CN112835264A - Adjusting device, wafer exposure equipment and wafer edge exposure method - Google Patents
Adjusting device, wafer exposure equipment and wafer edge exposure method Download PDFInfo
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- CN112835264A CN112835264A CN201911166000.8A CN201911166000A CN112835264A CN 112835264 A CN112835264 A CN 112835264A CN 201911166000 A CN201911166000 A CN 201911166000A CN 112835264 A CN112835264 A CN 112835264A
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- wafer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
- G03F7/2028—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction of an edge bead on wafers
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention relates to a regulating device, a wafer exposure device and a wafer edge exposure method, wherein the regulating device is used for the edge exposure of a wafer and comprises the following components: the diameter of the shading disc is smaller than that of the wafer; the adjusting module comprises an annular edge part and is positioned on the periphery of the shading disk; and the driving device is used for driving the annular edge part to move so as to adjust the distance between the annular edge part and the center of the shading disk. The adjusting device improves the wafer edge exposure speed, greatly reduces the wafer edge exposure time, improves the wafer edge exposure efficiency and reduces the production cost. The adjusting device can adjust the size, so that the wafer edge exposure equipment can expose wafers with different sizes, the width of the wafer edge exposure can be adjusted, and the application range of the wafer edge exposure equipment is expanded.
Description
Technical Field
The present invention relates to the field of semiconductors, and in particular, to an adjusting device, a wafer exposure apparatus, and a wafer edge exposure method.
Background
Photolithography is an important process in the production and manufacture of semiconductor devices, and a general photolithography process includes the steps of wafer surface cleaning and drying, spin coating of a photoresist, soft drying, alignment exposure, post-drying, development and the like. After the photoresist is coated, the photoresist on the edge of the wafer is generally not uniformly coated, a good pattern cannot be obtained, and Peeling (Peeling) is easy to occur to affect the pattern of other parts, so that the photoresist needs to be removed. The traditional method adopts laser to expose a circle of photoresist along the edge of the wafer in sequence to remove the photoresist on the edge, which takes long time and has low efficiency.
Disclosure of Invention
Based on the above, the invention provides a regulating device, a wafer exposure device and a wafer edge exposure method, aiming at the problem of low wafer edge exposure efficiency.
The invention provides an adjusting device for edge exposure of a wafer, comprising: the diameter of the shading disc is smaller than that of the wafer; the adjusting module comprises an annular edge part and is positioned on the periphery of the shading disk; and the driving device is used for driving the annular edge part to move so as to adjust the distance between the annular edge part and the center of the shading disk.
The adjusting device improves the wafer edge exposure speed, greatly reduces the wafer edge exposure time, improves the wafer edge exposure efficiency and reduces the production cost. The adjusting device can adjust the size, so that the wafer edge exposure equipment can expose wafers with different sizes, the width of the wafer edge exposure can be adjusted, and the application range of the wafer edge exposure equipment is expanded.
In one embodiment, the adjusting module further comprises a connecting rod, one end of the connecting rod is connected with the annular edge part, and the other end of the connecting rod is connected with the driving device.
In one embodiment, the adjusting module comprises a plurality of annular edge portions and a plurality of connecting rods, and the connecting rods are connected with the annular edge portions in a one-to-one correspondence manner; the driving device includes: the driving gear is positioned on the shading disc; the driven gear is positioned on the shading disk, and the center of the driven gear is coincided with the center of the shading disk; the driven gear is meshed with the driving gear; the driven gear is provided with a plurality of arc-shaped sliding grooves which are radially distributed by taking the center of the driven gear as the center; the adjusting module further comprises a plurality of convex columns, the convex columns are in one-to-one correspondence with the connecting rods and the arc-shaped sliding grooves, the bottoms of the convex columns are fixed on the upper surfaces of the connecting rods, and the tops of the convex portions at least extend into the arc-shaped sliding grooves.
In one embodiment, adjacent annular edge portions are located on different horizontal planes, and adjacent annular edge portions have a region that partially overlaps one another.
In one embodiment, the shading disk comprises a plurality of fan-shaped blades, and the side wall of each fan-shaped blade is provided with an elongated groove; the connecting rod is positioned in the strip-shaped groove.
In one embodiment, the annular edge portion is spaced from the outer edge of the shutter disk; the adjusting device further comprises an annular edge protruding part, the annular edge protruding part is located on the periphery of the shading disk, and the annular edge part and the annular edge protruding part are provided with regions which are partially overlapped up and down.
In one embodiment, the annular rim portion has a width of at least more than 3 mm.
The present invention also provides a wafer edge exposure apparatus, comprising: a light source module; the adjusting device is positioned below the light source module and used for adjusting the exposure of the edge area of the wafer.
The wafer edge exposure equipment improves the wafer edge exposure speed, greatly reduces the wafer edge exposure time, improves the wafer edge exposure efficiency and reduces the production cost.
In one embodiment, the light source module includes a light source and a lens positioned below the light source.
In one embodiment, the lens is a convex lens.
In one embodiment, the light source comprises an annular light source and the lens comprises an annular lens.
In one embodiment, the annular light source, the annular lens, the dispensing device and the center of the wafer are on the same straight line.
In one embodiment, the light source emits light, the light is irradiated on the wafer through the lens, and the irradiation area at least covers the edge area of the wafer.
The invention also provides a wafer edge exposure method, which comprises the following steps: providing the wafer edge exposure equipment; placing a wafer below the wafer edge exposure equipment; and carrying out edge exposure on the wafer by adopting the wafer edge exposure equipment.
The wafer edge exposure method improves the wafer edge exposure speed, greatly reduces the wafer edge exposure time, improves the wafer edge exposure efficiency and reduces the production cost.
Drawings
Fig. 1-2 are top views of the adjustment device of the present invention.
Fig. 3 is a cross-sectional view along direction AA' of the adjustment device of the present invention.
Fig. 4 is a cross-sectional view of the adjustment device of the invention in the direction BB'.
FIG. 5 is a front view of the wafer edge exposure apparatus of the present invention.
FIG. 6 is a top view of a light source module in the wafer edge exposure apparatus according to the present invention.
Fig. 7 is a top view presented by the adjustment device of the present invention.
| 102 | Lens and |
| 20 | Adjusting |
| 201 | |
| 2011 | |
| 2012 | Strip- |
| 202 | Adjusting |
| 2021 | |
| 2022 | |
| 2023 | Convex |
| 203 | |
| 2031 | Arc |
| 204 | |
| 30 | Wafer |
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on methods or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
One embodiment, as shown in fig. 1-2, provides a conditioning apparatus 20 for edge exposure of a wafer 30, the conditioning apparatus 20 comprising: a light shielding disc 201, wherein the diameter of the light shielding disc 201 is smaller than that of the wafer 30; an adjusting module 202 including an annular edge portion 2021 located at the periphery of the light shielding disc 201; and a driving device for driving the annular edge portion 2021 to move so as to adjust the distance between the annular edge portion 2021 and the center of the shading disk 201.
In this embodiment, the blocking range of the adjusting device is set in advance, so that the wafer 30 can be exposed in the preset edge area of the wafer 30 through one exposure, the edge exposure speed of the wafer 30 is further improved, the edge exposure time of the wafer 30 is greatly reduced, the edge exposure efficiency of the wafer 30 is improved, and the production cost is reduced. The adjusting device 20 can adjust the size, so that the edge exposure equipment of the wafer 30 can expose wafers 30 with different sizes, the edge exposure width of the wafer 30 can be adjusted, and the application range of the wafer 30 exposure equipment is expanded.
In the present embodiment, the radius of the adjusting device 20 can be adjusted within a range of 100mm to 150mm, for example, the radius of the adjusting device 20 can be adjusted to 120mm, 130mm, 140mm, 148mm, 149 mm. The accuracy of the sizing of the adjustment device 20 may be 1 um.
In this embodiment, the annular edge portion 2021 has a width that is at least greater than 3mm, such that the edge exposure field of the wafer 30 has a conditioning range of at least 3 mm.
In one embodiment, the adjustment module 202 further comprises a link 2022, one end of the link 2022 is connected to the annular edge portion 2021, and the other end is connected to the driving device.
In one embodiment, the adjusting module 202 includes a plurality of annular edge portions and a plurality of connecting rods 2022, wherein the connecting rods 2022 are connected to the annular edge portions in a one-to-one correspondence; the drive device includes: a driving gear 204 located on the light shielding disc 201; a driven gear 203 which is positioned on the light-shielding disc 201, wherein the center of the driven gear 203 is coincided with the center of the light-shielding disc 201; the driven gear 203 is meshed with the driving gear 204; the driven gear 203 is provided with a plurality of arc chutes 2031, and the plurality of arc chutes 2031 are radially distributed by taking the center of the driven gear 203 as the center; the adjusting module 202 further includes a plurality of protruding columns 2023, the protruding columns 2023 are disposed in one-to-one correspondence with the connecting rods 2022 and the arc chutes 2031, the bottom of the protruding columns 2023 is fixed on the upper surface of the connecting rods, and the tops of the protruding sections at least extend into the arc chutes 2031, as shown in fig. 3.
In the present embodiment, the diameter of the driven gear 203 is between 5cm and 10cm, for example, the diameter of the driven gear 203 may be 5cm, 7cm, 8cm, 10 cm. The radius of the shading disc 201 is between 10cm and 15cm, for example, the radius of the shading disc 201 may be 10cm, 12cm, 15 cm. The material of the shading disk 201 comprises polyethylene or metal. The number of the plurality of adjusting modules 202 is at least 2, for example, the number of the plurality of adjusting modules 202 may be 4, 5, 6, 7, 8, 9, and preferably, in the present embodiment, the number of the plurality of adjusting modules 202 is 6. The material of the plurality of adjustment modules 202 includes polyethylene or metal. The material of the driven gear 203 includes polyethylene or metal. The shading disc 201 and the driven gear 203 are fixed on the supporting column, and a bearing is arranged between the driven gear 203 and the supporting column.
In one embodiment, adjacent annular edge portions are located on different horizontal planes, and adjacent annular edge portions 2021 have a region that partially overlaps one another.
In one embodiment, the shading disk 201 comprises a plurality of fan-shaped blades, and the side wall of each fan-shaped blade is provided with an elongated groove 2012; the link 2022 is located within the elongated recess 2012 as shown in fig. 4.
In one embodiment, the annular edge portion is spaced from the outer edge of the shutter disk 201; the adjustment device 20 further includes an annular edge protrusion 2011, the annular edge protrusion 2011 is located at the periphery of the shading disk 201, and the annular edge portion and the annular edge protrusion 2011 have a region partially overlapped up and down.
One embodiment, as shown in FIG. 5, provides an edge exposure apparatus for a wafer 30, comprising: a light source module 10; the adjusting device 20 is located below the light source module 10 to adjust the light source module 10 to expose the edge region of the wafer 30.
In the embodiment, the above wafer 30 edge exposure apparatus increases the wafer 30 edge exposure speed, greatly reduces the wafer 30 edge exposure time, and increases the wafer 30 edge exposure efficiency, thereby reducing the production cost.
In one embodiment, the light source module 10 includes a light source 101 and a lens 102 positioned below the light source 101.
In the present embodiment, the light irradiation area of the wafer 30 irradiated by the light source 101 through the lens 102 at least covers the edge area of the wafer 30.
In the embodiment, the exposure energy is between 5000mj/cm2 and 20000mj/cm2, for example, the exposure energy may be 8000mj/cm2, 12000mj/cm2, 18000mj/cm 2. The light source 101 and the lens 102 may both be fixed to the same support column.
In one embodiment, light source 101 comprises an annular light source 101 and lens 102 comprises an annular lens 102, as shown in FIG. 6. Preferably, the lens 102 is a convex lens capable of converting the light emitted from the light source 101 into parallel light, and the parallel light is irradiated on the edge portion of the wafer 30 through the adjusting device 20, so as to facilitate accurate control of the exposure position on the edge of the wafer 30 and uniformity of exposure.
In the present embodiment, the centers of the ring light source 101, the ring lens 102, the dispensing device 20 and the wafer 30 are aligned.
In the present embodiment, the width of the ring-shaped light source 101 is between 5cm and 10cm, for example, the width of the ring-shaped light source 101 may be 6cm, 7cm, 8cm, 9 cm. The width of the annular lens 102 is between 10cm and 20cm, and the width of the annular lens 102 can be 11cm, 13cm, 17cm and 18 cm.
One embodiment, as shown in fig. 7, provides a method for exposing an edge of a wafer 30, comprising: providing an edge exposure device for the wafer 30; placing the wafer 30 under the edge exposure equipment of the wafer 30; the wafer 30 is edge exposed using an edge exposure apparatus for the wafer 30.
In the embodiment, the above method for exposing the edge of the wafer 30 increases the speed of exposing the edge of the wafer 30, greatly reduces the time for exposing the edge of the wafer 30, and increases the efficiency of exposing the edge of the wafer 30, thereby reducing the production cost.
In the embodiment, the vertical distance between the wafer 30 and the adjusting device 20 is between 1mm and 50mm, for example, the vertical distance between the wafer 30 and the adjusting device 20 may be 1mm, 2mm, 3mm, 20mm, 30mm, 40mm, or 50 mm.
In the embodiment, before the wafer 30 enters the edge exposure apparatus for the wafer 30, the adjusting device 20 in the edge exposure apparatus for the wafer 30 is adjusted to the exposure size set at the edge of the wafer 30 in advance, so as to save the process time.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (14)
1. An adjustment device for edge exposure of a wafer, the adjustment device comprising:
the diameter of the shading disc is smaller than that of the wafer;
the adjusting module comprises an annular edge part and is positioned on the periphery of the shading disk;
and the driving device is used for driving the annular edge part to move so as to adjust the distance between the annular edge part and the center of the shading disk.
2. The adjustment device of claim 1, wherein the adjustment module further comprises a link having one end connected to the annular rim portion and another end connected to the drive device.
3. The adjusting device of claim 2, wherein the adjusting module comprises a plurality of the annular edge portions and a plurality of the connecting rods, and the connecting rods are connected with the annular edge portions in a one-to-one correspondence manner;
the driving device includes:
the driving gear is positioned on the shading disc;
the driven gear is positioned on the shading disk, and the center of the driven gear is coincided with the center of the shading disk; the driven gear is meshed with the driving gear; the driven gear is provided with a plurality of arc-shaped sliding grooves which are radially distributed by taking the center of the driven gear as the center;
the adjusting module further comprises a plurality of convex columns, the convex columns are in one-to-one correspondence with the connecting rods and the arc-shaped sliding grooves, the bottoms of the convex columns are fixed on the upper surfaces of the connecting rods, and the tops of the convex portions at least extend into the arc-shaped sliding grooves.
4. An adjustment device according to claim 3, characterized in that adjacent ring edge portions are located on different horizontal planes and that adjacent ring edge portions have a region which partly overlaps one another.
5. The adjustment device of claim 2 wherein said shutter disk includes a plurality of fan-shaped blades, the side walls of each of said fan-shaped blades defining an elongated recess; the connecting rod is positioned in the strip-shaped groove.
6. The adjustment device of claim 1, wherein the annular edge portion is spaced from an outer edge of the shutter disk; the adjusting device further comprises an annular edge protruding part, the annular edge protruding part is located on the periphery of the shading disk, and the annular edge part and the annular edge protruding part are provided with regions which are partially overlapped up and down.
7. The adjustment device of claim 1, wherein the annular edge portion has a width of at least more than 3 mm.
8. A wafer edge exposure apparatus, comprising:
a light source module;
the adjusting device as claimed in any one of claims 1 to 7, located below the light source module for adjusting exposure of the edge region of the wafer.
9. The wafer edge exposure apparatus of claim 8, wherein the light source module includes a light source and a lens located below the light source.
10. The wafer edge exposure apparatus of claim 9, wherein the lens is a convex lens.
11. The wafer edge exposure apparatus of claim 9, wherein the light source comprises an annular light source and the lens comprises an annular lens.
12. The wafer edge exposure apparatus of claim 11, wherein the annular light source, the annular lens, the dispensing device and the center of the wafer are collinear.
13. The wafer edge exposure apparatus of claim 9, wherein an illumination area of the wafer illuminated by the light from the light source via the lens covers at least an edge area of the wafer.
14. A wafer edge exposure method, comprising:
providing the wafer edge exposure apparatus of any one of claims 8-13;
placing a wafer below the wafer edge exposure equipment;
and carrying out edge exposure on the wafer by adopting the wafer edge exposure equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911166000.8A CN112835264A (en) | 2019-11-25 | 2019-11-25 | Adjusting device, wafer exposure equipment and wafer edge exposure method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911166000.8A CN112835264A (en) | 2019-11-25 | 2019-11-25 | Adjusting device, wafer exposure equipment and wafer edge exposure method |
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| Publication Number | Publication Date |
|---|---|
| CN112835264A true CN112835264A (en) | 2021-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911166000.8A Pending CN112835264A (en) | 2019-11-25 | 2019-11-25 | Adjusting device, wafer exposure equipment and wafer edge exposure method |
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| Country | Link |
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| CN (1) | CN112835264A (en) |
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- 2019-11-25 CN CN201911166000.8A patent/CN112835264A/en active Pending
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