CN112786804B - Display panel and manufacturing method thereof - Google Patents

Display panel and manufacturing method thereof Download PDF

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Publication number
CN112786804B
CN112786804B CN202110021210.9A CN202110021210A CN112786804B CN 112786804 B CN112786804 B CN 112786804B CN 202110021210 A CN202110021210 A CN 202110021210A CN 112786804 B CN112786804 B CN 112786804B
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layer
opening
groove
display panel
encapsulation
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CN112786804A (en
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郑秉文
葛晓明
丁峰
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention discloses a display panel and a manufacturing method thereof. This display panel includes display area and the frame district that is close to the display area, and display panel includes: the bearing layer is provided with a groove, and the groove is positioned in the frame area; the packaging layer is positioned on the bearing layer, and the first part of the packaging layer is positioned in the groove; the packaging layer in the groove comprises a partition unit, and the partition unit enables the packaging layer to be discontinuously arranged. According to the invention, the packaging layer in the groove forms the partition gap, and when the packaging layer is broken in the process of being close to the hole digging region, the broken extension path of the packaging layer is blocked in the frame region, so that the packaging effect of the display region is ensured.

Description

Display panel and manufacturing method thereof
Technical Field
The invention relates to the field of display, in particular to a display panel and a manufacturing method thereof.
Background
With the popularization of the comprehensive screen concept, display technologies such as a camera under the screen, a water drop screen, an inner opening of the screen and the like are gradually developed, so that the packaging technical requirements for the inner opening of the screen are higher and higher.
At present, through set up the recess in the frame district, extension encapsulation route, reinforcing encapsulation effect, but to opening a hole laser cutting in the screen or in technologies such as module equipment, the encapsulated layer has the fracture risk near digging hole district edge, because the fracture has the ductility, when the fracture extends to the display area, can lead to the encapsulation inefficacy.
Therefore, a display panel and a method for fabricating the same are needed to solve the above-mentioned problems.
Disclosure of Invention
The invention provides a display panel and a manufacturing method thereof, and aims to solve the technical problem that an encapsulation layer at the edge of a hole digging area of a camera at present has a fracture risk, and when the fracture extends to a display area, the encapsulation is invalid.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
a display panel including a display area and a bezel area adjacent to the display area, the display panel comprising:
the bearing layer is provided with a groove, and the groove is positioned in the frame area; and
an encapsulation layer located on the carrier layer, a first portion of the encapsulation layer being located within the recess;
the packaging layer in the groove comprises a partition unit, and the partition unit enables the packaging layer to be in discontinuous arrangement.
In the display panel of the present invention, the groove includes a first groove and a second groove, the size of the first groove is larger than that of the second groove, the first portion of the encapsulation layer is located in the first groove and the second groove, and the partition unit is located in the first groove.
In the display panel of the invention, the bearing layer comprises a first substrate and a first buffer layer positioned on the first substrate;
the first groove comprises a first opening penetrating through the first buffer layer and a second opening arranged on the first substrate, and the first opening is correspondingly connected with the second opening;
the second groove comprises a third opening penetrating through the first buffer layer and a fourth opening arranged on the first substrate, and the third opening and the fourth opening are correspondingly connected;
the aperture of the second opening is larger than that of the first opening, the aperture of the fourth opening is larger than that of the third opening, the depth and the inner diameter of the second opening are larger than those of the fourth opening, and the partition unit is located in the second opening.
In the display panel of the invention, the first substrate corresponding to the sidewall of the second opening includes a first recess, the first recess is arranged in a closed loop parallel to the display panel along the sidewall of the second opening, and the encapsulation layer in the second opening is discontinuously arranged around the first recess.
In the display panel of the present invention, the encapsulation layer includes a first inorganic layer, a first organic layer on the first inorganic layer, and a second inorganic layer on the first organic layer, the first organic layer is located in the display region, and the partition unit penetrates through the first inorganic layer and the second inorganic layer.
In the display panel of the invention, the first inorganic layer and the second inorganic layer in the second groove are continuously disposed.
In the display panel of the invention, the bottom of the groove is provided with a first bulge, and the first bulge is arranged corresponding to the partition unit.
In the display panel of the present invention, the display panel further includes a hole digging region located on a side of the frame region away from the display region, and in a direction from the display region to the hole digging region, a distribution density of the first grooves is gradually increased and/or a size of the first grooves is gradually increased.
In the display panel of the present invention, the encapsulation layer in the first groove further includes a first opening, the first opening is located in a bottom region of the first groove, and the first opening penetrates through the encapsulation layer in the first groove.
The invention also provides a manufacturing method of the display panel, the display panel comprises a display area, a frame area adjacent to the display area and a hole digging area positioned at the periphery of the frame area, and the manufacturing method of the display panel comprises the following steps:
forming a first buffer layer on a first substrate;
forming a plurality of second grooves on the first buffer layer in the frame region, wherein any second groove penetrates through the first buffer layer and extends to a part of the first substrate;
etching the second grooves close to the hole digging region to form a plurality of first grooves;
forming an encapsulation material layer on the first buffer layer and the first substrate, wherein the encapsulation material layer is broken in the first groove to form at least one partition unit so as to form an encapsulation layer comprising the partition unit;
wherein the depth and inner diameter of the first groove are greater than the depth and inner diameter of the second groove.
Has the advantages that: according to the invention, the packaging layer in the groove forms the partition gap, and when the packaging layer is broken in the process of generating the packaging layer near the digging hole region, the broken expanding path of the packaging layer is blocked in the frame region, so that the packaging effect of the display region is ensured.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
FIG. 1 is a schematic structural diagram of a first structure of a display panel according to the present invention;
FIG. 2 is a schematic structural diagram of a second structure of a display panel according to the present invention;
FIG. 3 is a schematic structural diagram of a third structure of a display panel according to the present invention;
FIG. 4 is a schematic structural diagram of a fourth structure of a display panel according to the present invention;
FIG. 5 is a schematic structural diagram of a fifth structure of a display panel according to the present invention;
FIG. 6 is a schematic diagram of a sixth structure of a display panel according to the present invention;
FIG. 7 is a flowchart illustrating a method of fabricating a display panel according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
At present, through set up the recess in the frame district, extension encapsulation route, reinforcing encapsulation effect, but to opening a hole laser cutting in the screen or in technologies such as module equipment, the encapsulated layer has the fracture risk near digging hole district edge, because the fracture has the ductility, when the fracture extends to the display area, can lead to the encapsulation inefficacy.
Referring to fig. 1 to 6, the present invention discloses a display panel 100, including a display area a and a frame area B adjacent to the display area a, wherein the display panel 100 includes:
the bearing layer 200 is provided with a groove, and the groove is positioned in the frame area B; and
an encapsulation layer 500 located on the carrier layer 200, a first portion of the encapsulation layer 500 being located within the recess;
the encapsulation layer 500 in the groove includes a partition unit 610, and the partition unit 610 makes the encapsulation layer 500 be non-continuous.
According to the invention, the packaging layer in the groove forms the partition gap, and when the packaging layer is broken in the process of being close to the hole digging region, the broken extension path of the packaging layer is blocked in the frame region, so that the packaging effect of the display region is ensured.
The technical solution of the present invention will now be described with reference to specific embodiments.
Referring to fig. 1 to 6, the display panel 100 includes a display area a and a frame area B adjacent to the display area a, and the display panel 100 includes: the bearing layer 200 is provided with a groove, and the groove is positioned in the frame area B; and an encapsulation layer 500 on the carrier layer 200, a first portion of the encapsulation layer 500 being located within the recess; the encapsulation layer 500 in the groove includes a partition unit 610, and the partition unit 610 makes the encapsulation layer 500 be non-continuous.
In this embodiment, the encapsulation layer 500 located in the groove may be a first portion of the encapsulation layer 500.
In this embodiment, the carrier layer 200 includes a first substrate 210 and a first buffer layer 310 on the first substrate 210.
In this embodiment, the carrier layer 200 further includes a second buffer layer 320 located on a side of the first substrate 210 away from the first buffer layer 310, and a second substrate 220 located on the second buffer layer 320, as shown in fig. 6.
In this embodiment, the first substrate 210, the second substrate 220, the first buffer layer 310, and the second buffer layer 320 are disposed in a whole layer, which is specifically shown in fig. 6.
In this embodiment, the material of the first substrate 210 and the second substrate 220 may be polyimide. The material of the first buffer layer 310 and the second buffer layer 320 may be a silicon nitride compound,
in this embodiment, the encapsulation layer 500 located in the hole digging region C and the frame region B includes a first inorganic layer 501 and a second inorganic layer 502, and the first inorganic layer 501 is located on the first buffer layer 310, and in particular, referring to fig. 1, the two inorganic layers can better block water and oxygen, and simultaneously facilitate one-time formation of a blocking gap.
In this embodiment, the hole digging region C may be a hole forming region of the special-shaped screen, or may be a hole forming region of the camera under the screen, which is not limited herein.
In this embodiment, the grooves include a first groove 410 and a second groove 420, the size of the first groove 410 is larger than that of the second groove 420, the first portion of the encapsulation layer 500 is located in the first groove 410 and the second groove 420, and may be the first portion of the encapsulation layer 500 is located in the first groove 410 and the second groove 420, wherein the partition unit 610 is located in the first groove 410, specifically referring to fig. 1.
In this embodiment, any one of the first grooves 410 includes a first opening 441 disposed on the same layer as the first buffer layer 310 and a second opening 442 disposed on the same layer as the first substrate 210, the first opening 441 and the second opening 442 are correspondingly disposed, and the first opening 441 penetrates through the first buffer layer 310. Any one of the second recesses 420 includes a third opening 443 disposed on the same layer as the first buffer layer 310 and a fourth opening 444 disposed on the same layer as the first substrate 210, the third opening 443 and the fourth opening 444 are correspondingly disposed, and the third opening 443 penetrates the first buffer layer 310. The second opening 442 has a larger diameter than the first opening 441, the fourth opening 444 has a larger diameter than the third opening 443, and the second opening 442 has a larger depth and inner diameter than the fourth opening 444. The partition unit 610 is disposed in a region near the second opening 442 corresponding to the first buffer layer 310, as shown in fig. 1. The first buffer layer 310 and the first substrate 210 have different etching rates, the first opening 441 and the second opening 442 can be formed by one etching, the etching method can be wet etching, the first opening 441, the second opening 442 and the first buffer layer 310 form an eave-like structure, the first buffer layer 310 above the first opening 441 is an eave, the encapsulation layer 500 can be broken in a region close to the second opening 442 and corresponding to the first buffer layer 310 during the formation process, so as to form the discontinuously arranged encapsulation layer 500 with gaps, when the process is generated, the encapsulation layer 500 has a risk of breaking near the edge of the opening C in the screen during laser cutting of the opening in the screen or during module assembly, and the expansion path of the broken encapsulation layer 500 tends to extend toward other gaps or notches, the partition unit 610 may guide the fracture expansion path to itself, so as to block the fracture expansion path of the encapsulation layer 500 in the frame area B, thereby ensuring the encapsulation effect of the display area a.
In this embodiment, the first substrate 210 corresponding to the sidewall of the second opening 442 includes a first recess 620, the first recess 620 is disposed in a closed loop along the sidewall of the second opening 442, and the encapsulation layer 500 in the second opening 442 is disposed discontinuously around the first recess 620, as shown in fig. 2. The sidewalls of the second openings 442 may be etched a second time or precisely when forming the first recesses 410, a first recess 620 is formed on the first substrate 210 corresponding to the sidewall of the second opening 442, when the encapsulation layer 500 is formed, the encapsulation layer 500 also generates a natural fracture gap in the vicinity of the first recess 620, the first recess 620 is disposed in a closed loop along the sidewall of the second opening 442, it is better to form the encapsulation layer 500 into a ring of fracture gaps in the first recess 410, thereby directing more of the cracking path of the encapsulation layer 500 to the fracture gap near the first recess 620, meanwhile, a circle of fracture gap can also better terminate the fracture path of the packaging layer 500 in the first groove 410, so that the fracture of the packaging layer 500 cannot extend to the display area A, and the packaging effect of the display area A is ensured.
In this embodiment, the bottom of the groove is provided with a first protrusion 630, and the first protrusion 630 is arranged corresponding to the partition unit 610. When the encapsulation layer 500 is formed, the encapsulation layer 500 is not easily covered on the first protrusion 630, so that a natural gap is formed in the encapsulation layer 500, the rupture path of the encapsulation layer 500 is terminated around the first protrusion 630, the fracture of the encapsulation layer 500 is not extended to the display area a, and the encapsulation effect of the display area a is ensured.
In this embodiment, a plurality of first bumps 630 are disposed on the first substrate 210 corresponding to the bottoms of the second openings 442, and the encapsulation layer 500 in the second openings 442 is discontinuously disposed around any of the first bumps 630, as shown in fig. 3. The first protrusion 630 may be a part of the first substrate 210, or may be a photoresist material, and a slope included angle between the first protrusion 630 and the first substrate 210 may be greater than 60 °, so that when the encapsulation layer 500 is formed, the encapsulation layer 500 is not easily covered on the first protrusion 630, so that the encapsulation layer 500 forms a natural gap, a fracture path of the encapsulation layer 500 is terminated in the first groove 410, and the fracture of the encapsulation layer 500 does not extend to the display area a, thereby ensuring the encapsulation effect of the display area a.
In this embodiment, a plurality of the first protrusions 630 are disposed at intervals in one of the first grooves 410. The encapsulation layer 500 in the second opening 442 forms a plurality of gaps spaced apart from each other. Similar to the easy-to-tear line, the structure is more easily broken, and the broken extension path can be guided to the structure, so that the broken extension path of the encapsulation layer 500 is blocked in the frame region B, and the encapsulation effect of the display region a is ensured.
In this embodiment, in at least one of the first grooves 410, the inner diameter of the second opening 442 gradually increases in a direction from the first buffer layer 310 to the first substrate 210. The partition unit 610 is located between the bottom of the second opening 442 and the sidewall of the second opening 442, as shown in fig. 4. The second opening 442 is configured to have a structure with a small opening and a large bottom, so that when the encapsulation layer 500 is formed, the encapsulation layer 500 is more easily naturally broken at the bottom to form the partition unit 610, thereby blocking the broken extension path of the encapsulation layer 500 in the frame area B and ensuring the encapsulation effect of the display area a.
In this embodiment, the first substrate 210 corresponding to the sidewall of the second opening 442 includes a second recess. The second recess is matched with the structure that the opening of the second opening 442 is small and the bottom of the second recess is large, so that when the packaging layer 500 is formed, more natural fracture can occur to the packaging layer 500, and a gap is formed, so that the fracture expansion path of the packaging layer 500 is blocked in the frame area B, and the packaging effect of the display area A is guaranteed.
In this embodiment, the partition unit 610 is disposed in a closed loop parallel to the first substrate 210. When the packaging layer 500 is formed, a circle of partition units 610 arranged in a closed loop are formed, so that a circle of fracture gap can be better formed in the first groove 410 by the packaging layer 500, and thus, the fracture paths of more packaging layers 500 are led to the fracture gap of the partition units 610 arranged in the closed loop, and meanwhile, the fracture path of the packaging layer 500 can be better stopped in the first groove 410 by the circle of fracture gap, so that the fracture of the packaging layer 500 cannot extend to the display area A, and the packaging effect of the display area A is ensured.
In this embodiment, in a direction from the display area a to the hole digging area C, the distribution density of the first grooves 410 is gradually increased, and the size of the second openings 442 is gradually increased, as shown in fig. 1. The first groove 410 functions to prevent the crack extension path of the encapsulation layer 500 from being concentrated near the dug hole region C, and the blocking effect is better. The larger the size of the second opening 442 is, the greater the probability that the package layer 500 will naturally break in the first groove 410 during the formation process is, the better the breaking extension path of the package layer 500 can be terminated in the frame region B, and the packaging effect of the display region a can be ensured.
In this embodiment, the first groove 410 is disposed close to the hole digging region C, the second groove 420 is disposed close to the display region a, and the first groove 410 surrounds and distributes around the hole digging region C, so as to keep a possible breaking path of the encapsulation layer 500 away from the display region a as far as possible, thereby ensuring the encapsulation effect of the display region a.
In this embodiment, the encapsulation layer 500 in the second opening 442 further includes a first opening 510, the first opening 510 is located in a bottom region of the second opening 442, and the first opening 510 penetrates through the encapsulation layer 500 in the second opening 442, as shown in fig. 5. And (3) packaging in a partition manner: the first groove 410 and the surrounding area are encapsulated, the process of the first opening 510 is performed, and then the second groove 420 and the surrounding area are encapsulated, so that the integrity of the encapsulation layer 500 in the second groove 420 is not affected by the formation of the first opening 510 in the first groove 410, and a fracture gap of the encapsulation layer 500 is artificially formed, so that the fracture extension path of the encapsulation layer 500 can be better terminated in the frame area B, and the encapsulation effect of the display area a is ensured.
In this embodiment, the orthographic projection of the first opening 510 on the first substrate 210 is located within the orthographic projection of the first opening 441 on the first substrate 210, that is, the first opening 510 can be vertically formed through the first opening 441, which simplifies the manufacturing process.
In this embodiment, the package layer 500 further includes a plurality of second openings 520, the second openings 520 are located in the sidewall regions of the first recess 410 corresponding to the buffer layer, and the second openings 520 penetrate through the package layer 500, as shown in fig. 5. The second opening 520 is located on the sidewall of the first opening 441 corresponding to the buffer layer. The forming process of the second opening 520 is similar to the forming process of the first opening 510 by the sub-region package, the first groove 410 and the surrounding region are packaged first, the process of the second opening 520 is performed, and then the second groove 420 and the surrounding region are packaged, the formation of the second opening 520 in the first groove 410 does not affect the integrity of the package layer 500 in the second groove 420, the second opening 520 is close to the corner of the buffer layer corresponding to the first opening 441, and the fracture extension path of the package layer 500 is easily led to the second opening 520, so that the fracture extension path of the package layer 500 is blocked in the frame region B, and the packaging effect of the display region a is ensured.
In this embodiment, the second opening is disposed in a closed loop along a sidewall of the first opening. The ring of fracture gap can also better terminate the fracture path of the packaging layer 500 in the first groove 410, so that the fracture of the packaging layer 500 does not extend to the display area a, and the packaging effect of the display area a is ensured.
In this embodiment, the first inorganic layer 501 and the second inorganic layer 502 extend to the display area a. The encapsulation layer 500 in the display area a further includes a first organic layer 503 between the first inorganic layer 501 and the second inorganic layer 502, please refer to fig. 6 specifically. The first organic layer 503 can better protect the display area a and enhance the flexibility of the display area a.
In this embodiment, the first buffer layer 310 further includes a plurality of third grooves 430, the third grooves 430 are located on a side of the display area a close to the frame area B, a portion of the first inorganic layer 501 is located in the third grooves 430, and the third grooves 430 are further filled with a portion of the first organic layer 503, as shown in fig. 6. The third groove 430 may extend the encapsulation path of the encapsulation layer 500, and the third groove 430, in cooperation with the first inorganic layer 501 and the first organic layer 503, may form an anchoring effect, which may enhance the fixing and connecting force between the encapsulation layer 500 and the first buffer layer 310 in the display area a.
In this embodiment, the display panel 100 further includes a plurality of first dams 301, the first dams 301 are located at a side of the frame region B close to the display region a, and the first dams 301 are located between the first buffer layer 310 and the encapsulation layer 500, as shown in fig. 6. The first dam 301 may better limit the flow of the first organic layer 503 during the formation process, so that the first organic layer 503 is limited in the display area a, and the first organic layer 503 is prevented from entering the frame area B, which may reduce the water and oxygen blocking effect of the encapsulation layer 500 in the frame area B.
In this embodiment, in the display area a, the display panel 100 further includes an array substrate on the first buffer layer 310.
In this embodiment, the display panel 100 may be an OLED (Organic Light-Emitting semiconductor) display panel 100, in the display area a, the display panel 100 further includes a Light-Emitting device layer on the array substrate, and the encapsulation layer 500 is located on the Light-Emitting device layer.
In this embodiment, the partition unit 610, the first protrusion 630, the first recess 620, the first opening 510, the second opening 520, and the structures in the embodiments may be combined at will, and are not described herein again.
According to the invention, the packaging layer in the groove forms the partition gap, and when the packaging layer is broken in the process of being close to the hole digging region, the broken extension path of the packaging layer is blocked in the frame region, so that the packaging effect of the display region is ensured.
Referring to fig. 1 to 7, the present invention further provides a manufacturing method of a display panel 100, where the display panel 100 includes a display area a, a frame area B located at one side of the display area a, and a hole digging area C located at the periphery of the frame area B, and the manufacturing method of the display panel 100 includes:
s100, a first buffer layer 310 is formed on the first substrate 210.
S200, forming a plurality of second grooves 420 on the first buffer layer 310 in the frame region B, wherein any of the second grooves 420 penetrates through the first buffer layer 310 and extends to a portion of the first substrate 210.
S300, etching the second grooves 420 close to the hole digging region C to form a plurality of first grooves 410.
S400, forming an encapsulation material layer on the first buffer layer 310 and the first substrate 210, wherein the encapsulation material layer is broken in the first groove 410 to form a partition unit 610, so as to form an encapsulation layer 500 including a plurality of partition units 610.
Wherein the depth and inner diameter of the first groove 410 are greater than the depth and inner diameter of the second groove 420.
According to the invention, the packaging layer in the groove forms the partition gap, and when the packaging layer is broken in the process of being close to the hole digging region, the broken extension path of the packaging layer is blocked in the frame region, so that the packaging effect of the display region is ensured.
The technical solution of the present invention will now be described with reference to specific embodiments.
The manufacturing method of the display panel 100 includes:
s100, a first buffer layer 310 is formed on the first substrate 210.
The method for manufacturing the display panel 100 before forming the first substrate 210 further includes:
s101, a second buffer layer 320 is formed on the second substrate 220.
In this embodiment, the display panel 100 further includes a second buffer layer 320 located on a side of the first substrate 210 away from the first buffer layer 310, and a second substrate 220 located on the second buffer layer 320, as shown in fig. 6.
In this embodiment, the first substrate 210, the second substrate 220, the first buffer layer 310, and the second buffer layer 320 are disposed in a whole layer, which is specifically shown in fig. 6.
In this embodiment, the first substrate 210 and the second substrate 220 may be made of polyimide. The material of the first buffer layer 310 and the second buffer layer 320 may be a silicon nitride compound,
s200, forming a plurality of second grooves 420 on the first buffer layer 310 in the frame region B, wherein any of the second grooves 420 penetrates through the first buffer layer 310 and extends to a portion of the first substrate 210.
In this embodiment, step S200 includes:
s210, forming a first photoresist pattern on the first buffer layer 310 in the frame region B.
S220, etching the first buffer layer 310 uncovered by the first photoresist pattern by using exposure, etching, and developing processes to form a plurality of second grooves 420, wherein any one of the second grooves 420 penetrates through the first buffer layer 310 and extends to a portion of the first substrate 210.
S300, etching the second grooves 420 close to the hole digging region C to form a plurality of first grooves 410.
In this embodiment, step S300 includes:
s310, forming a second photoresist pattern on the first buffer layer 310 in the frame region B.
In this embodiment, the second photoresist pattern exposes a portion of the second recess 420.
S320, etching the first buffer layer 310 and the first substrate 210 uncovered by the second photoresist pattern by using exposure, etching, and developing processes to form a plurality of first grooves 410.
In this embodiment, the depth and the inner diameter of the first groove 410 are greater than those of the second groove 420, please refer to fig. 1.
In this embodiment, any one of the first recesses 410 includes a first opening 441 disposed on a same layer as the first buffer layer 310 and a second opening 442 disposed on a same layer as the first substrate 210, the first opening 441 and the second opening 442 are disposed correspondingly, and the first opening 441 penetrates through the first buffer layer 310. Any of the second recesses 420 includes a third opening 443 disposed on the same layer as the first buffer layer 310 and a fourth opening 444 disposed on the same layer as the first substrate 210, the third opening 443 and the fourth opening 444 are correspondingly disposed, and the third opening 443 penetrates through the first buffer layer 310. The second opening 442 has a larger diameter than the first opening 441, the fourth opening 444 has a larger diameter than the third opening 443, and the second opening 442 has a larger depth and inner diameter than the fourth opening 444. The partition unit 610 is disposed near the second opening 442 and in a region corresponding to the first buffer layer 310, as shown in fig. 1. The first buffer layer 310 and the first substrate 210 have different etching rates, the first opening 441 and the second opening 442 can be formed by one etching, the etching method can be wet etching, the first opening 441, the second opening 442 and the first buffer layer 310 form an eave-like structure, the first buffer layer 310 above the first opening 441 is an eave, the encapsulation layer 500 can be broken in a region close to the second opening 442 and corresponding to the first buffer layer 310 during the formation process, so as to form the discontinuously arranged encapsulation layer 500 with gaps, when the process is generated, the encapsulation layer 500 has a risk of breaking near the edge of the opening C in the screen during laser cutting of the opening in the screen or during module assembly, and the expansion path of the broken encapsulation layer 500 tends to extend toward other gaps or notches, the partition unit 610 may guide the fracture expansion path to itself, so as to block the fracture expansion path of the encapsulation layer 500 in the frame area B, thereby ensuring the encapsulation effect of the display area a.
In this embodiment, the first substrate 210 corresponding to the sidewall of the second opening 442 includes a first recess 620, the first recess 620 is disposed in a closed loop along the sidewall of the second opening 442, and the encapsulation layer 500 in the second opening 442 is disposed discontinuously around the first recess 620, as shown in fig. 2. The sidewalls of the second openings 442 may be etched a second time or precisely when forming the first recesses 410, a first recess 620 is formed on the first substrate 210 corresponding to the sidewall of the second opening 442, when the encapsulation layer 500 is formed, the encapsulation layer 500 also generates a natural fracture gap in the vicinity of the first recess 620, the first recess 620 is disposed in a closed loop along the sidewall of the second opening 442, it is better to form the encapsulation layer 500 into a ring of fracture gaps in the first groove 410, thereby directing more of the cracking path of the encapsulation layer 500 to the fracture gap near the first recess 620, meanwhile, a circle of fracture gap can also better terminate the fracture path of the packaging layer 500 in the first groove 410, so that the fracture of the packaging layer 500 cannot extend to the display area A, and the packaging effect of the display area A is ensured.
In this embodiment, a plurality of first bumps 630 are disposed on the first substrate 210 corresponding to the bottoms of the second openings 442, and the encapsulation layer 500 in the second openings 442 is discontinuously disposed around any of the first bumps 630, as shown in fig. 3. The first protrusion 630 may be a part of the first substrate 210, or may be a photoresist material, and a slope included angle between the first protrusion 630 and the first substrate 210 may be greater than 60 °, so that when the encapsulation layer 500 is formed, the encapsulation layer 500 is not easily covered on the first protrusion 630, so that the encapsulation layer 500 forms a natural gap, a fracture path of the encapsulation layer 500 is terminated in the first groove 410, and the fracture of the encapsulation layer 500 does not extend to the display area a, thereby ensuring the encapsulation effect of the display area a.
In this embodiment, a plurality of the first protrusions 630 are disposed at intervals in one of the first grooves 410. The encapsulation layer 500 in the second opening 442 forms a plurality of gaps spaced apart from each other. Similar to the easy-to-tear line, the structure is more easily broken, and the broken extension path can be guided to the structure, so that the broken extension path of the encapsulation layer 500 is blocked in the frame region B, and the encapsulation effect of the display region a is ensured.
In this embodiment, in at least one of the first recesses 410, the inner diameter of the second opening 442 is gradually increased in a direction from the first buffer layer 310 to the first substrate 210, as shown in fig. 4. The partition unit 610 is located between the bottom of the second bore 442 and the sidewall of the second bore 442. The second opening 442 is configured to have a structure with a small opening and a large bottom, so that when the encapsulation layer 500 is formed, the encapsulation layer 500 is more easily naturally broken at the bottom to form the partition unit 610, thereby blocking the broken extension path of the encapsulation layer 500 in the frame area B and ensuring the encapsulation effect of the display area a.
In this embodiment, the first substrate 210 corresponding to the sidewall of the second opening 442 includes a second recess. The second recess is matched, and the opening of the second opening 442 is small and the bottom of the second opening is large, so that when the packaging layer 500 is formed, more natural fracture can occur to the packaging layer 500 to form an interval gap, and therefore the fracture expansion path of the packaging layer 500 is blocked in the frame area B, and the packaging effect of the display area A is guaranteed.
In this embodiment, the partition unit 610 is disposed in a closed loop parallel to the first substrate 210. When the packaging layer 500 is formed, a circle of partition units 610 arranged in a closed loop are formed, and a circle of fracture gap can be better formed in the first groove 410 by the packaging layer 500, so that more fracture paths of the packaging layer 500 are led to the fracture gap of the partition units 610 arranged in the closed loop, and meanwhile, the fracture path of the packaging layer 500 can be better stopped by the circle of fracture gap in the first groove 410, so that the fracture of the packaging layer 500 cannot extend to the display area A, and the packaging effect of the display area A is ensured.
In this embodiment, in a direction from the display area a to the hole digging area C, the distribution density of the first grooves 410 is gradually increased, and the size of the second openings 442 is gradually increased, as shown in fig. 1. The first groove 410 functions to prevent the crack extension path of the encapsulation layer 500 from being concentrated near the dug hole region C, and the blocking effect is better. The larger the size of the second opening 442 is, the greater the probability that the package layer 500 will naturally break in the first groove 410 during the formation process is, the better the breaking extension path of the package layer 500 can be terminated in the frame region B, and the packaging effect of the display region a can be ensured.
In this embodiment, the first groove 410 is disposed close to the hole digging region C, the second groove 420 is disposed close to the display region a, and the first groove 410 surrounds and distributes around the hole digging region C, so as to keep a possible breaking path of the encapsulation layer 500 away from the display region a as far as possible, thereby ensuring the encapsulation effect of the display region a.
In this embodiment, step S300 further includes:
s330, forming a plurality of third grooves 430 on the first buffer layer 310 in the display area a and on a side close to the frame area B.
S340, forming a plurality of first dams 301 on the first buffer layer 310 on the side of the frame region B close to the display region a.
In this embodiment, the display panel 100 further includes a plurality of first dams 301, the first dams 301 are located at a side of the frame region B close to the display region a, and the first dams 301 are located between the first buffer layer 310 and the encapsulation layer 500, as shown in fig. 6. The first dam 301 may better limit the flow of the first organic layer 503 during the formation process, so that the first organic layer 503 is limited in the display area a, and the first organic layer 503 is prevented from entering the frame area B, which may reduce the water and oxygen blocking effect of the encapsulation layer 500 in the frame area B.
S400, forming an encapsulation material layer on the first buffer layer 310 and the first substrate 210, wherein the encapsulation material layer is broken in the first groove 410 to form a partition unit 610, so as to form an encapsulation layer 500 including a plurality of partition units 610.
In this embodiment, the package layer 500 may be formed as a whole layer, as shown in fig. 1.
In this embodiment, the display panel 100 includes a first substrate 210, a first buffer layer 310 on the first substrate 210, and an encapsulation layer 500 on the first buffer layer 310. The first buffer layer 310 includes a plurality of first grooves 410 and a plurality of second grooves 420, any one of the first grooves 410 and any one of the second grooves 420 penetrates the first buffer layer 310 and extends to a portion of the first substrate 210, and a portion of the encapsulation layer 500 is located in any one of the first grooves 410 and any one of the second grooves 420. The display panel 100 includes a display area a, a frame area B located at one side of the display area a, and a hole digging area C located at the periphery of the frame area B, wherein any one of the first grooves 410 and any one of the second grooves 420 are located in the frame area B. The package layer 500 in the first groove 410 includes a partition unit 610, and the partition unit 610 makes the package layer 500 be discontinuously disposed, as shown in fig. 1.
In this embodiment, the hole digging region C may be a hole forming region of the special-shaped screen, or may be a hole forming region of the camera under the screen, which is not limited herein.
In this embodiment, the step of forming the encapsulation layer 500 may be formed by partitioning, and the step S400 includes:
s410, forming a first encapsulation layer on the first portion of the encapsulation layer 500 in the frame region B.
And S420, carrying out first process treatment on the first packaging layer.
In this embodiment, the first process is to form a plurality of first openings 510 on the first package layer.
In this embodiment, the encapsulation layer 500 in the second opening 442 further includes a first opening 510, the first opening 510 is located in a bottom region of the second opening 442, and the first opening 510 penetrates through the encapsulation layer 500 in the second opening 442, as shown in fig. 5. The packaging can be carried out by regions: the first groove 410 and the surrounding area are encapsulated, the process of the first opening 510 is performed, and then the second groove 420 and the surrounding area are encapsulated, so that the integrity of the encapsulation layer 500 in the second groove 420 is not affected by the formation of the first opening 510 in the first groove 410, and a fracture gap of the encapsulation layer 500 is artificially formed, so that the fracture extension path of the encapsulation layer 500 can be better terminated in the frame area B, and the encapsulation effect of the display area a is ensured.
In this embodiment, the orthographic projection of the first opening 510 on the first substrate 210 is located within the orthographic projection of the first opening 441 on the first substrate 210, that is, the first opening 510 can be vertically formed through the first opening 441, which simplifies the manufacturing process.
In this embodiment, the first process is to form a plurality of second openings 520 on the first encapsulation layer.
In this embodiment, the package layer 500 further includes a plurality of second openings 520, the second openings 520 are located in the sidewall regions of the first recess 410 corresponding to the buffer layer, and the second openings 520 penetrate through the package layer 500, as shown in fig. 5. The second opening 520 is located on the sidewall of the first opening 441 corresponding to the buffer layer. The forming process of the second opening 520 is similar to the forming process of the first opening 510 by the sub-region package, the first groove 410 and the surrounding region are packaged first, the process of the second opening 520 is performed, and then the second groove 420 and the surrounding region are packaged, the formation of the second opening 520 in the first groove 410 does not affect the integrity of the package layer 500 in the second groove 420, the second opening 520 is close to the corner of the first buffer layer 310 corresponding to the first opening 441, and the fracture extension path of the package layer 500 is easily led to the second opening 520, so that the fracture extension path of the package layer 500 is blocked in the frame region B, and the package effect of the display region a is ensured.
In this embodiment, the second opening is disposed in a closed loop along a sidewall of the first opening. The ring of fracture gap can also better terminate the fracture path of the packaging layer 500 in the first groove 410, so that the fracture of the packaging layer 500 does not extend to the display area a, and the packaging effect of the display area a is ensured.
S430, forming a second encapsulation layer on the second portion of the encapsulation layer 500.
In this embodiment, the sum of the first encapsulation layer and the second encapsulation layer constitutes the encapsulation layer 500.
In this embodiment, step S400 includes:
s401, forming a first inorganic layer 501 on the first buffer layer 310 and the first substrate 210.
S402, forming a first organic layer 503 on the first inorganic layer 501 in the display area a.
S403, forming a second inorganic layer 502 on the first inorganic layer 501 and the first organic layer 503.
In this embodiment, the encapsulation layer 500 located in the hole digging region C and the frame region B includes a first inorganic layer 501 and a second inorganic layer 502, and the first inorganic layer 501 is located on the first buffer layer 310, and in particular, referring to fig. 6, the two inorganic layers can better block water and oxygen, and simultaneously facilitate one-time formation of a blocking gap.
In this embodiment, the first inorganic layer 501 and the second inorganic layer 502 extend to the display area a. The encapsulation layer 500 in the display area a further includes a first organic layer 503 between the first inorganic layer 501 and the second inorganic layer 502, please refer to fig. 6 specifically. The first organic layer 503 can better protect the display area a and enhance the flexibility of the display area a.
In this embodiment, the first buffer layer 310 further includes a plurality of third grooves 430, the third grooves 430 are located on a side of the display area a close to the frame area B, a portion of the first inorganic layer 501 is located in the third grooves 430, and the third grooves 430 are further filled with a portion of the first organic layer 503, as shown in fig. 6. The third groove 430 may extend an encapsulation path of the encapsulation layer 500, and the third groove 430 forms an anchoring effect with the first inorganic layer 501 and the first organic layer 503 to enhance a fixing force between the encapsulation layer 500 and the first buffer layer 310 in the display area a.
In this embodiment, before step S400, the method for manufacturing the display panel 100 further includes:
s500, an array substrate on the first buffer layer 310 in the display area a.
In this embodiment, in the display area a, the display panel 100 further includes an array substrate on the first buffer layer 310.
In this embodiment, before step S400, the method for manufacturing the display panel 100 further includes: and S600, forming a light-emitting device layer on the array substrate.
In this embodiment, the display panel 100 may be an OLED (Organic Light-Emitting semiconductor) display panel 100, in the display area a, the display panel 100 further includes a Light-Emitting device layer on the array substrate, and the encapsulation layer 500 is located on the Light-Emitting device layer.
In this embodiment, the partition unit 610, the first protrusion 630, the first recess 620, the first opening 510, the second opening 520, and the structures in the embodiments may be combined at will, and are not described herein again.
According to the invention, the packaging layer in the groove forms the partition gap, and when the packaging layer is broken in the process of being close to the hole digging region, the broken extension path of the packaging layer is blocked in the frame region, so that the packaging effect of the display region is ensured.
The invention discloses a display panel and a manufacturing method thereof. This display panel includes display area and the frame district that is close to the display area, and display panel includes: the bearing layer is provided with a groove, and the groove is positioned in the frame area; the packaging layer is positioned on the bearing layer, and the first part of the packaging layer is positioned in the groove; the packaging layer in the groove comprises a partition unit, and the partition unit enables the packaging layer to be discontinuously arranged. According to the invention, the packaging layer in the groove forms the partition gap, and when the packaging layer is broken in the process of being close to the hole digging region, the broken extension path of the packaging layer is blocked in the frame region, so that the packaging effect of the display region is ensured.
The above embodiments of the present invention are described in detail, and the principle and the implementation of the present invention are explained by applying specific embodiments, and the description of the above embodiments is only used to help understanding the technical scheme and the core idea of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (9)

1. A display panel comprising a display area and a bezel area adjacent to the display area, the display panel comprising:
the bearing layer is provided with a groove, and the groove is positioned in the frame area; and
an encapsulation layer located on the carrier layer, a first portion of the encapsulation layer being located within the recess;
wherein, in the recess the encapsulation layer is including cutting off the unit, cut off the unit messenger the encapsulation layer is discontinuous setting, the recess includes first recess and second recess, the size of first recess is greater than the second recess, the encapsulation layer the first part be located first recess and within the second recess, wherein, cut off the unit and be located in the first recess.
2. The display panel according to claim 1, wherein the carrier layer comprises a first substrate and a first buffer layer on the first substrate;
the first groove comprises a first opening penetrating through the first buffer layer and a second opening arranged on the first substrate, and the first opening is correspondingly connected with the second opening;
the second groove comprises a third opening penetrating through the first buffer layer and a fourth opening arranged on the first substrate, and the third opening and the fourth opening are correspondingly connected;
the aperture of the second opening is larger than that of the first opening, the aperture of the fourth opening is larger than that of the third opening, the depth and the inner diameter of the second opening are larger than those of the fourth opening, and the partition unit is located in the second opening.
3. The display panel according to claim 2, wherein the first substrate corresponding to the sidewall of the second opening comprises a first recess, the first recess is disposed in a closed loop along the sidewall of the second opening in parallel with the display panel, and the encapsulation layer in the second opening is disposed discontinuously around the first recess.
4. The display panel according to claim 1, wherein the encapsulation layer comprises a first inorganic layer, a first organic layer on the first inorganic layer, and a second inorganic layer on the first organic layer, the first organic layer being located in the display region, wherein the partition unit penetrates through the first inorganic layer and the second inorganic layer.
5. The display panel according to claim 4, wherein the first inorganic layer and the second inorganic layer in the second groove are continuously disposed.
6. The display panel according to claim 1, wherein the display panel further comprises a cutout region located on a side of the bezel region away from the display region, and a distribution density of the first grooves is gradually increased and/or a size of the first grooves is gradually increased in a direction from the display region to the cutout region.
7. The display panel of claim 1, wherein the encapsulation layer in the first groove further comprises a first opening in a bottom region of the first groove, the first opening extending through the encapsulation layer in the first groove.
8. The display panel according to claim 1, wherein a bottom of the groove is provided with a first protrusion.
9. A manufacturing method of a display panel is characterized in that the display panel comprises a display area, a frame area adjacent to the display area and a hole digging area located on the periphery of the frame area, and the manufacturing method of the display panel comprises the following steps:
forming a first buffer layer on a first substrate;
forming a plurality of second grooves on the first buffer layer in the frame region, wherein any second groove penetrates through the first buffer layer and extends to a part of the first substrate;
etching the second grooves close to the hole digging region to form a plurality of first grooves;
forming an encapsulation material layer on the first buffer layer and the first substrate, wherein the encapsulation material layer is broken in the first groove to form at least one partition unit so as to form an encapsulation layer comprising the partition unit;
wherein the depth and inner diameter of the first groove are greater than the depth and inner diameter of the second groove.
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