CN112820546A

CN112820546A - Capacitor, multilayer capacitor, and method for manufacturing multilayer capacitor

Info

Publication number: CN112820546A
Application number: CN202011643619.6A
Authority: CN
Inventors: 杨凯; 宁连才; 陈琛; 李如升; 秦钟华; 靳博; 陈绪鑫; 陈新华; 张国荣
Original assignee: State Run Factory 4326 of China Zhenhua Group Xinyun Electronic Comp and Dev Co Ltd
Current assignee: State Run Factory 4326 of China Zhenhua Group Xinyun Electronic Comp and Dev Co Ltd
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-05-18

Abstract

The present application relates to a capacitor, a laminated capacitor, and a method of manufacturing a laminated capacitor. The laminated capacitor of the present application includes: the packaging structure comprises a plurality of monomers, a packaging body, a plurality of conducting layers, a plurality of conducting gaskets, at least one anode lead and at least one cathode lead, wherein any one of the monomers comprises a monomer anode end, a monomer cathode end and an isolation glue line, and the monomers are electrically connected to form a core group; one conducting layer is connected between any two adjacent monomer negative terminals; a conductive gasket is connected between the positive terminals of any two adjacent single bodies; a positive electrode lead is electrically connected with the positive electrode of the core group through the conductive gasket; a negative electrode lead is electrically connected with the negative electrode of the core group through the conducting layer; therefore, the conductive gasket and the conductive layer are arranged, so that any two adjacent monomers can be firmly connected, the yield of the large-size laminated capacitor is improved, and the capacity of the large-size laminated capacitor is improved.

Description

Capacitor, multilayer capacitor, and method for manufacturing multilayer capacitor

Technical Field

The application relates to the technical field of capacitors, in particular to a capacitor, a laminated capacitor and a manufacturing method of the laminated capacitor.

Background

The laminated solid-state aluminum electrolytic capacitor is a novel chip electronic component product which takes a conductive polymer material with high conductivity as a solid electrolyte. The conventional laminated aluminum capacitor has dimensions of 7.3mm × 4.3mm × 1.9mm, 7.3mm × 4.3mm × 2.8mm, and 7.3mm × 4.3mm × 4.3 mm. The large size of the stacked capacitor limits the application range and development prospect due to the difficulty of manufacturing.

The prior art has the following problems when preparing a large-size laminated capacitor:

(1) two adjacent monomers are connected insecurely, and when the number of layers of monomer is too much to be greater than 12 layers, because two adjacent monomers are connected insecurely, can appear in user's use or test process that the positive pole becomes flexible the capacity that causes reduces, loss increase, ESR increase etc. phenomenon.

(2) Epoxy molding encapsulation cannot be realized for encapsulating large-sized ultra-thin cores or core groups.

(3) The epoxy resin plastic package mould pressing package can not realize full sealing.

(4) The preparation of the special-shaped laminated capacitor cannot be realized.

Disclosure of Invention

It is an object of the present application to provide a multilayer capacitor which is capable of producing a surface area of maximum area greater than 31.39mm²The multilayer capacitor of (1).

The present application further aims to provide a stacked capacitor, wherein two adjacent single bodies are connected more firmly.

The present application further provides a stacked capacitor, which has a good packaging effect.

It is also an object of the present application to provide a capacitor which is capable of producing a surface area of maximum area greater than 31.39mm²The capacitor of (2).

It is also an object of the present application to provide a method of manufacturing a multilayer capacitor capable of manufacturing a surface area of maximum area greater than 31.39mm²The laminated capacitor has the advantages that the connection of the two adjacent monomers is firm, and the packaging effect is good.

In order to achieve the above object, the embodiments of the present application are implemented as follows:

a stacked capacitor, comprising: the packaging structure comprises a plurality of monomers, a packaging body, a plurality of conducting layers, a plurality of conducting gaskets, at least one anode lead and at least one cathode lead, wherein each monomer comprises a monomer anode end, a monomer cathode end and an isolation glue line positioned between the monomer anode end and the monomer cathode end, and the monomers are electrically connected to form a core group; one conducting layer is connected between any two adjacent monomer negative terminals; a conductive gasket is connected between the positive terminals of any two adjacent single bodies; a positive electrode lead is electrically connected with the positive electrode of the core group through the conductive gasket; a negative electrode lead is electrically connected with the negative electrode of the core group through the conducting layer; wherein the area of the largest surface of the package body is greater than 31.39mm²。

In one embodiment, the stacked capacitor further comprises: and the lugs are connected with the packaging body and are respectively electrically connected with the anode lead and the cathode lead.

In one embodiment, the conductive pad is made of a conductive material having a melting point in the range of 300-1200 ℃.

In one embodiment, the material of the positive terminal of the cell includes metal; the material of the conductive gasket is the same as that of the monomer positive terminal, or the material of the conductive gasket comprises an alloy of at least one metal element selected from the materials of the monomer positive terminal.

In one embodiment, the material of the positive terminals of the cells includes aluminum, and the material of the conductive pads includes aluminum or an aluminum alloy.

In one embodiment, the package is a packaging film, and the package comprises an inner barrier layer, a barrier layer and an outer barrier layer which are connected from inside to outside; the inner barrier layer is made of one or more of nylon, polyester resin, modified nylon and modified polyester resin; the material of the barrier layer comprises metal; the material of the outer resistance layer comprises one or more of polypropylene, polyethylene, modified polypropylene and modified polyethylene.

In one embodiment, a first adhesive is disposed between the inner barrier layer and the barrier layer, and between the barrier layer and the outer barrier layer.

In one embodiment, the package includes a housing and a sealant layer disposed in the housing.

In one embodiment, the conductive layer is made of a conductive material; the negative end of each monomer comprises a first metal layer, a first dielectric layer, a conductive polymerization layer, a graphite layer and a conductive silver layer which are connected from inside to outside; the conductive polymer layer is made of one or more of polypyrrole, polythiophene, polyaniline, polyphenyl propylamine, polypyrrole derivatives, polythiophene derivatives, polyaniline derivatives and polyphenyl propylamine derivatives.

In one embodiment, the conductive polymeric layer includes a first polymeric layer and a second polymeric layer, the first polymeric layer disposed between the first dielectric layer and the second polymeric layer.

In one embodiment, the conductive layer is made of aluminum; the negative end of any monomer comprises a first metal layer, a first dielectric layer and a conductive polymerization layer which are connected from inside to outside; the conductive polymer layer is made of one or more of polypyrrole, polythiophene, polyaniline, polyphenyl propylamine, polypyrrole derivatives, polythiophene derivatives, polyaniline derivatives and polyphenyl propylamine derivatives.

In one embodiment, the isolation glue line is linear or closed curve.

In one embodiment, the package has a maximum surface with a length greater than 7.3mm and a width greater than 4.3 mm.

In one embodiment, the largest surface of the package body is triangular, trapezoidal, elliptical, circular, square, polygonal, or irregular.

In one embodiment, any two of the single cells in the core set are stacked up and down, and the positive electrode lead and the negative electrode lead are respectively connected to two opposite sides of the core set.

In one embodiment, in the core set, two monomers form a connecting unit, and in each connecting unit, the positive ends of the two monomers are abutted and arranged side by side left and right; the connecting units are provided with a plurality of connecting units which are stacked up and down to form a core group; at least two negative leads are arranged and are respectively connected with two opposite sides of the core group; the positive lead is connected to the middle position of the core group.

A stacked capacitor, comprising: the packaging structure comprises a plurality of monomers, a packaging body, a plurality of conducting layers, a plurality of conducting gaskets, at least one anode lead and at least one cathode lead, wherein each monomer comprises a monomer anode end, a monomer cathode end and an isolation glue line positioned between the monomer anode end and the monomer cathode end, and the monomers are electrically connected to form a core group; the packaging body is packaged outside the chip set; one conducting layer is connected between any two adjacent monomer negative terminals; a conductive gasket is connected between the positive terminals of any two adjacent single bodies; a positive electrode lead is electrically connected with the positive electrode of the core group through the conductive gasket; a negative electrode lead is electrically connected with the negative electrode of the core group through the conducting layer; wherein, the conductive gasket is made of conductive material with the melting point range of 300-1200 ℃.

A stacked capacitor, comprising: the packaging structure comprises a plurality of monomers, a packaging body, a plurality of conducting layers, a plurality of conducting gaskets, at least one anode lead and at least one cathode lead, wherein each monomer comprises a monomer anode end, a monomer cathode end and an isolation glue line positioned between the monomer anode end and the monomer cathode end, and the monomers are electrically connected to form a core group; one conducting layer is connected between any two adjacent monomer negative terminals; a conductive gasket is connected between the positive terminals of any two adjacent single bodies; a positive electrode lead is electrically connected with the positive electrode of the core group through the conductive gasket; a negative electrode lead is electrically connected with the negative electrode of the core group through the conducting layer; the packaging body comprises an inner barrier layer, a barrier layer and an outer barrier layer which are connected from inside to outside.

A capacitor, comprising: the single body comprises a single body positive end, a single body negative end and an isolation glue line positioned between the single body positive end and the single body negative end; the packaging body is packaged outside the single body; one positive lead is electrically connected with the positive end of the monomer; a negative lead is electrically connected with the single negative end; wherein the area of the largest surface of the package body is greater than 31.39mm²。

A method of manufacturing a stacked capacitor, comprising:

cutting the initial material into single pieces with preset sizes;

coating isolation glue at a preset position of the single piece, wherein the isolation glue divides the single piece into a single piece positive end and a single piece negative end;

preparing a conductive polymerization layer, a graphite layer and a conductive silver layer on the single negative electrode end to obtain a monomer;

a plurality of monomer stacks are placed;

connecting any two adjacent single positive terminals through a conductive gasket;

filling conductive paste into any two adjacent single negative terminals of the laminated monomers to form a conductive layer, so that the monomers are electrically connected to form a core group;

at least one negative electrode lead and at least one positive electrode lead are respectively connected to the core set;

and packaging the packaging body in the core group to obtain the laminated capacitor.

In one embodiment, the packaging of the package before the chip set is formed into the stacked capacitor includes:

connecting the outer barrier layer with the barrier layer;

and connecting the barrier layer with the inner barrier layer to obtain the packaging body.

In one embodiment, connecting any two adjacent monolithic positive terminals by a conductive gasket comprises:

placing a conductive gasket between any two adjacent single-chip positive terminals;

compressing the conductive gasket and the single positive terminal;

welding the conductive gasket with the single positive electrode end;

wherein, the conductive gasket is made of conductive material with the melting point range of 300-1200 ℃.

In one embodiment, at least one negative electrode lead and at least one positive electrode lead are respectively connected to the core set, including:

electrically connecting at least one positive lead with the positive electrode of the core group through the conductive gasket;

electrically connecting at least one negative lead with the negative electrode of the core group through the conductive layer;

the electrode lugs are respectively and electrically connected with the anode lead and the cathode lead.

In one embodiment, the connection mode of the conductive gasket and the positive end of the single sheet is resistance welding, ultrasonic welding, piercing riveting, cold riveting or laser welding.

In one embodiment, the connection modes of the positive electrode lead and the core set, the negative electrode lead and the core set, the tab and the negative electrode lead, and the tab and the positive electrode lead are resistance welding, ultrasonic welding, riveting or laser welding.

Compared with the prior art, the beneficial effect of this application is:

the conductive gasket is connected with the positive ends of any two adjacent monomers, and the conductive layer is connected with the negative ends of any two adjacent monomers, so that any two adjacent monomers can be firmly connected, the yield of the large-size laminated capacitor is improved, and the capacity of the large-size laminated capacitor is improved in a multi-layer parallel mode.

Furthermore, this application conducting gasket can be laser welding with the connected mode of monomer positive terminal, and the material of this application conducting gasket chooses for use the material that is close with monomer positive terminal melting point, has improved welding quality, has reduced the appearance probability that can appear the capacity that positive pole becomes flexible and arouses and reduce, the loss increase, or phenomenon such as ESR (Equivalent Series Resistance) increase in user's use or test process chip group.

In addition, the packaging body composed of the inner barrier layer, the barrier layer and the outer barrier layer is used for packaging, or the shell body is packaged in a pouring sealant packaging mode, so that the packaging effect is improved, no pressure exists in the packaging process, and the damage to the core set is avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a stacked capacitor according to an embodiment of the present application.

Fig. 2 is a schematic partial structure diagram of a package according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a stacked capacitor according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a single body according to an embodiment of the present disclosure.

Fig. 5 is a schematic structural diagram of a single body according to an embodiment of the present disclosure.

Fig. 6 is a schematic structural diagram of a single body according to an embodiment of the present disclosure.

Fig. 7 is a schematic structural diagram of a single body according to an embodiment of the present disclosure.

Fig. 8 is a schematic structural diagram of a single body according to an embodiment of the present disclosure.

Fig. 9 is a front view of a partial structure of a stacked capacitor according to an embodiment of the present application.

Fig. 10 is a top view of a portion of a stacked capacitor according to an embodiment of the present application.

Fig. 11 is a top view of a portion of a stacked capacitor according to an embodiment of the present application.

Fig. 12 is a flowchart illustrating a method for manufacturing a stacked capacitor according to an embodiment of the present application.

Fig. 13 is a flowchart illustrating a method for manufacturing a stacked capacitor according to an embodiment of the present application.

Icon: 1-a stacked capacitor; 200-a package; 210-inner barrier layer; 220-a barrier layer; 230-an outer resist layer; 240-a first binder; 260-a housing body; 270-encapsulating adhesive layer; 300-core group; 310-a monomer; 311-cell positive terminal; 311 a-second metal layer; 311 b-second dielectric layer; 312 — cell negative terminal; 312a — a first metal layer; 312 b-a conductive polymeric layer; 312 c-graphite layer; 312 d-a conductive silver layer; 312 e-first dielectric layer; 312 f-electrolyte layer; 313-an isolation glue line; 500-pole ear; 600-a conductive layer; 700-a conductive pad; 710-laser welding spot; 800-positive lead; 900-negative lead; 801-a first connection point; 901-second connection point.

Detailed Description

The terms "first," "second," "third," and the like are used for descriptive purposes only and not for purposes of indicating or implying relative importance, and do not denote any order or order.

Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it should be noted that the terms "inside", "outside", "left", "right", "upper", "lower", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally arranged when products of the application are used, and are used only for convenience in describing the application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the application.

In the description of the present application, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements.

The technical solution of the present application will be clearly and completely described below with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a stacked capacitor 1 according to an embodiment of the present application. A multilayer capacitor 1 includes: each of the plurality of cells 310 includes a cell positive terminal 311, a cell negative terminal 312, and an isolation glue line 313 between the cell positive terminal 311 and the cell negative terminal 312, and the plurality of cells 310 are electrically connected to form the cell group 300.

In order to increase the capacity of the multilayer capacitor 1, in the present embodiment, the plurality of cells 310 in the core set 300 may be connected in parallel in multiple layers, any two cells 310 in the core set 300 are stacked up and down, the cell positive terminals 311 of two adjacent cells 310 are connected, and the cell negative terminals 312 of two adjacent cells 310 are connected, at this time, the positive electrode and the negative electrode of the core set 300 are respectively located at the left and right sides of the core set 300, and one positive lead 800 and one negative lead 900 are respectively connected to the left and right sides of the core set 300.

In another embodiment, in order to increase the capacity of the multilayer capacitor 1, the number of layers may be increased by stacking the multi-core groups 300 in parallel.

In this embodiment, the area of the largest surface of the package 200 is greater than 31.39mm²Wherein the largest surface is the surface having the largest area. Further, the maximum surface of the package body 200 has a length greater than 7.3mm and a width greater than 4.3 mm. The structure of the package 200 may be a rectangular parallelepiped structure, a cylindrical structure or a special-shaped structure, wherein the shape of the largest surface of the package 200 is a triangle, a trapezoid, an ellipse, a circle, a square, a polygon or a special shape, including but not limited to a ring, a square, or a special shapeDiamond, roof, letter row, polygon, and various irregular shapes.

In the core set 300, any two adjacent cell negative terminals 312 are connected through the conductive layer 600; any two adjacent cell positive terminals 311 are connected by a conductive gasket 700. In the embodiment, any two adjacent monomer positive terminals 311 are connected through the conductive gasket 700, and any two adjacent monomer negative terminals 312 are connected through the conductive layer 600, so that any two adjacent monomers 310 can be firmly connected, the yield of the large-size stacked capacitor 1 is improved, and the capacity of the large-size stacked capacitor 1 is improved in a multi-layer parallel connection manner. The conductive layer 600 may be made of copper foil, aluminum foil, silver or nickel, and in this embodiment, the conductive layer 600 is made of conductive silver paste.

The higher the melting point of conductive pad 700, the more heat that needs to be generated by soldering, and the excessive heat in the moment can cause polymer damage and affect the performance of laminated capacitor 1. The conductive pad 700 of this embodiment is made of a material with a low melting point. The conductive pad 700 is made of a conductive material with a melting point range of 300-: copper, nickel, or aluminum, etc. Wherein, the monomer positive terminal 311 is also made of a conductive material with a melting point range of 300-1200 ℃, such as: copper, nickel, or aluminum, etc.

In one embodiment, the material of the cell positive terminal 311 includes metal; the material of the conductive gasket 700 is the same as the material of the cell positive electrode terminal 311, or the material of the conductive gasket 700 includes an alloy of at least one metal element selected from the materials of the cell positive electrode terminal 311. So set up, then the melting point of conductive gasket 700 is close with monomer positive terminal 311 melting point, welding quality has been improved, can be so that in welding process, conductive gasket 700 can run through the butt fusion effectively with monomer positive terminal 311 together, be in stable molten state, make to connect more firmly, the connection effect is better, furthermore, make the positive pole of core group 300 can resist the corruption of aqueous vapor and foreign ion effectively, make laminated capacitor 1 performance parameter stable, avoid laminated capacitor 1 because of the performance deterioration problem that the moisture absorption arouses under adverse circumstances, laminated capacitor 1's life has been prolonged.

In this embodiment, the material of the cell positive electrode 311 includes aluminum, and the material of the conductive pad 700 includes aluminum or an aluminum alloy. Wherein, when the material of monomer positive terminal 311 includes aluminium, the scheme of aluminium or aluminum alloy is chooseed for use to the material of conductive gasket 700, compares in the scheme that copper was chooseed for use to the material of conductive gasket 700, more can guarantee welding quality, has reduced the probability of appearance that the capacity that the positive pole becomes flexible and arouses reduces, loss increase or ESR increases the phenomenon such as the increase in user's use or test in-process chip group can appear.

The formation voltage of the aluminum foil of the laminated capacitor core is more than 2V, the thickness range of the single positive electrode terminal 311 is 0.05-0.3 mm, the thickness range of the conductive gasket 700 is 0.05-0.5 mm, the thickness range of the conductive gasket 700 is 0.02-3 mm, and the thickness range of the conductive gasket 700 is 0.1-0.2 mm. Still further, the thickness of the conductive pad 700 ranges from 0.08mm to 0.15 mm. The area of the conductive gasket 700 is greater than 1 square millimeter and less than or equal to the area of the connection surface of the cell positive terminal 311.

The number of conductive pads 700 is less than or equal to the number of cells 310, the number of cells 310 is n, and the number of conductive pads 700 may be n, n-1, or n-2.

The connection mode of the conductive gasket 700 and the single positive terminal 311 may be resistance welding, ultrasonic welding, piercing and riveting, cold riveting, laser welding or other heat source welding.

In this embodiment, a laser welding point 710 is disposed at the conductive pad 700, and the conductive pad 700 is connected to the cell positive terminal 311 by laser welding. Compared with resistance welding, laser welding can increase the number of welding layers to more than 12 layers on the basis of ensuring higher welding quality, such as: 40 layers or more.

In another embodiment, the conductive gasket 700 and the positive electrode 311 of the single body are connected by cold riveting, so as to reduce the damage of high temperature to the negative polymer layer of the stacked capacitor 1 during welding, ensure the leakage current of the stacked capacitor 1, have a large connection area, and are firm and reliable, and the contact resistance between the conductive gasket 700 and the positive electrode 311 of the single body is less than 0.8m Ω.

In order to ensure that the connection between the conductive gasket 700 and the cell positive terminal 311 is reliable and free of cold joint, the conductive gasket 700 and the cell positive terminal 311 may be connected by a melt or by piercing through materials at a connection section, for example, the materials of the conductive gasket 700 and the cell positive terminal 311 are overlapped with each other to form a concave pit for closely staggered connection or a piercing rivet needle penetrates through the conductive gasket 700 and the cell positive terminal 311 and is turned over, flattened and riveted together. Further, the connection strength between the conductive gasket 700 and the monomer positive terminal 311 can be greater than or equal to 0.7Kg, and the connection resistance can be less than or equal to 0.0012 Ω by adjusting the control parameters and the precision of the corresponding welding or riveting equipment; the time range of the conductive gasket 700 and the monomer positive terminal 311 for forming the melt is 4-2000 nanoseconds, and the single energy range for forming the melt is 1.0-1.5 millijoules.

A package 200 is packaged outside the core set 300; the core set 300 is electrically connected with a tab 500, and the tab 500 is connected with the package 200; a tab 500 is electrically connected to the conductive pad 700 and the positive electrode of the core set 300 through a positive electrode lead 800; a tab 500 is electrically connected to the conductive layer 600 and the negative electrode of the core set 300 through a negative electrode lead 900.

In this embodiment, a connection point of the positive lead 800 and the tab 500 is a first connection point 801, and the first connection point 801 is located in the package body 200. The connection point of the negative lead 900 and the tab 500 is a second connection point 901, and the first connection point 801 is located in the package body 200.

In this embodiment, the positive lead 800 and the negative lead 900 are led out through the tab 500, and the tab 500 can be fixed to the package body 200 through the tab 500 glue, so that the problem of the sealing performance between the positive lead 800 and the package body 200 and the negative lead 900 is effectively solved, the sealing performance is improved, and moisture and air can be effectively prevented from entering the package body 200 to corrode the internal core set 300. In another embodiment, the positive electrode of the core set 300 may be led out by using a soldering metal tab, a soldering metal tab after bonding a metal sheet, or a direct bonding metal tab to the negative electrode of the core set 300.

The thickness range of the tab 500 is 0.02mm-2mm, the width range of the tab 500 is 2mm-200mm, and the material of the tab 500 can be aluminum, iron, nickel, tin, copper and alloy materials thereof. In one embodiment, the tab 500 is made of tin nickel-plated copper. The tab 500 glue can be yellow glue, black glue, white glue and gray glue, wherein the white glue is a CPP layer (cast polypropylene protective film); the yellow glue material is a CPP layer and a UHR layer (non-woven fabric structure) positioned in the middle of the CPP layer, and the black glue material is a CPP layer and a PEN layer (polyethylene naphthalate film) positioned in the middle of the CPP layer. In this embodiment, the tab 500 is made of tin nickel plated copper. The tab 500 glue may be white glue.

In this embodiment, the capacitance of the multilayer capacitor 1 is large, and then a large leakage current may be generated in the charging and discharging process, and this embodiment may shunt the current by increasing the number of terminals, thereby reducing the influence of the current on the multilayer capacitor 1. The number of the positive leads 800 is 1-3, the number of the negative leads 900 is 1-5, correspondingly, the number of the terminals led out from the positive electrodes is 1-3, and the number of the terminals led out from the negative electrodes is 1-5.

In another embodiment, a capacitor having only one single body 310 further comprises: the single body 310 comprises a single body positive end 311, a single body negative end 312 and an isolation glue line 313 positioned between the single body positive end 311 and the single body negative end 312; the package 200 is packaged outside the single body 310; one positive lead 800 is electrically connected with the monomer positive terminal 311; a negative lead 900 electrically connected to the cell negative terminal 312; the tabs 500 are connected to the package body 200, and the tabs 500 are electrically connected to the positive lead 800 and the negative lead 900, respectively.

Fig. 2 is a schematic diagram illustrating a partial structure of a package 200 according to an embodiment of the present disclosure. The package body 200 is an encapsulation film and includes an inner barrier layer 210, a barrier layer 220, and an outer barrier layer 230 connected from inside to outside. When the package body 200 is packaged outside the core set 300, the barrier layer 220 is disposed in the middle for supporting, protecting the form forming, and preventing moisture from entering; the outer barrier layer 230 is disposed at the outer side for protecting the barrier layer 220 disposed in the middle from being scratched; the inner barrier layer 210 is adjacent to the core set 300 or in contact with the outer surface of the core set 300, so that the inner core set 300 can be prevented from damaging the barrier layer 220 provided in the middle.

The material of the barrier layer 220 includes a ductile metal; the inner barrier layer 210 is made of one or more of nylon (polyamide), polyester resin (PET), modified nylon and modified polyester resin; the material of the outer resistance layer 230 includes one or more of Polypropylene (PP), Polyethylene (PE), modified Polypropylene and modified polyethylene.

Further, the material of the barrier layer 220 includes aluminum, and the material of the inner barrier layer 210 includes one or more of glass fiber reinforced nylon, flame retardant nylon, glass fiber modified polyester resin, and polyolefin modified polyester resin. The material of the resist layer 230 includes a CPP film (cast polypropylene protective film).

A first adhesive 240 is disposed between the inner barrier layer 210 and the barrier layer 220, and between the barrier layer 220 and the outer barrier layer 230. The first adhesive 240 is glue of modified polyolefins and polyurethanes, such that the outer barrier layer 230, the barrier layer 220, and the inner barrier layer 210 are sequentially connected.

In another embodiment, the inner barrier layer 210 and the barrier layer 220, and the barrier layer 220 and the outer barrier layer 230 are connected by MPP, wherein MPP is a modified PP (i.e., an acidic PP) for the metallized polypropylene film, and has a high thermal bonding performance. With the MPP connection, the first adhesive 240 need not be additionally provided.

In the embodiment, the package body 200 composed of the inner barrier layer 210, the barrier layer 220 and the outer barrier layer 230 is used for packaging, and compared with the plastic package mold pressing package, no pressure exists in the packaging process, no damage is caused to the core set 300, the packaging effect is improved, the sealing performance is good, and moisture and air can be effectively prevented from entering the package body 200 to corrode the core set 300.

The package body 200 of the embodiment can be diversified in package shape and package size, and the problems of fixed size and fixed shape of the mold pressing plastic package are effectively solved. The package 200 of the present embodiment has an extremely high barrier property, and the water vapor transmission amount is less than 10^- ³g/m²D.1atm, oxygenThe permeability is less than 0.5cm³/m²D.1atm. The packaging body 200 has good heat sealing performance, and the sealing strength is more than 20N/15 mm. The packaging body 200 has good cold-hot stamping formability, the stamping depth is 1-20mm, the deformation degree is less than 10 degrees, and the packaging body 200 has no defects of layering, cracking or pinhole light leakage and the like. The laminated capacitor 1 of the present embodiment can withstand high temperature and high humidity, and the laminated capacitor 1 of the present embodiment can withstand a high temperature and high humidity test condition of 125 ℃ for more than 2000 hours, and can withstand a high temperature and high humidity test condition of 85 ℃ to 85% RH for more than 1000 hours.

Fig. 3 is a schematic structural diagram of a stacked capacitor 1 according to an embodiment of the present application. The package 200 includes a housing 260 and a potting adhesive layer 270 disposed in the housing 260. The potting adhesive layer 270 is formed by pouring a potting adhesive along the outer surface of the shell body 260 and then curing the potting adhesive. The material of the housing body 260 may be metal or plastic.

In this embodiment, the positive lead 800 and the negative lead 900 may be bent lines led out from the potting adhesive layer 270, wherein the positive lead 800 and the negative lead 900 may be multi-segment metal leads, and the multi-segment metal leads are connected to each other.

In the embodiment, the shell body 260 and the potting adhesive are used for packaging, so that the packaging effect is improved, no pressure exists in the packaging process, and no damage is caused to the core set 300.

In another embodiment, the package 200 is a metal housing or a plastic housing, and is directly packaged.

Please refer to fig. 4, which is a schematic structural diagram of a single body 310 according to an embodiment of the present disclosure. Any single negative terminal 312 comprises a first metal layer 312a, a first dielectric layer 312e, an electrolyte layer 312f, a graphite layer 312c and a conductive silver layer 312d which are connected from inside to outside. The electrolyte layer 312f, graphite layer 312c, and conductive silver layer 312d may be referred to as a cathode layer.

The material of the first metal layer 312a may be aluminum, the material of the first dielectric layer 312e may be aluminum oxide, and the material of the electrolyte layer 312f may be a solid of conductive polymer. The graphite layer 312c may be made of graphite, and the conductive silver layer 312d may be made of silver.

The positive cell terminal 311 includes a second metal layer 311a and a second dielectric layer 311b connected from inside to outside. The material of the second metal layer 311a may be aluminum, and the material of the second dielectric layer 311b may be aluminum oxide. In another embodiment, any of the cell positive terminals 311 has only the second metal layer 311 a.

Please refer to fig. 5, which is a schematic structural diagram of a single body 310 according to an embodiment of the present disclosure. The conductive layer 600 is made of a conductive material, and in this embodiment, the conductive layer 600 is made of conductive silver paste. Any single negative terminal 312 comprises a first metal layer 312a, a first dielectric layer 312e, a conductive polymer layer 312b, a graphite layer 312c and a conductive silver layer 312d which are connected from inside to outside. The conductive polymeric layer 312b, graphite layer 312c, and conductive silver layer 312d may be referred to as a cathode layer.

Wherein the conductive polymer layer 312b can be one of the electrolyte layers 312f of fig. 4. The conductive polymer layer 312b is made of one or more of polypyrrole, polythiophene, polyaniline, polyphenylamine, polypyrrole derivatives, polythiophene derivatives, polyaniline derivatives, and polyphenylamine derivatives. The material of the first metal layer 312a may be aluminum, the material of the first dielectric layer 312e may be aluminum oxide, the material of the graphite layer 312c may be graphite, and the material of the conductive silver layer 312d may be silver. Further, the material of the conductive polymer layer 312b includes one or more of poly-3-methyl-dioxythiophene, poly-3-methylthiophene, poly-3-hexylthiophene, and poly-3-octylthiophene.

In an operation process, different polymerization processes can be selected according to the products of the laminated capacitor 1 with different voltages, the products at the low-voltage section are prepared by adopting a chemical polymerization method or an electrolytic polymerization method, the products at the medium-voltage section are prepared by adopting a chemical polymerization method and a dispersion polymerization method, and the products at the high-voltage section are prepared by adopting a dispersion polymerization method, so that different requirements of the products at different voltage sections can be met, and the polymerization is uniform and consistent.

In another embodiment, the conductive polymeric layer 312b includes a first polymeric layer and a second polymeric layer, the first polymeric layer being disposed between the first dielectric layer 312e and the second polymeric layer.

In the process of forming the conductive polymer layer 312b when the stacked capacitor 1 is manufactured, the conductive polymer layer 312b may be formed in two times, so that the first polymer layer and the second polymer layer are formed in two molding processes, respectively, and finally the conductive polymer layer 312b is composed of the first polymer layer and the second polymer layer. The material of the first polymeric layer and the material of the second polymeric layer may be different or the same. If the material of the first polymeric layer is the same as the material of the second polymeric layer, the morphological densities of the first polymeric layer and the second polymeric layer may be different.

In the present embodiment, the size of the multilayer capacitor 1 may be 1.0mm × 1.0mm × 1.0mm to 500mm × 500mm × 500 mm. The method for manufacturing the multilayer capacitor 1 of the present embodiment may be to adhere silver paste to the cell negative terminals 312, laser-weld the cell positive terminals 311, and stack the cell positive terminals 311 into the core group 300, and then stack the core group 300 into the multilayer capacitor 1 with the designed number of layers.

Please refer to fig. 6, which is a schematic structural diagram of a single body 310 according to an embodiment of the present disclosure. In this embodiment, the conductive layer 600 is made of aluminum, and the conductive layer 600 may be an aluminum pad; any single negative electrode end 312 comprises a first metal layer 312a, a first dielectric layer 312e, and a conductive polymer layer 312b connected from inside to outside, without providing a graphite layer 312c and a conductive silver layer 312 d. The conductive polymer layer 312b may be referred to as a cathode layer.

The conductive polymer layer 312b is made of one or more of polypyrrole, polythiophene, polyaniline, polypyrrole derivatives, polythiophene derivatives, polyaniline derivatives, and polyaniline derivatives.

Please refer to fig. 7, which is a schematic structural diagram of a single body 310 according to an embodiment of the present disclosure. Any monomer 310 comprises a monomer positive end 311, a monomer negative end 312 and an isolation glue line 313 located between the monomer positive end 311 and the monomer negative end 312, in this embodiment, the isolation glue line 313 is a linear type, and the monomer positive end 311 and the monomer negative end 312 are respectively located at two sides of the isolation glue line 313.

Please refer to fig. 8, which is a schematic structural diagram of a single body 310 according to an embodiment of the present disclosure. In this embodiment, the isolation glue line 313 is a closed curve. The cross section of the isolation glue line 313 is in a shape like a Chinese character 'hui', the monomer positive end 311 is positioned on the outer side of the isolation glue line 313, and the monomer negative end 312 is positioned on the inner side of the isolation glue line 313 and surrounded by the isolation glue line 313.

Fig. 9 is a partial structural front view of a stacked capacitor 1 according to an embodiment of the present application. Fig. 10 is a top view of a partial structure of a stacked capacitor 1 according to an embodiment of the present application. Fig. 11 is a top view of a partial structure of a stacked capacitor 1 according to an embodiment of the present application.

In order to increase the capacity of the multilayer capacitor 1, in the present embodiment, the plurality of cells 310 in the core group 300 may be connected in parallel in a bow-tie manner.

The two monomers 310 form a connecting unit, and in each connecting unit, the monomer positive terminals 311 of the two monomers 310 are abutted and arranged side by side left and right; the connection unit is provided in plurality, and the plurality of connection units are stacked up and down and connected in parallel to form a core set 300.

At this time, the positive electrode of the core set 300 is positioned in the middle, and the negative electrode of the core set 300 is positioned at the right and left sides. One positive electrode lead 800 is electrically connected to the positive electrode in the middle of the core set 300, and at least two negative electrode leads 900 are connected to the negative electrodes on the left and right sides of the core set 300 by laser welding or the like.

In another embodiment, the positive lead 800 is electrically connected to the positive electrode of the core set 300 through the conductive pad 700; the negative electrode lead 900 is electrically connected to the negative electrode of the core set 300 through the conductive layer 600.

Referring to fig. 10, a positive lead 800 is directly connected to the cell positive terminals 311 of two adjacent left and right cells 310 by laser welding. The positive lead 800 is provided with a plurality of laser welding spots 710.

Referring to fig. 11, two adjacent left and right cells 310 are connected to a negative electrode lead 900 by laser welding or the like.

In another embodiment, the plurality of cells 310 in the core set 300 are connected in series or in series-parallel, so as to increase the voltage of the stacked capacitor 1. For example, the original voltage of the multilayer capacitor 1 which can only be 50V can reach 100V through series connection, and can reach 150V through three series connections, so that the capacity of the multilayer capacitor 1 with the bow-tie-shaped core can be doubled compared with the capacity of the common multilayer capacitor 1 under the condition of the same layer number.

Fig. 12 is a flowchart illustrating a method for manufacturing the multilayer capacitor 1 according to an embodiment of the present application. The method can be used to produce a stacked capacitor 1 as shown in fig. 1. The manufacturing method of the multilayer capacitor 1 may include the steps of:

step S101: the starting material is cut into individual pieces of predetermined dimensions.

The step can adopt a laser heat source cutting mode. The laser temperature range in this step may be 300-. The single sheet of this step may be an aluminum foil. The preset size in this step can be set according to the maximum area required.

Step S102: and coating isolation glue at the preset position of the single piece, wherein the isolation glue divides the single piece into a single piece positive end and a single piece negative end.

The preset position in this step can be designed according to the length of the single positive terminal and the single negative terminal required. The single positive terminal in this step can be directly used as the single positive terminal 311 in fig. 1, and the single negative terminal can be used as the single negative terminal 312 in fig. 1 after being subjected to polymerization, graphite slurry impregnation, conductive silver slurry impregnation and other treatments.

In this step, after the isolation glue is coated, the aluminum foil in the area below the glue line may be immersed in the forming solution, and the aluminum foil cut on the single sheet cut in the power-on repairing step S101 may be repaired.

The monolithic positive terminal in this step may include the second metal layer 311a and the second dielectric layer 311b as shown in fig. 5, and the monolithic negative terminal in this step may include the first metal layer 312a and the first dielectric layer 312e as shown in fig. 5.

Step S103: a conductive polymeric layer 312b, a graphite layer 312c, and a conductive silver layer 312d are prepared on the monolithic negative terminal, resulting in a monomer 310.

In this step, the single sheet obtained in step 102 is polymerized to form a conductive polymer layer 312b serving as a cathode at the negative end (the area below the glue line) of the single sheet, and then the negative end of the single sheet where the conductive polymer layer 312b is formed is immersed in graphite slurry, a graphite layer 312c is covered on the conductive polymer layer 312b, and then the negative end of the single sheet where the graphite layer 312c is formed is immersed in silver slurry, and a conductive silver layer 312d is covered on the graphite layer 312c, and the cathode is led out, so that the negative end of the single sheet can be converted into the negative end 312 of the single sheet shown in fig. 1 or fig. 5. Among them, the structure composed of the conductive polymer layer 312b, the graphite layer 312c, and the conductive silver layer 312d may be referred to as a cathode layer.

The material of the conductive polymer layer 312b in this step includes one or more of polypyrrole, polythiophene, polyaniline, polyphenylamine, polypyrrole derivatives, polythiophene derivatives, polyaniline derivatives, and polyphenylamine derivatives. The material of the first metal layer 312a may be aluminum, the material of the graphite layer 312c may be graphite, and the material of the conductive silver layer 312d may be silver.

The formation treatment may be performed on the single negative terminal before this step.

Step S104: a plurality of the cells 310 are stacked.

This step places a plurality of monomers 310 in a stack in preparation for subsequent formation of the core set 300. The plurality of single cells 310 may be placed in a single row or in multiple layers, and the placement manner of the plurality of single cells 310 may be designed according to the series, parallel, or series-parallel connection of the stacked capacitors 1 to be manufactured.

Step S105: any two adjacent monolithic positive terminals are connected by a conductive spacer 700.

The conductive pad 700 of this step is made of a conductive material having a melting point range of 300-1200 deg.C. This step can adopt modes such as laser welding, resistance weld, ultrasonic welding, thorn rivet, cold rivet, argon arc welding to connect conductive gasket 700.

Step S106: the conductive layer 600 is formed by filling the conductive paste between any two adjacent monolithic negative terminals, so that the plurality of cells 310 are electrically connected to form the core set 300.

The conductive paste of this step may be a silver paste. Step S106 may be performed simultaneously with step S105 or may be performed sequentially, wherein the fixing of the conductive pad 700 in step S105 may initially form the core group 300, which is beneficial to performing the subsequent filling of the conductive paste.

Step S107: at least one negative electrode lead 900 and at least one positive electrode lead 800 are connected to the core set 300, respectively.

The number of the negative electrode lead 900 and the positive electrode lead 800 of this step may be designed according to the capacity of the multilayer capacitor 1 to be manufactured, so as to reduce the influence of excessive current on the multilayer capacitor 1.

Step S108: the package 200 is packaged in the core set 300 to obtain the multilayer capacitor 1.

The plastic package molding is non-hermetic package, and the step is to perform full-hermetic package, and the package mode of the step can be a metal shell package mode, a plastic shell package mode, a metal shell and pouring sealant, a plastic shell and pouring sealant, an aluminum plastic film package mode and a mixture of the above package modes. In one embodiment, a hybrid metal and plastic housing closure may be used.

The metal shell packaging mode is good in heat dissipation performance and strong in mechanical performance, but the weight is heavier; the plastic shell packaging mode is light in weight, but the heat dissipation performance is poor; therefore, the present embodiment can adopt an aluminum plastic film packaging manner, which has light weight, vacuum packaging, unlimited size and can be packaged in different specifications and styles in a customized manner, although the mechanical property is poor.

The step may be followed by aging, measuring, shaping, taping or packaging.

In another embodiment, the positive single sheet and the negative single sheet with corresponding sizes are respectively cut, the positive single sheet and the negative single sheet are respectively subjected to glue coating, formation repairing, conductive polymer polymerization layer preparation and the like, and the processed positive single sheet and the processed negative single sheet are stacked to form the core package.

In another embodiment, the positive single pieces and the negative single pieces with corresponding sizes are respectively cut, only the positive single pieces are subjected to glue coating, complement formation, conductive polymer layer preparation and the like, the negative single pieces are not subjected to glue coating, complement formation, conductive polymer layer preparation and the like, the negative single pieces are used as aluminum foils, the treated positive single pieces and the untreated negative single pieces are alternately stacked, and the core package is formed by bonding conductive silver paste.

Fig. 13 is a flowchart illustrating a method for manufacturing the multilayer capacitor 1 according to an embodiment of the present application. The method can be used to produce a stacked capacitor 1 as shown in fig. 1. The manufacturing method of the multilayer capacitor 1 may include the steps of:

step S201: the starting material is cut into individual pieces of predetermined dimensions. Refer to the description of step S101 in the above embodiments in detail.

Step S202: and coating isolation glue at the preset position of the single piece, wherein the isolation glue divides the single piece into a single piece positive end and a single piece negative end. Refer to the description of step S102 in the above embodiments in detail.

Step S203: a conductive polymeric layer 312b, a graphite layer 312c, and a conductive silver layer 312d are prepared on the monolithic negative terminal, resulting in a monomer 310. Refer to the description of step S103 in the above embodiments in detail.

Step S204: a plurality of the cells 310 are stacked. Refer to the description of step S104 in the above embodiments in detail.

Step S205: a conductive shim 700 is placed between any two adjacent monolithic positive terminals.

This step overlaps the conductive pad 700 with the positive end of the single piece for the subsequent soldering step.

Step S206: compressing the conductive gasket 700 and the one-piece positive terminal.

This step may utilize a pressure plate or weld wheel to compress the conductive gasket 700 and the single positive terminal for subsequent welding steps.

Step S207: the conductive pad 700 is soldered to the single positive terminal.

In this step, the connection mode of the conductive gasket 700 and the positive end of the single sheet is resistance welding, ultrasonic welding, piercing and riveting, cold riveting or laser welding. Since the conductive spacer 700 is made of aluminum or aluminum alloy, the positive end of the single plate is made of aluminum foil, and the laser heat of the violet light and green light sources is not concentrated, the heat effect is low, and the MOPA red laser (fiber laser) with concentrated energy and highest thermal reaction can be adopted in the step.

Wherein, the wavelength of the laser can be 1064 nm; the laser power can be selected in the range of 100W-200W; the laser frequency can be selected to be in the range of 1-4000 KHZ; the range of the laser pulse width is 1-500 ns; the single pulse energy of the laser is between 1.0 and 1.5 mj.

Furthermore, since the spot size affects the welding strength, the smaller the lens, the better the spot quality, and therefore the F-number of the laser lens aperture (the diameter of the lens aperture) can be selected to be in the range of 100-160 mm.

Step S208: the conductive layer 600 is formed by filling the conductive paste between any two adjacent monolithic negative terminals, so that the plurality of cells 310 are electrically connected to form the core set 300. Refer to the description of step S106 in the above embodiments in detail.

Step S209: at least one positive lead 800 is electrically connected to the positive electrode of the core set 300 through the conductive spacer 700.

Step S210: at least one negative electrode lead 900 is electrically connected to the negative electrode of the core set 300 through the conductive layer 600.

Step S211: the plurality of tabs 500 are connected to the positive electrode lead 800 and the negative electrode lead 900, respectively.

In steps S209, 310, and 311, the positive electrode lead 800 and the core set 300, the negative electrode lead 900 and the core set 300, the tab 500 and the negative electrode lead 900, and the tab 500 and the positive electrode lead 800 are connected by resistance welding, ultrasonic welding, riveting, or laser welding.

Step S212: the outer barrier layer 230 is connected to the barrier layer 220.

In this step, the outer barrier layer 230 and the barrier layer 220 are pressed and adhered together by the first adhesive 240 to obtain an intermediate film.

In this step, the material of the barrier layer 220 includes a ductile metal; the material of the outer barrier layer 230 includes one or more of polypropylene, polyethylene, modified polypropylene and modified polyethylene.

Step S213: the intermediate film is connected to the inner barrier layer 210, resulting in the package 200.

In this step, the barrier layer 220 in the intermediate film is bonded to the high barrier layer with an adhesive, and then the package 200 shown in fig. 2 is formed by pressing. In the package 200, the barrier layer 220 is sandwiched between the outer barrier layer 230 and the inner barrier layer 210.

In another embodiment, the barrier layer 220 in the intermediate film is bonded to the high barrier layer with MPP, and then the package 200 is thermally formed by heating and pressurizing.

In this step, the inner barrier layer 210 is made of one or more of nylon, polyester resin, modified nylon and modified polyester resin; further, the inner barrier layer 210 is made of one or more of glass fiber reinforced nylon, flame retardant nylon, glass fiber modified polyester resin, and polyolefin modified polyester resin.

However, steps S212 and S213 may be performed just before step S214, before step S201, or in synchronization with steps S201 and the like.

Step S214: the package 200 is packaged in the core set 300 to obtain the multilayer capacitor 1. Refer to the description of step S108 in the above embodiments in detail.

The applicant conducted a plurality of tests on the multilayer capacitor 1 shown in fig. 1 to 11 and the method for manufacturing the multilayer capacitor 1 shown in fig. 12 and 13.

The first set of tests: the first set of tests included test one, test two, and test three.

Test one:

test objectives: A6.3V multilayer capacitor 1 was prepared, and the capacitance of the multilayer capacitor 1 was about 3900 μ F.

Test parameters are as follows: the conductive gasket 700 is an aluminum gasket with a melting point of 660 ℃, the conductive layer 600 is conductive silver paste, the conductive gasket 700 and the positive end 311 of the monomer are welded by laser, and 10 layers of monomers 310 are arranged in the core set 300. The package 200 is made of an aluminum-plastic film and has the structure of the embodiment shown in fig. 2.

The test process comprises the following steps: 1. cutting the initial material into single pieces with preset sizes; 2. coating isolation glue at a preset position of the single piece, wherein the isolation glue divides the single piece into a single piece positive end and a single piece negative end; 3. carrying out formation treatment on the single-chip negative electrode end; 4. preparing a cathode layer on the single negative electrode end subjected to the formation treatment to obtain a monomer 310; 5. placing the conductive gasket 700 on the cell positive terminal 311; 6. compressing the conductive gasket 700 and the cell positive terminal 311; 7. welding the conductive gasket 700 and the monomer positive terminal 311; 8. a plurality of single bodies 310 on which the conductive pads 700 are soldered are stacked; 9. connecting any two adjacent single positive terminals by laser welding through a conductive gasket 700; 10. filling the conductive layer 600 between any two adjacent monolithic negative terminals such that the plurality of cells 310 are connected in parallel to form the core group 300; 11. the positive electrode lead-out wires are respectively connected with the conductive gaskets 700 at preset positions; 12. connecting the tabs 500 with a positive lead-out wire, so that at least one tab 500 is electrically connected with the conductive gasket 700 and the positive electrode of the core set 300 through the positive lead-out wire; 13. the negative lead wires are respectively connected with the conductive layers 600 at preset positions, the tabs 500 are connected with the negative lead wires, and at least one tab 500 is electrically connected with the conductive layers 600 and the negative electrodes of the core set 300 through the negative lead wires; 14. connecting the outer barrier layer 230 with the barrier layer 220; 15. connecting the barrier layer 220 with the internal barrier layer to obtain a package body 200; 16. packaging the core set 300 in the package 200 to obtain the stacked capacitor 1; 17. the above process is repeated five times to obtain test products of 5 laminated capacitors 1, the 5 laminated capacitors 1 are measured, parameters such as capacity, loss tangent value, equivalent series resistance and leakage current are measured, and test results are recorded according to product numbers.

And (2) test II:

Test parameters are as follows: the conductive pad 700 was a copper pad with a melting point of 1083 c, and the rest was the same as in test one.

The specific test process is the same as the first test, the test products of the 5 laminated capacitors 1 are obtained, the 5 laminated capacitors 1 are numbered and measured, and the test results are recorded according to the product numbers.

And (3) test III:

Test parameters are as follows: the conductive pad 700 is an iron-nickel alloy pad with a melting point of about 1500 ℃, and the rest is the same as the first test.

The results of tests one, two and three of the first set of tests are shown in the following table:

according to the first set of test results, when the conductive gasket 700 is an aluminum gasket, the quality of the manufactured laminated capacitor 1 is better and the performance is more stable than that of the laminated capacitor 1 manufactured when the conductive gasket 700 is a copper gasket or an iron-nickel alloy gasket.

The second set of tests: the second set of tests included test four, test five and test six.

And (4) testing:

test objectives: A6.3V multilayer capacitor 1 was prepared, and the capacity of the multilayer capacitor 1 was about 330. mu.F.

Test parameters are as follows: the conductive gasket 700 is an aluminum gasket with a melting point of 660 ℃, the conductive layer 600 is conductive silver paste, and the conductive gasket 700 and the positive end 311 of the monomer are welded by laser. The package 200 is made of an aluminum-plastic film and has the structure of the embodiment shown in fig. 2.

The test process comprises the following steps: 1. cutting the initial material into single pieces with preset sizes; 2. coating isolation glue at a preset position of the single piece, wherein the isolation glue divides the single piece into a single piece positive end and a single piece negative end; 3. carrying out formation treatment on the single-chip negative electrode end; 4. preparing a cathode layer on the single negative electrode end subjected to the formation treatment to obtain a monomer 310; 5. placing the conductive gasket 700 on the cell positive terminal 311; 6. compressing the conductive gasket 700 and the cell positive terminal 311; 7. welding the conductive gasket 700 and the monomer positive terminal 311; 8. a plurality of single bodies 310 on which the conductive pads 700 are soldered are stacked; 9. connecting any two adjacent single positive terminals by laser welding through a conductive gasket 700; 10. filling the conductive layer 600 between any two adjacent monolithic negative terminals such that the plurality of cells 310 are connected in parallel to form the core group 300; 11. the positive electrode lead-out wires are respectively connected with the conductive gaskets 700 at preset positions; 12. connecting the tabs 500 with a positive lead-out wire, so that at least one tab 500 is electrically connected with the conductive gasket 700 and the positive electrode of the core set 300 through the positive lead-out wire; 13. the negative lead wires are respectively connected with the conductive layers 600 at preset positions, the tabs 500 are connected with the negative lead wires, and at least one tab 500 is electrically connected with the conductive layers 600 and the negative electrodes of the core set 300 through the negative lead wires; 14. connecting the outer barrier layer 230 with the barrier layer 220; 15. connecting the barrier layer 220 with the internal barrier layer to obtain a package body 200; 16. packaging the core set 300 in the package 200 to obtain the stacked capacitor 1; 17. aging and voltage aging are carried out on the obtained laminated capacitor 1; 18. and (3) mounting the upper plate of the laminated capacitor 1 product after the voltage aging is finished, placing the laminated capacitor 1 product in a 60 ℃ 90% RH oven, applying a rated voltage for 1000h for testing, measuring parameters such as capacity, loss tangent value, equivalent series resistance and leakage current, 19, repeating the process for five times to obtain test products of 5 laminated capacitors 1, sequentially measuring the 5 laminated capacitors 1, and recording test results according to product numbers.

And (5) testing:

Test parameters are as follows: the package 200 is a package case and has the structure of the embodiment shown in fig. 3, and the rest is the same as that of the test four.

The specific test process is the same as that of the fourth test, the test products of the 5 laminated capacitors 1 are obtained, the 5 laminated capacitors 1 are numbered and measured, and the test results are recorded according to the product numbers.

And (6) test six:

Test parameters are as follows: the laminated capacitor 1 is packaged by plastic molding.

The results of tests four, five and six in the second set of tests are shown in the following table:

according to the second set of test results, when the package 200 adopts the structure of the embodiment shown in fig. 2 or fig. 3, the quality of the manufactured laminated capacitor 1 is better than that of the laminated capacitor 1 packaged by plastic molding, and the performance is more stable.

The third set of tests: the second set of trials included trial seven and trial eight.

Test seven:

Test parameters are as follows: the test parameters were the same as test one.

And (eight) test:

Test parameters are as follows: the conductive gasket 700 and the cell positive terminal 311 were resistance welded, and the rest was the same as in test seven.

The results of tests seven and eight in the third set of tests are shown in the following table:

according to the third set of test results, when the conductive gasket 700 and the single positive terminal 311 are welded by laser, the quality of the manufactured laminated capacitor 1 is better than that of the laminated capacitor 1 which is formed by resistance welding of the conductive gasket 700 and the single positive terminal 311 and packaged by plastic molding, and the performance is more stable.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A stacked capacitor, comprising:

the single-body-type solar cell comprises a plurality of single bodies, a plurality of connecting plates and a plurality of connecting wires, wherein each single body comprises a single body positive end, a single body negative end and an isolation glue line positioned between the single body positive end and the single body negative end;

the packaging body is packaged outside the core set;

a plurality of conductive layers connected between any two adjacent single negative terminals;

the conductive gaskets are connected between any two adjacent single positive terminals;

at least one positive electrode lead electrically connected to the positive electrode of the core group through the conductive gasket; and

at least one negative electrode lead electrically connected with the negative electrode of the core set through the conductive layer;

wherein the area of the largest surface of the package body is larger than 31.39mm²。

2. The multilayer capacitor of claim 1, wherein the conductive pad is made of a conductive material having a melting point in the range of 300-1200 ℃.

3. The multilayer capacitor according to claim 2, wherein the material of the cell positive terminal includes a metal;

the material of the conductive gasket is the same as that of the monomer positive terminal, or the material of the conductive gasket comprises an alloy of at least one metal element selected from the materials of the monomer positive terminal.

4. The multilayer capacitor according to claim 3, wherein the material of the cell positive terminals comprises aluminum, and the material of the conductive spacers comprises aluminum or an aluminum alloy.

5. The laminated capacitor of claim 1, wherein the package comprises an inner barrier layer, a barrier layer and an outer barrier layer connected from inside to outside;

the inner barrier layer is made of one or more of nylon, polyester resin, modified nylon and modified polyester resin;

the material of the barrier layer comprises metal;

the material of the outer resistance layer comprises one or more of polypropylene, polyethylene, modified polypropylene and modified polyethylene.

6. A laminated capacitor according to claim 5, wherein a first adhesive is provided between the inner barrier layer and the barrier layer, and between the barrier layer and the outer barrier layer.

7. The laminated capacitor of claim 1, wherein the package comprises a housing body and a potting compound disposed within the housing body.

8. The multilayer capacitor of claim 1, wherein the conductive layer is made of a conductive material;

any single negative electrode end comprises a first metal layer, a first dielectric layer, a conductive polymerization layer, a graphite layer and a conductive silver layer which are connected from inside to outside;

the conductive polymer layer is made of one or more of polypyrrole, polythiophene, polyaniline, polyphenyl propylamine, polypyrrole derivatives, polythiophene derivatives, polyaniline derivatives and polyphenyl propylamine derivatives.

9. A stacked capacitor as claimed in claim 8, wherein said conductive polymeric layer comprises a first polymeric layer and a second polymeric layer, said first polymeric layer being disposed between said first dielectric layer and said second polymeric layer.

10. The multilayer capacitor of claim 1, wherein the conductive layer is made of aluminum;

any single negative electrode end comprises a first metal layer, a first dielectric layer and a conductive polymerization layer which are connected from inside to outside;

11. The multilayer capacitor of claim 1, wherein said lines of isolating glue are linear or closed curve.

12. A laminated capacitor according to any one of claims 1 to 11, wherein the package body has a maximum surface with a length greater than 7.3mm and a width greater than 4.3 mm.

13. The stacked capacitor of claim 12, wherein the largest surface of the package is triangular, trapezoidal, elliptical, circular, square, polygonal, or irregular in shape.

14. The multilayer capacitor of claim 1, wherein any two of the cells in the core group are stacked one on top of the other, and the positive and negative leads are connected to opposite sides of the core group, respectively.

15. The multilayer capacitor of claim 1, wherein, in the core set,

the two monomers form a connecting unit, and in each connecting unit, the positive ends of the monomers of the two monomers are abutted and are arranged side by side;

the connecting units are arranged in plurality and are stacked up and down to form the core group;

at least two negative leads are arranged and are respectively connected with two opposite sides of the core set;

the positive lead is connected to an intermediate position of the core group.

16. The stacked capacitor of claim 1, further comprising:

and the lugs are connected with the packaging body and are multiple in number, and the lugs are respectively electrically connected with the anode lead and the cathode lead.

17. A stacked capacitor, comprising:

the single bodies comprise single body positive terminals, single body negative terminals and isolation glue lines located between the single body positive terminals and the single body negative terminals, and the single bodies are electrically connected to form a core group;

the packaging body is packaged outside the core set;

18. A stacked capacitor, comprising:

the packaging body is packaged outside the core set;

the packaging body comprises an inner barrier layer, a barrier layer and an outer barrier layer which are connected from inside to outside.

19. A capacitor, comprising:

the single body comprises a single body positive end, a single body negative end and an isolation glue line positioned between the single body positive end and the single body negative end;

a packaging body packaged outside the single body;

at least one anode lead wire electrically connected with the anode end of the monomer; and

at least one negative lead electrically connected to the single negative terminal;

20. A method of manufacturing a multilayer capacitor, comprising:

cutting the initial material into single pieces with preset sizes;

a plurality of said monomer stacks are placed;

filling conductive paste into any two adjacent single negative terminals of the laminated single units to form a conductive layer, so that the single units are electrically connected to form a core group;

connecting at least one negative electrode lead and at least one positive electrode lead to the core group respectively;

and packaging a packaging body in the core group to obtain the laminated capacitor.

21. The method for manufacturing a multilayer capacitor as claimed in claim 20, wherein the step of packaging a package before the step of packaging the package in the core group to obtain the multilayer capacitor comprises:

connecting the outer barrier layer with the barrier layer;

22. A method of manufacturing a laminated capacitor as claimed in claim 20, wherein said connecting any two adjacent said monolithic positive terminals by a conductive spacer comprises:

placing the conductive gasket between any two adjacent positive terminals of the single sheet;

compressing the conductive gasket and the single positive terminal;

welding the conductive gasket and the single positive electrode terminal;

23. The method for manufacturing a multilayer capacitor as claimed in claim 22, wherein at least one negative electrode lead and at least one positive electrode lead are connected to the core groups, respectively, comprising:

electrically connecting at least one positive lead with the positive electrode of the core set through the conductive gasket;

electrically connecting at least one negative electrode lead with the negative electrode of the core set through the conductive layer;

and the plurality of tabs are respectively electrically connected with the anode lead and the cathode lead.

24. The method of manufacturing a multilayer capacitor as claimed in claim 23,

the connection mode of the conductive gasket and the positive end of the single sheet is resistance welding, ultrasonic welding, piercing riveting, cold riveting or laser welding;

the positive lead and the core group, the negative lead and the core group, the tab and the negative lead and the tab and the positive lead are connected in a resistance welding mode, an ultrasonic welding mode, a riveting mode or a laser welding mode.