CN112822863A - PCB bottom plate printing method - Google Patents
PCB bottom plate printing method Download PDFInfo
- Publication number
- CN112822863A CN112822863A CN202011608220.4A CN202011608220A CN112822863A CN 112822863 A CN112822863 A CN 112822863A CN 202011608220 A CN202011608220 A CN 202011608220A CN 112822863 A CN112822863 A CN 112822863A
- Authority
- CN
- China
- Prior art keywords
- area
- bottom plate
- ink
- pcb bottom
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 238000001514 detection method Methods 0.000 claims abstract description 4
- 238000000016 photochemical curing Methods 0.000 claims abstract description 4
- 238000005406 washing Methods 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000010019 resist printing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 5
- 238000007790 scraping Methods 0.000 description 3
- 241001268993 Heterochrosis Species 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Methods (AREA)
Abstract
The invention discloses a PCB bottom plate printing method, which comprises the following steps of S1 resistance welding pretreatment: the processing linear speed is 3M/S; s2 printing: printing by using the photosensitive black ink with the viscosity of 120-150 IV; s3 pre-baking: pre-baking at 70 deg.C for 20 min; s4 exposure: taking an area which is 2mil larger than the area containing the circuit, the bonding pad and the large copper surface in the PCB bottom plate as a first area, taking an area except the first area as a second area, and exposing a negative film at the second area to ensure that the ink of the second area is subjected to photocuring, and the first area is not covered by the ink; s5 developing: washing away the first areas of unreacted ink with a developer solution, leaving second areas that have been photopolymerized; s6 detection: detecting whether the PCB bottom plate is qualified or not; s7 baking sheet: the PCB bottom plate is baked after being detected to be qualified, and the problem that the PCB bottom plate is scraped to be scratched to cause scrapping is solved by adding a new process before resistance welding printing, so that the product yield is ensured, the production cost is reduced, the rejection rate is greatly reduced, and the quality is improved.
Description
Technical Field
The invention belongs to the technical field of PCB manufacturing, and particularly relates to a PCB bottom plate printing method.
Background
For military industry and automobile electronic products made of embedded high-frequency materials, customers have strict appearance requirements, and slight substrate color difference and scratch are not allowed to be accepted, so that a large number of PCB products with qualified electrical performance and good reliability are removed and scrapped corresponding to the strict appearance requirements of factories, and therefore, the production cost is high, and the yield is low.
Disclosure of Invention
The embodiment of the application provides a PCB bottom plate printing method, and the problem that scraping of the PCB bottom plate causes scrapping is solved by adding a new process before resistance welding printing, so that the product yield is ensured, the production cost is reduced, the rejection rate is greatly reduced, and the quality is improved.
The technical scheme provided by the embodiment of the application is as follows:
a PCB bottom plate printing method comprises the following steps before solder resist printing:
s1 solder resist pretreatment: the oxide layer, oil stain, fingerprint and other dirt on the board surface are removed, the linear speed of the treatment is 3M/S, the contact area of the solder resist ink and the board surface can be increased, and the solder resist ink is firmer;
s2 printing: printing by adopting a 120T screen plate empty screen and using photosensitive black ink with the viscosity of 120-150IV, standing the ink for 20 minutes, and controlling the wet weight to be 1.0-1.5 g;
s3 pre-baking: pre-baking at 70 ℃ for 20min to reduce internal stress in the plate and reduce expansion and contraction deformation of the plate during production;
s4 exposure: taking an area which is 2mil larger than the area containing the circuit, the bonding pad and the large copper surface in the PCB bottom plate as a first area, taking an area except the first area as a second area, and exposing a negative film at the second area to ensure that the ink of the second area is subjected to photocuring, and the first area is not covered by the ink;
s5 developing: washing away the first area of the unreacted printing ink by using a developing solution to leave a second area which is subjected to photopolymerization, wherein the processing linear speed is 2-3M/S;
s6 detection: detecting whether the electrical performance and the appearance condition of the PCB bottom plate are qualified or not;
s7 baking sheet: and (5) detecting to be qualified, and baking the PCB bottom plate under the condition of 150 ℃/30 MIN.
The invention has the beneficial effects that:
through newly-increased technology before hindering the printing of welding, solved the PCB bottom plate and scraped the flower and lead to condemned problem, the flower of scraping of PCB bottom plate obtains obviously improving, covers the heterochrosis of PCB bottom plate completely, scrapes the flower anomaly to guarantee the product yield, reduce manufacturing cost, greatly reduced disability rate promotes quality.
Drawings
FIG. 1 is a flow chart of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
To facilitate an understanding of the present invention for those skilled in the art, the present invention will be described in further detail below with reference to specific embodiments and accompanying drawings.
A PCB bottom plate printing method comprises the following steps before solder resist printing:
s1 solder resist pretreatment: the oxide layer, oil stain, fingerprint and other dirt on the board surface are removed, the linear speed of the treatment is 3M/S, the contact area of the solder resist ink and the board surface can be increased, and the solder resist ink is firmer;
s2 printing: printing by adopting a 120T screen plate empty screen and using photosensitive black ink with the viscosity of 120-150IV, standing the ink for 20 minutes, and controlling the wet weight to be 1.0-1.5 g;
s3 pre-baking: pre-baking at 70 ℃ for 20min to reduce internal stress in the plate and reduce expansion and contraction deformation of the plate during production;
s4 exposure: taking an area which is 2mil larger than the area containing the circuit, the bonding pad and the large copper surface in the PCB bottom plate as a first area, taking an area except the first area as a second area, and exposing a negative film at the second area to ensure that the ink of the second area is subjected to photocuring, and the first area is not covered by the ink;
s5 developing: washing away the first area of the unreacted printing ink by using a developing solution to leave a second area which is subjected to photopolymerization, wherein the processing linear speed is 2-3M/S;
s6 detection: detecting whether the electrical performance and the appearance condition of the PCB bottom plate are qualified or not;
s7 baking sheet: and (5) detecting to be qualified, and baking the PCB bottom plate under the condition of 150 ℃/30 MIN.
The invention has the beneficial effects that:
through newly-increased technology before hindering the printing of welding, solved the PCB bottom plate and scraped the flower and lead to condemned problem, the flower of scraping of PCB bottom plate obtains obviously improving, covers the heterochrosis of PCB bottom plate completely, scrapes the flower anomaly to guarantee the product yield, reduce manufacturing cost, greatly reduced disability rate promotes quality.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (1)
1. A PCB bottom plate printing method is characterized by comprising the following steps before solder resist printing:
s1 solder resist pretreatment: removing oxide layers, oil stains, fingerprints and other dirt on the board surface, wherein the linear speed of treatment is 3M/S;
s2 printing: printing by adopting a 120T screen plate empty screen and using photosensitive black ink with the viscosity of 120-150IV, standing the ink for 20 minutes, and controlling the wet weight to be 1.0-1.5 g;
s3 pre-baking: pre-baking at 70 deg.C for 20 min;
s4 exposure: taking an area which is 2mil larger than the area containing the circuit, the bonding pad and the large copper surface in the PCB bottom plate as a first area, taking an area except the first area as a second area, and exposing a negative film at the second area to ensure that the ink of the second area is subjected to photocuring, and the first area is not covered by the ink;
s5 developing: washing away the first area of the unreacted printing ink by using a developing solution to leave a second area which is subjected to photopolymerization, wherein the processing linear speed is 2-3M/S;
s6 detection: detecting whether the electrical performance and the appearance condition of the PCB bottom plate are qualified or not;
s7 baking sheet: and (5) detecting to be qualified, and baking the PCB bottom plate under the condition of 150 ℃/30 MIN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011608220.4A CN112822863A (en) | 2020-12-30 | 2020-12-30 | PCB bottom plate printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011608220.4A CN112822863A (en) | 2020-12-30 | 2020-12-30 | PCB bottom plate printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112822863A true CN112822863A (en) | 2021-05-18 |
Family
ID=75855568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011608220.4A Pending CN112822863A (en) | 2020-12-30 | 2020-12-30 | PCB bottom plate printing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112822863A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4088545A (en) * | 1977-01-31 | 1978-05-09 | Supnet Fred L | Method of fabricating mask-over-copper printed circuit boards |
| CN108012443A (en) * | 2017-11-29 | 2018-05-08 | 惠州市特创电子科技有限公司 | A kind of wiring board welding resistance printing method |
| CN110366324A (en) * | 2019-08-22 | 2019-10-22 | 星河电路（福建）有限公司 | A kind of Gao Houtong pcb board welding resistance green oil silk screen printing process of improvement |
| CN112020237A (en) * | 2020-08-31 | 2020-12-01 | 全成信电子（深圳）股份有限公司 | Solder mask manufacturing process method for high-power thick copper circuit board |
-
2020
- 2020-12-30 CN CN202011608220.4A patent/CN112822863A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4088545A (en) * | 1977-01-31 | 1978-05-09 | Supnet Fred L | Method of fabricating mask-over-copper printed circuit boards |
| CN108012443A (en) * | 2017-11-29 | 2018-05-08 | 惠州市特创电子科技有限公司 | A kind of wiring board welding resistance printing method |
| CN110366324A (en) * | 2019-08-22 | 2019-10-22 | 星河电路（福建）有限公司 | A kind of Gao Houtong pcb board welding resistance green oil silk screen printing process of improvement |
| CN112020237A (en) * | 2020-08-31 | 2020-12-01 | 全成信电子（深圳）股份有限公司 | Solder mask manufacturing process method for high-power thick copper circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210518 |