CN112799282A - Wafer photoetching, developing and etching device for manufacturing power supply chip and preparation process thereof - Google Patents
Wafer photoetching, developing and etching device for manufacturing power supply chip and preparation process thereof Download PDFInfo
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- CN112799282A CN112799282A CN202011625526.0A CN202011625526A CN112799282A CN 112799282 A CN112799282 A CN 112799282A CN 202011625526 A CN202011625526 A CN 202011625526A CN 112799282 A CN112799282 A CN 112799282A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
Abstract
The invention relates to the technical field of a wafer photoetching developing device, and discloses a wafer photoetching developing etching device for manufacturing a power supply chip and a preparation process thereof, wherein an ultraviolet projector is started firstly, ultraviolet light irradiates a wafer coating film to be softened after passing through a photomask and a convex lens, then a liquid pump is started, a liquid inlet pipe discharges a spraying agent in a liquid storage barrel into a liquid pump, the spraying agent is discharged into two liquid outlet pipes through the pressurization effect of the liquid pump, and is sprayed onto a wafer through a spray head, the wafer coating film on the wafer is dissolved and washed away, so that silicon under a film is exposed, the integration of a photoetching mechanism and a photoresist spraying mechanism is realized, the production cost of an enterprise is reduced, the photomask is held by hands firstly, then a U-shaped handle is pulled outwards to slide in a T-shaped groove, a sliding clamping plate is driven, and two horizontal clamping springs are elastically deformed, the slide clamp plate is away from one side of the mask, thereby making the mask easy to replace.
Description
Technical Field
The invention relates to the technical field of wafer photoetching developing devices, in particular to a wafer photoetching developing etching device for manufacturing a power supply chip and a preparation process thereof.
Background
The power chip also comprises the processes of wafer photoetching development and etching, wherein a chemical substance sensitive to ultraviolet light is used, namely the chemical substance becomes soft when meeting ultraviolet light, the appearance of the chip can be obtained by controlling the position of a light shield and the shape of a hollow on a photomask, a silicon wafer is coated with photoresist, so that the silicon wafer can be dissolved when meeting the ultraviolet light, the first light shield can be used, the part irradiated by the ultraviolet light is dissolved, the dissolved part can be washed away by using a solvent, the rest part is the same as the shape of the light shield, and the effect is exactly what we need, so that the silicon dioxide layer required by us is obtained.
In the prior art, because of the different shapes of fretwork on the light shield of the same size different styles, lead to need to change the light shield of the same size different styles many times when carrying out the photoetching development to the silicon wafer of multiple different requirements, current wafer lithography apparatus lacks the convenient change mechanism of light shield, make the operation comparatively loaded down with trivial details when needing to change the light shield, and the height of the photoetching convex lens of current equipment can't be adjusted, make the imaging size of ultraviolet ray on the silicon wafer can't change, and then can't adjust the area size of exposed silicon on the chip conveniently, on the other hand, current some equipment need to be separated photoetching mechanism and photoresist spray mechanism, the manufacturing cost of enterprise has been increased, therefore, we disclose a wafer lithography development etching device for power chip manufacturing to satisfy the production demand of enterprise.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the wafer photoetching, developing and etching device for manufacturing the power supply chip, which has the advantages of easy replacement of a photomask, convex lens adjustment and the like, and solves the problems of high production cost, difficult replacement of the photomask and incapability of changing the imaging size on a silicon wafer.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a wafer photoetching, developing and etching device for manufacturing a power supply chip comprises a bottom plate, wherein a base is fixedly connected to the top of the bottom plate, a driving motor is fixedly connected to the top of the base, a shaft coupler is fixedly connected to the output end of the driving motor, an input shaft is fixedly connected to one end of the shaft coupler, a driving belt pulley is fixedly connected to one end of the input shaft, four supporting columns are fixedly connected to the top of the bottom plate, rotating holes are formed in the side wall of one side of each of the four supporting columns, a first rotating shaft and a second rotating shaft are respectively rotatably sleeved in two rotating holes in the same relative position, the two ends of the first rotating shaft and the second rotating shaft respectively extend out of the corresponding rotating holes, a driven belt pulley is fixedly connected to one end of each of the first rotating shaft and the second rotating shaft, and a rotating roller is fixedly sleeved on one side of each of the first rotating shaft, two the common tensioning of one side of live-rollers has same conveyer belt, the even stopper of a plurality of distributions of one side fixedly connected with of conveyer belt, one side of conveyer belt is equipped with the even thing dish of carrying of three distribution, and is three carry the thing dish and correspond with a plurality of stoppers respectively, it is three carry the equal fixedly connected with sucking disc in top of thing dish.
Preferably, it is three the top of sucking disc all is equipped with the wafer, be connected with two support columns in the top of bottom plate is fixed, two the arc spread groove has all been seted up to one side that the support column is close to each other, two all be equipped with the arc connecting block in the arc spread groove, two the screw has all been seted up at the support column and two the top of arc connecting block, with two of one side the screw respectively with two the arc spread groove is linked together.
Preferably, with two of one side all rotate the spiro union in the screw hole and have perpendicular connecting bolt, two the same fixed cover of one end fixedly connected with that the arc connecting block is close to each other, fixedly connected with ultraviolet projector in the fixed cover, two the rectangle spread groove has all been seted up to one side that the support column is close to each other, two be equipped with arc splint and connecting rod in the rectangle spread groove respectively.
Preferably, two rectangular connecting grooves are respectively provided with a threaded hole at one end of the connecting rod, the two threaded holes at the same side are respectively communicated with the two corresponding rectangular connecting grooves, the two threaded holes at the same side are respectively screwed with the same clamping nut in a rotating manner, two rectangular grooves are respectively provided at one side of the connecting rod, and the two rectangular grooves are respectively provided with a through hole.
Preferably, the two through holes are respectively communicated with the two rectangular grooves, horizontal guide rods are sleeved in the through holes in a sliding mode, two ends of the two horizontal guide rods extend to the outer sides of the two through holes respectively, one end of each of the two horizontal guide rods is provided with the same sliding clamping plate, one side of each sliding clamping plate is fixedly connected with two rectangular convex blocks, and one side of each rectangular convex block is connected with the two horizontal guide rods, corresponds to the two rectangular grooves in position and is matched with the two rectangular grooves in position.
Preferably, one side of the sliding clamping plate is provided with an arc-shaped clamping groove, two horizontal guide rods are fixedly sleeved with horizontal clamping springs, two ends of each horizontal clamping spring are respectively connected with the rectangular convex block and the inner wall of one side of the rectangular groove, the top of the sliding clamping plate is fixedly connected with the U-shaped handle, the bottom of the U-shaped handle is fixedly connected with a T-shaped block, and the top of the connecting rod is provided with a T-shaped groove.
Preferably, the one end of U type handle extends to T type inslot, and T type piece with T type groove looks adaptation, the arc press from both sides tight groove with be equipped with same light shield in the arc splint, two the lift groove has all been seted up to one side that the support column is close to each other, two the through-hole has all been seted up in the lift groove, two it has lifting bolt, two all to rotate the spiro union in the through-hole lifting bolt's one end all extends to two the outside in lift groove.
Preferably, two one side of lifting bolt all rotates the spiro union and has a lifting nut, two the one end that lifting bolt is close to each other all rotates the spiro union and has a lift clamp splice, two one side that lift clamp splice is close to each other all sets up flutedly, two the slide opening has been seted up to the top square of lift clamp splice, two the slide opening respectively with two the recess is linked together, two all slide the cup joint in the slide opening and have the clamping bolt, and the both ends of two clamping bolts extend to two respectively the slide opening outside.
Preferably, two the equal fixedly connected with hood in top of clamping bolt, two the equal fixedly connected with rubber pad in bottom of clamping bolt, two the equal fixed connection in one side of clamping bolt has connect vertical clamping spring, two vertical clamping spring's both ends respectively with the hood the rubber pad is connected, two be equipped with same convex lens in the recess, one side and two of convex lens the rubber pad contacts.
Preferably, the top fixedly connected with stock solution bucket and the liquid pump of ultraviolet projector, one side fixedly connected with feed liquor pipe and two drain pipes of liquid pump, the other end of feed liquor pipe extends to in the stock solution bucket, two the equal fixedly connected with shower nozzle of one end of drain pipe, and extend to the bottom of ultraviolet projector with the wafer is corresponding, drive pulley and two the common tensioning has same interlocking belt on the driven pulley.
A power chip preparation process using the power chip manufacturing wafer lithography development etching apparatus of any one of claims 1 to 5.
(III) advantageous effects
Compared with the prior art, the invention provides a wafer photoetching, developing and etching device for manufacturing a power supply chip, which has the following beneficial effects:
1. this power chip makes and uses wafer photoetching development etching device, through starting ultraviolet projector earlier, make the ultraviolet ray shine the wafer after light shield and convex lens and coat and make it soften on, then start the liquid pump, make the feed liquor pipe arrange the spray agent in the liquid storage bucket into the liquid pump, through the pressure boost effect of liquid pump, in arranging the spray agent into two liquid outlet pipes, spray to the wafer through the shower nozzle at last, wafer coating film on the wafer dissolves and washes away, make the silicon under the film expose, thereby realized the integration that photoetching mechanism and photoresist sprayed the mechanism, the manufacturing cost of enterprise has been reduced.
2. According to the wafer photoetching, developing and etching device for manufacturing the power supply chip, the convex lens and the photomask are easy to replace, and the height of the convex lens can be adjusted, so that the imaging size of ultraviolet rays on a silicon wafer can be adjusted.
3. According to the wafer photoetching, developing and etching device for manufacturing the power supply chip, the two top caps are lifted upwards, so that the two top caps drive the corresponding clamping bolts to slide upwards in the sliding holes, the vertical clamping springs elastically deform and drive the corresponding rubber pads, the two rubber pads are far away from the convex lenses, and convenience is brought.
Drawings
FIG. 1 is a perspective view of a first embodiment of the present invention;
FIG. 2 is a perspective view of a second embodiment of the present invention;
FIG. 3 is a perspective view of the conveyor belt of the present invention;
FIG. 4 is a partially enlarged perspective view of FIG. 1 according to the present invention;
FIG. 5 is a perspective view of the carrier tray of the present invention;
FIG. 6 is a schematic perspective view of an ultraviolet projector according to the present invention;
FIG. 7 is a schematic perspective view of a photomask according to the present invention;
FIG. 8 is a partially enlarged perspective view of FIG. 7 in accordance with the present invention;
FIG. 9 is a schematic perspective view of a convex lens according to the present invention;
fig. 10 is an enlarged perspective view of the point a in fig. 9 according to the present invention.
In the figure: 1. a base plate; 2. a base; 3. a drive motor; 4. a drive pulley; 5. a pillar; 6. a first rotating shaft; 7. a second rotating shaft; 8. a rotating roller; 9. a conveyor belt; 10. a limiting block; 11. a carrying tray; 12. a suction cup; 13. a wafer; 14. a support pillar; 15. an arc-shaped connecting groove; 16. a vertical connecting bolt; 17. an arc-shaped connecting block; 18. fixing a sleeve; 19. an ultraviolet projector; 20. a rectangular connecting groove; 21. an arc-shaped splint; 22. a connecting rod; 23. clamping the nut; 24. a rectangular groove; 25. a horizontal guide rod; 26. a sliding clamp plate; 27. a rectangular bump; 28. an arc-shaped clamping groove; 29. a horizontal clamping spring; 30. a U-shaped handle; 31. a T-shaped block; 32. a T-shaped groove; 33. a photomask; 34. a lifting groove; 35. a lifting bolt; 36. a lifting nut; 37. lifting the clamping block; 38. clamping the bolt; 39. a top cap; 40. a rubber pad; 41. a vertical clamping spring; 42. a convex lens; 43. a liquid storage barrel; 44. a liquid pump; 45. a liquid inlet pipe; 46. a liquid outlet pipe; 47. a spray head; 48. a driven pulley.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As described in the background, the defects in the prior art are overcome, and in order to solve the technical problems, the application provides a wafer photoetching development etching device for manufacturing power chips
In a typical embodiment of the present application, as shown in fig. 1-10, a power chip manufacturing wafer lithography development etching apparatus includes a bottom plate 1, a base 2 is fixedly connected to the top of the bottom plate 1, a driving motor 3 is fixedly connected to the top of the base 2, a shaft coupling is fixedly connected to the output end of the driving motor 3, an input shaft is fixedly connected to one end of the shaft coupling, a driving pulley 4 is fixedly connected to one end of the input shaft, four pillars 5 are fixedly connected to the top of the bottom plate 1, rotating holes are respectively formed in the side walls of one side of the four pillars 5, a first rotating shaft 6 and a second rotating shaft 7 are respectively rotatably sleeved in two rotating holes in the same relative position, two ends of the first rotating shaft 6 and the second rotating shaft 7 respectively extend out of the corresponding rotating holes, a driven pulley 48 is fixedly connected to one end of the first rotating shaft 6 and one end of the second rotating shaft 7, a rotating roller 8 is fixedly sleeved on one side of the first rotating shaft 6 and one side, the common tensioning of one side of two live-rollers 8 has same conveyer belt 9, and one side fixedly connected with of conveyer belt 9 a plurality of stoppers 10 that distribute evenly, and one side of conveyer belt 9 is equipped with three even year thing dish 11 that distributes, and three year thing dish 11 is corresponding with a plurality of stoppers 10 respectively, and the equal fixedly connected with sucking disc 12 in top of three year thing dish 11.
Further, in the above scheme, the top of three sucking disc 12 all is equipped with wafer 13, be connected with two support columns 14 in the top of bottom plate 1 is fixed, arc connecting groove 15 has all been seted up to one side that two support columns 14 are close to each other, all be equipped with arc connecting block 17 in two arc connecting grooves 15, the screw has all been seted up at two support columns 14 and two arc connecting block 17's top, two screws with one side are linked together with two arc connecting grooves 15 respectively, through the setting of arc connecting groove 15 and screw, just there is arc connecting block 17's spacing.
Further, in the above scheme, all rotate the spiro union in two screw holes with one side and have perpendicular connecting bolt 16, the same fixed cover 18 of one end fixedly connected with that two arc connecting blocks 17 are close to each other, fixedly connected with ultraviolet projector 19 in the fixed cover 18, rectangle spread groove 20 has all been seted up to one side that two support columns 14 are close to each other, be equipped with arc splint 21 and connecting rod 22 in two rectangle spread grooves 20 respectively, through the setting of rectangle spread groove 20, be convenient for arc splint 21 and connecting rod 22's connection.
Further, in the above scheme, two rectangular connecting grooves 20 and corresponding arc splint 21, the one end of connecting rod 22 all has seted up threaded hole, two threaded holes with one side are linked together with two corresponding rectangular connecting grooves 20 respectively, two threaded holes with one side all rotate the spiro union with same one and have same clamping nut 23, two rectangular channels 24 have been seted up to one side of connecting rod 22, all seted up the perforation in two rectangular channels 24, through the setting of rectangular channel 24 for rectangle lug 27 can correspond.
Further, in above-mentioned scheme, two perforation are linked together with two rectangular channels 24 respectively, the equal slip cap has horizontal guide 25 in two perforations, the both ends of two horizontal guide 25 extend to two perforation outsides respectively, the one end of two horizontal guide 25 is equipped with same slip splint 26, two rectangle lugs 27 of one side fixedly connected with of slip splint 26, one side of two rectangle lugs 27 is connected with two horizontal guide 25 respectively, and corresponding with the position of two rectangular channels 24 respectively, and looks adaptation, setting through horizontal guide 25, can take and drive slip splint 26 and remove.
Further, in the above scheme, one side of the sliding clamping plate 26 is provided with an arc clamping groove 28, one side of each of the two horizontal guide rods 25 is fixedly sleeved with a horizontal clamping spring 29, two ends of each of the two horizontal clamping springs 29 are respectively connected with the rectangular bump 27 and the inner wall of one side of the rectangular groove 24, the top of the sliding clamping plate 26 is fixedly connected with the U-shaped handle 30, the bottom of the U-shaped handle 30 is fixedly connected with a T-shaped block 31, the top of the connecting rod 22 is provided with a T-shaped groove 32, and the arc clamping groove 28 is arranged, so that the position limitation and the replacement of the light cover 33 are facilitated.
Further, in above-mentioned scheme, U type handle 30's one end extends to in T type groove 32, and T type piece 31 and T type groove 32 looks adaptation, be equipped with same light shield 33 in arc clamping groove 28 and the arc splint 21, lift groove 34 has all been seted up to one side that two support columns 14 are close to each other, the through-hole has all been seted up in two lift grooves 34, it has lifting bolt 35 all to rotate the spiro union in two through-holes, the one end of two lifting bolt 35 all extends to the outside of two lift grooves 34, through the setting of lift groove 34 and through-hole, the lifting bolt 35 of being convenient for can the slide adjusting height.
Further, in the above scheme, one side of two lifting bolts 35 all rotates the spiro union and has a lifting nut 36, the one end that two lifting bolts 35 are close to each other all rotates the spiro union and has a lifting clamp 37, one side that two lifting clamp 37 are close to each other all sets up flutedly, the slide opening has been seted up to the top moment of two lifting clamp 37, two slide openings are linked together with two recesses respectively, clamping bolt 38 has all been cup jointed in two slide openings in a sliding manner, the both ends of two clamping bolt 38 extend to the two slide opening outsides respectively, through the setting of recess, be convenient for place of convex lens 42.
Further, in the above scheme, the top ends of the two clamping bolts 38 are fixedly connected with the top caps 39, the bottom ends of the two clamping bolts 38 are fixedly connected with the rubber pads 40, one sides of the two clamping bolts 38 are fixedly connected with the vertical clamping springs 41, two ends of each vertical clamping spring 41 are respectively connected with the top caps 39 and the rubber pads 40, the same convex lens 42 is arranged in the two grooves, one side of each convex lens 42 is in contact with the two rubber pads 40, and the convex lens 42 is limited and replaced conveniently through the arrangement of the clamping bolts 38, the top caps 39, the rubber pads 40 and the vertical clamping springs 41.
Further, in the above scheme, top fixedly connected with stock solution bucket 43 and liquid pump 44 of ultraviolet projector 19, one side fixedly connected with feed liquor pipe 45 and two drain pipes 46 of liquid pump 44, the other end of feed liquor pipe 45 extends to in the stock solution bucket 43, the equal fixedly connected with shower nozzle 47 of one end of two drain pipes 46, and it is corresponding with wafer 13 to extend to the bottom of ultraviolet projector 19, common tensioning has same interlock belt on drive pulley 4 and two driven pulleys 48, through the setting of intercommunication belt, make two driven pulleys 48 can rotate.
When the ultraviolet photoetching machine is used, the ultraviolet projector 19 is started firstly, ultraviolet light irradiates the wafer coating film to be softened after passing through the photomask 33 and the convex lens 42, then the liquid pump 44 is started, the spraying agent in the liquid storage barrel 43 is discharged into the liquid pump 44 through the liquid inlet pipe 45, the spraying agent is discharged into the two liquid outlet pipes 46 through the pressurization effect of the liquid pump 44, and finally the spraying agent is sprayed onto the wafer 13 through the spray head 47, the wafer coating film on the wafer 13 is dissolved and washed away, and silicon under the film is exposed, so that the integration of the photoetching mechanism and the photoresist spraying mechanism is realized, and the production cost of enterprises is reduced.
The light shield 33 is held by hand, and then the U-shaped handle 30 is pulled outwards, so that the U-shaped handle 30 slides in the T-shaped groove 32, the sliding clamp plate 26 is driven, the two horizontal clamping springs 29 are elastically deformed, and the sliding clamp plate 26 is far away from one side of the light shield 33, so that the light shield 33 is easy to replace.
The two lifting nuts 36 are rotated to relieve the limit of the lifting bolt 35, the two lifting bolts 35 slide in the through hole, the convex lens 42 is driven to slide through the lifting clamping block 37, after the convex lens slides to a proper height, the two lifting nuts 36 are rotated again to fix the lifting bolt 35, the height of the convex lens 42 can be adjusted, and the imaging size of ultraviolet rays on the silicon wafer can be adjusted.
The two top caps 39 are lifted upwards, so that the two top caps 39 drive the corresponding clamping bolts 38 to slide upwards in the sliding holes, the vertical clamping springs 41 are elastically deformed, the corresponding rubber pads 40 are driven, the two rubber pads 40 are far away from the convex lenses 42, and the convex lenses 42 are convenient to replace.
Start driving motor 3, driving motor 3's output passes through the shaft coupling and drives the input shaft rotation, the input shaft and then drives driving pulley 4 and rotate, driving pulley 4 drives two driven pulley 48 through the interlock belt and rotates, two driven pulley 48 drive corresponding first pivot 6 and second pivot 7 respectively and rotate, and then make two driving roller 8 rotate, two driving roller 8 make conveyer belt 9 rotate, thereby can convey wafer 13 in order, the operating speed has been improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a power is wafer photoetching development etching device for chip manufacturing, includes bottom plate (1), its characterized in that: the top of the bottom plate (1) is fixedly connected with a base (2), the top of the base (2) is fixedly connected with a driving motor (3), the output end of the driving motor (3) is fixedly connected with a shaft coupling, one end of the shaft coupling is fixedly connected with an input shaft, one end of the input shaft is fixedly connected with a driving pulley (4), the top of the bottom plate (1) is fixedly connected with four pillars (5), rotating holes are formed in the side wall of one side of each of the four pillars (5), a first rotating shaft (6) and a second rotating shaft (7) are respectively rotatably sleeved in the two rotating holes at the same relative position, the two ends of the first rotating shaft (6) and the second rotating shaft (7) respectively extend to the corresponding rotating holes, and one ends of the first rotating shaft (6) and the second rotating shaft (7) are respectively fixedly connected with a driven pulley (48), the driving belt pulley (4) and the two driven belt pulleys (48) are jointly tensioned with the same linkage belt; rotating rollers (8) are fixedly sleeved on one sides of the first rotating shaft (6) and the second rotating shaft (7), and one side of each of the two rotating rollers (8) is tensioned with the same conveying belt (9); the top of the bottom plate (1) is fixedly connected with two supporting columns (14), the top ends of the two supporting columns (14) are fixedly connected with an ultraviolet projector (19), the top of the ultraviolet projector (19) is fixedly connected with a liquid storage barrel (43) and a liquid pump (44), one side of the liquid pump (44) is fixedly connected with a liquid inlet pipe (45) and two liquid outlet pipes (46), the other end of the liquid inlet pipe (45) extends into the liquid storage barrel (43), one ends of the two liquid outlet pipes (46) are both fixedly connected with a spray head (47), and the spray heads extend to the bottom of the ultraviolet projector (19) and correspond to the wafer (13); a light shield 33 is arranged at the lower part of the ultraviolet projector (19), and the light shield 33 is connected with the two support columns through a first clamping mechanism; the light shield 33 lower part is provided with convex lens 42, convex lens 42 pass through the second fixture with two support columns are connected, convex lens can carry out the altitude mixture control in vertical direction and adjust.
2. The lithography, development and etching device for the wafer for manufacturing the power chip as claimed in claim 1, wherein: arc-shaped connecting grooves (15) are formed in the sides, close to each other, of the two supporting columns (14), arc-shaped connecting blocks (17) are arranged in the two arc-shaped connecting grooves (15), screw holes are formed in the tops of the two supporting columns (14) and the two arc-shaped connecting blocks (17), and the two screw holes in the same side are respectively communicated with the two arc-shaped connecting grooves (15); the two screw holes on the same side are rotatably screwed with vertical connecting bolts (16), one end, close to each other, of each arc-shaped connecting block (17) is fixedly connected with the same fixing sleeve (18), and an ultraviolet projector (19) is fixedly connected in the fixing sleeve (18).
3. The lithography development etching device for power chip manufacturing wafer according to claim 1 or 2, wherein: the first clamping mechanism comprises an arc-shaped clamping plate (21) and a connecting rod (22), rectangular connecting grooves (20) are formed in the sides, close to each other, of the two supporting columns (14), and the arc-shaped clamping plate (21) and the connecting rod (22) are arranged in the two rectangular connecting grooves (20) respectively; threaded holes are formed in the two rectangular connecting grooves (20), the corresponding arc-shaped clamping plates (21) and one end of the connecting rod (22), the two threaded holes on the same side are respectively communicated with the two corresponding rectangular connecting grooves (20), the two threaded holes on the same side are respectively in threaded connection with the same clamping nut (23) in a rotating and screwing mode, two rectangular grooves (24) are formed in one side of the connecting rod (22), and through holes are formed in the two rectangular grooves (24); the two through holes are respectively communicated with the two rectangular grooves (24), horizontal guide rods (25) are sleeved in the two through holes in a sliding mode, two ends of the two horizontal guide rods (25) respectively extend to the outer sides of the two through holes, one end of each horizontal guide rod (25) is provided with the same sliding clamping plate (26), one side of each sliding clamping plate (26) is fixedly connected with two rectangular convex blocks (27), one side of each rectangular convex block (27) is respectively connected with the two horizontal guide rods (25), corresponds to the positions of the two rectangular grooves (24) respectively and is matched with the positions of the two rectangular grooves (24); an arc-shaped clamping groove (28) is formed in one side of the sliding clamp plate (26), horizontal clamping springs (29) are fixedly sleeved on one sides of the two horizontal guide rods (25), two ends of each horizontal clamping spring (29) are respectively connected with the rectangular bump (27) and the inner wall of one side of the rectangular groove (24), the top of the sliding clamp plate (26) is fixedly connected with a U-shaped handle (30), a T-shaped block (31) is fixedly connected to the bottom of the U-shaped handle (30), and a T-shaped groove (32) is formed in the top of the connecting rod (22); one end of the U-shaped handle (30) extends into the T-shaped groove (32), the T-shaped block (31) is matched with the T-shaped groove (32), and the arc-shaped clamping groove (28) and the arc-shaped clamping plate (21) are internally provided with the same light shield (33).
4. The lithography development etching device for power chip manufacturing wafer according to claim 1 or 2, wherein: the second clamping mechanism comprises lifting clamping blocks (37), lifting grooves (34) are formed in one sides, close to each other, of the two supporting columns (14), through holes are formed in the two lifting grooves (34), lifting bolts (35) are screwed in the two through holes in a rotating mode, one ends of the two lifting bolts (35) extend to the outer sides of the two lifting grooves (34), lifting nuts (36) are screwed in one sides of the two lifting bolts (35) in a rotating mode, the ends, close to each other, of the two lifting bolts (35) are screwed in a rotating mode, lifting clamping blocks (37) are arranged in one sides, close to each other, of the two lifting clamping blocks (37) in a groove mode, sliding holes are formed in the tops of the two lifting clamping blocks (37), the two sliding holes are communicated with the two grooves respectively, and clamping bolts (38) are sleeved in the two sliding holes in a sliding mode, two ends of the two clamping bolts (38) respectively extend to the outer sides of the two sliding holes; two the equal fixedly connected with hood (39) in top of clamping bolt (38), two the equal fixedly connected with rubber pad (40) in bottom of clamping bolt (38), two the equal fixedly connected with in one side of clamping bolt (38) has connected perpendicular clamping spring (41), two the both ends of perpendicular clamping spring (41) respectively with hood (39) rubber pad (40) are connected, two be equipped with same convex lens (42) in the recess, one side and two of convex lens (42) rubber pad (40) contact.
5. The lithography, development and etching device for the wafer for manufacturing the power chip as claimed in claim 1, wherein: one side fixedly connected with of conveyer belt (9) a plurality of stoppers (10) that distribute evenly, one side of conveyer belt (9) is equipped with the even thing dish of carrying of three distribution (11), and is three carry thing dish (11) corresponding with a plurality of stoppers (10) respectively, it is three carry the equal fixedly connected with sucking disc (12) in top of thing dish (11), it is three the top of sucking disc (12) all is equipped with wafer (13).
6. A power chip preparation technology is characterized in that: a power chip manufacturing wafer lithography development etching apparatus according to any one of claims 1 to 5 is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011625526.0A CN112799282A (en) | 2020-12-30 | 2020-12-30 | Wafer photoetching, developing and etching device for manufacturing power supply chip and preparation process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011625526.0A CN112799282A (en) | 2020-12-30 | 2020-12-30 | Wafer photoetching, developing and etching device for manufacturing power supply chip and preparation process thereof |
Publications (1)
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Application publication date: 20210514 |