップリングとエポキシ樹脂の絶縁リングとを交互に挿
入積層し、この積層体内にエポキシ樹脂を注入するの
で、絶縁リングをモールド成形する必要が無く、支持軸
を成形するだけであるからエポキシ樹脂の注入が容易で
あり、またモールド品の外表面には凹凸が少ないので、
切削、研摩の仕上げ整形には手間がかからない。しかも
本発明のスリップリングアセンブリの製造方法に用いる
モールド金型は、内部に環状溝が無く、内径が全長にわ
たって同径の円筒状の簡単な構造であるから、金型費用
が安価となる。
As described above, according to the method of manufacturing the slip ring assembly of the present invention, the slip rings made of the conductive material and the insulating rings of the epoxy resin are alternately inserted and laminated in the molding die, and the epoxy resin is placed in the laminated body. Since it is not necessary to mold the insulating ring, it is only necessary to mold the support shaft, so it is easy to inject the epoxy resin, and since the outer surface of the molded product has few irregularities,
It takes no effort to finish and shape the cutting and polishing. Moreover, since the molding die used in the method of manufacturing the slip ring assembly of the present invention has no annular groove inside and has a simple cylindrical structure having the same inner diameter over the entire length, the die cost is low.

【0009】[0009]

【実施例】本発明のスリップリングアセンブリの製造方
法の一実施例を図1によって説明すると、内径が全長に
わたって 5.0mmの同径の円筒状のモールド金型10内に、
リード線11を内周面に溶接した外径 5.0mm、内径 4.0m
m、厚さ 0.7mmのAu−Cu10wt%よりなるスリップリ
ング12を4個と外径 5.0mm、内径 3.5mm、厚さ 0.7mmの
エポキシ樹脂よりなる絶縁リング13を5個とを交互に挿
入積層した後、リード線11を集束の上モールド金型10外
に導出の上、モールド金型10内の上端部に螺締した後、
スリップリング12と絶縁リング13との積層体内にエポキ
シ樹脂を注入して一体化すると共に外径 4.0mmの支持軸
14を成形し、然る後モールド金型10内より取り外して、
外表面を切削、研摩して仕上げ整形し、スリップリング
アセンブリを得た。
EXAMPLE An example of a method for manufacturing a slip ring assembly according to the present invention will be described with reference to FIG. 1 in a cylindrical molding die 10 having the same inner diameter of 5.0 mm over the entire length.
5.0 mm outer diameter and 4.0 m inner diameter with lead wire 11 welded to the inner surface
m, thickness 0.7mm, 4 slip rings 12 made of Au-Cu 10wt% and 5 insulation rings 13 made of epoxy resin with outer diameter 5.0mm, inner diameter 3.5mm, thickness 0.7mm are alternately inserted and laminated. Then, after leading the lead wire 11 out of the upper mold die 10 after focusing, and screwing the lead wire 11 to the upper end portion in the mold die 10,
Epoxy resin is injected into the laminated body of slip ring 12 and insulating ring 13 to integrate them, and a support shaft with an outer diameter of 4.0 mm
Mold 14 and then remove it from inside mold 10
The outer surface was cut, ground and finish-shaped to obtain a slip ring assembly.

【0010】この実施例で判るように本発明のスリップ
リングアセンブリの製造方法は、モールド金型10内に導
電材よりなるスリップリング12とエポキシ樹脂の絶縁リ
ング13とを交互に挿入積層し、この積層体内にエポキシ
樹脂を注入するので、絶縁リング13をモールドする必要
が無く、支持軸14を成形するだけであるからエポキシ樹
脂の注入が容易であり、またモールド品の外表面には、
凹凸が少ないので、切削、研摩の仕上げ整形には手間が
かからない。しかも本発明のスリップリングアセンブリ
の製造方法に用いられるモールド金型10は、内部に環状
溝が無く、内径が全長にわたって同径の円筒状の簡単な
構造であるから、金型費用が安価となる。
As can be seen from this embodiment, in the method of manufacturing a slip ring assembly of the present invention, slip rings 12 made of a conductive material and insulating rings 13 made of epoxy resin are alternately inserted and laminated in a molding die 10. Since the epoxy resin is injected into the laminated body, it is not necessary to mold the insulating ring 13 and only the support shaft 14 is molded, so that the epoxy resin can be easily injected.
Since there are few irregularities, it does not take time to finish and shape the cutting and polishing. Moreover, since the molding die 10 used in the method for manufacturing the slip ring assembly of the present invention has no annular groove inside and has a simple cylindrical structure having the same inner diameter over the entire length, the die cost becomes low. .

【0011】[0011]

【発明の効果】以上の通り本発明のスリップリングアセ
ンブリの製造方法によれば、エポキシ樹脂の注入が容易
なモールド法で、しかも仕上げが容易で、その上金型費
用を安価にして、寸法精度の良いスリップリングアセン
ブリを得ることのできる。
As described above, according to the method of manufacturing the slip ring assembly of the present invention, the molding method is such that the epoxy resin can be easily injected, the finishing is easy, the die cost is low, and the dimensional accuracy is low. It is possible to obtain a good slip ring assembly.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のスリップリングアセンブリの製造方法
の一実施例を示す図である。
FIG. 1 is a diagram showing an embodiment of a method for manufacturing a slip ring assembly of the present invention.

【図2】従来の組立式のスリップリングアセンブリの製
造方法を示す図である。
FIG. 2 is a view showing a method for manufacturing a conventional assembly-type slip ring assembly.

【図3】従来のモールド式のスリップリングアセンブリ
の製造方法を示す図である。
FIG. 3 is a view showing a method of manufacturing a conventional mold type slip ring assembly.

【符号の説明】[Explanation of symbols]

10 モールド金型 11 リード線 12 スリップリング 13 絶縁リング 14 支持軸 10 Mold die 11 Lead wire 12 Slip ring 13 Insulation ring 14 Support shaft

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 内径が全長にわたって同径の円筒状のモ
ールド金型内に、リード線を内周面に溶接した導電材よ
りなるスリップリングとエポキシ樹脂の絶縁リングとを
交互に挿入積層し、次にこの積層体内にエポキシ樹脂を
注入して一体化すると共に支持軸を成形し、然る後モー
ルド金型内より取り出して、外表面を切削、研摩して仕
上げ整形することを特徴とするスリップリングアセンブ
リの製造方法。
1. A slip ring made of a conductive material having a lead wire welded to its inner peripheral surface and an insulating ring made of an epoxy resin are alternately inserted and laminated in a cylindrical molding die having the same inner diameter over the entire length, Next, slip is characterized by injecting epoxy resin into this laminated body to integrate it and molding the supporting shaft, and then taking it out from the molding die, cutting and polishing the outer surface and finishing shaping. Ring assembly manufacturing method.
JP24983593A 1993-09-10 1993-09-10 Manufacture of slip ring assembly Pending JPH0785941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24983593A JPH0785941A (en) 1993-09-10 1993-09-10 Manufacture of slip ring assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24983593A JPH0785941A (en) 1993-09-10 1993-09-10 Manufacture of slip ring assembly

Publications (1)

Publication Number Publication Date
JPH0785941A true JPH0785941A (en) 1995-03-31

Family

ID=17198897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24983593A Pending JPH0785941A (en) 1993-09-10 1993-09-10 Manufacture of slip ring assembly

Country Status (1)

Country Link
JP (1) JPH0785941A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104377528A (en) * 2014-10-31 2015-02-25 北京航天控制仪器研究所 Conductive slip ring assembly assembling method
CN111009793A (en) * 2019-12-10 2020-04-14 中船航海科技有限责任公司 Miniature conducting ring assembly and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104377528A (en) * 2014-10-31 2015-02-25 北京航天控制仪器研究所 Conductive slip ring assembly assembling method
CN111009793A (en) * 2019-12-10 2020-04-14 中船航海科技有限责任公司 Miniature conducting ring assembly and preparation method thereof

Similar Documents

Publication Publication Date Title
GB8910056D0 (en) Method for the production of sintered bodies with internal passages
NO178824C (en) Process for manufacturing a non-metallic composite coil with a helical groove in the outer surface
CA989350A (en) Method for the manufacture of a composite wire with an aluminum core and niobium cladding
JPH0785941A (en) Manufacture of slip ring assembly
ZA862608B (en) Process for the manufacture of building components
JPH0129128B2 (en)
JPS5816988B2 (en) Manufacturing method of cylindrical grinding wheel
JPS6130244Y2 (en)
CN202727221U (en) Mould with chamfer angle
JPH0222253Y2 (en)
JPH0223017B2 (en)
JPS6312699B2 (en)
JPS57163047A (en) Machining method of ring
JPS561754A (en) Production method of and apparatus for solidly molded coil
JPS5912419U (en) Casting butching
JPS6340530B2 (en)
JPS5972120A (en) Manufacture of separate type rotary transformer core
JPH0259594B2 (en)
JPH0259595B2 (en)
JPS57166855A (en) Slip ring for microminiature electric machine
JPS58130049A (en) Syringe needle
JPH05101946A (en) Resin-molded coil and manufacture thereof
IT956908B (en) PROCEDURE FOR INCREASING THE COMPRESSION STRESSES IN EXPANDED SUBSTANCES, FINISHED IN A HARD BUTTERFLY
ES2010354A6 (en) Mould for making a tubular body of fiber reinforced plastic material.
JPS5937506A (en) Lens holder