CN112802779A - PCB chip appearance packaging equipment with auxiliary positioning mechanism - Google Patents

PCB chip appearance packaging equipment with auxiliary positioning mechanism Download PDF

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Publication number
CN112802779A
CN112802779A CN202110161107.4A CN202110161107A CN112802779A CN 112802779 A CN112802779 A CN 112802779A CN 202110161107 A CN202110161107 A CN 202110161107A CN 112802779 A CN112802779 A CN 112802779A
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China
Prior art keywords
groups
fixed block
base
block
fixed
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CN202110161107.4A
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Chinese (zh)
Inventor
胡富生
浦金玉
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Xiefeng Wanjia Science And Technology Shenzhen Co ltd
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Xiefeng Wanjia Science And Technology Shenzhen Co ltd
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Priority to CN202110161107.4A priority Critical patent/CN112802779A/en
Publication of CN112802779A publication Critical patent/CN112802779A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The invention belongs to the technical field of packaging, and particularly relates to PCB chip shape packaging equipment with an auxiliary positioning mechanism. Comprises a base, a movable seat, a limiting block, a lifting device and a sealing cover component; the base is of a cubic structure, each side end of the upper surface of the base is provided with a mounting groove, and the side ends of each group of mounting grooves respectively penetrate through one side wall of the base; the movable seats are movably mounted in the mounting grooves of the groups respectively, the limiting blocks of the groups can be clamped and fixed at the upper ends of the movable seats respectively, and the side ends of the limiting blocks can be lapped on the upper surface of the base. The quantity of being more than the stopper is set up through the quantity with the sliding seat for this equipment can adjust preset position with a plurality of sliding seats according to the chip size of multiple different pins with the specification simultaneously when using, only need when changing the encapsulation chip carry out the position to the stopper remove can, be applicable to the chip of various different pins with the specification, application scope is wider.

Description

PCB chip appearance packaging equipment with auxiliary positioning mechanism
Technical Field
The invention belongs to the technical field of packaging, and particularly relates to PCB chip shape packaging equipment with an auxiliary positioning mechanism.
Background
The PCB chip packaging is a process of placing a produced integrated circuit bare chip on a substrate which plays a bearing role, then leading out pins, and fixing and packaging the integrated circuit bare chip into a whole.
The existing chip is packaged by one or more groups of bases and cavities during packaging, the bases and the cavities are only suitable for packaging chips with specific styles, and chips except the styles cannot be effectively packaged.
Disclosure of Invention
Aiming at the problems, the invention provides PCB chip appearance packaging equipment with an auxiliary positioning mechanism, which comprises a base, a movable seat, a limiting block, a lifting device and a sealing cover assembly, wherein the movable seat is arranged on the base;
the base is of a cubic structure, each side end of the upper surface of the base is provided with a mounting groove, and the side ends of each group of mounting grooves respectively penetrate through one side wall of the base;
the movable seats are movably arranged in the mounting grooves respectively, the limiting blocks can be clamped and fixed at the upper ends of the movable seats respectively, and the side ends of the limiting blocks can be lapped on the upper surface of the base;
the four groups of lifting devices are symmetrically arranged at four corners of the upper end surface of the base, the sealing cover assembly is positioned right above the base, and the side ends of the sealing cover assembly are respectively fixedly connected with the lifting ends of the four groups of lifting devices;
an encapsulation cavity can be formed between the cover assembly and the base.
Furthermore, the number of the movable seats is more than that of the limiting blocks.
Further, the base comprises a base and a screw rod;
the base is of a cube structure, two groups of grooves are formed in the upper end of the base, and the two groups of grooves are arranged in a 90-degree annular array by taking the central axis of the base as the center; the distance between two opposite side ends of the groove is greater than the side length of the base, and the other two side ends of the groove are less than the side length of the base; four groups of first clamping grooves are respectively formed at the joints of the two groups of side walls of the grooves, and the four groups of side walls of the first clamping grooves are vertically arranged and are mutually vertical or parallel;
the four groups of mounting grooves are arranged on the bottom surface of the groove in an annular array, and the minimum distance between the two opposite groups of mounting grooves is greater than the maximum distance between the two opposite groups of first clamping grooves;
the four groups of screw rods are respectively arranged in the four groups of mounting grooves, and two ends of each group of screw rods are respectively fixedly penetrated through two side walls of one group of mounting grooves;
four groups of first mounting grooves are symmetrically formed in four corners of the upper end face of the base, and the four groups of lifting devices are respectively mounted in the four groups of first mounting grooves.
Further, the mounting groove comprises a second clamping groove and a through groove; the four groups of second clamping grooves are arranged on the bottom surface of the groove in an annular array, and the minimum distance between two opposite groups of second clamping grooves is greater than the maximum distance between two opposite groups of first clamping grooves; the four groups of through grooves are arranged on the side wall of the base in an annular array, and each group of through grooves is respectively communicated with one group of second clamping grooves; two ends of each group of screw rods are respectively and fixedly penetrated through two side walls of one group of second clamping grooves, the central axes of the screw rods are respectively parallel to the central axes of the second clamping grooves, and the screw rods and the through grooves are positioned at the same horizontal height.
Further, the movable seat comprises a first fixed block and a bolt;
a through hole is formed in the side wall of the first fixing block, the first fixing block is movably clamped in the second clamping groove, and the first fixing block is movably sleeved on the screw rod through the through hole; the upper end of the first fixing block is provided with a second mounting groove;
the bolt threads are installed on the screw rod, and the two groups of bolts are symmetrically arranged on two sides of the first fixing block.
Further, the limiting block comprises a second fixing block and a clamping block;
the fixture block is arranged at the lower end of the second fixing block, the fixture block can be clamped and fixed in the second mounting groove, and two end parts of the lower surface of the second fixing block can be respectively attached to planes on two sides of the upper end of the second clamping groove;
the second fixing block comprises a fixing seat and a rotating seat;
the lower end of the fixed seat is fixedly connected with the clamping block, and the rotating seat is hinged to the fixed seat.
Further, the fixing seat comprises a third fixing block, a fourth fixing block, a fifth fixing block and a rotating rod;
the lower end of the third fixed block is fixedly connected with the fixture block, the fourth fixed block is arranged at one end of the upper surface of the third fixed block, one ends of the fourth fixed block and the third fixed block are positioned on the same vertical plane, and a first fillet is arranged at the joint of the upper surface of the fourth fixed block and the fourth fixed block, which is close to the central axis of the third fixed block; and the fifth fixing blocks are symmetrically arranged at one ends of the two side walls of the fourth fixing block, which are far away from the central axis of the third fixing block, and the rotating rod movably penetrates through one end, which is close to the central axis of the third fixing block, of the side wall of the fourth fixing block.
Further, the rotating seat comprises a sixth fixed block, a seventh fixed block and an eighth fixed block;
the two groups of the sixth fixed blocks are symmetrically arranged and movably attached to the third fixed block, the two groups of the seventh fixed blocks are symmetrically arranged at the upper ends of the two groups of the sixth fixed blocks respectively, and one ends of the two groups of the seventh fixed blocks are movably attached to the side ends of the two groups of the fifth fixed blocks and the two side ends of the fourth fixed block respectively; a second fillet is arranged at the joint of one end of each of the two groups of seventh fixed blocks, which is movably attached to the two groups of fifth fixed blocks, and the upper end face of each of the seventh fixed blocks, the eighth fixed block is arranged between the two groups of seventh fixed blocks, the bottom surface of the eighth fixed block is movably attached to the upper end face of the third fixed block, one end of the eighth fixed block is movably attached to the first fillet, and an oblique angle is arranged at the joint of the other end of the eighth fixed block and the lower surface of each of the eighth fixed blocks; hinge holes are formed in the joint of the sixth fixing block and the seventh fixing block, and the hinge holes are movably sleeved at two ends of the rotating rod respectively.
Further, the cover sealing assembly comprises a cover plate, a connecting block, a material injection pipe and a material injection device;
the cover plate is positioned right above the base, the side length of the cover plate is equal to the maximum distance between the two opposite groups of first clamping grooves, and four corners of the cover plate are respectively fixedly connected with the lifting ends of one group of lifting devices through four groups of connecting blocks; a cavity is arranged in the cover plate, and the lower end of the cover plate is of an open structure; one end of the material injection pipe penetrates through the cover plate and is communicated with the cavity, and the other end of the material injection pipe is communicated with the output end of the material injection device.
Furthermore, the material injection pipes are provided with a plurality of groups, and the material injection pipes in the groups are arranged in an annular array, penetrate through the side ends of the cover plate respectively and are communicated with the cavity.
The invention has the beneficial effects that:
1. the number of the movable seats is more than that of the limiting blocks, so that the equipment can adjust the movable seats to preset positions according to the sizes of various chips with the same specification and different pins simultaneously when in use, and the limiting blocks are only required to be moved when packaged chips are replaced, so that the equipment is suitable for various chips with the same specification and different pins, and is wider in application range;
2. through the through groove arranged at the side end of the base, the through groove is communicated with the second clamping groove and is positioned at the same horizontal height with the screw rod, so that a user can adjust the position of the movable seat through the through groove, and the movable seat is more visual and convenient to adjust;
3. through being the annular array setting with a plurality of groups material injection pipe to run through each side of apron respectively, with the cavity intercommunication, make this encapsulation equipment when encapsulating the chip, the encapsulation effect is better, and breaks away from more conveniently.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic perspective view of a packaging apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a package device according to an embodiment of the invention;
FIG. 3 shows a schematic structural diagram of a base according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a movable seat according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a limiting block according to an embodiment of the invention;
fig. 6 is a schematic structural diagram illustrating a second fixing block according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a fixing base according to an embodiment of the invention;
FIG. 8 is a schematic structural view of a rotary base according to an embodiment of the present invention;
fig. 9 shows a schematic structural view of a closure assembly according to an embodiment of the present invention.
In the figure: 1. a base; 101. mounting grooves; 2. a movable seat; 3. a limiting block; 4. a lifting device; 5. a closure assembly; 6. a packaging cavity; 7. a base; 701. a groove; 702. a first card slot; 703. a second card slot; 704. a through groove; 705. a first mounting groove; 8. a screw; 9. a first fixed block; 901. a through hole; 902. a second mounting groove; 10. a bolt; 11. a second fixed block; 12. a clamping block; 13. a cover plate; 1301. a cavity; 14. connecting blocks; 15. a material injection pipe; 16. a fixed seat; 17. a rotating base; 18. a third fixed block; 19. a fourth fixed block; 1901. a first rounded corner; 20. a fifth fixed block; 21. rotating the rod; 22. a sixth fixed block; 23. a seventh fixed block; 2301. a hinge hole; 2302. a second rounded corner; 24. an eighth fixed block; 2401. and (4) oblique angle.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides PCB chip appearance packaging equipment with an auxiliary positioning mechanism, which comprises a base 1, a movable seat 2, a limiting block 3, a lifting device 4 and a cover assembly 5, and is exemplarily shown in fig. 1 and 2.
The base 1 is of a cube structure, each side end of the upper surface of the base 1 is provided with a mounting groove 101, a plurality of groups of movable seats 2 are movably mounted in each group of mounting grooves 101 respectively, each group of limiting blocks 3 can be clamped and fixed at the upper end of one group of movable seats 2 respectively, and the side ends of the limiting blocks 3 can be lapped on the upper surface of the base 1; the base 1 is a lower disc of the packaging equipment, the limiting block 3 is used for limiting pins of the PCB chip, and the movable seat 2 is used for adjusting the limiting position of the limiting block 3;
the four groups of lifting devices 4 are symmetrically arranged at four corners of the upper end surface of the base 1, the sealing cover assembly 5 is positioned right above the base 1, and the side ends of the sealing cover assembly 5 are respectively fixedly connected with the lifting ends of the four groups of lifting devices 4; the cover sealing component 5 is an upper disc of the packaging equipment, and the lifting device 4 is used for controlling the distance between the cover sealing component 5 and the base 1 so as to control the sealing joint or separation of the cover sealing component 5 and the base;
an encapsulation cavity 6 can be formed between the cover component 5 and the base 1; the packaging cavity 6 is used for packaging the PCB chip inside.
Preferably, the side ends of each set of the mounting grooves 101 respectively penetrate through one side wall of the base 1.
The side ends of the mounting grooves 101 are arranged to penetrate through one side wall of the base 1, so that the position of the movable seat 2 can be adjusted conveniently by a user.
For example, before use, the position of the movable seat 2 is adjusted and fixed according to the pin position of the PCB chip, then the limit blocks 3 are respectively clamped and fixed on the movable seat 2 at the preset positions, and then the PCB chip can be moved to the center of the upper surface of the base 1 by using a conveying device or a manipulator existing in the prior art; when the PCB chip moves onto the base 1, the pins of the PCB chip are respectively clamped between the groups of limiting blocks 3, and the primary packaging and positioning of the PCB chip can be realized through the structure; at this moment, the lifting device 4 operates to control the cover assembly 5 to move downwards until the cover assembly 5 is pressed down at the side end of the PCB chip substrate, the PCB chip is positioned in the packaging cavity 6 at this moment, then the cover assembly 5 injects packaging materials such as resin into the packaging cavity 6, then the lifting device 4 operates reversely to enable the cover assembly 5 to move upwards and separate from the base 1, at this moment, the packaging of the PCB chip is completed, and the PCB chip can be taken out and moved to a preset position by using a conveying device or a mechanical arm.
Through using movable seat 2 and stopper 3 with it complex to carry out preliminary location to the chip for this chip is more stable when the encapsulation, and the encapsulation effect is better.
Preferably, the number of the movable seats 2 is more than that of the limit blocks 3.
Illustratively, when the PCB chips with the same specification and size and the same packaging mode but different pin positions and numbers are packaged, a plurality of groups of movable seats 2 can be adjusted to adapt to the PCB chips with the same specification and different pins, and when one PCB chip is packaged, the fixed limit blocks 3 can be clamped on the plurality of groups of movable seats 2 adjusted according to the pin of the chip to adapt to the PCB chip; when other PCB chips need to be packaged, the original limiting blocks 3 are taken down and clamped on a plurality of groups of movable seats 2 arranged according to the chips; through the arrangement, the device can package the PCB chips with different specifications and different pins.
The quantity that is more than stopper 3 is set up through the quantity with sliding seat 2 for this equipment can adjust preset position with a plurality of sliding seats 2 according to the chip size of the different pins of multiple with the specification simultaneously when using, only need when changing the encapsulation chip carry out the position to stopper 3 remove can, be applicable to the chip of the different pins of various different specifications, application scope is wider.
The base 1 comprises a base 7 and a screw 8, as shown in fig. 3; the base 7 is in a cube structure, two groups of grooves 701 are formed in the upper end of the base 7, and the two groups of grooves 701 are arranged in a 90-degree annular array by taking the central axis of the base 7 as the center; the distance between two opposite side ends of the groove 701 is greater than the side length of the base 7, and the other two side ends of the groove 701 are less than the side length of the base 7; four groups of first clamping grooves 702 are respectively formed at the joints of the side walls of the two groups of grooves 701, and the side walls of the four groups of first clamping grooves 702 are vertically arranged and are mutually vertical or parallel;
the four groups of mounting grooves 101 are arranged on the bottom surface of the groove 701 in an annular array, and the minimum distance between the two groups of opposite mounting grooves 101 is greater than the maximum distance between the two groups of opposite first clamping grooves 702;
the four groups of screw rods 8 are respectively arranged in the four groups of mounting grooves 101, and two ends of each group of screw rods 8 respectively fixedly penetrate through two side walls of one group of mounting grooves 101;
four corners of the upper end surface of the base 7 are symmetrically provided with four sets of first mounting grooves 705, and the four sets of lifting devices 4 are respectively mounted in the four sets of first mounting grooves 705.
Specifically, the mounting groove 101 includes a second card slot 703 and a through slot 704; the four groups of second card slots 703 are arranged on the bottom surface of the groove 701 in an annular array, and the minimum distance between two opposite groups of second card slots 703 is greater than the maximum distance between two opposite groups of first card slots 702; the four groups of through grooves 704 are arranged on the side wall of the base 7 in an annular array, and each group of through grooves 704 is respectively communicated with one group of second clamping grooves 703; two ends of each group of the screw rods 8 respectively and fixedly penetrate through two side walls of one group of the second clamping grooves 703, central axes of the screw rods 8 are respectively parallel to central axes of the group of the second clamping grooves 703, and the screw rods 8 and the through grooves 704 are located at the same horizontal height.
Through set up logical groove 704 at base 7 side, and lead to groove 704 and second draw-in groove 703 intercommunication to be located same level with screw rod 8, make stopper 3 overlap joint more stable, and the user accessible leads to groove 704 and adjusts the position of sliding seat 2, and sliding seat 2 adjusts more directly perceived, convenient.
The movable seat 2 comprises a first fixed block 9 and a bolt 10, as shown in fig. 4; a through hole 901 is formed in the side wall of the first fixing block 9, the first fixing block 9 is movably clamped in the second clamping groove 703, and the first fixing block 9 is movably sleeved on the screw 8 through the through hole 901; the upper end of the first fixing block 9 is provided with a second mounting groove 902;
the bolts 10 are installed on the screw rod 8 in a threaded mode, and the two groups of bolts 10 are symmetrically arranged on two sides of the first fixing block 9.
Fix the position of first fixed block 9 through using two sets of bolts for the movable seat 2 is fixed a position more accurately when adjusting, and the regulating effect is better, and governing speed is higher.
The limiting block 3 comprises a second fixing block 11 and a clamping block 12, as shown in fig. 5; the fixture block 12 is disposed at the lower end of the second fixing block 11, the fixture block 12 can be fixed in the second mounting groove 902 in a clamping manner, and two end portions of the lower surface of the second fixing block 11 can be respectively attached to two planes at two sides of the upper end of the second clamping groove 703.
The second fixing block 11 comprises a fixing seat 16 and a rotating seat 17, as shown in fig. 6; the lower end of the fixed seat 16 is fixedly connected with the clamping block 12, and the rotating seat 17 is hinged on the fixed seat 16.
Specifically, as shown in fig. 7, the fixing seat 16 includes a third fixing block 18, a fourth fixing block 19, a fifth fixing block 20, and a rotating rod 21; the lower end of the third fixed block 18 is fixedly connected with the fixture block 12, the fourth fixed block 19 is arranged at one end of the upper surface of the third fixed block 18, one end of the third fixed block and one end of the fourth fixed block are positioned on the same vertical plane, and a first fillet 1901 is arranged at the joint of the upper surface of the fourth fixed block 19 and the joint close to the central axis of the third fixed block 18; two sets of the one end of keeping away from the 18 axis of third fixed block is set up to the symmetry of fifth fixed block 20 on the wall of fourth fixed block 19 both sides, the activity of dwang 21 runs through the one end that is close to the 18 axis of third fixed block on the wall of fourth fixed block 19 lateral wall.
The rotating seat 17 comprises a sixth fixed block 22, a seventh fixed block 23 and an eighth fixed block 24, as shown in fig. 8; the two groups of the sixth fixed blocks 22 are symmetrically arranged and movably attached to the third fixed block 18, the two groups of the seventh fixed blocks 23 are respectively symmetrically arranged at the upper ends of the two groups of the sixth fixed blocks 22, and one ends of the two groups of the seventh fixed blocks 23 are respectively movably attached to the side ends of the two groups of the fifth fixed blocks 20 and the two side ends of the fourth fixed block 19; a second fillet 2302 is arranged at the joint of one end of the two groups of seventh fixed blocks 23 movably jointed with the two groups of fifth fixed blocks 20 and the upper end face of the seventh fixed block, the eighth fixed block 24 is arranged between the two groups of seventh fixed blocks 23, the bottom surface of the eighth fixed block 24 is movably jointed with the upper end face of the third fixed block 18, one end of the eighth fixed block 24 is movably jointed with the first fillet 1901, and an oblique angle 2401 is arranged at the joint of the other end of the eighth fixed block 24 and the lower surface of the eighth fixed block; hinge holes 2301 are formed in the joints of the sixth fixing block 22 and the seventh fixing block 23, and the hinge holes 2301 are movably sleeved at two ends of the rotating rod 21 respectively.
Illustratively, when the lower end surface of the eighth fixed block 24 is attached to the upper end surface of the third fixed block 18, the front end, the rear end and the lower end of the sixth fixed block 22 are respectively located on the same plane as the front end, the rear end and the lower end of the third fixed block 18;
when the chip fixing device is used, the chip pins are clamped on the two adjacent groups of the rotating seats 17, and between the two adjacent groups of the sixth fixing blocks 22 and the seventh fixing blocks 23; when the limiting block 3 needs to be removed, the bevel 2401 at the end of the eighth fixing block 24 is shifted, so that the rotating base 17 rotates around the rotating rod 21, the end of the sixth fixing block 22 abuts against the bottom surface of the groove 701, and the clamping block 12 is jacked up from the second mounting groove 902.
The oblique angle 2401 is arranged at the tail end of the eighth fixing block 24, so that a user can more conveniently stir the rotating base 17; through articulating roating seat 17 on fixing base 16, and the tip of roating seat 17 can contradict with recess 701 bottom surface to play stopper 3 from sliding seat 2 out, make this encapsulation equipment's stopper 3 install with get rid of more swiftly, convenient.
The cover assembly 5 comprises a cover plate 13, a connecting block 14, a feeding pipe 15 and a feeding device (not shown in the figure), as shown in fig. 9; the cover plate 13 is positioned right above the base 7, the side length of the cover plate 13 is equal to the maximum distance between the two opposite groups of first clamping grooves 702, and four corners of the cover plate 13 are respectively fixedly connected with the lifting ends of one group of lifting devices 4 through four groups of connecting blocks 14; a cavity 1301 is arranged in the cover plate 13, and the lower end of the cover plate 13 is of an open structure; one end of the material injection pipe 15 penetrates through the cover plate 13 and is communicated with the cavity 1301, and the other end of the material injection pipe 15 is communicated with the output end of the material injection device.
For example, the material injection device may be a fluid conveying device used in the prior art, and the lifting device 4 may be an electric push rod or a hydraulic cylinder, which will not be described in detail in this embodiment.
Preferably, the plurality of groups of the material injection pipes 15 are arranged in an annular array, and the plurality of groups of the material injection pipes 15 penetrate through the side ends of the cover plate 13 respectively and are communicated with the cavity 1301.
Through being the annular array setting with a plurality of groups of notes material pipe 15 to run through each side of apron 13 respectively, communicate with cavity 1301, make this encapsulation equipment when encapsulating the chip, the encapsulation effect is better, and breaks away from more conveniently.
Illustratively, the bolts 10 on both sides of each group of first fixing blocks 9 are rotated from the through grooves 704, so as to adjust the positions of the first fixing blocks 9, so that a plurality of groups of first fixing blocks 9 respectively correspond to one or more chips with the same specification and different pins, then a plurality of groups of limiting blocks 3 are clamped on the movable seat 2 at the preset positions, and then the chips are moved into the packaging cavity 6 by means of a manipulator and the like; the lifting device 4 operates to control the cover assembly 5 to move downwards until the cover assembly 5 is pressed down at the side end of the P chip substrate, the chip is positioned in the packaging cavity 6 at the moment, then the cover assembly 5 injects packaging materials such as resin into the packaging cavity 6, then the lifting device 4 operates reversely to enable the cover assembly 5 to move upwards and separate from the base 1, at the moment, the chip packaging is completed, and the PCB chip can be taken out and moved to a preset position by using a manipulator.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. The utility model provides a PCB chip appearance encapsulation equipment with assistance-localization real-time mechanism which characterized in that: comprises a base (1), a movable seat (2), a limiting block (3), a lifting device (4) and a sealing cover component (5);
the base (1) is of a cubic structure, each side end of the upper surface of the base (1) is provided with a mounting groove (101), and the side ends of each group of mounting grooves (101) respectively penetrate through one side wall of the base (1);
the movable seats (2) are movably arranged in the mounting grooves (101), the limiting blocks (3) are fixed to the upper ends of the movable seats (2) in a clamping mode, and the side ends of the limiting blocks (3) can be lapped on the upper surface of the base (1);
the four groups of lifting devices (4) are symmetrically arranged at four corners of the upper end surface of the base (1), the sealing cover assembly (5) is positioned right above the base (1), and the side ends of the sealing cover assembly (5) are respectively fixedly connected with the lifting ends of the four groups of lifting devices (4);
an encapsulation cavity (6) can be formed between the cover component (5) and the base (1).
2. A PCB chip outline package apparatus having an auxiliary positioning mechanism as recited in claim 1, wherein: the number of the movable seats (2) is more than that of the limiting blocks (3).
3. A PCB chip outline package apparatus having an auxiliary positioning mechanism as recited in claim 1, wherein: the base (1) comprises a base (7) and a screw rod (8);
the base (7) is of a cube structure, two groups of grooves (701) are formed in the upper end of the base (7), and the two groups of grooves (701) are arranged in a 90-degree annular array by taking the central axis of the base (7) as the center; the distance between two opposite side ends of the groove (701) is greater than the side length of the base (7), and the other two side ends of the groove (701) are less than the side length of the base (7); four groups of first clamping grooves (702) are respectively formed at the joints of the side walls of the two groups of grooves (701), and the side walls of the four groups of first clamping grooves (702) are vertically arranged and are mutually vertical or parallel;
the four groups of mounting grooves (101) are arranged on the bottom surface of the groove (701) in an annular array, and the minimum distance between the two groups of opposite mounting grooves (101) is greater than the maximum distance between the two groups of opposite first clamping grooves (702);
the four groups of screw rods (8) are respectively arranged in the four groups of mounting grooves (101), and two ends of each group of screw rods (8) respectively fixedly penetrate through two side walls of one group of mounting grooves (101);
four corners of the upper end surface of the base (7) are symmetrically provided with four groups of first mounting grooves (705), and the four groups of lifting devices (4) are respectively mounted in the four groups of first mounting grooves (705).
4. A PCB chip outline package apparatus having an auxiliary positioning mechanism as recited in claim 3, wherein: the mounting groove (101) comprises a second clamping groove (703) and a through groove (704); the four groups of second clamping grooves (703) are arranged on the bottom surface of the groove (701) in an annular array, and the minimum distance between the two opposite groups of second clamping grooves (703) is greater than the maximum distance between the two opposite groups of first clamping grooves (702); the four groups of through grooves (704) are arranged on the side wall of the base (7) in an annular array, and each group of through grooves (704) are respectively communicated with one group of second clamping grooves (703); two ends of each group of screw rods (8) are respectively and fixedly penetrated through two side walls of one group of second clamping grooves (703), the central axis of each group of screw rods (8) is respectively parallel to the central axis of one group of second clamping grooves (703), and the screw rods (8) and the through grooves (704) are positioned at the same horizontal height.
5. The PCB chip outline package device with the auxiliary positioning mechanism of claim 4, wherein: the movable seat (2) comprises a first fixed block (9) and a bolt (10);
a through hole (901) is formed in the side wall of the first fixing block (9), the first fixing block (9) is movably clamped in the second clamping groove (703), and the first fixing block (9) is movably sleeved on the screw rod (8) through the through hole (901); the upper end of the first fixing block (9) is provided with a second mounting groove (902);
the bolts (10) are installed on the screw rod (8) in a threaded mode, and the two groups of bolts (10) are symmetrically arranged on two sides of the first fixing block (9).
6. The PCB chip outline package device with the auxiliary positioning mechanism of claim 5, wherein: the limiting block (3) comprises a second fixing block (11) and a clamping block (12);
the fixture block (12) is arranged at the lower end of the second fixing block (11), the fixture block (12) can be clamped and fixed in the second mounting groove (902), and two end parts of the lower surface of the second fixing block (11) can be respectively attached to planes on two sides of the upper end of the second clamping groove (703);
the second fixed block (11) comprises a fixed seat (16) and a rotating seat (17);
the lower end of the fixed seat (16) is fixedly connected with the clamping block (12), and the rotating seat (17) is hinged on the fixed seat (16).
7. The PCB chip outline package device with the auxiliary positioning mechanism of claim 6, wherein: the fixing seat (16) comprises a third fixing block (18), a fourth fixing block (19), a fifth fixing block (20) and a rotating rod (21);
the lower end of the third fixed block (18) is fixedly connected with the fixture block (12), the fourth fixed block (19) is arranged at one end of the upper surface of the third fixed block (18), one ends of the third fixed block and the fourth fixed block are positioned on the same vertical plane, and a first fillet (1901) is arranged at the joint of the upper surface of the fourth fixed block (19) and the joint of the upper surface of the fourth fixed block (19) close to the central axis of the third fixed block (18); two sets of fifth fixed block (20) symmetry sets up the one end of keeping away from third fixed block (18) axis on fourth fixed block (19) both sides wall, dwang (21) activity runs through the one end that is close to third fixed block (18) axis on fourth fixed block (19) lateral wall.
8. The PCB chip outline package device with the auxiliary positioning mechanism of claim 7, wherein: the rotating seat (17) comprises a sixth fixed block (22), a seventh fixed block (23) and an eighth fixed block (24);
the two groups of the sixth fixed blocks (22) are symmetrically arranged and movably attached to the third fixed block (18), the two groups of the seventh fixed blocks (23) are symmetrically arranged at the upper ends of the two groups of the sixth fixed blocks (22) respectively, and one ends of the two groups of the seventh fixed blocks (23) are movably attached to the side ends of the two groups of the fifth fixed blocks (20) and the two side ends of the fourth fixed block (19) respectively; a second fillet (2302) is arranged at the joint of one end of each of the two groups of seventh fixed blocks (23) movably attached to the two groups of fifth fixed blocks (20) and the upper end face of the seventh fixed block, the eighth fixed block (24) is arranged between the two groups of seventh fixed blocks (23), the bottom surface of the eighth fixed block (24) is movably attached to the upper end face of the third fixed block (18), one end of the eighth fixed block (24) is movably attached to the first fillet (1901), and an oblique angle (2401) is arranged at the joint of the other end of the eighth fixed block (24) and the lower surface of the eighth fixed block; hinge holes (2301) have been seted up to the sixth fixed block (22) with the junction of seventh fixed block (23), and two sets of hinge holes (2301) are the activity respectively and are cup jointed at the both ends of dwang (21).
9. A PCB chip outline package apparatus having an auxiliary positioning mechanism as recited in claim 3, wherein: the cover sealing assembly (5) comprises a cover plate (13), a connecting block (14), a material injection pipe (15) and a material injection device;
the cover plate (13) is positioned right above the base (7), the side length of the cover plate (13) is equal to the maximum distance between the two groups of first clamping grooves (702) which are opposite, and four corners of the cover plate (13) are fixedly connected with the lifting ends of one group of lifting devices (4) through four groups of connecting blocks (14); a cavity (1301) is formed in the cover plate (13), and the lower end of the cover plate (13) is of an open structure; one end of the material injection pipe (15) penetrates through the cover plate (13) and is communicated with the cavity (1301), and the other end of the material injection pipe (15) is communicated with the output end of the material injection device.
10. A PCB chip outline package apparatus having an auxiliary positioning mechanism as recited in claim 9, wherein: the material injection pipes (15) are arranged in a plurality of groups, and the material injection pipes (15) in the groups are arranged in an annular array, penetrate through the side ends of the cover plate (13) respectively and are communicated with the cavity (1301).
CN202110161107.4A 2021-02-05 2021-02-05 PCB chip appearance packaging equipment with auxiliary positioning mechanism Pending CN112802779A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110161107.4A CN112802779A (en) 2021-02-05 2021-02-05 PCB chip appearance packaging equipment with auxiliary positioning mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110161107.4A CN112802779A (en) 2021-02-05 2021-02-05 PCB chip appearance packaging equipment with auxiliary positioning mechanism

Publications (1)

Publication Number Publication Date
CN112802779A true CN112802779A (en) 2021-05-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110161107.4A Pending CN112802779A (en) 2021-02-05 2021-02-05 PCB chip appearance packaging equipment with auxiliary positioning mechanism

Country Status (1)

Country Link
CN (1) CN112802779A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113643998A (en) * 2021-08-02 2021-11-12 东莞先导先进科技有限公司 Semiconductor packaging test system and method
CN115084050A (en) * 2022-07-25 2022-09-20 成都汉芯国科集成技术有限公司 Broadband radio frequency system-level sip packaging structure adopting BGA interface
CN116779496A (en) * 2023-08-21 2023-09-19 成都汉芯国科集成技术有限公司 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113643998A (en) * 2021-08-02 2021-11-12 东莞先导先进科技有限公司 Semiconductor packaging test system and method
CN113643998B (en) * 2021-08-02 2024-03-26 东莞先导先进科技有限公司 Semiconductor package testing system and method
CN115084050A (en) * 2022-07-25 2022-09-20 成都汉芯国科集成技术有限公司 Broadband radio frequency system-level sip packaging structure adopting BGA interface
CN115084050B (en) * 2022-07-25 2022-11-11 成都汉芯国科集成技术有限公司 Broadband radio frequency system-level sip packaging structure adopting BGA interface
CN116779496A (en) * 2023-08-21 2023-09-19 成都汉芯国科集成技术有限公司 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips
CN116779496B (en) * 2023-08-21 2023-12-26 成都汉芯国科集成技术有限公司 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips

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