CN112809816B - Super-thick double-sided adhesive tape non-overflow non-cutter mark process and flat cutter feeding system thereof - Google Patents
Super-thick double-sided adhesive tape non-overflow non-cutter mark process and flat cutter feeding system thereof Download PDFInfo
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- CN112809816B CN112809816B CN202010836170.9A CN202010836170A CN112809816B CN 112809816 B CN112809816 B CN 112809816B CN 202010836170 A CN202010836170 A CN 202010836170A CN 112809816 B CN112809816 B CN 112809816B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D9/00—Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
- B26D1/15—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member
- B26D1/151—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member for thin material, e.g. for sheets, strips or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a flat-cutting feeding system of an ultra-thick double-sided adhesive tape non-overflow non-knife mark process, which is characterized by comprising the following processes: s1, slitting by a circular knife; s2, bonding; s3, stamping by a die A; s4, B die stamping; s5, C die stamping; s6, D-die stamping; s7, E die stamping; and S8, F die stamping. According to the invention, the cutting of the release films in different processes is realized through ABCDEF, namely, the adhesive tape cutting is carried out by using transverse and vertical splicing in the cutting process, and the product size precision is met by adopting a method of digging waste to reserve the product.
Description
Technical Field
The invention relates to the technical field of double-sided adhesive tapes, in particular to an ultra-thick double-sided adhesive tape overflow-free and knife mark-free process and a flat-cutting feeding system thereof.
Background
At present, slight glue overflow generally occurs when the thickness of the double-sided adhesive tape exceeds 0.05MM in the market, glue overflow is serious when the thickness exceeds 0.1MM, processing difficulty when the thickness exceeds 0.15MM is caused, and the bottom film has knife marks in the processing process in the prior art. Therefore, the technology and the flat-cutting feeding system for the super-thick double-sided adhesive tape without glue overflow and knife mark are designed.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides an ultra-thick double-sided adhesive tape non-overflow non-cutter mark process and a flat cutter feeding system thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
a flat-cutter feeding system of an ultra-thick double-sided adhesive tape non-overflow non-cutter mark process comprises the following processes:
s1, slitting by a circular knife: conveying the self-carrying film surface of the silica gel protective film upwards and forwards, adhering the adhesive surface of the first PE low-viscosity film upwards to the self-carrying film of the silica gel protective film in the conveying process to obtain a product A1, carrying out striping treatment on the product A1 through a striping knife to obtain a product A2, adhering the adhesive surface of an OPP box sealing adhesive tape downwards to the product A2 to obtain a product A, and rolling the product A;
s2, bonding: conveying the release surface of the release film upwards and forwards, adhering any surface of a double-sided adhesive to the release surface of the release film downwards, recovering a self-carried film of the double-sided adhesive to obtain a product B1, recovering the self-carried film of the release film in a product B2 to obtain a product B2, adhering the release film of 0.025T to the product B2 to obtain a product B, and rolling the product B;
s3, stamping by a die A: stamping the product B through a die A to obtain a product C1, adhering the adhesive surface of a second PE low-viscosity film to the product C1 in an upward mode to obtain a product C2, then pulling the waste material of the 0.025T release film to obtain a product C3, adhering the release surface of the 0.025T release film to the product C3 in a downward mode to obtain a product C, and rolling the product C;
s4, B die stamping: punching the product C through a die B to obtain a product D1, pulling the double-sided adhesive on two sides of the product D1 and all 0.025 release film waste materials to obtain a product D2, adhering the printed red and white printed release film on the product D2 with the release side facing down to obtain a product D3, adhering the product A on the product D3, simultaneously compounding two PE high-viscosity films along two sides of the product D3 respectively, pulling the box sealing adhesive and the silica gel protective film self-contained film waste materials in the adhering process of the product A to obtain a product D, and rolling the product D;
s5, C die stamping: punching the product D through a C die to obtain a product E1, pulling the product E1 to obtain release film waste to obtain a product E2, then adhering the release surface of the 0.025T release film to the product E2 in a downward mode, pulling two PE high-viscosity films and all hole waste to obtain a product E3, finally adhering the PE high-viscosity films to the product E3 to obtain a product E, and rolling the product E;
s6, D die stamping: stamping the product E through a die D to obtain a product F1, adhering the PE high-viscosity film with the adhesive surface facing downwards to the product F1 to obtain a product F2, pulling the waste material of the release film from F2 to obtain a product F3, adhering the release surface of the blue printing release film downwards to the product F3 to obtain a product F, and rolling the product F;
s7, E die stamping: punching the product F through an E die to obtain a product G1, drawing the product G1 to obtain waste of the thin strip blue printing release film to obtain a product G, and rolling the product G;
s8, F die stamping: and stamping the product G through an F die to obtain a product H1, pulling the product H1 from the outer frame waste to obtain a product H2, adhering a 0.05T transparent PET original film on the product H2 with any side facing downwards to obtain a product H3, pulling the product H3 from the PE low-adhesive film and the middle silica gel protective film waste to obtain a product H4, reversing the product H4 material, and cutting into 20 EA/piece to obtain a final product M.
A technology for preventing overflow of double-sided adhesive tape and knife mark of super-thick double-sided adhesive tape comprises the following knife mark treatment: s1, performing groove pressing treatment on the double-sided adhesive tape by stamping through an A die, namely stamping the middle of the double-sided adhesive tape into a plurality of rectangular groove shapes, and stamping a plurality of external guide post grooves on two sides of the release film;
s2, the double faced adhesive tape is trimmed through B die stamping, the B die stamping is two straight knife edges, the distance between the two straight knife edges is the same as the length of the rectangular groove in the S1, the thickness between two adjacent rectangular grooves and the frames on two sides of the rectangular groove are reserved after the B die stamping, and the required thickness part between the rectangular grooves can be reserved by pulling the frames on two sides of the rectangular groove;
s3, forming an inner guide post groove on the two PE high-adhesive films by C-die stamping, and facilitating the positioning of the guide post during D-die stamping;
s4, through D-die stamping, the notching treatment of the release film at the bottom of the blue printing release film is realized, and the pulling of the redundant release film is facilitated after the blue printing release film is stamped;
s5, realizing the mould pressing treatment of the redundant blue printing release film through E-mould punching, and further facilitating the subsequent pulling of the redundant blue printing release film;
s6, stamping through an F die, and realizing die pressing of the needed blue printing release film, the red-white printing release film and the redundant blue printing release film and the red-white printing release film, so that the redundant blue printing release film, the red-white printing release film and other frame wastes can be conveniently pulled.
Compared with the prior art, the invention has the following advantages:
1. the device realizes the cutting of the release films in different processes through ABCDEF, namely, the adhesive tape cutting is carried out by using horizontal and vertical splicing in the cutting process, and the product size precision is met by adopting a method of digging waste and reserving the product;
2. in addition, the device also realizes material feeding and waste material removal while feeding through the feeding system, and ensures the continuity of production in each stage.
Drawings
FIG. 1 is a flow chart of a flat-blade feeding system of the super-thick double-sided adhesive tape non-overflow non-knife mark process provided by the invention;
FIG. 2 is a flow chart of circular knife slitting in a flat knife feeding system of the super-thick double-sided adhesive tape non-overflow non-knife mark process provided by the invention;
FIG. 3 is a flow chart of the bonding in the flat-bed feeding system of the super-thick double-sided adhesive tape non-overflow non-knife mark process provided by the invention;
FIG. 4 is a flow chart of A-die stamping in a flat-blade feeding system of the super-thick double-sided adhesive tape non-overflow non-knife mark process provided by the invention;
FIG. 5 is a flow chart of B-die stamping in a flat-blade feeding system of the super-thick double-sided adhesive tape non-overflow non-knife mark process provided by the invention;
FIG. 6 is a flow chart of C-die stamping in a flat-blade feeding system of the super-thick double-sided adhesive tape non-overflow non-knife mark process provided by the invention;
FIG. 7 is a flow chart of D-die stamping in a flat-blade feeding system of the super-thick double-sided adhesive tape non-overflow non-knife mark process provided by the invention;
FIG. 8 is a flow chart of E-die stamping in a flat-blade feeding system of the super-thick double-sided adhesive tape non-overflow non-knife mark process provided by the invention;
FIG. 9 is a flow chart of F-die stamping in a flat-blade feeding system of the super-thick double-sided adhesive tape non-overflow non-knife mark process provided by the invention;
FIG. 10 is a diagram of a tool face of an A-die stamping and etching tool in the super-thick double-sided adhesive tape non-overflow non-tool mark process according to the present invention;
FIG. 11 is a diagram of a tool face of a B-die stamping and etching tool in the super-thick double-sided adhesive tape overflow-free and tool mark-free process according to the present invention;
FIG. 12 is a diagram of a tool face of a C-die stamping and etching tool in the super-thick double-sided adhesive tape overflow-free and tool mark-free process according to the present invention;
FIG. 13 is a diagram showing the surface of a D-die stamping and etching knife in the process of the present invention, wherein the ultra-thick double-sided adhesive tape has no overflow and no knife mark;
FIG. 14 is a tool face diagram of an E-die stamping and etching tool in the super-thick double-sided adhesive tape non-overflow non-tool mark process according to the present invention;
FIG. 15 is a diagram of a tool face of an F-die stamping and etching tool in the super-thick double-sided adhesive tape overflow-free and tool mark-free process.
In the figure: 1 release film, 2 double faced adhesive tape, 30.025T release film, 4 PE high adhesive film, 5 first PE low adhesive film, 6 red white printing release film, 7 blue printing release film, 8 second PE low adhesive film, 9 silica gel protective film, 10 OPP box sealing adhesive tape and 110.05T transparent PET original film.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1, a flat-cutting feeding system for an ultra-thick double-sided adhesive tape non-overflow non-knife-mark process comprises the following processes:
referring to fig. 2, S1, circular knife slitting: conveying the self-carrying film surface of the silica gel protective film upwards and forwards, adhering the adhesive surface of the first PE low-viscosity film upwards to the self-carrying film of the silica gel protective film in the conveying process to obtain a product A1, carrying out striping treatment on the product A1 through a striping knife to obtain a product A2, adhering the adhesive surface of an OPP box sealing adhesive tape downwards to the product A2 to obtain a product A, and rolling the product A;
referring to fig. 3, S2, bonding: conveying the release surface of the release film upwards and forwards, adhering the random surface of the double-sided adhesive to the release surface of the release film downwards, recovering the self-carried film of the double-sided adhesive to obtain a product B1, recovering the self-carried film of the release film in the product B2 to obtain a product B2, adhering the 0.025T release film of the product to the product B2 to obtain a product B, and rolling the product B;
referring to fig. 4, S3, die a stamping: stamping the product B through a die A to obtain a product C1, adhering the adhesive surface of a second PE low-viscosity film to the product C1 in an upward mode to obtain a product C2, then pulling the waste material of the 0.025T release film to obtain a product C3, adhering the release surface of the 0.025T release film to the product C3 in a downward mode to obtain a product C, and rolling the product C;
referring to fig. 5, S4, B die stamping: punching the product C through a die B to obtain a product D1, pulling the double-sided adhesive on two sides of the product D1 and all 0.025 release film waste materials to obtain a product D2, adhering the printed red and white printed release film on the product D2 with the release side facing down to obtain a product D3, adhering the product A on the product D3, simultaneously compounding two PE high-viscosity films along two sides of the product D3 respectively, pulling the box sealing adhesive and the silica gel protective film self-contained film waste materials in the adhering process of the product A to obtain a product D, and rolling the product D;
referring to fig. 6, S5, C die stamping: punching the product D through a C die to obtain a product E1, pulling the product E1 to obtain release film waste to obtain a product E2, then adhering the release surface of the 0.025T release film to the product E2 in a downward mode, pulling two PE high-viscosity films and all hole waste to obtain a product E3, finally adhering the PE high-viscosity films to the product E3 to obtain a product E, and rolling the product E;
referring to fig. 7, S6, D-die stamping: stamping the product E through a D die to obtain a product F1, adhering the PE high-viscosity film adhesive surface to the product F1 downwards to obtain a product F2, pulling the waste material of the release film from F2 to obtain a product F3, adhering the blue printing release film release surface to the product F3 downwards to obtain a product F, and rolling the product F;
referring to fig. 8, S7, E-die stamping: punching the product F through an E die to obtain a product G1, drawing the product G1 to obtain waste of the thin strip blue printing release film to obtain a product G, and rolling the product G;
referring to fig. 9, S8, F die stamping: and stamping the product G through an F die to obtain a product H1, pulling the product H1 from the outer frame waste to obtain a product H2, adhering a 0.05T transparent PET original film on the product H2 with any side facing downwards to obtain a product H3, pulling the product H3 from the PE low-adhesive film and the middle silica gel protective film waste to obtain a product H4, reversing the product H4 material, and cutting into 20 EA/piece to obtain a final product M.
In addition, it should be noted that:
a technology for preventing overflow of an ultra-thick double-sided adhesive tape and cutting marks comprises the following cutting mark treatment:
referring to fig. 10, S1, performing a notching process on the double-sided adhesive tape by a die a stamping, that is, stamping the middle of the double-sided adhesive tape into a plurality of rectangular grooves, and stamping a plurality of external guide pillar grooves on two sides of the release film;
referring to fig. 11, S2, performing trimming processing on the double-sided adhesive tape by die B punching, where the die B punching is two straight knife edges, and the distance between the two straight knife edges is the same as the length of the rectangular groove in S1, the die B punching retains the thickness between two adjacent rectangular grooves and the frames on both sides of the rectangular groove, and further retains the thickness part between the rectangular grooves by pulling the frames on both sides of the rectangular groove;
referring to fig. 12, S3, forming an inner guide pillar groove on two PE high adhesive films by C-die stamping, so as to facilitate positioning of the guide pillar during D-die stamping;
referring to fig. 13, S4, through D-die stamping, the notching treatment of the release film at the bottom of the blue-printed release film is realized, which is convenient for pulling the excess release film after the blue-printed release film is stamped;
referring to fig. 14, S5, the die pressing treatment of the excess blue printing release film is realized through E-die stamping, so as to facilitate the subsequent pulling of the excess blue printing release film;
referring to fig. 15, S6, the required blue-printed release film and red-white-printed release film and the excess blue-printed release film and red-white-printed release film are molded by F-die stamping, so that the excess blue-printed release film and red-white-printed release film and other frame waste materials are conveniently drawn.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (2)
1. The utility model provides a flat-bed sword feed system of super thick double faced adhesive tape no excessive glue no knife mark technology which characterized in that includes the following process:
s1, slitting by a circular knife: conveying the silica gel protective film with the film surface facing upwards forwards, adhering the first PE low-viscosity film adhesive surface facing upwards to the silica gel protective film with the film surface facing upwards in the conveying process to obtain a product A1, performing slitting treatment on the product A1 through a slitting knife to obtain a product A2, adhering the OPP box sealing adhesive tape surface facing downwards to the product A2 to obtain a product A, and rolling the product A;
s2, bonding: conveying the release surface of the release film upwards and forwards, adhering any surface of a double-sided adhesive to the release surface of the release film downwards, recovering a self-carried film of the double-sided adhesive to obtain a product B1, recovering the self-carried film of the release film in a product B1 to obtain a product B2, adhering a 0.025T release film to the product B2 to obtain a product B, and rolling the product B;
s3, stamping by a die A: stamping the product B through a die A to obtain a product C1, adhering the adhesive surface of a second PE low-viscosity film to the product C1 in an upward mode to obtain a product C2, then pulling the waste material of the 0.025T release film to obtain a product C3, adhering the release surface of the 0.025T release film to the product C3 in a downward mode to obtain a product C, and rolling the product C;
s4, B die stamping: punching the product C through a die B to obtain a product D1, pulling the double-sided adhesive on two sides of the product D1 and all 0.025T release film waste materials to obtain a product D2, adhering the printed red and white printed release film on the product D2 with the release surface facing downwards to obtain a product D3, adhering the product A on the product D3, simultaneously compounding two PE high-viscosity films along two sides of the product D3 respectively, pulling the box sealing adhesive and the silica gel protective film self-contained film waste materials in the adhering process of the product A to obtain a product D, and rolling the product D;
s5, C die stamping: punching the product D through a C die to obtain a product E1, pulling the product E1 to obtain release film waste to obtain a product E2, then adhering the release surface of the 0.025T release film to the product E2 in a downward mode, pulling two PE high-viscosity films and all hole waste to obtain a product E3, finally adhering the PE high-viscosity films to the product E3 to obtain a product E, and rolling the product E;
s6, D die stamping: stamping the product E through a die D to obtain a product F1, adhering the PE high-viscosity film with the adhesive surface facing downwards to the product F1 to obtain a product F2, pulling the waste material of the release film from F2 to obtain a product F3, adhering the release surface of the blue printing release film downwards to the product F3 to obtain a product F, and rolling the product F;
s7, E die stamping: punching the product F through an E die to obtain a product G1, pulling the product G1 to obtain waste of the thin strip blue printing release film to obtain a product G, and rolling the product G;
s8, F die stamping: and stamping the product G through an F die to obtain a product H1, pulling the outer frame waste material by using the product H1 to obtain a product H2, adhering a 0.05T transparent PET original film on the product H2 in a downward mode with any surface to obtain a product H3, pulling the PE low-adhesive film and the middle silica gel protective film waste material by using the product H3 to obtain a product H4, reversing the material of the product H4, and cutting into 20 EA/piece to obtain a final product M.
2. The process for preventing the overflow of the ultra-thick double-sided adhesive tape and the knife mark is characterized by comprising the following knife mark treatment:
s1, through A-die stamping, the double-sided adhesive tape is subjected to groove pressing treatment, namely the middle of the double-sided adhesive tape is stamped into a plurality of rectangular groove shapes, and a plurality of external guide pillar grooves are stamped on two sides of the release film;
s2, the double faced adhesive tape is trimmed through B die stamping, the B die stamping is two straight knife edges, the distance between the two straight knife edges is the same as the length of the rectangular groove in the S1, the thickness between two adjacent rectangular grooves and the frames on two sides of the rectangular groove are reserved after the B die stamping, and the required thickness part between the rectangular grooves can be reserved by pulling the frames on two sides of the rectangular groove;
s3, forming an inner guide post groove on the two PE high-adhesive films by C-die stamping, and facilitating the positioning of the guide post during D-die stamping;
s4, through D-die stamping, notching treatment of the release film at the bottom of the blue printing release film is realized, and pulling of redundant release films is facilitated after the blue printing release film is stamped;
s5, realizing the mould pressing treatment of the redundant blue printing release film through E-mould punching, and further facilitating the subsequent pulling of the redundant blue printing release film;
s6, stamping through an F die, and realizing die pressing of the needed blue printing release film, the red-white printing release film and the redundant blue printing release film and the red-white printing release film, so that the redundant blue printing release film, the red-white printing release film and other frame wastes can be conveniently pulled.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010836170.9A CN112809816B (en) | 2020-08-19 | 2020-08-19 | Super-thick double-sided adhesive tape non-overflow non-cutter mark process and flat cutter feeding system thereof |
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|---|---|---|---|
| CN202010836170.9A CN112809816B (en) | 2020-08-19 | 2020-08-19 | Super-thick double-sided adhesive tape non-overflow non-cutter mark process and flat cutter feeding system thereof |
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| CN112809816A CN112809816A (en) | 2021-05-18 |
| CN112809816B true CN112809816B (en) | 2022-06-21 |
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| CN110385907A (en) * | 2019-07-29 | 2019-10-29 | 郑州领胜科技有限公司 | It is a kind of for solving anti-release die cutting product and its production technology |
| CN111251361A (en) * | 2020-01-16 | 2020-06-09 | 东莞六淳智能科技有限公司 | Double-sided adhesive tape punching process |
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|---|---|---|---|---|
| CN102689327A (en) * | 2011-03-25 | 2012-09-26 | 比亚迪股份有限公司 | Die cutting preparation method of reflection strip attached with shading adhesive |
| CN110385907A (en) * | 2019-07-29 | 2019-10-29 | 郑州领胜科技有限公司 | It is a kind of for solving anti-release die cutting product and its production technology |
| CN111251361A (en) * | 2020-01-16 | 2020-06-09 | 东莞六淳智能科技有限公司 | Double-sided adhesive tape punching process |
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