CN112793324A

CN112793324A - UV transfer printing mold and manufacturing method thereof

Info

Publication number: CN112793324A
Application number: CN202011490225.1A
Authority: CN
Inventors: 洪利锋; 赵青松; 李雪峰
Original assignee: Weidali Industry Chibi Co ltd; Wanjin Industrial Chibi Co Ltd
Current assignee: Weidali Technology Co.,Ltd.; Wanjin Industrial Chibi Co Ltd
Priority date: 2020-12-16
Filing date: 2020-12-16
Publication date: 2021-05-14
Anticipated expiration: 2040-12-16
Also published as: CN112793324B

Abstract

The invention relates to a UV transfer printing mold and a manufacturing method thereof, the manufacturing method comprises the steps of attaching a protection plate to texture surfaces of a plurality of sub-molds to prevent texture regions from being damaged, dividing to obtain a plurality of division blocks which are in line with the typesetting mode of a target texture region and have single texture regions, placing the plurality of division blocks according to the typesetting mode of the target texture region and bonding the division blocks in a specific mode, and under the condition of not modifying a mold processing machine table and related jigs, the UV transfer printing mold with a small typesetting quantity can be used for manufacturing the UV transfer printing mold with a larger typesetting quantity, a new female mold does not need to be manufactured, the typesetting limitation of at most 6 pieces/plates at present is overcome, and the UV transfer printing mold with 8 pieces/plates or more plates is produced. The manufacturing method of the UV transfer printing mold is simple, convenient and quick, has low cost and is suitable for large-scale production.

Description

UV transfer printing mold and manufacturing method thereof

Technical Field

The invention relates to the technical field of UV transfer printing, in particular to a UV transfer printing mold and a manufacturing method thereof.

Background

Currently, people are pursuing more and more the beauty of 3C products such as mobile phones and tablet computers, and the way of forming decorative patterns on product shells is becoming more and more popular, such as forming holographic colorful patterns, mechanical patterns, superimposed patterns, fading, anti-glare frosting and other effects.

Texture design and manufacture are the most central processes in the processing process of the composite board shell. The composite board is formed by 3D high pressure and matched with a precise texture manufacturing technology, is similar to a glass material in visual effect, and can be comparable to a 3D glass shell. Precision texturing techniques are therefore a key to the visual competition of composite sheet housings with glass housings.

The mold technology for realizing precise texture mainly includes a steel plate mold technology, an electroforming mold technology, a pr (photo resist) mold technology and a mechanical mold technology. The texture formed by the mechanical die technology is finer in lines, and various effects can be superposed together, so that the special appearance effect of multiple superposition is realized.

The UV transfer mold is one of mechanical molds. The UV transfer printing mold is provided with textures, UV glue is coated on the textures when the UV transfer printing mold is used, a workpiece needing transfer printing of the textures is covered on the textures of the UV transfer printing mold coated with the UV glue, and after the UV glue is solidified through ultraviolet light radiation, the workpiece is demoulded, so that a texture effect can be formed on the workpiece.

The master mold of the UV transfer mold is a metal mold, and a sub mold having the same transfer effect as the master mold can be copied by UV transfer using the master mold. The submoulds are typically of a plastic material such as Polycarbonate (PC). As shown in fig. 1, the sub-mold has a textured surface, and the textured surface is provided with a plurality of textured regions 11, and adjacent textured regions 11 are separated by non-textured regions 12.

The larger the number of texture layouts, i.e., the larger the number of texture regions, the more densely the texture regions are arranged in the same layout size. Due to the limitation of a mold processing machine table and a processing technology, the UV texture typesetting on the current female mold is 6 pieces/plate at most, namely 6 texture areas are distributed on the mold. Thus, the UV textured layout on the daughter mold replicated from the master mold was up to 6 chips/plate. Thus, a larger number of layouts cannot be obtained by using the conventional submodel.

Disclosure of Invention

Accordingly, there is a need for a UV transfer mold and a method for manufacturing the same, which can solve the problem that a larger number of layouts cannot be obtained.

The invention provides a manufacturing method of a UV transfer printing mold, which comprises the following steps:

providing a plurality of sub-dies, the sub-dies having texture surfaces with a plurality of texture zones;

attaching a protection plate to the texture surface of each sub-mold to obtain a plurality of attaching pieces;

dividing the attaching piece according to the typesetting mode of the target texture area to obtain a plurality of divided blocks which are in accordance with the corresponding shapes and sizes and have single texture areas;

placing a plurality of the division blocks according to the target texture area typesetting mode to obtain a makeup array;

sticking an adhesive tape on one side of the makeup array to bond the adjacent segmentation blocks to obtain a spliced array;

gluing in gaps between adjacent dividing blocks, and curing to obtain a bonded array;

and peeling the protective plate and the adhesive tape on the bonding array to obtain a bonding sub-die.

In one embodiment, before the protection plate is attached, a wire frame is silk-screened on one side of the protection plate according to an original texture region typesetting mode of a sub-mold, and when the protection plate is attached, the side, printed with the wire frame, of the protection plate is attached to the sub-mold in a back-to-back mode.

In one embodiment, the method for attaching the protection plate to the texture surface of each sub-mold comprises the following steps:

punching positioning holes on the sub-die and the protection plate respectively;

fixing the sub-die on a UV transfer printing machine table by using a positioning pin;

dripping UV glue on the texture surface of the sub-mold;

covering the protection plate on the texture surface of the sub-die, and fixing the protection plate by using the positioning pin;

rolling the protection plate through a glue driving roller;

and (5) curing the UV glue by illumination.

In one of the embodiments, the protective plate is a PC (polycarbonate) plate, a PET (polymethylmethacrylate) plate or a composite plate.

In one embodiment, the fitting is divided by a laser cutting process.

In one embodiment, before the split blocks are placed, the step of cleaning the split blocks is further included. The dust on the cutting blocks can be cleaned by using a dust adhering roller, and then the whole body is wiped by dipping alcohol with the purity of 95% with a piece of dust-free cloth.

In one embodiment, after peeling the protective plate and the adhesive tape, the method further comprises the steps of: and polishing the bonding marks protruding out of the texture surface on the bonding sub-die.

In one embodiment, the method of grinding the bond mark comprises:

covering a protective film on the texture surface of the sub-bonding die;

cutting off the part of the protective film at the bonding mark to expose the bonding mark;

polishing the bonding mark to be flush with the texture surface;

and removing the protective film.

In one embodiment, after the bonding mark is polished, the polished dust can be cleaned by using a dust sticking paper, and then the whole body is wiped by dipping alcohol by using a cleaning cloth.

In one embodiment, the protective film is a PE (polyethylene) film or a PP (polypropylene) film. The protective film can be cut off by slightly cutting the protective film at positions on both sides of the bonding mark (e.g., positions 3mm on both sides), and removing the protective film.

In one embodiment, the bond lines are sanded with 3000-5000 mesh polishing sandpaper.

In one embodiment, a release layer is formed on the polished adhesive mark before removing the protective film.

In one embodiment, the anti-sticking layer is AF anti-fingerprint film or silicon dioxide (SiO)₂) And (3) a membrane.

In one embodiment, the release layer is formed by coating or vacuum coating.

The invention also provides a UV transfer printing mold which is manufactured by the manufacturing method of any one of the embodiments.

Compared with the prior art, the manufacturing method of the UV transfer printing mold has the following beneficial effects:

according to the manufacturing method of the UV transfer printing mold, the protection plate is attached to the texture surface of the plurality of sub-molds to prevent the texture area from being damaged, the sub-molds are divided to obtain a plurality of dividing blocks which are in line with the target texture area typesetting mode and have single texture area, the dividing blocks are placed according to the target texture area typesetting mode and are bonded in a specific mode, the UV transfer printing mold with more typesetting quantity can be manufactured by using the UV transfer printing mold with less typesetting quantity under the condition of not modifying a mold processing machine table and related jigs, a new female mold does not need to be manufactured, the typesetting limitation of at most 6 pieces/plates at present is overcome, and the UV transfer printing mold with 8 pieces/plates or more plates is produced. The manufacturing method of the UV transfer printing mold is simple, convenient and quick, has low cost and is suitable for large-scale production.

Drawings

FIG. 1 is a texture side of a 6 die/plate sub-mold;

FIG. 2 is a schematic flow chart illustrating a method for fabricating a UV transfer mold according to an embodiment;

FIG. 3 is a texture surface of a sub-mold for 8-patch/plate target texture region layout style;

FIG. 4 is a schematic view of a film for placing a plurality of segments;

FIG. 5 is a schematic diagram of a plurality of division blocks arranged in a layout manner of 8 patches/plates;

fig. 6 is a schematic view of the sub-mold and the protection plate being attached.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 2, a method 100 for manufacturing a UV transfer mold according to an embodiment of the present invention includes the following steps:

in step S1, a plurality of submodels is provided. Referring to fig. 1, the sub-mold has a texture surface having a plurality of texture regions. Fig. 1 shows the textured side of a 6-die/plate submould with 6 textured areas arranged on the textured side, adjacent textured areas being separated by non-textured areas.

And step S2, attaching a protection plate on the texture surface of each sub-mold to obtain a plurality of attaching pieces. The lamination protection plate can be used for preventing damage to the texture region in the cutting and other operation processes. The protective plate is preferably a transparent plate, such as a PC plate, a PET plate, a composite plate, or the like.

And step S3, dividing the fitting piece according to the typesetting mode of the target texture area to obtain a plurality of divided blocks which conform to the corresponding shape and size and have a single texture area. Fig. 3 shows an 8-patch/plate layout of the target texture region, in which the texture surface is uniform in size and the texture region 2 is more closely arranged than the 6-patch/plate submould. It should be noted that the layout manner of the target texture region may be a larger number of layouts.

And step S4, placing a plurality of the segmentation blocks according to the typesetting mode of the target texture area to obtain a makeup array. As shown in fig. 4, a film 30 may be provided for placing a plurality of dividing blocks, and the film 30 has a position alignment 31 with the target texture region layout manner, so as to facilitate placing the dividing blocks. Fig. 5 is a schematic diagram of a plurality of the division blocks 40 arranged in an 8-tile/plate layout manner.

And step S5, sticking the adhesive tape on one side of the makeup array to bond adjacent dividing blocks to obtain a splicing array. The adhesive tape can be attached to the sub-mold or the protection plate.

And step S6, gluing in the gaps between the adjacent divided blocks, and curing to obtain the bonding array.

In step S7, the protective plate and the adhesive tape on the adhesive array are peeled off to obtain an adhesive sub-mold.

In one example, before the protection plate is attached, a wire frame is silk-printed on one side of the protection plate according to an original texture region typesetting mode of the sub-mold, when the protection plate is attached, one side of the protection plate, on which the wire frame is silk-printed, faces away from the sub-mold, and the other side of the protection plate is attached to the sub-mold. Because the texture area on the sub-die is difficult to see by naked eyes, the positions of the texture areas are displayed by wire frames through silk-screen wire frames on one side of the protective plate according to the original texture area typesetting mode of the sub-die, so that the positioning effect is realized, and the subsequent segmentation is facilitated.

As shown in fig. 6, in one example, the method of attaching the protection plate to the textured surface of each sub-mold includes:

punching a positioning hole 51 on the sub-die 50, and punching a positioning hole 61 on the protection plate 60 at the same position;

fixing the sub-mold on the UV transfer machine 70 by using a positioning pin 80;

dripping UV glue on the texture surface of the sub-mold;

covering the texture surface of the sub-mold with a protective plate, and fixing the protective plate by using a positioning pin 80;

rolling the protective plate through the glue driving roller;

and (5) irradiating and curing the UV glue.

In one example, in step S3, the attached member is divided by a laser cutting process, and the cutting accuracy is high.

In one example, before step S4, a step of cleaning the divided blocks is further included. The dust on the cutting blocks can be cleaned by using a dust adhering roller, and then the whole body is wiped by dipping alcohol with the purity of 95% with a piece of dust-free cloth.

In one example, after peeling the protective plate and the adhesive tape, the method further comprises the steps of: and polishing the bonding marks protruding out of the texture surface on the bonding sub-die. The bonding marks protruding out of the texture surface are polished to be smooth, and the UV transfer printing effect can be prevented from being influenced by the bonding marks. In addition, if the bonding mark is flat after the protective plate and the adhesive tape are peeled off, polishing is not required.

In one example, a method of sanding a tack mark includes:

covering a protective film on the texture surface of the sub-bonding die;

polishing the bonding mark until the bonding mark is flush with the texture surface;

and removing the protective film.

The protective film has certain transparency, so that the lower bonding mark can be seen. For example, a PE film or a PP film may be employed as the protective film.

The protective film can be cut off by slightly cutting the protective film at positions on both sides of the bonding mark (e.g., positions 3mm on both sides), and removing the protective film. Because the exposed position of the protective film is a non-texture area, the texture area is not damaged in the polishing process.

In one example, the bonding mark is polished by polishing sand paper with 3000-5000 meshes, for example, 3000 meshes, 3500 meshes, 4000 meshes, 5000 meshes, etc., so that the polished bonding mark is smooth and flat.

After the bonding marks are polished, the polished dust can be cleaned by using dust-sticking paper, and then the whole body is wiped by dipping alcohol by using a purifying cloth.

In one example, a low surface energy, low tension adhesive film is formed on the polished adhesive mark before the protective film is peeled off. The anti-sticking layer is formed on the bonding mark, so that the transfer printing work can be smoothly demoulded.

In one example, the release layer is AF anti-fingerprint film or silicon dioxide (SiO)₂) And (3) a membrane.

In one example, a method of forming a release layer includes:

and (4) coating AF liquid medicine on the polished and flat bonding mark, and baking.

In one example, a method of forming a release layer includes:

plating AF fingerprint-proof film or SiO on the splicing mark area by vacuum coating₂And (3) a membrane.

Further, the invention also provides a UV transfer printing mold which is manufactured by any one of the manufacturing methods.

The following specific examples are provided to illustrate the present invention, but the present invention is not limited to the following examples, and it should be understood that the appended claims outline the scope of the present invention and those skilled in the art, guided by the inventive concept, will appreciate that certain changes may be made to the examples of the present invention which are intended to be covered by the spirit and scope of the claims of the present invention.

Example 1

The present example provides a method of fabricating a 6 die/plate sub-mold into an 8 die/plate, comprising the steps of:

step 1, preparing a plurality of sub-molds copied from the master mold. The sub-mold is provided with a texture surface, and the typesetting mode of the texture area of the sub-mold is 6 small pieces/edition, namely the texture surface is provided with 6 texture areas.

And 2, preparing the same number of PC boards as the sub-dies as a protection board, and silk-screening a wire frame on one side of the protection board according to the texture area typesetting mode of the sub-dies.

And 3, punching positioning holes in corresponding positions of the sub-die and the protection plate respectively.

And 4, attaching the sub-dies and the protection plates one by one. Specifically, a positioning pin is used for penetrating through a positioning hole in the sub-die on the UV transfer printing machine table so as to fix the sub-die; dripping UV glue on the texture surface of the sub-mold, wherein the UV glue is dripped at one end close to the sub-mold; one side of the silk-screen line frame of the protection plate faces upwards, the protection plate is covered on the texture surface of the sub-die, and the protection plate is fixed by utilizing a positioning pin; rolling the protective plate back and forth from the glue dripping position through the glue driving roller to uniformly distribute the UV glue; and (5) curing the UV glue by UV illumination to obtain the laminating piece. Taking down the fitting piece for standby. According to the steps, a plurality of attaching pieces are manufactured.

And 5, dividing the attaching piece by laser processing according to the target texture area typesetting mode of 8 small pieces/plates to obtain a plurality of divided blocks which conform to corresponding shapes and sizes and have single texture areas, and marking on the protection plate of each divided block. The parts which can not conform to the corresponding shape and size during the segmentation or the parts which do not have complete single texture areas are discarded.

And 6, cleaning the segmentation block, cleaning dust on the segmentation block by using a dust adhering roller, and wiping the segmentation block by dipping 95% purity alcohol with dust-free cloth once.

And 7, fixing 8 pieces/version of films on a flat working table surface in a dust-free clean shed, and neatly and flatly placing the clean segmentation blocks on the films in comparison with the films to obtain a makeup array.

And 8, sticking the high-temperature adhesive tape without residual adhesive on one side of the makeup array, flatly sticking the adjacent segmentation blocks to obtain a spliced array, turning over the spliced array after sticking the whole block, and flatly placing the spliced array on a transparent PC board.

And 9, uniformly coating UV glue in gaps among the spliced segmented blocks, and curing by UV illumination to obtain the bonded array.

And step 10, sequentially peeling the protective plate and the adhesive tape on the bonding array to obtain a bonding sub-die. If the bonding marks between the segmentation blocks are smooth and flat, and no UV glue solidification bulge exists, the bonding sub-die can be used; and if the bonding mark protrudes out of the texture surface, performing the subsequent steps.

And 11, covering a layer of PE film without residual glue on the texture surface of the sub-bonding die to serve as a protective film, slightly scratching the protective film at the position of 3mm on each of the two sides of the bonding mark by using a blade, removing the protective film, and polishing the bonding mark by using 3000-mesh polishing abrasive paper until the bonding mark is flush with the texture surface.

And step 12, cleaning the polished dust by using dust sticking paper, and then wiping the whole body once by using a purifying cloth dipped with alcohol.

And step 13, uniformly coating AF liquid medicine on each polished and flat bonding mark, baking, forming an anti-sticking layer on the polished bonding mark, and removing the protective film covered in the step 11 to obtain the 8-piece/plate sub-die.

Example 2

The present example provides a method of fabricating a 6 die/plate sub-mold into a 10 die/plate, comprising the steps of:

And 5, dividing the attaching piece by laser processing according to the target texture area typesetting mode of 10 small pieces/plates to obtain a plurality of divided blocks which conform to corresponding shapes and sizes and have single texture areas, and marking on the protective plate of each divided block. The parts which can not conform to the corresponding shape and size during the segmentation or the parts which do not have complete single texture areas are discarded.

And 6, cleaning the segmentation block, cleaning dust on the segmentation block by using a dust adhering roller, and wiping the segmentation block by dipping alcohol with the purity of 95% with a piece of dust-free cloth.

And 7, fixing 10 pieces/version of film on a flat working table surface in a dust-free clean shed, and neatly and flatly placing the clean segmentation blocks on the film in comparison with the film to obtain a makeup array.

And 8, sticking the high-temperature adhesive tape without residual adhesive on one side of the makeup array, flatly sticking the adjacent segmentation blocks to obtain a spliced array, turning over the spliced array after sticking the whole block, and flatly placing the spliced array on a transparent glass plate.

And 11, covering a layer of PE film without residual glue on the texture surface of the sub-bonding die to serve as a protective film, slightly scratching the protective film at the position of 3mm on each of two sides of the bonding mark by using a blade, removing the protective film, and polishing the bonding mark by using 5000-mesh polishing abrasive paper until the bonding mark is flush with the texture surface.

And step 13, carrying out vacuum coating treatment, paying attention to the fact that the bonding marks are exposed, shielding and protecting non-bonding joint mark areas, plating silicon dioxide on each polished and flat bonding mark to form an anti-sticking layer, forming the anti-sticking layer on the polished bonding mark, and removing the protective film covered in the step 11 after coating is completed, so that the sub-die with 10 chips/plates is obtained.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The manufacturing method of the UV transfer printing mold is characterized by comprising the following steps:

gluing in gaps between adjacent dividing blocks on the splicing array, and curing to obtain a bonding array;

2. The method of manufacturing a UV transfer mold according to claim 1, wherein a wire frame is silk-screened on one side of the protection plate according to an original texture region typesetting manner of a sub mold before the protection plate is attached, and when the protection plate is attached, the side of the protection plate on which the wire frame is silk-screened is attached to face away from the sub mold.

3. The method of manufacturing a UV transfer mold according to claim 1, wherein the method of attaching a protective plate to the textured surface of each of the sub-molds comprises:

dripping UV glue on the texture surface of the sub-mold;

rolling the protection plate through a glue driving roller;

and (5) curing the UV glue by illumination.

4. The method of manufacturing a UV transfer mold according to any one of claims 1 to 3, further comprising, after peeling the protective sheet and the adhesive tape, the steps of: and polishing the bonding marks protruding out of the texture surface on the bonding sub-die.

5. The method of manufacturing a UV transfer mold according to claim 4, wherein the method of grinding the bonding mark comprises:

covering a protective film on the texture surface of the sub-bonding die;

polishing the bonding mark to be flush with the texture surface;

and removing the protective film.

6. The method of manufacturing a UV transfer mold according to claim 5, wherein the protective plate is a PC plate, a PET plate, or a composite plate; and/or

The protective film is a PE film or a PP film.

7. The method of manufacturing a UV transfer mold according to claim 5 or 6, wherein a release layer is formed on the ground adhesion mark before removing the protective film.

8. The method of manufacturing a UV transfer mold according to claim 7, wherein the release layer is an AF anti-fingerprint film or SiO₂And (3) a membrane.

9. The method of manufacturing a UV transfer mold according to claim 8, wherein the release layer is formed by a coating film or a vacuum coating film.

10. A UV transfer mold produced by the production method according to any one of claims 1 to 9.