CN112793270A - Film suitable for laser cutting - Google Patents

Film suitable for laser cutting Download PDF

Info

Publication number
CN112793270A
CN112793270A CN202011610539.0A CN202011610539A CN112793270A CN 112793270 A CN112793270 A CN 112793270A CN 202011610539 A CN202011610539 A CN 202011610539A CN 112793270 A CN112793270 A CN 112793270A
Authority
CN
China
Prior art keywords
master batch
density polyethylene
thickness
layer
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011610539.0A
Other languages
Chinese (zh)
Inventor
于连生
任文强
吴旭东
张志鹏
牛思双
孙德武
董春莹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dalian Dafu Plastic Color Printing Co ltd
Original Assignee
Dalian Dafu Plastic Color Printing Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dalian Dafu Plastic Color Printing Co ltd filed Critical Dalian Dafu Plastic Color Printing Co ltd
Priority to CN202011610539.0A priority Critical patent/CN112793270A/en
Publication of CN112793270A publication Critical patent/CN112793270A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/402Coloured
    • B32B2307/4026Coloured within the layer by addition of a colorant, e.g. pigments, dyes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/412Transparent
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04Homopolymers or copolymers of ethene
    • C08J2323/06Polyethene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/04Homopolymers or copolymers of ethene
    • C08J2423/06Polyethene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/04Homopolymers or copolymers of ethene
    • C08J2423/08Copolymers of ethene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof

Abstract

The invention discloses a film suitable for laser cutting, which is characterized in that: the thin film is of a three-layer structure, the total thickness of the thin film is 80 microns, the thickness of a first layer is 25 microns, the formula of the thin film is 20% of linear low-density polyethylene, 77% of low-density polyethylene and 3% of white master batch, the thickness of a second layer is 30 microns, the formula of the thin film is 95% of low-density polyethylene, 3% of white master batch and 2% of LMB master batch, the thickness of a third layer is 25 microns, the formula of the thin film is 98% of low-density polyethylene and 2% of LMB master batch, the LBM master batch is prepared by mixing a nanoscale laser absorber and low-density polyethylene according to the mass ratio of 1: 19 through a mixing roll, the processing temperature of the LBM master batch is lower than 180 ℃, and the nanoscale laser absorber is cesium tungstate laser absorber.

Description

Film suitable for laser cutting
Technical Field
The invention relates to the field of printing, in particular to a film suitable for laser cutting.
Background
The laser cutting process for stainless steel plate is to irradiate the steel plate with focused high-power-density laser beam to melt, vaporize and ablate the irradiated material or reach the burning point, and to blow off the molten material with the help of high-speed airflow coaxial with the beam. Laser cutting belongs to one of thermal cutting methods, has the advantages of high speed, high precision, smooth cut and the like, and is more and more favored by enterprises. However, there are many disadvantages in laser cutting, for example, if a protective film is not attached during laser cutting, the surface of the metal plate is easily damaged by a melt generated during the cutting process, and when a conventional protective film is attached to the surface of the metal plate for cutting, the protective film cannot be rapidly melted due to insufficient absorption of laser (infrared light wave), so that the cutting is not uniform, the protective film at the cutting position is bubbled or the surface is carbonized, and the like, which seriously affects the cutting operation. Secondly, the existing laser cutting protective film usually adopts black master batch (carbon black) as a laser absorber, has great influence on the color of the film, is not suitable for white or light-colored products, is not suitable for surface printing and can not meet various production requirements.
There is therefore a need for a new film suitable for laser cutting that addresses the above-mentioned problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a film which can be quickly fused under the irradiation of a laser beam so as to ensure the cutting quality and is suitable for laser cutting.
The technical solution of the invention is as follows: a film suitable for laser cutting, comprising: the film is a three-layer structure with a total thickness of 80 μm, wherein the first layer has a thickness of 25 μm and is formulated from 20% of linear low density polyethylene, 77% of low density polyethylene and 3% of white master batch, the second layer has a thickness of 30 μm and is formulated from 95% of low density polyethylene, 3% of white master batch and 2% of LMB master batch, and the third layer has a thickness of 25 μm and is formulated from 98% of low density polyethylene and 2% of LMB master batch,
the LBM master batch is prepared by mixing a nanoscale laser absorber and low-density polyethylene according to the mass ratio of 1: 19 by using a mixing roll, and the processing temperature of the LBM master batch is lower than 180 ℃ during mixing, wherein the nanoscale laser absorber is a cesium tungstate laser absorber.
Compared with the prior art, the invention has the following advantages:
the film suitable for laser cutting adopts a special layered structure, and the specific formula of each layer of film is specifically limited, so that the problem of difficulty in dispersion of a laser absorbent in film blowing processing is solved, the absorption rate of laser is improved, the laser can be rapidly melted, and the neatness of a notch position is ensured; meanwhile, the coating does not take black master batch (carbon black) as a laser absorber, so that the whole color of the coating is white or transparent, and a white or transparent protective film is provided to be suitable for the laser cutting operation of white or light-colored products. In conclusion, the film has multiple advantages, is particularly suitable for popularization and application in the field, and has a very wide market prospect.
Detailed Description
The following will explain specific embodiments of the present invention.
A film suitable for laser cutting, having a three layer structure with a total thickness of 80 μm, wherein the first layer has a thickness of 25 μm and is formulated with 20% of a linear low density polyethylene, 77% of a low density polyethylene and 3% of a white masterbatch, the second layer has a thickness of 30 μm and is formulated with 95% of a low density polyethylene, 3% of a white masterbatch and 2% of a LMB masterbatch, and the third layer has a thickness of 25 μm and is formulated with 98% of a low density polyethylene and 2% of a LMB masterbatch,
the LBM master batch is prepared by mixing a nano-scale laser absorbent and low-density polyethylene according to the mass ratio of 1: 19 by using a mixing roll, and the processing temperature of the LBM master batch is lower than 180 ℃ during mixing, and meanwhile, the actual melt temperature of a screw and a machine head cannot exceed 180 ℃ during film blowing processing; the nano-scale laser absorber is a cesium tungstate laser absorber.
Before the production of the film, the LDPE is required to be used for cleaning the screw firstly, and the LDPE is also required to be used for cleaning the screw after the production is finished, because the LDPE does not contain a catalyst and cannot react with the LMB master batch, so that the quality problems of crystal point paste and the like cannot be generated in the processing process of the LMB master batch.

Claims (1)

1. A film suitable for laser cutting, comprising: the film is a three-layer structure with a total thickness of 80 μm, wherein the first layer has a thickness of 25 μm and is formulated from 20% of linear low density polyethylene, 77% of low density polyethylene and 3% of white master batch, the second layer has a thickness of 30 μm and is formulated from 95% of low density polyethylene, 3% of white master batch and 2% of LMB master batch, and the third layer has a thickness of 25 μm and is formulated from 98% of low density polyethylene and 2% of LMB master batch,
the LBM master batch is prepared by mixing a nanoscale laser absorber and low-density polyethylene according to the mass ratio of 1: 19 by using a mixing roll, and the processing temperature of the LBM master batch is lower than 180 ℃ during mixing, wherein the nanoscale laser absorber is a cesium tungstate laser absorber.
CN202011610539.0A 2020-12-30 2020-12-30 Film suitable for laser cutting Pending CN112793270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011610539.0A CN112793270A (en) 2020-12-30 2020-12-30 Film suitable for laser cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011610539.0A CN112793270A (en) 2020-12-30 2020-12-30 Film suitable for laser cutting

Publications (1)

Publication Number Publication Date
CN112793270A true CN112793270A (en) 2021-05-14

Family

ID=75804535

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011610539.0A Pending CN112793270A (en) 2020-12-30 2020-12-30 Film suitable for laser cutting

Country Status (1)

Country Link
CN (1) CN112793270A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102597081A (en) * 2009-10-29 2012-07-18 帝斯曼知识产权资产管理有限公司 Laser-marking additive
CN103509478A (en) * 2012-06-25 2014-01-15 日东电工株式会社 Adhesive film
CN103597046A (en) * 2011-06-17 2014-02-19 日东电工株式会社 Adhesive film
CN206456047U (en) * 2017-01-13 2017-09-01 佛山市顺德区春祥包装材料有限公司 A kind of laser cutting diaphragm
US20190351623A1 (en) * 2017-06-29 2019-11-21 Orient Chemical Industries Co., Ltd. Laser welded body and method for manufacturing same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102597081A (en) * 2009-10-29 2012-07-18 帝斯曼知识产权资产管理有限公司 Laser-marking additive
CN103597046A (en) * 2011-06-17 2014-02-19 日东电工株式会社 Adhesive film
CN103509478A (en) * 2012-06-25 2014-01-15 日东电工株式会社 Adhesive film
CN206456047U (en) * 2017-01-13 2017-09-01 佛山市顺德区春祥包装材料有限公司 A kind of laser cutting diaphragm
US20190351623A1 (en) * 2017-06-29 2019-11-21 Orient Chemical Industries Co., Ltd. Laser welded body and method for manufacturing same

Similar Documents

Publication Publication Date Title
Kru et al. Femtosecond-pulse visible laser processing of transparent materials
DE102005030670B4 (en) Apparatus for cutting a substrate and method using the same
EP1224053B1 (en) Method and device for rapid cutting of a workpiece from a brittle material
US5961852A (en) Laser scribe and break process
KR20100007955A (en) Laser processing method and laser processed article
EP3741495B1 (en) Method and system for laser additive manufacturing based on keyhole effects
CN206298642U (en) It is a kind of that the laser cladding equipment for preheating gentle cold light is produced based on bifocal
CN106552997A (en) Based on the method that mechanism of ultrashort-pulse laser ablation principle is processed to sheet metal sand screen mesh
Jia et al. Combined pulsed laser drilling of metal by continuous wave laser and nanosecond pulse train
CN112793270A (en) Film suitable for laser cutting
CN109014615A (en) A kind of short pulse duration laser cutting device and its cutting method
JPS6189636A (en) Optical processing
Xie et al. High-quality laser processing of fused silica with bursts of ultrafast pulses
DE69813227T2 (en) METHODS AND COMPOSITIONS FOR LASER LABELING, AND OBJECTS PRINTED BY THIS METHOD AND COMPOSITIONS
US10854554B2 (en) Carbide, nitride and silicide enhancers for laser absorption
CN114571064B (en) Laser-induced oxidation auxiliary milling composite processing device and method
CN116121878A (en) Method for homogenizing ablation of single crystal diamond
Liu et al. Research on hole depth in femtosecond laser deep micropore processing technology based on filament effect
CN109530934B (en) Method for reducing thermal influence of low-power scribing on workpiece and laser cutting head
JP4405761B2 (en) Laser processing glass
US10723160B2 (en) Carbide, nitride and silicide enhancers for laser absorption
CN104827778A (en) Backlight liquid crystal module marking method and device
Lim et al. Effect of indirect irradiation on surface morphology of Au film by nanosecond laser
CN209477528U (en) A kind of short pulse duration laser cutting device
CN210498834U (en) Accurate laser cutting pottery and circuit board aluminium base board equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20210514