JP6507828B2 - Optical member and light emitting device - Google Patents

Description

The present disclosure relates to an optical Faculty material and a light-emitting device.

  In recent years, many lamps and lighting devices use a light emitting diode which consumes less power and has a long life as a light source. Also in special applications, many lighting devices such as high-brightness street lights with light emitting diodes and high-altitude room lights are rapidly spreading. Further, at present, there is a possibility that a lighting apparatus using a semiconductor laser apparatus will be widely used in the future.

  When a light emitting device using a laser beam as a light source is used as a lighting device, it is necessary to irradiate the laser beam, which is coherent light, to a wavelength conversion unit such as a phosphor to convert it into light for illumination. Here, the light obtained from the wavelength conversion unit to which the laser light is applied is a Lambertian light distribution. In order to control the light of the Lambertian light distribution to a desired directional characteristic such as an acute angle or an obtuse angle suitable for illumination, a reflector or a lens is required. Conventionally, in an illumination device using a semiconductor laser device, it has been proposed to perform light distribution control using a reflector (see Patent Document 1).

JP 2012-084276 A

  If a reflecting plate is used for focusing as in Patent Document 1, the apparatus becomes large. On the other hand, in LED illumination using a light emitting diode as a light source, a translucent member such as a lens is used for light distribution control. Such a translucent member is manufactured, for example, by integral molding with a light emitting diode, and thus has an advantage that it is easy to process a refracting surface. Therefore, it is desirable that light distribution control be performed using a translucent member as in the case of LED lighting also in a light emitting device for lighting application using a semiconductor laser device.

  However, if bulk light transmitting members such as lenses are disposed apart from the wavelength conversion unit in order to secure the path of the laser light, in order to efficiently collect the light obtained from the wavelength conversion unit to which the laser light is applied. There is no choice but to increase the size of the translucent member.

The present disclosure has been made in view of the problems above mentioned, small size, and provides an optical undergraduate material and a light-emitting device having a structure which does not obstruct the laser beam path used for the light source.

  A light transmitting member according to an embodiment of the present disclosure receives a laser beam passage for passing a laser beam from a semiconductor laser device and light obtained by wavelength-converting the laser beam by a wavelength conversion unit through the laser beam passage. A light transmitting member comprising: a light incident surface for emitting light and a light emitting surface for collecting light incident on the light incident surface and emitting the light as substantially parallel light, and the laser light passage is formed of a groove or a hole; It forms so that it may incline with respect to the optical axis of the light from a conversion part.

  Moreover, the optical member which concerns on embodiment of this indication is equipped with the said translucent member and the said wavelength conversion part installed facing the entrance plane of the said translucent member.

  A light emitting device according to an embodiment of the present disclosure includes the optical member, and a semiconductor laser device installed at a position where the wavelength conversion unit is irradiated with a laser beam from the laser beam path.

  The translucent member according to the embodiment of the present disclosure has a configuration that is compact and does not become an obstacle in the path of the laser light used for the light source of the light emitting device. Accordingly, the optical member including the light transmitting member and the wavelength conversion unit is also miniaturized. Therefore, it is possible to provide a small-sized light emitting device that performs light distribution control of the diffused light from the wavelength conversion unit irradiated with the laser light through the path using the optical member.

It is a block diagram which shows the outline of the light-emitting device concerning 1st Embodiment. It is a perspective view which shows the outline of the light source body part of the light-emitting device of FIG. It is a perspective view which shows the outline of the light-receiving part of the light-emitting device of FIG. It is a perspective view showing an outline of a translucent member concerning a 1st embodiment. It is a perspective view which shows the partial cross section of the translucent member of FIG. It is a figure which shows the outline of the optical member of FIG. 1, and is explanatory drawing of the optical path of the light excited by the laser beam. It is a block diagram which shows the outline of the light-emitting device which concerns on 2nd Embodiment. It is a perspective view showing an outline of a translucent member concerning a 2nd embodiment. It is a figure which shows the outline of the light-emitting device based on 3rd Embodiment, and is a perspective view which shows an optical member and a semiconductor laser apparatus. It is a perspective view which shows the outline of the translucent member which concerns on 3rd Embodiment. It is sectional drawing containing the laser beam path of the translucent member of FIG. It is the figure which looked at the translucent member of FIG. 10 from the one end side of a laser beam path.

  Embodiments are described below with reference to the drawings. However, the form shown below illustrates the translucent member, the optical member, and the light-emitting device for embodying the technical thought of this invention, and is not limited to the following. Further, the dimensions, materials, shapes, relative arrangements and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention to only the specific ones unless specifically described, and are merely illustrative. It is only Note that the sizes, positional relationships, etc. of members shown in each drawing may be exaggerated for the sake of clarity.

First Embodiment
As shown in FIG. 1, the light emitting device 100 includes a translucent member 110, a light source body portion 120, and a light receiving portion 130 in a certain casing.
The light source unit 120 is a laser light source fixed to a housing and mainly configured by combining the semiconductor laser device 122 and the heat dissipation structure 123. The angle between the irradiation direction of the laser light B from the light source unit 120 and the light emission direction of the light emitting device 100 is arranged at a predetermined acute angle. In addition, the light receiving unit 130 is installed at a predetermined distance from the light source unit 120 in the housing. In the light receiving unit 130, the light transmitting member 110 is provided on the phosphor plate 131. The optical member 101 includes the light transmitting member 110 and the phosphor plate 131.

  Hereinafter, each configuration of the light emitting device 100 will be described. First, an example of the configuration of the light source unit 120 will be described in detail with reference to FIG. Here, the light source body portion 120 includes the substrate 121, the semiconductor laser device 122, and the heat dissipation structure 123.

  The substrate 121 is a base member for installing the semiconductor laser device 122. The material of the substrate 121 is not particularly limited, and is made of, for example, a general printed circuit board. The substrate 121 can have an appropriate shape (size, length) depending on the purpose, application, and the like.

  A semiconductor laser device 122 is provided on the substrate 121, and laser light is emitted from one surface side. The heat dissipation structure 123 is attached to the other surface of the substrate 121 by a predetermined connection member 124 such as a screw.

  Here, the substrate 121 has a notch toward the center on one side, and the semiconductor laser device 122 is disposed at the center of the substrate 121 by installing the semiconductor laser device 122 in this notch. In addition, a connector 125 for feeding power to the semiconductor laser device 122 is disposed in the cutout portion. The connector 125 is electrically connected to the external power supply by a wire harness drawn from the notch side.

  The semiconductor laser device 122 irradiates laser light from the laser light passage 113 of the light transmitting member 110 to the wavelength conversion unit 132, and includes a general semiconductor laser element. The semiconductor laser device is packaged, and includes a plurality of lead terminals (connection pins) such as an anode and a cathode. The plurality of lead terminals are electrically connected to the connector 125.

  The material and shape of the housing and the cover of the package are not particularly limited, and a conventionally known housing and cover of the package can be used. For example, it is preferable to use a metal package in consideration of light resistance, heat resistance, and weather resistance. In that case, it is preferable to use gas sealing without using a resin for sealing the semiconductor laser element. In the package, it is preferable that an opening is provided on the light emitting portion side, and the opening is covered with a member that is resistant to light degradation such as inorganic glass. The package may have a photodiode arranged to monitor the output of the semiconductor laser device. In addition, a package may be used in which a protective element such as a Zener diode is disposed in order to protect the semiconductor laser element from element destruction or performance deterioration due to excessive voltage application. The light emitted from the semiconductor laser element is not parallel light, but since the spread angle in the horizontal direction is different from the spread angle in the vertical direction, the laser spot is divergent light spread in an elliptical shape.

The semiconductor laser device can be selected at any wavelength depending on the application. For example, the blue light-emitting element, it is possible to use a nitride semiconductor _{(In X Al Y Ga 1-} XY N, 0 ≦ X ≦ 1,0 ≦ Y ≦ 1, X + Y ≦ 1) and the like. The semiconductor laser device will be described below as emitting blue light, for example. The blue semiconductor laser device is an example capable of providing a white light source.

  In the present embodiment, the semiconductor laser device 122 is provided with the semiconductor laser element and the collimator lens disposed on the optical axis in the device unit. Here, the collimator lens is a general configuration for extracting diverging light as parallel light. Here, it is assumed that the laser beam B emitted from the semiconductor laser device 122 is parallel light.

  The heat dissipation structure 123 can be configured by a general cooling means. The heat dissipation structure 123 is preferably made of a material having high thermal conductivity such as metal (eg, copper, aluminum), ceramics such as aluminum nitride, and carbon. Thus, the heat generation of the light source unit 120 can be efficiently dissipated.

  As shown in FIG. 2, the heat dissipation structure 123 is provided with a flat plate member whose one surface is in close contact with the substrate 121 and a large number of fins provided on the other surface of the flat plate member. The flat plate member preferably has a larger area than the substrate 121. The material, thickness, width, length and the like of the flat plate member are determined in accordance with the use conditions of the light emitting device 100. The material, diameter, length, number, installation interval and the like of the fins are determined according to the use conditions of the light emitting device 100.

  Next, an example of the configuration of the light receiving unit 130 of the light emitting device 100 of FIG. 1 will be described in detail with reference to FIG. The light receiving unit 130 is installed at a position where the laser light B from the light source unit 120 can be directly received. The light receiving unit 130 includes a phosphor plate 131, a wavelength conversion unit 132, and a heat dissipation structure 133.

  The phosphor plate 131 is a base member for installing the wavelength conversion unit 132. The material of the phosphor plate 131 is not particularly limited, but is made of, for example, a general printed circuit board. The phosphor plate 131 can have an appropriate shape (size, length) according to the purpose, application, and the like. For example, a square, a rectangle, a polygon, a circle, an ellipse, and a shape combining them may be mentioned. Here, the external shape of the phosphor plate 131 is an elongated rectangular shape.

  The wavelength conversion part 132 is installed in one side of the fluorescent substance plate 131 so that a laser beam can be received. Further, the heat dissipating structure 133 is attached to the other surface of the phosphor plate 131 by a predetermined connecting member 136 such as a screw.

  The wavelength conversion unit 132 absorbs part of the laser light from the light source unit 120 and emits light of a wavelength different from that to obtain light emission of a desired color tone. In addition, the wavelength conversion unit 132 reflects part of the laser light from the light source unit 120 in the direction according to the incident angle. As an example of the wavelength conversion part 132, what used transparent members, such as transparent resin and an inorganic member, as a base material, and disperse | distributed the fluorescent substance which is a wavelength conversion material there is mentioned.

The phosphor of the wavelength conversion unit 132 may use a yellow phosphor that absorbs blue light and emits yellow light. As the yellow phosphor, for example, a YAG-based phosphor in which yttrium, aluminum and garnet are mixed can be used. By doing this, the yellow light emitting phosphor can be excited by the blue light emitted from the semiconductor laser device 122. The wavelength conversion unit 132 mixes the partially converted yellow light and the unconverted blue light, and emits the mixed light in the complementary color relationship as white light. That is, the mixed light of the fluorescence excited by the wavelength conversion unit 132 and the reflected light (the light of the semiconductor laser device 122) is emitted.
As the other phosphors, any of known phosphors can be used in consideration of, for example, the wavelength of light emitted from the light source used, the color of light to be obtained, and the like. Specifically, cerium-activated lutetium aluminum garnet (LAG), europium and / or chromium-activated nitrogen-containing calcium aluminosilicate (CaO-Al ₂ O ₃ -SiO ₂ ), and europium activated Silicate ((Sr, Ba) ₂ SiO ₄ ), β sialon phosphor, KSF phosphor (K ₂ SiF ₆ : Mn), etc. may be mentioned. Among them, it is preferable to use a phosphor having heat resistance.
By using these phosphors, a light emitting device that emits mixed light (for example, a white color system) of primary light and secondary light of visible wavelength, and is excited by primary light of ultraviolet light to emit secondary light of visible wavelength Can also be used.
The phosphors may be used in combination of a plurality of types of phosphors. For example, Si _{6 -Z} Al _Z O _Z N _8-Z : Eu, Lu ₃ Al ₅ O ₁₂ : Ce, BaMgAl ₁₀ O ₁₇ : Eu, BaMgAl ₁₀ O ₁₇ : Eu, Mn, (Zn, Cd) Zn: Cu _{, (Sr, Ca) 10 (} PO 4) 6 Cl 2: Eu, Mn, (Sr, Ca) 2 Si 5 N 8: Eu, CaAlSiB X N 3 + X: Eu, K 2 SiF 6: Mn and CaAlSiN ₃ Color rendering and color reproducibility can also be adjusted by using a phosphor such as Eu in a combination or blending ratio suitable for the desired color tone.
The phosphors may be used in combination in the wavelength converter, or may be in a laminated structure.

  The base material of the wavelength conversion unit 132 is a member that transmits at least part of light. The light transmissive member is preferably a material having a low absorptivity of light emitted from the semiconductor laser device 122. Specifically, translucent members such as quartz glass, borosilicate glass, low melting point glass, silicone resin, epoxy resin and the like can be mentioned.

  The shape of the wavelength conversion portion 132 may be, for example, a disk shape other than the illustrated flat shape, or any shape such as a convex shape or a hemispherical shape.

  In the wavelength conversion part 132, in addition to the wavelength conversion material, an appropriate member such as a viscosity extender, a light diffusing substance, a pigment and the like can be added according to the intended use. Examples of the light diffusion material include barium titanate, titanium oxide, aluminum oxide, silicon carbide, silicon dioxide, calcium carbonate carbonate, light calcium carbonate, silver, and a mixture containing at least one or more of them. Similarly, various coloring agents can be added as a filter material having a filter effect of cutting light of unnecessary wavelength components from the semiconductor laser device 122.

  The heat dissipation structure 133 can be configured by a general cooling means. Here, as shown in FIG. 3, the heat dissipation structure 133 is provided with a flat plate member whose one surface is in close contact with the phosphor plate 131 and a large number of fins provided on the other surface of the flat plate member. . The heat dissipating structure 133 is the same as the heat dissipating structure 123 shown in FIG.

  Next, an example of the configuration of the light transmitting member 110 of the light emitting device 100 will be described in detail with reference to FIGS. 4 and 5 (refer to FIGS. 1 to 3 as needed). 4 shows the light transmitting member 110 in a state where the light incident surface 111 of the light transmitting member 110 shown in FIG. 1 is disposed on the upper side in FIG. 4 and the light emitting surface 112 shown in FIG. It is a perspective view showing an outline. FIG. 5 is a perspective view showing a cross section of the light transmitting member 110 of FIG. 4 cut in the vertical direction so as to pass through the laser light passage 113.

  The translucent member 110 is made of a material that transmits at least a part of light. The material of the light transmitting member 110 is not particularly limited, and examples thereof include thermosetting resin materials such as silicone resin, thermoplastic resin materials such as polycarbonate and acrylic, and polymer materials such as polyethylene. Alternatively, examples of the material of the light transmitting member 110 include quartz, synthetic quartz, and optical glass such as BK7.

  In addition, the light transmitting member 110 has a function of a collimating lens here. Therefore, the light-transmissive member 110 has a substantially truncated-cone-shaped outer shape, includes the incident surface 111 on the upper bottom side, and includes the output surface 112 on the lower bottom side. In addition, the light transmitting member 110 is provided with a laser light passage 113 from the side surface 114 to the incident surface 111. The laser light passage 113 is for passing the laser light B from the light source unit 120 (see FIG. 1) toward the wavelength conversion unit 132.

  The light transmitting member 110 is disposed on the phosphor plate 131 so that the light incident surface 111 side is directed to the wavelength conversion unit 132 (see FIG. 1) and the wavelength conversion unit 132 is covered. The incident surface 111 is provided by forming a concave portion 115 at the position of the light transmitting member 110 facing the wavelength conversion portion 132. The incident surface 111 is a surface through which the light converted in wavelength by the wavelength conversion unit 132 passes through the laser light passage 113.

  Further, when the light transmitting member 110 is installed on the phosphor plate 131, the laser light passage 113 allows the laser light B from the semiconductor laser device 122 to pass through and irradiate the wavelength conversion portion 132 (see FIG. 1). It is arranged to be in position. Thus, the laser light is guided to the wavelength conversion unit 132 through the laser light path 113 and wavelength-converted. The laser beam path 113 is formed to be inclined with respect to the optical axis of the light from the wavelength conversion unit 132. The angle between the optical axis of the light transmitting member 110 and the irradiation direction of the laser light B is appropriately set according to the purpose, application, and the like.

  Further, the laser light passage 113 is, for example, a groove formed to communicate the light transmitting member 110 as an example. That is, a part of the surface of the light transmitting member 110 is opened along the groove (laser light passage 113). In the present embodiment, one end 118 of the laser light passage 113 is disposed on the side surface 114, and the other end 119 is in communication with the recess 115.

  The groove as the laser beam passage 113 has a size that allows the beam diameter of the laser beam to pass in a cross-sectional view corresponding to the cross section. If the cross-sectional beam shape (laser spot) of the laser light is, for example, an elliptical shape, the shape of the groove is also an elliptical shape along the cross-sectional beam shape. Also, the size of the groove may be at least a beam (laser light) passing therethrough, and more preferably, the shape of the groove should not hit the surface of the light-transmissive member 10 forming the groove and be as small as possible. .

  The recess 115 of the translucent member 110 is for delivering the laser light B from the light source unit 120 as parallel light. By providing the concave portion 115 in the light transmitting member 110, a gap is formed when the wavelength converting portion 132 is covered with the light transmitting member 110, and the light from the wavelength converting portion 132 is provided in the concave portion 115 incident surface 111 The light is incident on the inner bottom surface 116 and the inner side surface 117.

  The recess 115 has an inner bottom surface 116 and an inner side surface 117. The inner bottom surface 116 and the inner side surface 117 are the incident surface 111 of the translucent member 110. The inner bottom surface 116 is disposed to face the emission surface 112 and is, for example, circular in plan view.

  The inner bottom surface 116 is formed in a convex shape toward the opening of the recess 115 as shown in FIG. 5 as an example. In other words, the inner bottom surface 116 is formed so as to bulge toward the wavelength conversion unit 132 and to have the function of a convex lens. By forming the inner bottom surface 116 in such a shape, light incident on the inner bottom surface 116 from the wavelength conversion unit 132 can be made substantially parallel light. As a result, the exit surface 112 condenses the light incident on the entrance surface 111 and emits it as substantially parallel light.

  Further, as shown in FIG. 5, the inner side surface 117 of the recess 115 is, for example, in a shape inclined so as to extend toward the opening of the recess 115. When the light-transmissive member 110 covers the wavelength conversion portion 132 (see FIG. 3), the light incident from the wavelength conversion portion 132 is refracted and reflected by the interface of the side surface 114 and guided to the output surface 112 It is inclined to be bitten. Here, the exit surface 112 is formed to be a flat surface, and the exit surface 112 is formed to have a circular shape in plan view.

  Next, an example of a method of fixing the translucent member 110 to the light receiving unit 130 will be described with reference to FIG. Here, the light transmitting member 110 is arranged such that the optical axis 140 of the light transmitting member 110 is aligned with the desired position where the laser light B is irradiated on the wavelength conversion unit 132 installed on the phosphor plate 131. The light receiver 130 is mounted. In this example, the translucent member 110 is supported by the plurality of columnar support portions 150 on the light receiving portion 130. One end of the supporting portion 150 is in contact with the outer edge side of the light emitting surface 112 of the light transmitting member 110, and the other end is in contact with the upper surface of the heat dissipation structure 133. The translucent member 110 and the phosphor plate 131 may not be in contact with each other. And the support part 150 is joined with the translucent member 110 and the thermal radiation structure 133 via an adhesive agent. Note that the bonding portion where the light transmitting member 110 and the phosphor plate 131 are in contact may be fixed by an adhesive.

  Next, an optical path of light emission by the light emitting device 100 will be described with reference to FIG. 6 (see FIGS. 1 and 4 as appropriate). In the light emitting device 100, since the laser light B from the light source unit 120 passes through the laser light passage 113, the wavelength conversion unit 132 installed on the phosphor plate 131 is not blocked by the light transmitting member 110. It is irradiated. When the laser light B is irradiated to the wavelength conversion unit 132, color conversion (wavelength conversion) is performed by mixing the excited fluorescence and the laser light reflected by the wavelength conversion unit 132. At this time, the light obtained from the wavelength conversion unit 132 is a Lambertian light distribution. The light converted by the wavelength conversion unit 132 is incident on the incident surface 111 of the translucent member 110.

  Then, when color converted (wavelength converted) light is incident on the inner bottom surface 116 (see FIG. 4) of the recess 115, it is refracted at the inner bottom surface 116, refracted at the exit surface 112, and emitted as parallel light. Alternatively, when color converted (wavelength converted) light is incident on the inner side surface 117 (see FIG. 1) of the recess 115, it is refracted at the inner side surface 117, reflected at the side surface 114, and refracted at the emission surface 112 to be parallel. Emit as light. That is, the color converted (wavelength converted) light including the light of the Lambertian light distribution is subjected to light distribution control so as to be condensed into parallel light by the light transmitting member 110 and emitted. As described above, the translucent member 110 has a function of condensing the diffused light from the wavelength conversion unit 132. The light transmitting member 110 is configured such that the laser light passing through the laser light passage 113 is irradiated from the direction inclined with respect to the optical axis of the light from the wavelength conversion unit 132.

  As described above, in the light emitting device 100 according to the present embodiment, since the laser beam passage 113 is provided in the light transmitting member 110 used for light distribution control, the laser beam B from the light source unit 120 is the laser beam passage 113 Can pass. Therefore, the laser light B can be applied to the wavelength conversion portion 132 disposed on the phosphor plate 131 without the light transmitting member 110 becoming an obstacle. Here, since the light transmitting member 110 is disposed to cover the wavelength converting portion 132 with a gap from the wavelength converting portion 132, even if the laser light path 113 is provided in the light transmitting member 110, The translucent member 110 can be miniaturized. Further, in the present embodiment, since the laser light path 113 is formed of a groove formed along the shape of the laser beam, it is possible to minimize the influence on the light for light distribution control.

Second Embodiment
Next, a translucent member, an optical member, and a light emitting device according to a second embodiment will be described with reference to FIG. In the light emitting device 100B according to the second embodiment, the light receiving unit 130 is disposed such that the irradiation direction of the laser light and the light emitting direction of the light emitting device are the same, and includes a plurality of light source units 120. The same components as those of the light emitting device 100 according to the first embodiment are denoted by the same reference numerals, and the description will be appropriately omitted.

  As shown in FIG. 7, the light emitting device 100 </ b> B includes a translucent member 110 </ b> B, a plurality of light source units 120, a light receiving unit 130, and a plurality of reflecting mirrors 160 in a certain casing. Further, the optical member 101B according to the second embodiment includes the light transmitting member 110B and the phosphor plate 131.

  A light transmitting member 110B according to the second embodiment is different from the light transmitting member 110 of FIG. 4 in that, for example, two laser light paths 113 are provided as shown in FIG. Here, the first laser beam path 113 and the second laser beam path 113 are formed at intervals of 180 degrees in the circumferential direction on the side surface of the light transmitting member 110B made of a collimating lens.

  The light emitting device 100B includes, for example, a first light source body portion 120 and a second light source body portion 120 in accordance with the arrangement of the first laser light path 113 and the second laser light path 113, respectively. The first light source body portion 120 and the second light source body portion 120 are arranged side by side so that the irradiation direction of the laser light B is the same. Here, the two semiconductor laser devices 122 are positioned so as to emit laser light parallel to the optical axis direction of the light from the wavelength conversion unit 132 (see FIG. 6). In addition, the semiconductor laser device 122 is located on the light incident surface side of the light emission surface of the light transmissive member 110B as viewed in the optical axis direction. That is, here, the semiconductor laser device 122 is separated from the light incident surface 111 of the light transmitting member 110B so as not to contact the heat dissipation structure 133 of the light receiving portion 130 and on the light incident surface 111 side in the optical axis direction. positioned. Further, in the example shown in FIG. 7, the size of the light emitting device 100B can be reduced by bringing the first light source body portion 120 and the second light source body portion 120 into contact so as to share two heat dissipation structures. .

The light emitting device 100B includes the first reflecting mirror 160 and the second reflecting mirror 160 on the light path in accordance with the arrangement of the first laser light path 113 and the second laser light path 113, respectively.
The first reflecting mirror 160 is disposed in the vicinity of the translucent member 110 B, and on the optical axis of the semiconductor laser element of the first light source unit 120, the first reflecting mirror 160 is configured to receive the first laser beam B from the first light source unit 120. It is set to an angle that can be guided to the laser light passage 113.

  Similarly, the second reflecting mirror 160 is disposed in the vicinity of the translucent member 110 B, and on the optical axis of the semiconductor laser element of the second light source unit 120, the laser beam B from the second light source unit 120. Is set to an angle at which it can be guided to the second laser light path 113.

In the light emitting device 100B, the laser beam B from the first light source unit 120 is reflected by the first reflecting mirror 160, passes through the first laser beam path 113, and is mounted on the phosphor plate 131. (See FIG. 6).
Similarly, the laser beam B from the second light source unit 120 is reflected by the second reflecting mirror 160, passes through the second laser beam passage 113, and is emitted to the wavelength conversion unit 132 installed on the phosphor plate 131. Ru. As described above, in the light emitting device 100B, since the plurality of laser light paths 113 are provided in the translucent member 110B used for light distribution control, it is possible to increase the light emission output.

Third Embodiment
Next, a translucent member, an optical member, and a light emitting device according to a third embodiment will be described with reference to FIGS. 9 to 12. In the light emitting device 100C according to the third embodiment, the translucent member is formed of a plano-convex lens. The same components as those of the light emitting device 100 according to the first embodiment are denoted by the same reference numerals, and the description will be appropriately omitted. In FIG. 9, the heat dissipation structure is omitted from the configuration of the light emitting device 100C. In the light emitting device 100C, the angle between the irradiation direction of the laser light B and the light emitting direction of the light emitting device 100C is arranged at a predetermined acute angle.

  As shown in FIG. 9, the light emitting device 100C includes a light transmitting member 110C, a semiconductor laser device 122 (light source body portion 120: see FIG. 2), and a phosphor plate 131 (light receiving portion 130: a view) in a certain casing. 3) and is equipped. Further, an optical member 101C according to the third embodiment includes a light transmitting member 110C and a phosphor plate 131.

  A translucent member 110C according to the third embodiment is formed in a plano-convex lens shape as shown in FIGS. 10 and 11, and an exit surface 112C is formed on the convex lens surface side, and on the plane side (bottom surface 170 side). An incident surface 111C is formed. The bottom surface 170 forms a concave incident surface 111C at the center, and forms the periphery of the incident surface 111C in an annular flat surface.

The entrance surface 111C and the exit surface 112C are refracting surfaces having a convex shape in the same direction (upward in FIG. 11) of the optical axis 140C of light from the wavelength conversion unit 132 (see FIG. 9), and the exit surface 112C is incident It is formed larger than the surface 111C.
The light transmitting member 110C is disposed on the phosphor plate 131 so that the light incident surface 111C side faces the wavelength conversion unit 132 and covers the wavelength conversion unit 132, as shown in FIG. In this example, the light-transmissive member 110C has a bottom surface 170 (annular ring) whose portion contacting the top surface of the phosphor plate 131 is fixed to the phosphor plate 131 by an adhesive.

  The incident surface 111 </ b> C is provided with a recess 115 at the position of the light transmitting member 110 facing the wavelength conversion unit 132. The concave portion 115C is for accommodating the wavelength conversion unit 132 and condensing the light from the wavelength conversion unit 132. By providing the concave portion 115C in the translucent member 110C, a gap is formed when the wavelength conversion part 132 is covered by the translucent member 110C, and a medium (air) in which light is refracted is interposed.

  As shown in FIG. 10, the laser beam passage 113C of the translucent member 110C is a hole. One end 118C of the laser beam passage 113C is disposed on a circumferential surface (side surface) which is a part of the emission surface 112C. Further, the other end 119C of the laser beam passage 113C is formed in communication with the recess 115C.

  The light emitting device 100C guides the laser beam B to the wavelength conversion unit 132 (see FIG. 9) through the laser beam path 113 penetrating the light transmitting member 110C from the direction inclined with respect to the optical axis 140C (see FIG. 11). It is a structure. Therefore, as shown in FIG. 12, it is preferable that the beam shape 200 has an elliptical shape in which the spread angle in the horizontal direction is larger than the spread angle in the vertical direction. In this case, the light distribution is better than when the spread angle in the horizontal direction is an elliptical shape smaller than the spread angle in the vertical direction.

  Next, an optical path of light emission by the light emitting device 100C will be described with reference to FIG. 9 and FIG. As shown in FIG. 9, in the light emitting device 100C, color mixing is achieved by mixing the fluorescence excited by the wavelength converter 132 with the laser light B from the semiconductor laser device 122 and the laser light reflected by the wavelength converter 132. Perform conversion (wavelength conversion). When the converted light is incident on the incident surface 111C of the light transmitting member 110C, it is refracted at the incident surface 111C and emitted from the output surface 112C as parallel light. That is, the color converted (wavelength converted) light including the light of the Lambertian light distribution is subjected to light distribution control so as to be condensed into parallel light by the light transmitting member 110C and then emitted.

  In the light emitting device 100C according to the present embodiment, since the laser light path 113C of the light transmitting member 110C is formed of the holes formed along the beam shape 200 of the laser light B as shown in FIG. Influence on the light can be minimized.

Note that various modifications of the translucent member, the optical member, and the light emitting device according to the first to third embodiments described above will be listed below.
In the light-transmissive member 110 shown in FIG. 5, the inner bottom surface 116 of the recess 115 is formed in a convex shape toward the opening of the recess 115, but the present invention is not limited thereto. It may be a curved surface or a flat surface. Even when the inner bottom surface 116 is, for example, a flat surface, the refractive index of the medium (air) in the concave portion 115 and the light transmission when the wavelength conversion portion 132 (see FIG. 1) is covered with the light transmission member 110 Since there is a difference from the refractive index of the sexing member 110, it is possible to refract light incident on the inner bottom surface 116 from the wavelength conversion unit 132 to control light distribution.

  In the translucent member 110 shown in FIG. 5, the output surface 112 is formed to be flat, but the present invention is not limited to this. The output surface 112 is formed in a convex shape toward the opening of the recess 115 It may be a concave shape or a shape in which the surface is embossed to form fine irregularities. According to the emission surface 112 of such a form, light emitted from the emission surface 112 can be diffused or condensed.

In the light emitting device 100B shown in FIG. 7, the positions where the two laser beams B are respectively irradiated on the phosphor plate 131 are the same in the illustrated form, but may be different. As illustrated, when the two laser beams B are irradiated at the same position, the light emission output can be increased without changing the light distribution, as compared with the case where one light source unit 120 is provided. .
On the other hand, when the positions where the two laser beams B are respectively irradiated in the phosphor plate 131 are different (including partial overlap), the heat generation of the wavelength conversion unit 132 can be dispersed, so the deterioration of the wavelength conversion unit 132 due to heat generation The light emission output can be increased as compared with the case where the number of light source body portions 120 is one.

  Although the translucent member 110B shown in FIG. 8 includes the two laser beam paths 113, the present disclosure is not limited to this, and the number of the laser beam paths 113 may be three or more. . For example, three laser beam paths 113 may be formed at intervals of 120 degrees in the circumferential direction on the side surface of the light transmissive member 110B. In this case, in the light emitting device using the light transmitting member 110B, the three light source body portions 120 and the three reflecting mirrors 160 may be provided in accordance with the arrangement of the respective laser light paths 113.

  The light emitting device 100 shown in FIG. 1 or 100C shown in FIG. 9 changes the direction of the light receiving unit 130 and then adds the reflecting mirror 160 (see FIG. 7), thereby irradiating the laser beam B and the light emitting device. It can be deformed so as to have the same direction as the light emission direction of. That is, the light emitting device according to the present disclosure includes the light transmitting member 110 or the light transmitting member 110C, the light receiving portion 130, the one light source body portion 120, and the one reflecting mirror 160. It does not matter.

  The translucent member 110 according to the first embodiment and the translucent member 110B according to the second embodiment are formed of a collimator lens, and the translucent member 110C according to the third embodiment is described as being formed of a plano-convex lens However, in the translucent member according to the present disclosure, the lens shape is not limited to these. For example, the present invention can be applied to a wide range of lenses such as cylindrical lenses and concave lenses.

  The light emitted from the semiconductor laser device 122 shown in FIG. 2 is not limited to blue, and may be, for example, light in the short wavelength side of ultraviolet to visible light. Plural kinds of phosphors may exist in the wavelength conversion unit 132 shown in FIG. We decided to obtain white color by mixing color of blue and yellow using yellow phosphor, but if we use phosphor of red light emission and phosphor of green light together instead of yellow phosphor, it is blue By mixing red, green and green, white can be obtained.

  In the light emitting device 100 shown in FIG. 1, the orientation of the light receiving unit 130 may be changed in a certain casing. For example, the laser from the semiconductor laser device 122 is installed in the housing so that the heat dissipation structure 133 of the light receiving unit 130 can change its direction around the axis C (see FIG. 1) and the direction of the light receiving unit 130 is changed. The size of the groove or hole of the laser light passage 113 may be set appropriately so that light is not blocked by the light transmitting member 110. In this case, by changing the direction of the light receiving unit 130 during the irradiation of the laser light, it is possible to change the direction of illumination by light emission, so the light emitting device 100 is suitable for the application of the lighting device.

100, 100B, 100C Light-emitting devices 101, 101B, 101C Optical members 110, 110B, 110C Translucent members 111, 111C Incident surfaces 112, 112C Emitting surfaces 113, 113C Laser light path 114 Sides 115, 115C Recesses 116 Inner bottom surface 117 Side face 118, 118C End part of laser light passage 119, 119C End of laser light passage 120 Light source unit 121 Substrate 122 Semiconductor laser device 123 Heat dissipation structure 124 Connection member 125 Connector 130 Light receiving unit 131 Phosphor plate 132 Wavelength conversion unit 133 Heat dissipation structure 136 Connecting member 140, 140C Optical axis 150 Support 160 Reflector 170 Bottom

Claims (8)

A laser light passage for passing laser light from the semiconductor laser device;
An incident surface which passes through the laser light path and enters light obtained by wavelength-converting the laser light by a wavelength conversion unit;
And the light-transmitting member and a emission surface for emitting a substantially parallel light condenses the light incident on the incident surface,
The wavelength conversion unit disposed opposite to the incident surface of the light-transmissive member;
A phosphor plate provided with the wavelength conversion unit on one side;
A heat dissipation structure attached to the other side of the phosphor plate;
The laser beam path comprises a groove or hole, Ri Na is formed so as to be inclined with respect to the optical axis of the light from the wavelength converting part,
The incident surface is provided by forming a recess at a position of the light-transmissive member facing the wavelength conversion unit,
The light transmitting member is an optical member disposed so as to cover the wavelength converting portion with the concave portion with a gap from the wavelength converting portion. The light transmitting member includes a side surface that reflects light incident from the wavelength conversion unit to the incident surface and guides the light to the exit surface.
The optical member according to claim 1, wherein an end of the laser light path is formed on the side surface. The translucent member is formed in a plano-convex lens shape, the emitting surface is formed on the convex lens surface, the optical member according to claim 1 or claim 2 wherein the entrance surface to the plane side. The optical member according to claim 3 , wherein an end of the laser light path is disposed on the emission surface. The light-emitting device provided with the optical member as described in any one of Claims 1-4, and the semiconductor laser apparatus installed in the position which irradiates a laser beam to the said wavelength conversion part from the said laser beam path. The light emitting device according to claim 5 , further comprising: a reflecting mirror that reflects the laser beam from the semiconductor laser device and guides the laser beam to the laser beam path of the translucent member. The light emitting device according to claim 6 , wherein the semiconductor laser device is positioned closer to the light incident surface than the light emitting surface of the light transmitting member as viewed in the optical axis direction. A plurality of the laser light paths are formed in the light-transmissive member, and the plurality of semiconductor laser devices and a plurality of reflecting mirrors for respectively guiding laser light to the plurality of laser light paths are provided. The light emitting device according to claim 5 , wherein laser light from the plurality of semiconductor laser devices is irradiated to the wavelength conversion unit via the reflecting mirror.

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