CN112825407A

CN112825407A - Laser light source

Info

Publication number: CN112825407A
Application number: CN201911149642.7A
Authority: CN
Inventors: 郑兆祯; 陈长安
Original assignee: Shenzhen Zhongguang Industrial Technology Research Institute
Current assignee: YLX Inc
Priority date: 2019-11-21
Filing date: 2019-11-21
Publication date: 2021-05-21
Also published as: WO2021098841A1

Abstract

The invention provides a laser light source which comprises a supporting shaft piece and a first light source module. Wherein the support shaft member includes an outer peripheral surface; the first light source module comprises a plurality of first light source structures which are arranged around the axis of the supporting shaft piece at equal intervals, each first light source structure comprises a first heat sink base plate and a corresponding first laser chip, each first heat sink base plate comprises an adjacent fixing surface and an installation surface, the fixing surfaces are fixed on the outer peripheral surface along the direction parallel to the axis of the supporting shaft piece, and the first laser chips are arranged on the installation surfaces. The laser light source provided by the invention integrates the first heat sink substrate and the first laser chip on the supporting shaft member, and can emit the emergent light beam with better light distribution under the condition that an optical element is not required for light shaping.

Description

Laser light source

Technical Field

The invention relates to the technical field of optics, in particular to a laser light source.

Background

Semiconductor laser pumped all-solid-state lasers are a new type of laser emerging at the end of the 80's of the 20 th century. The overall efficiency is at least 10 times higher than that of lamp pumping, higher power can be obtained due to the reduction of heat load of unit output, the service life and reliability of the system are about 100 times of those of a flash lamp pumping system, and therefore, the semiconductor laser pumping technology injects new vitality and vitality into a solid laser. Semiconductor laser pumping technology has penetrated into various disciplines such as: laser information storage and processing, laser material processing, laser medicine and biology, laser communication, and military laser technologies, etc., have greatly facilitated technological advances and unprecedented developments in these areas.

The general laser chip has poor collimation property due to the large divergence angle of the emergent light, and the application of the general laser chip in the industry is limited. The common processing method is to arrange an optical element on an emergent light path of a laser chip, the optical element can further shape non-uniformly distributed light spots so as to realize emergent light with required light distribution, and the shaped light beam has better pattern distribution and collimation, so that the laser chip can be directly applied to various fields. However, the addition of the optical element means that the cost of the laser is increased, and due to the high energy density distribution characteristics of the laser, there is also a high demand for the reliability of the optical element, further increasing the material cost of the optical element.

Disclosure of Invention

The present invention is directed to a laser light source to solve the above problems.

The embodiment of the invention achieves the aim through the following technical scheme.

The invention provides a laser light source which comprises a supporting shaft piece and a first light source module. Wherein the support shaft member includes an outer peripheral surface; the first light source module comprises a plurality of first light source structures which are arranged around the axis of the supporting shaft piece at equal intervals, each first light source structure comprises a first heat sink base plate and a corresponding first laser chip, each first heat sink base plate comprises an adjacent fixing surface and an installation surface, the fixing surfaces are fixed on the outer peripheral surface along the direction parallel to the axis of the supporting shaft piece, and the first laser chips are arranged on the installation surfaces.

In one embodiment, the number of the first light source structures is four, and the included angle between the mounting surfaces of the first heat sink substrates of two adjacent first light source structures is 90 °.

In one embodiment, the number of the first light source structures is eight, and the included angle between the mounting surfaces of the first heat sink substrates of two adjacent first light source structures is 45 °.

In one embodiment, the supporting shaft further includes a first end face and a second end face which are parallel to each other, the outer peripheral surface is perpendicularly connected between the first end face and the second end face, the distance between the first light source module and the second end face is larger than the distance between the first light source module and the first end face, and the distances between the plurality of first light source structures in the first light source module and the second end face are the same.

In one embodiment, the supporting shaft member has a first cavity and a second cavity formed therein and communicating with each other, the second cavity is exposed at the second end face, and the first cavity surrounds the second cavity.

In one embodiment, the laser light source further includes a heat dissipation fan disposed on the second end surface.

In one embodiment, the laser light source further includes a second light source module, a distance between the second light source module and the second end surface is smaller than a distance between the second light source module and the first end surface, the second light source module includes a plurality of second light source structures disposed around the axis of the supporting shaft at equal intervals, and a distance between the plurality of second light source structures in the second light source module and the second end surface is the same.

In one embodiment, each second light source structure comprises a second heat sink substrate and a corresponding second laser chip, the second heat sink substrate of each second light source structure is adjacent to the second laser chip of another second light source structure, and the projection of each second light source structure is located between the projections of the two first light source structures on the projection plane perpendicular to the outer peripheral surface.

In one embodiment, the first laser chips in the plurality of first light source structures emit different primary colors of light to mix into white light, and the laser light source further comprises a driving device, wherein the driving device is mechanically connected with the supporting shaft piece and is used for driving the supporting shaft piece to rotate around the axis of the supporting shaft piece.

In one embodiment, the first laser chips in the plurality of first light source structures include at least one red chip, at least one green chip, and at least one blue chip.

In one embodiment, the first laser chips in the plurality of first light source structures include at least two red light chips, at least two green light chips, and at least two blue light chips, and the first light source structures emitting the same primary light are not adjacent.

Compared with the prior art, the laser light source provided by the invention integrates the first heat sink substrate and the first laser chip on the supporting shaft member, and can emit the emergent light beam with better light distribution under the condition that an optical element is not needed for light shaping.

These and other aspects of the invention are apparent from and will be elucidated with reference to the embodiments described hereinafter.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a first laser light source according to an embodiment of the present invention.

Fig. 2 is a schematic perspective view of a first laser light source according to an embodiment of the present invention.

Fig. 3 is a longitudinal sectional view of a supporting shaft of a laser light source according to an embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view of a supporting shaft of a laser light source according to an embodiment of the present invention.

Fig. 5 is a schematic longitudinal sectional view of another supporting shaft of the laser light source according to the embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a second laser light source according to an embodiment of the present invention.

Fig. 7 is a schematic perspective view of a second laser light source according to an embodiment of the present invention.

Fig. 8 is a schematic perspective view of a third laser light source according to an embodiment of the present invention.

Fig. 9 is a schematic perspective view of a fourth laser light source according to an embodiment of the present invention.

Fig. 10 is a schematic perspective view of a fifth laser light source according to an embodiment of the present invention.

Fig. 11 is a schematic perspective view of a sixth laser light source according to an embodiment of the present invention.

Fig. 12 is a schematic perspective view of a seventh laser light source according to an embodiment of the present invention.

Detailed Description

In order to facilitate an understanding of the embodiments of the present invention, the embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the examples of the present invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Referring to fig. 1 and 2, a laser light source 1 according to the present invention includes a supporting shaft 10 and a first light source module 20. Wherein the support shaft member 10 includes an outer peripheral surface 14. The first light source module 20 includes a plurality of first light source structures 200 disposed around the axis of the supporting shaft 10 at equal intervals. Each first light source structure 200 includes a first heatsink substrate 210 and a corresponding first laser chip 220. The first heat sink substrate 210 includes a fixing surface 211 and a mounting surface 213 adjacent to each other, the fixing surface 211 is fixed to the outer peripheral surface 14 along a direction parallel to the axis of the supporting shaft 10, the first laser chip 220 is disposed on the mounting surface 213, and in this embodiment, the mounting surface 213 is a curved surface having the same curvature as the outer peripheral surface 14 of the supporting shaft 10. The plurality of first light source structures 200 are sequentially arranged along the same direction around the axis of the supporting shaft 10, that is, the plurality of first light source structures 200 are sequentially arranged in a clockwise direction or sequentially arranged in a counterclockwise direction.

Specifically, in the present embodiment, the supporting shaft 10 is substantially cylindrical, a wire harness may be disposed on a surface of the supporting shaft 10 to supply power to the first laser chip 200, and the supporting shaft 10 may be made of metal, resin, or plastic. The supporting shaft 10 needs to have sufficient strength to support the first heat sink substrate 210 and the like, and may have good heat dissipation performance to quickly dissipate heat generated by the light emitting element such as the first laser chip 220 and the like into the environment, so as to prevent the accumulation of heat from affecting the life of the light emitting element.

In other embodiments, the supporting shaft 10 may have another shape such as an elliptic cylindrical shape or a square shape, and may be adapted to the mounting of the first heatsink base plate 210.

With reference to fig. 2, the supporting shaft 10 includes an outer peripheral surface 14 and a first end surface 11 and a second end surface 13 which are parallel to each other, wherein the outer peripheral surface 14 is vertically connected between the first end surface 11 and the second end surface 13. The outer peripheral surface 14, the first end surface 11 or the second end surface 13 may be used for fixing the supporting shaft 10, and the outer peripheral surface 14, the first end surface 11 or the second end surface 13 may also be provided with a heat dissipation structure to increase the heat dissipation performance of the supporting shaft 10. The structure of the supporting shaft member 10 itself may be changed.

Referring to fig. 3, in other embodiments, the supporting shaft 10 has a first cavity 15 and a second cavity 16 formed therein and communicated with each other, the first cavity 15 surrounds the second cavity 16, and both the first cavity 15 and the second cavity 16 are exposed to the second end surface 13. That is, the first cavity 15 and the second cavity 16 are both recessed from the second end surface 13 to the first end surface 11 along a direction parallel to the support axis, the recessed depth is not limited, and may be 5cm or 10cm, or the first cavity 15 and the second cavity 16 penetrate through the second end surface 13 and the first end surface 11. The first cavity 15 and the second cavity 16 are communicated with each other, so that heat exchange between the two cavities can be realized, and the communication position is not limited. Heat exchange can be achieved by air convection, for example, ambient air flows into the supporting shaft 10 from the second cavity 16 and flows out of the supporting shaft 10 through the first cavity 15, so that circulation of the air flows is achieved in the first cavity 15 and the second cavity 16, heat in the supporting shaft 10 is rapidly conducted out, and the heat dissipation capability of the supporting shaft 10 is improved. It will be appreciated by those skilled in the art that ambient air flow may also enter the support shaft 10 from the first cavity 15 and exit the support shaft 10 through the second cavity 16.

Referring to fig. 4, in other embodiments, the supporting shaft 10 further has a third cavity 17 and a fourth cavity 18 formed therein and communicated with each other, the third cavity 17 surrounds the fourth cavity 18, and both the third cavity 17 and the fourth cavity 18 are exposed to the first end surface 11, so that the heat dissipation performance of the supporting shaft 10 is further improved by forming the third cavity 17 and the fourth cavity 18.

Referring to fig. 3, in other embodiments, the heat exchange between the first cavity 15 and the second cavity 16 may be achieved by water cooling, for example, water may be fed from the first cavity 15 and discharged from the second cavity 16, or the heat in the supporting shaft 10 may be rapidly conducted out. It will be appreciated by those skilled in the art that ice water may also be used to achieve rapid heat removal to reduce the temperature of the support shaft member 10. The specific heat exchange mode can be selected according to actual needs.

Referring to fig. 6 and 7, in the present embodiment, a distance between the first light source module 20 and the second end surface 13 is greater than a distance between the first light source module 20 and the first end surface 11. In other embodiments, the first light source module 20 may be located between the first end surface 11 and the second end surface 13, or the distance between the first light source module 20 and the second end surface 13 is smaller than the distance between the first light source module 20 and the first end surface 11.

The first light source module 20 includes a plurality of first light source structures 200 disposed around the axis of the supporting shaft 10 at equal intervals, the plurality of first light source structures 200 are circumferentially distributed along the axis perpendicular to the supporting shaft 10, and the intervals between the plurality of first light source structures 200 and the second end surface 13 are the same. The number of first light source structures 200 may be four, five, six, eight or more. The distribution of the first light source structures 200 is related to the structure of the supporting shaft 10, for example, the supporting shaft 10 is cylindrical, the included angle between the first light source structures 200 is 360/n, where n is the number of the first light source structures 200. For another example, the supporting shaft 10 is a square shaft, the number of the first light source structures 200 may be 4, and each first light source structure 200 is located on one surface; or the number of the first light source structures 200 is 8, and every two first light source structures 200 are located on one surface.

Each of the first light source structures 200 includes a first heat sink base plate 210 and a corresponding first laser chip 220, and the first heat sink base plate 210 is attached to the outer circumferential surface 14 of the supporting shaft 10 and may be used to transfer heat generated by the first laser chip 220 to the supporting shaft 10. The first laser chip 220 is mounted to the first heatsink substrate 210.

Specifically, the first heat sink substrate 210 is a substantially square plate, and the first heat sink substrate 210 includes a fixing surface 211 and a mounting surface 213 adjacent to each other. The mounting surfaces 213 may be used for mounting the first heat sink substrate 210, and an included angle between any two adjacent mounting surfaces 213 is the same, and the included angle is related to the number of the first light source structures 200. For example, the number of the first light source structures 200 is four, and as shown in fig. 1, the included angle between the mounting surfaces 213 of the first heat sink substrates 210 of two adjacent first light source structures 200 is 90 °. For another example, the number of the first light source structures 200 is eight, and as shown in fig. 6, an included angle between the mounting surfaces 213 of the first heat sink substrates 210 of two adjacent first light source structures 200 is 45 °. The fixing surface 211 is fixed to the outer peripheral surface 14 along a direction parallel to the axis of the supporting shaft 10, and the fixing manner may be welding or bonding, and may be specifically selected according to the material or actual requirement of the supporting shaft 10 and the first heat sink base plate 210. In other embodiments, the first heat sink base plate 210 may also be integrally formed with the supporting shaft 10 to improve the connection strength of the first heat sink base plate 210 and the supporting shaft 10.

The intensity distribution of the outgoing light from the single first laser chip 220 is non-uniform distribution including a long axis direction and a short axis direction, and the outgoing light has a large divergence angle, so that the collimation of the outgoing light is poor.

In the present embodiment, the first laser chips 220 are disposed on the mounting surface 213, and the first laser chip 220 of each first light source structure 200 is adjacent to the first heatsink substrate 210 of another first light source structure 200, and the distance between each first laser chip 220 and the supporting shaft 10 is the same. Because the included angle between any two adjacent mounting surfaces 213 is the same, that is, the first laser chips 220 are uniformly distributed around the axis of the supporting shaft 10, the long axis direction of the light distribution emitted by each first laser chip 220 is approximately perpendicular to the long axis direction of the light emitted by another first laser chip 220 adjacent to the first laser chip 220, so that the light non-uniformly distributed by each first laser chip 220 is overlapped to realize a relatively uniform patterned light spot. The shape of the light spot is related to the number of the first laser chips 220, for example, if the number of the first laser chips 220 is four, the shape of the light spot finally emitted is a square light spot; for another example, if the number of the first laser chips 220 is eight, the shape of the light spot finally emitted is an octagonal light spot; for another example, the larger the number of the first laser chips 220, the closer the shape of the light spot finally emitted is to a circular shape.

In other embodiments, the first heat sink substrate 210 of each first light source structure 200 may also be adjacent to the first heat sink substrate 210 of another first light source structure 200, and it is understood that the first laser chip 220 of each first light source structure 200 may also be adjacent to the first laser chip 220 of another first light source structure 200.

Referring to fig. 6, in one embodiment, the first laser chip 220 can emit different primary colors of light to mix into white light. The first laser chips 220 in the plurality of first light source structures 200 include at least one red chip 223, at least one green chip 225, and at least one blue chip 227. Wherein the red chip 223 can be used to emit red laser light, the green chip 225 can be used to emit green laser light, and the blue chip 227 can be used to emit blue laser light.

Referring to fig. 7, the laser light source 1 further includes a driving device 30, and the driving device 30 is mechanically connected to the supporting shaft 10 and is configured to drive the supporting shaft 10 to rotate around the axis of the supporting shaft 10 to emit a uniform white circular light spot. Specifically, the driving device 30 may be a motor, and a rotating shaft of the motor may be directly fixed to the second end face 13 of the supporting shaft member 10 in a direction parallel to the axis of the supporting shaft member 10.

In other embodiments, the first laser chips 220 in the plurality of first light source structures 200 include at least two red light chips 223, at least two green light chips 225 and at least two blue light chips 227, at least one green light chip 225 or blue light chip 227 is included between any two red light chips 223, at least one red light chip 223 or blue light chip 227 is included between any two green light chips 225, and at least one red light chip 223 or green light chip 225 is included between any two blue light chips 227. That is, the first light source structures 200 emitting the same primary color light are not adjacent. The number of the red chips 223, the green chips 225, and the blue chips 227 may be the same, for example, 1 or 2, and different primary colors may be mixed and emitted as white light by rotating the support shaft 10 about the axis of the support shaft 10. In other embodiments, the numbers of the red light chips 223, the green light chips 225, and the blue light chips 227 may also be different, for example, in the case that the intensity of the blue laser light emitted by the blue light chips 227 is higher than that of the red light chips 223 and the green light chips 225, a smaller number of the blue light chips 227 may be selected. For example, the green chip 225 has the highest cost with respect to the red chip 223 and the blue chip 227, and a smaller number of green chips 225 may be selected in the case where the emitted light satisfies the condition.

Referring to fig. 8, in other embodiments, the laser light source 1 further includes a heat dissipation fan 40, and the heat dissipation fan 40 may be disposed on the second end surface 13. The air convection generated by the heat dissipation fan 40 can directly take away the heat on the surface of the first laser chip 220; the heat dissipation performance of the support shaft member 10 and the first heat sink substrate 210 can also be improved.

In other embodiments, the heat dissipation fan 40 may be disposed on the first end surface 11 or the outer peripheral surface 14, or at another position adjacent to the first laser chip 220, so that the heat dissipation of the first laser chip 220 may be accelerated.

In other embodiments, the laser light source 1 may further include a heat dissipation fan 40 at the same time when the supporting shaft 10 opens the first cavity 15 and the second cavity 16.

Referring to fig. 9, in other embodiments, the laser light source 1 further includes a second light source module 50, the second light source module 50 is located between the first light source module 20 and the second end surface 13, and a distance between the second light source module 50 and the second end surface 13 is smaller than a distance between the second light source module 50 and the first end surface 11.

The second light source module 50 includes a plurality of second light source structures 51 disposed around the axis of the supporting shaft 10 at equal intervals, and the plurality of second light source structures 51 in the second light source module 50 are spaced from the second end surface 13 at the same interval. Each second light source structure 51 comprises a second heat sink substrate 511 and a corresponding second laser chip 513, the second heat sink substrate 511 of each second light source structure 51 being adjacent to the second laser chip 513 of another second light source structure 51. The structure and installation manner of the second light source structure 51 are the same as those of the first light source structure 200, and are not described herein again.

On a projection plane perpendicular to the peripheral surface 14, the projection of each second light source structure 51 is located between the projections of the two first light source structures 200. That is, in the direction parallel to the axis of the supporting shaft 10, the second light source structure 51 and the first light source structure 200 are arranged in a crossed manner, so that the light emitted by the first light source structure 200 is prevented from being blocked by the second light source structure 51, or the light emitted by the second light source structure 51 is prevented from being blocked by the first light source structure 200.

In another embodiment, when the first laser chip 220 emits laser light toward the first end surface 11 and the second laser chip 513 emits laser light toward the second end surface 13, the mounting position of the second light source structure 51 may not be limited. For example, any one of the second light source structures 51 may be overlapped with the first light source structure 200 from the first end face 11 toward the second end face 13.

In other embodiments, when the radius of the light spot emitted from the second light source module 50 is larger than the radius of the light spot emitted from the first light source module 20, the installation position of the second light source structure 51 may not be limited.

Referring to fig. 10, in some embodiments, each of the first light source structures 200 may further include two first laser chips 220, and the two first laser chips 220 are respectively disposed on the two mounting surfaces 213 of the first heatsink substrate 210, which are opposite to each other, so that the luminance of the outgoing light beam may be improved under the condition of ensuring uniform light outgoing.

Referring to fig. 11, in other embodiments, each first light source structure 200 may further include a first laser chip 220, the mounting surface 213 may further have a recess 2132, and the first laser chip 220 is accommodated in the recess 2132 and exposed from the mounting surface 213, so that the first laser chip 220 may be better mounted, and the volume of the laser light source 1 may also be reduced.

Referring to fig. 12, in some other embodiments, each of the first light source structures 200 may further include two first laser chips 220, two opposite mounting surfaces 213 of each of the first heatsink substrates 210 may be respectively provided with a groove 2132, and the two first laser chips 220 are respectively mounted in the two grooves 2132 and are respectively exposed from the mounting surfaces 213.

In summary, the laser light source 1 provided by the present invention integrates the first heat sink substrate 210 and the first laser chip 220 on the supporting shaft 10, and can emit an outgoing beam with good light distribution without optical shaping by an optical element.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.

Claims

1. A laser light source, comprising:

a support shaft member including an outer peripheral surface; and

the first light source module comprises a plurality of first light source structures surrounding the axis of the supporting shaft piece at equal intervals, each first light source structure comprises a first heat sink base plate and a corresponding first laser chip, each first heat sink base plate comprises an adjacent fixing surface and an installation surface, the fixing surfaces are fixed on the outer peripheral surface along the direction parallel to the axis of the supporting shaft piece, and the first laser chips are arranged on the installation surfaces.

2. The laser light source of claim 1, wherein the number of the plurality of first light source structures is four, and an included angle between the mounting surfaces of the first heat sink substrates of two adjacent first light source structures is 90 °.

3. The laser light source of claim 1, wherein the number of the plurality of first light source structures is eight, and an included angle between the mounting surfaces of the first heat sink substrates of two adjacent first light source structures is 45 °.

4. The laser light source of claim 1, wherein the supporting shaft further comprises a first end face and a second end face which are parallel to each other, the outer peripheral surface is vertically connected between the first end face and the second end face, a distance between the first light source module and the second end face is larger than a distance between the first light source module and the first end face, and a distance between the plurality of first light source structures in the first light source module and the second end face is the same.

5. The laser light source of claim 4, wherein the supporting shaft has a first cavity and a second cavity formed therein and communicating with each other, the second cavity being exposed at the second end face, and the first cavity surrounding the second cavity.

6. The laser light source of claim 4, further comprising a heat dissipation fan disposed on the second end surface.

7. The laser source of claim 4, further comprising a second light source module, wherein a distance between the second light source module and the second end surface is smaller than a distance between the second light source module and the first end surface, the second light source module comprises a plurality of second light source structures arranged around the axis of the supporting shaft at equal intervals, and the distances between the second light source structures in the second light source module and the second end surface are the same.

8. The laser light source according to claim 7, wherein each of the second light source structures comprises a second heat sink substrate and a corresponding second laser chip, the second heat sink substrate of each of the second light source structures is adjacent to the second laser chip of another second light source structure, and a projection of each of the second light source structures is located between projections of two of the first light source structures on a projection plane perpendicular to the outer peripheral surface.

9. The laser source of claim 1, wherein the first laser chips in the plurality of first light source structures emit different primary colors of light to mix into white light, and the laser source further comprises a driving device mechanically connected to the supporting shaft, and the driving device is configured to drive the supporting shaft to rotate around an axis of the supporting shaft.

10. The laser light source of claim 9, wherein the first laser chips in the plurality of first light source structures comprise at least one red chip, at least one green chip, and at least one blue chip.

11. The laser light source of claim 9, wherein the first laser chips in the plurality of first light source structures comprise at least two red chips, at least two green chips, and at least two blue chips, and wherein the first light source structures emitting the same primary color light are not adjacent.