CN216911739U - Stamping die that three-dimensional steel reinforcement of 5G chip circuit board was glued in area - Google Patents
Stamping die that three-dimensional steel reinforcement of 5G chip circuit board was glued in area Download PDFInfo
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- CN216911739U CN216911739U CN202123304019.XU CN202123304019U CN216911739U CN 216911739 U CN216911739 U CN 216911739U CN 202123304019 U CN202123304019 U CN 202123304019U CN 216911739 U CN216911739 U CN 216911739U
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- stamping die
- circuit board
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Abstract
The utility model discloses a stamping die for a 5G chip circuit board three-dimensional steel reinforcing belt adhesive, which comprises an upper template, a lower template, and adhesive paper and a steel belt which are arranged between the upper template and the lower template, wherein the upper template comprises a clamping plate, a back plate and a stripper plate which are sequentially arranged, a punch is arranged in the upper template, the punch comprises an adhesive paper punch and a positioning hole punch, and the middle part of the lower template is provided with a punch corresponding to the adhesive paper punch.
Description
Technical Field
The utility model relates to the technical field of forming dies, in particular to a stamping die for a 5G chip circuit board three-dimensional steel reinforcing tape adhesive.
Background
The sticking of the gummed paper and the steel strip is a necessary process for reinforcing the circuit board, the well stuck circuit board has the electrical properties of high and low temperature resistance, high insulation, acid and alkali resistance, low electrolysis, friction resistance, tear resistance, strong mechanical property and the like, and no residual gum is left on the stuck surface after being torn off.
The existing method for reinforcing steel sheets generally comprises the steps of firstly punching a plurality of single reinforcing steel sheets by a punching process, then gradually putting the reinforcing steel sheets into a jig for typesetting, and finally pasting all the reinforcing steel sheets by using weak adhesive films, wherein the production mode of the manufacturing mode has low efficiency and low precision and is easy to cause unstable product quality; therefore, a need exists for a stamping die for steel reinforcement with glue to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a stamping die for a three-dimensional steel reinforcing tape adhesive of a 5G chip circuit board, and aims to solve the problems of low quality, low efficiency and the like of the existing stamping die for the steel reinforcing tape adhesive.
In order to achieve the purpose, the utility model provides a stamping die for a 5G chip circuit board three-dimensional steel reinforcing belt adhesive, which comprises an upper die plate, a lower die plate, and adhesive paper and a steel belt which are arranged between the upper die plate and the lower die plate, wherein the upper die plate comprises a clamping plate, a back plate and a stripper plate which are sequentially arranged, a punch is arranged in the upper die plate and comprises an adhesive paper punch and a positioning hole punch, and a punching hole corresponding to the adhesive paper punch is arranged in the middle of the lower die plate.
Preferably, the adhesive paper punch is arranged in the middle of the upper template and corresponds to the punching of the lower template, and the positioning hole punch is arranged on the side face of the adhesive paper punch.
Preferably, the gummed paper punch and the positioning hole punch are fixed through a clamping plate and penetrate through the back plate and the stripper plate to the position above the gummed paper.
The technical scheme of the utility model has the beneficial effects that:
the utility model relates to a stamping die for a 5G chip circuit board three-dimensional steel reinforcing belt adhesive, which comprises an upper die plate, a lower die plate, adhesive paper and a steel belt, wherein the upper die plate comprises a clamping plate, a back plate and a stripper plate which are sequentially arranged; through adopting automatic rubberizing of stamping die, not only the precision is high, and efficient.
Drawings
FIG. 1 is a schematic structural view of an embodiment of a stamping die for a 5G chip circuit board three-dimensional steel reinforcing tape adhesive of the present invention;
fig. 2 is a schematic structural diagram of a steel belt of an embodiment of a stamping die for a 5G chip circuit board three-dimensional steel reinforcing belt adhesive of the present invention.
In the figure: 1-upper template, 2-lower template, 21-punching, 3-gummed paper, 4-steel band, 5-punch, 51-gummed paper punch, 52-positioning hole punch, 6-positioning hole, 7-connecting film and 8-steel sheet.
Detailed Description
In the following, the embodiments of the present invention will be described in detail and completely, and obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As a preferred embodiment of the utility model, referring to fig. 1-2, the utility model provides a stamping die for a 5G chip circuit board three-dimensional steel reinforcing tape adhesive, the stamping die comprises an upper template 1, a lower template 2, and adhesive paper 3 and a steel tape 4 which are arranged between the upper template and the lower template, the upper template 1 comprises a clamping plate 11, a back plate 12 and a stripper plate 13 which are sequentially arranged, a punch 5 is arranged in the upper template 1, the punch 5 comprises an adhesive paper punch 51 and a positioning hole punch 52, and a punching hole 21 corresponding to the adhesive paper punch 51 is arranged in the middle of the lower template 2.
The utility model relates to a stamping die for a 5G chip circuit board three-dimensional steel reinforcing tape adhesive, which comprises an upper template 1, a lower template 2, adhesive paper 3, a steel belt 4 and a punch 5, wherein the upper template 1 comprises a clamping plate 11, a back plate 12 and a stripper plate 13, the clamping plate 11 is used for fixing the punch, the back plate 12 and the stripper plate 13 are locked together and are practical, and the back plate 12 locks parts in the stripper plate 13 to prevent the parts from falling out; the stripper plate 13 has the functions of avoiding material carrying when the die is lifted and avoiding die opening after punching is finished; the punch 5 comprises an adhesive paper punch 51 and a positioning hole punch 52, wherein the adhesive paper punch 51 is used for punching adhesive paper on the steel belt, and the positioning hole punch 52 is used for punching a steel belt positioning hole; a punching hole 21 which penetrates through the lower template and corresponds to the position of the adhesive paper punch 51 is arranged in the middle of the lower template 2; through setting up adhesive tape 3 and steel band 4 between cope match-plate pattern 1 and lower bolster 2, and adhesive tape 3 places in 4 tops of steel band, can dash adhesive tape 3 to steel band 4 when stamping die pushes down on, reach the effect of steel reinforcement, adopt the automatic rubberizing of stamping die, not only the precision is high, and efficient. The adhesive paper 3 of the utility model adopts the Sony adhesive paper or AU adhesive paper or conductive adhesive paper, and has the characteristic of high temperature resistance.
In a preferred embodiment, referring to fig. 1-2, the offset paper punch 51 of the stamping die is disposed in the middle of the upper mold plate 1, corresponding to the punching hole 21 of the lower mold plate 2, and the positioning hole punch 52 is disposed on the side of the offset paper punch 51. The adhesive paper punch 51 is used for punching the adhesive paper 3 to the steel belt 4, and the positioning hole punch 52 is used for punching the positioning hole 6 in the steel belt 4, so that the steel belt is not inclined, and the punching effect is not influenced.
In a preferred embodiment, referring to fig. 1, the offset paper punch 51 and the positioning hole punch 52 of the stamping die are fixed by the clamping plate 11 and penetrate through the back plate 12 and the stripper plate 13 to be above the offset paper 3. In the stamping process of the stamping die, the clamping plate 11 drives the adhesive tape punch 51 to penetrate through the back plate 12 and the stripper plate 13 to the position above the adhesive tape 3 and then to the surface of the adhesive tape 3, and the adhesive tape 3 is further stamped on the steel belt 4, so that the steel reinforcement effect is achieved.
The above description is only a part of or preferred embodiments of the present invention, and neither the text nor the drawings should be construed as limiting the scope of the present invention, and all equivalent structural changes, which are made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.
Claims (3)
1. The utility model provides a stamping die that three-dimensional steel reinforcement of 5G chip circuit board area was glued, its characterized in that, stamping die include cope match-plate pattern, lower bolster and locate adhesive tape and the steel band between cope match-plate pattern and the lower bolster, the cope match-plate pattern is including splint, backplate and the flitch of taking off that sets gradually, be equipped with the punching pin in the cope match-plate pattern, the punching pin includes adhesive tape punching pin and locating hole punching pin, the lower bolster middle part is equipped with the punching a hole corresponding with the adhesive tape punching pin.
2. The 5G chip circuit board three-dimensional steel reinforcing tape adhesive stamping die of claim 1, wherein the gummed paper punch is arranged in the middle of the upper template and corresponds to the punching of the lower template, and the positioning hole punch is arranged on the side face of the gummed paper punch.
3. The 5G chip circuit board three-dimensional steel reinforcing tape adhesive stamping die of claim 1, wherein the gummed paper punch and the positioning hole punch are fixed through a clamping plate and penetrate through the back plate and the stripper plate to be above the gummed paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123304019.XU CN216911739U (en) | 2021-12-24 | 2021-12-24 | Stamping die that three-dimensional steel reinforcement of 5G chip circuit board was glued in area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123304019.XU CN216911739U (en) | 2021-12-24 | 2021-12-24 | Stamping die that three-dimensional steel reinforcement of 5G chip circuit board was glued in area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216911739U true CN216911739U (en) | 2022-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123304019.XU Active CN216911739U (en) | 2021-12-24 | 2021-12-24 | Stamping die that three-dimensional steel reinforcement of 5G chip circuit board was glued in area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216911739U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114393096A (en) * | 2021-12-24 | 2022-04-26 | 深圳市腾鑫精密电子芯材科技有限公司 | Stamping die for three-dimensional steel reinforcing tape adhesive of 5G chip circuit board and processing technology of stamping die |
-
2021
- 2021-12-24 CN CN202123304019.XU patent/CN216911739U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114393096A (en) * | 2021-12-24 | 2022-04-26 | 深圳市腾鑫精密电子芯材科技有限公司 | Stamping die for three-dimensional steel reinforcing tape adhesive of 5G chip circuit board and processing technology of stamping die |
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