CN112804867A - 一种计算机大数据服务器散热装置 - Google Patents
一种计算机大数据服务器散热装置 Download PDFInfo
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- CN112804867A CN112804867A CN202110255019.0A CN202110255019A CN112804867A CN 112804867 A CN112804867 A CN 112804867A CN 202110255019 A CN202110255019 A CN 202110255019A CN 112804867 A CN112804867 A CN 112804867A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
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CN202110255019.0A CN112804867B (zh) | 2021-03-09 | 2021-03-09 | 一种计算机大数据服务器散热装置 |
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CN202110255019.0A CN112804867B (zh) | 2021-03-09 | 2021-03-09 | 一种计算机大数据服务器散热装置 |
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CN112804867A true CN112804867A (zh) | 2021-05-14 |
CN112804867B CN112804867B (zh) | 2022-08-26 |
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Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009193246A (ja) * | 2008-02-13 | 2009-08-27 | Hitachi Plant Technologies Ltd | 電子機器の冷却システム |
US20120050984A1 (en) * | 2010-08-24 | 2012-03-01 | Hon Hai Precision Industry Co., Ltd. | Server cabinet with liquid cooling system |
US20130043775A1 (en) * | 2011-08-19 | 2013-02-21 | Inventec Corporation | Server cabinet coolant distribution system |
WO2013100913A1 (en) * | 2011-12-27 | 2013-07-04 | Intel Corporation | Transient thermal management systems for semiconductor devices |
CN103592915A (zh) * | 2013-11-05 | 2014-02-19 | 孔繁忠 | 生态智能机房 |
US20150020998A1 (en) * | 2013-07-18 | 2015-01-22 | Acer Incorporated | Cycling heat dissipation module |
WO2015151400A1 (ja) * | 2014-03-31 | 2015-10-08 | ダイキン工業株式会社 | コンテナ用冷凍装置 |
WO2016163124A1 (ja) * | 2015-04-08 | 2016-10-13 | セイコーエプソン株式会社 | プロジェクター |
CN206350290U (zh) * | 2017-01-09 | 2017-07-21 | 广东黑拍师光电有限公司 | 液体冷却一体化装置 |
CN108055816A (zh) * | 2018-01-23 | 2018-05-18 | 扬州万方电子技术有限责任公司 | 一种单元模块化可快速安装的水冷服务器 |
CN207427683U (zh) * | 2017-11-06 | 2018-05-29 | 河南大林橡胶通信器材有限公司 | 一种新型网络机柜 |
CN108767358A (zh) * | 2018-04-14 | 2018-11-06 | 黄河科技学院 | 一种新能源汽车电池散热装置 |
CN109041530A (zh) * | 2018-08-21 | 2018-12-18 | 李锋 | 分布式服务器液冷系统 |
CN109475068A (zh) * | 2018-01-15 | 2019-03-15 | 香江科技股份有限公司 | 一种数据中心多冷源模块化分区冷却节能系统及控制方法 |
CN110712553A (zh) * | 2019-11-13 | 2020-01-21 | 南京能瑞电力科技有限公司 | 一种直流充电机 |
CN211063981U (zh) * | 2020-04-30 | 2020-07-21 | 海南汉普管家信息科技有限公司 | 一种知识产权大数据服务器机柜 |
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2021
- 2021-03-09 CN CN202110255019.0A patent/CN112804867B/zh active Active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009193246A (ja) * | 2008-02-13 | 2009-08-27 | Hitachi Plant Technologies Ltd | 電子機器の冷却システム |
US20120050984A1 (en) * | 2010-08-24 | 2012-03-01 | Hon Hai Precision Industry Co., Ltd. | Server cabinet with liquid cooling system |
US20130043775A1 (en) * | 2011-08-19 | 2013-02-21 | Inventec Corporation | Server cabinet coolant distribution system |
WO2013100913A1 (en) * | 2011-12-27 | 2013-07-04 | Intel Corporation | Transient thermal management systems for semiconductor devices |
US20150020998A1 (en) * | 2013-07-18 | 2015-01-22 | Acer Incorporated | Cycling heat dissipation module |
CN103592915A (zh) * | 2013-11-05 | 2014-02-19 | 孔繁忠 | 生态智能机房 |
CN106104181A (zh) * | 2014-03-31 | 2016-11-09 | 大金工业株式会社 | 集装箱用冷冻装置 |
WO2015151400A1 (ja) * | 2014-03-31 | 2015-10-08 | ダイキン工業株式会社 | コンテナ用冷凍装置 |
WO2016163124A1 (ja) * | 2015-04-08 | 2016-10-13 | セイコーエプソン株式会社 | プロジェクター |
CN206350290U (zh) * | 2017-01-09 | 2017-07-21 | 广东黑拍师光电有限公司 | 液体冷却一体化装置 |
CN207427683U (zh) * | 2017-11-06 | 2018-05-29 | 河南大林橡胶通信器材有限公司 | 一种新型网络机柜 |
CN109475068A (zh) * | 2018-01-15 | 2019-03-15 | 香江科技股份有限公司 | 一种数据中心多冷源模块化分区冷却节能系统及控制方法 |
CN108055816A (zh) * | 2018-01-23 | 2018-05-18 | 扬州万方电子技术有限责任公司 | 一种单元模块化可快速安装的水冷服务器 |
CN108767358A (zh) * | 2018-04-14 | 2018-11-06 | 黄河科技学院 | 一种新能源汽车电池散热装置 |
CN109041530A (zh) * | 2018-08-21 | 2018-12-18 | 李锋 | 分布式服务器液冷系统 |
CN110712553A (zh) * | 2019-11-13 | 2020-01-21 | 南京能瑞电力科技有限公司 | 一种直流充电机 |
CN211063981U (zh) * | 2020-04-30 | 2020-07-21 | 海南汉普管家信息科技有限公司 | 一种知识产权大数据服务器机柜 |
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Effective date of registration: 20230810 Address after: Room 518, 5th Floor, Building A18, No. 9 Jiusheng Road, Shangcheng District, Hangzhou City, Zhejiang Province, 310000 Patentee after: HANGZHOU PINGZHI INFORMATION TECHNOLOGY CO.,LTD. Address before: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee before: Dragon totem Technology (Hefei) Co.,Ltd. Effective date of registration: 20230810 Address after: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee after: Dragon totem Technology (Hefei) Co.,Ltd. Address before: No.38, Qingnian West Road, Zhongmou County, Zhengzhou City, Henan Province, 450000 Patentee before: HENAN VOCATIONAL College OF AGRICULTURE |