CN111430442A - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
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- CN111430442A CN111430442A CN202010346344.3A CN202010346344A CN111430442A CN 111430442 A CN111430442 A CN 111430442A CN 202010346344 A CN202010346344 A CN 202010346344A CN 111430442 A CN111430442 A CN 111430442A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention provides a display panel and a manufacturing method thereof, wherein the display panel is provided with a display area and a non-display area surrounding the display area and comprises a substrate and an encapsulation layer arranged on the substrate; the substrate is provided with a groove arranged in the non-display area, and the groove is used for blocking crack extension when the display panel is cut from one side of the groove far away from the display area; the packaging layer is arranged on one side of the groove close to the display area and comprises a first inorganic layer and a second inorganic layer, the first inorganic layer and the second inorganic layer have the same boundary, and the first inorganic layer and the second inorganic layer are formed by the same optical mask to shorten the distance between the boundary and the display area; the scheme can occupy less edge area of the display panel so as to improve the screen occupation ratio of the display panel.
Description
Technical Field
The application relates to the technical field of display, in particular to the technical field of display panel manufacturing, and particularly relates to a display panel and a manufacturing method thereof.
Background
An O L ED (Organic L light Emitting Diode) display device has the advantages of light weight, thin thickness, flexibility, and wide viewing angle range, but an O L ED material is easily and rapidly attenuated and aged when meeting water and oxygen, and therefore, an encapsulation layer needs to be disposed around an O L ED material for encapsulation.
However, in the conventional packaging technology, the packaging layer needs to occupy more edge areas of the O L ED display panel, which results in a larger non-display area of the O L ED display panel and reduces the screen occupation ratio of the O L ED display panel.
In summary, it is desirable to provide a display panel and a display device capable of improving the screen ratio.
Disclosure of Invention
The invention aims to provide a display panel and a manufacturing method thereof, wherein a first inorganic layer and a second inorganic layer in a packaging layer are prepared through the same optical mask, so that the first inorganic layer and the second inorganic layer have the same boundary, and the problem that the conventional packaging layer needs to occupy more edge areas of an O L ED display panel, so that the screen occupation ratio of the O L ED display panel is reduced is solved.
An embodiment of the present invention provides a display panel, where the display panel has a display area and a non-display area surrounding the display area, and the display panel includes:
a substrate having a groove thereon, the groove being provided in the non-display region, the groove being configured to block crack propagation when the display panel is cut from a side of the groove away from the display region;
the packaging layer is arranged on the substrate, the packaging layer is arranged on one side, close to the display area, of the groove, the packaging layer comprises a first inorganic layer and a second inorganic layer, the first inorganic layer and the second inorganic layer have the same boundary, and the first inorganic layer and the second inorganic layer are formed through the same optical mask to shorten the distance between the boundary and the display area.
In an embodiment, the display panel further includes a photoresist layer disposed on a side of the encapsulation layer close to the substrate, and the photoresist layer includes a first photoresist portion disposed opposite to the trench.
In one embodiment, a boundary of the first inorganic layer and the second inorganic layer is located on the first photoresist portion.
In an embodiment, the display panel further includes a retaining wall, the retaining wall is disposed between the encapsulating layer and the photoresist layer, the retaining wall is disposed on one side of the groove close to the display area, and a horizontal distance between the groove and the retaining wall is greater than 30 micrometers and less than 100 micrometers.
In an embodiment, the photoresist layer further includes a second photoresist portion, the second photoresist portion is disposed on a side of the trench close to the display area, and the second photoresist portion bears the retaining wall and the encapsulation layer.
In an embodiment, a gap is formed between the second photoresist portion and the first photoresist portion, and the encapsulation layer is disposed on the first photoresist portion, the gap, the retaining wall and the second photoresist portion.
In an embodiment, the encapsulation layer further includes an organic layer, the organic layer is disposed between the first inorganic layer and the second inorganic layer, and the organic layer is disposed on a side of the retaining wall close to the display area.
An embodiment of the present invention further provides a method for manufacturing a display panel, which is used for manufacturing the display panel as described in any one of the above paragraphs, where the display panel has a display area and a non-display area surrounding the display area, and the method includes:
providing a substrate, wherein the substrate is provided with a groove, the groove is arranged in the non-display area, and the groove is used for blocking crack extension when the display panel is cut from the side of the groove far away from the display area;
forming a packaging layer on the substrate, wherein the packaging layer is arranged on one side of the groove close to the display area and comprises a first inorganic layer and a second inorganic layer, the first inorganic layer and the second inorganic layer have the same boundary, and the first inorganic layer and the second inorganic layer are formed through the same photomask so as to shorten the distance between the boundary and the display area.
In an embodiment, before the step of forming the encapsulation layer on the substrate, the method further includes:
form the barricade on the substrate, the barricade is located the slot is close to one side in the display area, the slot with horizontal distance between the barricade is greater than 30 microns, and is less than 100 microns.
In an embodiment, before the step of forming the encapsulation layer on the substrate, the method further includes:
and forming a photoresist layer on the substrate, wherein the photoresist layer comprises a first photoresist part, and the first photoresist part is arranged opposite to the groove.
The invention provides a display panel and a manufacturing method thereof, wherein the display panel and a display device are provided with a display area and a non-display area surrounding the display area, the display panel and the display device comprise a substrate and an encapsulation layer arranged on the substrate, the substrate is provided with a groove arranged on the non-display area, and a first inorganic layer and a second inorganic layer in the encapsulation layer are prepared through the same optical mask plate, so that the first inorganic layer and the second inorganic layer have the same boundary, the distance between the boundary and the display area is shortened, the edge area of the display panel is less occupied, and the screen occupation ratio of the display panel is improved.
Drawings
The invention is further illustrated by the following figures. It should be noted that the drawings in the following description are only for illustrating some embodiments of the invention, and that other drawings may be derived from those drawings by a person skilled in the art without inventive effort.
Fig. 1 is a schematic cross-sectional view of a display panel structure according to an embodiment of the invention.
Fig. 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "near", "far", and the like indicate orientations or positional relationships based on those shown in the drawings, for example, "upper" simply means a surface above an object, specifically, right above, obliquely above, and upper surface, and "lower", "left", and "right" may refer to the above-mentioned understanding about "upper" as long as it is above the object level; "proximate" means that the side of the device or element that is closer to the target, by comparison, is oriented or positioned in a manner that is relatively closer to the target, and is intended merely to facilitate a description of the invention and to simplify the description, but does not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
It should be noted that the drawings only provide the structures and/or steps which are relatively closely related to the present invention, and some details which are not related to the present invention are omitted, so as to simplify the drawings and make the present invention clear, but not to show that the actual devices and/or methods are the same as the drawings and are not limitations of the actual devices and/or methods.
The present invention provides a display panel including, but not limited to, the following embodiments.
In one embodiment, as shown in fig. 1, the display panel 100 has a display area 01 and a non-display area 02 surrounding the display area 01, and the display panel 100 includes a substrate 101 and an encapsulation layer 102 disposed on the substrate 101.
Wherein the substrate 101 has a groove 03 thereon, the groove 03 is provided in the non-display region 02, and the groove 03 is used to block crack propagation when the display panel 100 is cut from a cutting line 04 at a side of the groove 03 away from the display region. Specifically, the number of the grooves 03 is not less than one, for example, the number of the grooves 03 can be 2, which can enhance the resistance to crack propagation.
Specifically, the encapsulation layer 102 is disposed on a side of the trench 03 close to the display area 01, the encapsulation layer 102 includes a first inorganic layer 1021 and a second inorganic layer 1022, the first inorganic layer 1021 and the second inorganic layer 1022 have a same boundary, and the first inorganic layer 1021 and the second inorganic layer 1022 are formed by a same optical mask to shorten a distance between the boundary and the display area 01.
It can be understood that, because the optical mask is a pattern master mask used in a common photoetching process of the micro-nano processing technology, a mask pattern structure is formed on a transparent substrate by an opaque shading film. The mask to be processed is composed of a glass/quartz substrate, a chromium layer and a photoresist layer, the graphic structure of the mask can be obtained by processing through a plate making process, and common processing equipment is direct-writing photoetching equipment, such as a laser direct-writing photoetching machine, an electron beam photoetching machine and the like. Therefore, the optical mask is high in melting point and stable in chemical property, and is not easy to deform at high temperature and high pressure, so that a film pattern with a fine pattern can be processed and formed by using the optical mask, and the error range of the optical mask can be smaller than 3 microns.
In an embodiment, as shown in fig. 1, the display panel 100 further includes a light blocking layer 103, the light blocking layer 103 is disposed on a side of the encapsulation layer 102 close to the substrate 101, and the light blocking layer 103 includes a first light blocking portion 1031, and the first light blocking portion 1031 is disposed opposite to the trench 03.
Further, the first photoresist 1031 may fill the trench 03. It is understood that the composition material of the light blocking layer 103 mainly includes resin and photosensitizer, and the first light blocking portion 1031 may protect the trench 03 and may further block cracks from extending to the encapsulation layer 102 when the display panel 100 is cut along the cutting line 04.
In one embodiment, as shown in fig. 1, a boundary between the first inorganic layer 1021 and the second inorganic layer 1022 is located on the first photoresist 1031. It can be understood that, since the first inorganic layer 1021 and the second inorganic layer 1022 are formed by the same reticle, and the error range of the reticle may be less than 3 μm, it may be ensured that the boundary of the first inorganic layer 1021 and the second inorganic layer 1022 is located on the first photoresist 1031. Further, since the first photoresist 1031 is located at a lower side of a boundary of the first inorganic layer 1021 and the second inorganic layer 1022, the first photoresist 1031 may prevent an etching material from corroding the substrate 101 when etching materials of the first inorganic layer 1021 and the second inorganic layer 1022 to form the first inorganic layer 1021 and the second inorganic layer 1022.
In an embodiment, as shown in fig. 1, the display panel 100 further includes a retaining wall 05, the retaining wall 05 is disposed on one side of the package layer 102 close to the substrate 101, the retaining wall 05 is disposed on one side of the trench 03 close to the display area 01, and a horizontal distance between the trench 03 and the retaining wall 05 is greater than 30 micrometers and less than 100 micrometers.
It can be understood that, since the first inorganic layer 1021 and the second inorganic layer 1022 are formed by the same optical mask, and the error range of the optical mask may be smaller than 3 micrometers, the horizontal distance between the trench 03 and the retaining wall 05 may be set to be larger than 30 micrometers and smaller than 100 micrometers, at this time, compared with the prior art, the horizontal distance between the trench 03 and the retaining wall 05 is reduced, when the position of the retaining wall 05 is fixed, the trench 03 is moved to the display area 01, so that the cutting line 04 is moved to the display area 01, and after the display panel 100 is cut along the cutting line 04, compared with the prior art, the area of the non-display area 02 of the display panel 100 is reduced, and the screen occupation ratio of the display panel 100 is improved.
In an embodiment, as shown in fig. 1, the photoresist layer 103 further includes a second photoresist portion 1032, the second photoresist portion 1032 is disposed on a side of the trench 03 close to the display area 01, and the second photoresist portion 1032 bears the retaining wall 05 and the encapsulation layer 102.
The first light blocking portion 1032 and the second light blocking portion 1033 may be formed of the same material, and further, the first light blocking portion 1032 and the second light blocking portion 1033 may be formed in the same layer.
A gap is formed between the second photo-resist portion 1033 and the first photo-resist portion 1032, and the package layer 103 is disposed on the first photo-resist portion 1032, the gap, the retaining wall 05 and the second photo-resist portion 1032.
In one embodiment, as shown in fig. 1, the encapsulation layer 102 further includes an organic layer 1023, the organic layer 1023 is disposed between the first inorganic layer 1021 and the second inorganic layer 1022, and the organic layer 1023 is disposed on a side of the retaining wall 05 close to the display area 01.
In one embodiment, as shown in fig. 1, the display panel 100 further includes a device layer 104, the device layer 104 is disposed in the display area 01, the device layer 104 is disposed between the photoresist layer 103 and the encapsulation layer 102, and the device layer 104 may include a thin film transistor device, an O L ED device.
It is understood that the encapsulation layer 102 may include the first inorganic layer 1021, the organic layer 1023, the second inorganic layer 1022, other organic layers, other inorganic layers, and so on in sequence from bottom to top, that is, the encapsulation layer 102 may include at least one organic layer and at least one inorganic layer alternately disposed up and down, and the first inorganic layer 1021 is in direct contact with the substrate 101 and the retaining wall 05, and so on, wherein the specific number of the organic layers and the inorganic layers may be determined according to the other film layers of the display panel 100.
Wherein the first inorganic layer 1021, the second inorganic layer 1022 and the other inorganic layers mainly serve to isolate water and oxygen and prevent water and oxygen from invading the device layer 104, and in particular, the composition materials of the first inorganic layer 1021, the second inorganic layer 1022 and the other inorganic layers may include at least one of SiNx, SiOx, SiOxNy and AlOx; the organic layer 1023 and the other organic layers mainly function to encapsulate the device layer 104 and release stress, and the organic layer 1023 and the other organic layers may include at least one of acrylate, hexamethyldisiloxane, and alceon. It is understood that the first inorganic layer 1021, the second inorganic layer 1022 and the other inorganic layers may be prepared by at least one process including a chemical vapor deposition method and an atomic layer deposition method, and the organic layer 1023 and the other organic layers may be prepared by at least one process including an ink jet printing method, a dispensing method and a chemical vapor deposition method.
It is understood that the retaining walls 05 are disposed around the display area 01 to prevent the organic layer 1023 in the display panel 100 from flowing out of the coverage area of the first inorganic layer 1021, so that the shape and number of the retaining walls 1012 can be set according to the specific situation of the first inorganic layer 1021, the second inorganic layer 1022, the other inorganic layers, the organic layer 1023 and the other organic layers, for example, the shape of the horizontal projection of the retaining wall 05 can be a circular ring or a frame, and the number of the retaining walls 05 can be one or two. It is understood that the material of the retaining wall 05 can include organic materials, such as parylene and other polymer materials, and the retaining wall 05 can be prepared by at least one method including exposure, development and imprinting.
In one embodiment, as shown in fig. 1, the substrate 101 may include a base 1011 and an inorganic layer 1012, the base 1011 may be a flexible substrate, for example, the base 1011 may be a polyimide film, and the groove 03 may be disposed on the inorganic layer 1012.
The present invention also provides a method for manufacturing a display panel having a display area and a non-display area surrounding the display area, including but not limited to the following embodiments.
In one embodiment, as shown in FIG. 2, the method comprises the steps of:
and S10, providing a substrate, wherein the substrate is provided with a groove which is arranged in the non-display area, and the groove is used for blocking crack extension when the display panel is cut from the side of the groove far away from the display area.
The substrate may include a base and an inorganic layer, the base may be a flexible substrate, for example, the base may be a polyimide film, and the inorganic layer may be provided with the groove. Specifically, the number of the grooves is not less than one, for example, the number of the grooves can be 2, and the resistance to crack extension can be enhanced.
S20, forming a packaging layer on the substrate, wherein the packaging layer is arranged on one side, close to the display area, of the groove and comprises a first inorganic layer and a second inorganic layer, the first inorganic layer and the second inorganic layer have the same boundary, and the first inorganic layer and the second inorganic layer are formed through the same photomask so as to shorten the distance between the boundary and the display area.
In an embodiment, the following steps may be further included before the step S20:
and forming a photoresist layer on the substrate, wherein the photoresist layer comprises a first photoresist part, and the first photoresist part is arranged opposite to the groove.
Further, the first photoresist portion may fill the trench. It is understood that the composition material of the photoresist layer mainly includes resin and photosensitizer, and the first photoresist portion can protect the trench and can further block cracks from extending to the encapsulation layer when the display panel is cut along the cutting line.
In an embodiment, the photoresist layer further includes a second photoresist portion, the second photoresist portion is disposed on a side of the trench close to the display area, the second photoresist portion bears the encapsulation layer, and a gap is formed between the second photoresist portion and the first photoresist portion.
The first photoresist portion and the second photoresist portion may be formed of the same material, and further, the first photoresist portion and the second photoresist portion may be formed in the same layer.
In one embodiment, a boundary of the first inorganic layer and the second inorganic layer is located on the first photoresist portion. It can be understood that, since the first inorganic layer and the second inorganic layer are formed by the same photomask, specifically, the error range of the photomask may be less than 3 μm, so that the boundary between the first inorganic layer and the second inorganic layer may be ensured to be located on the first photoresist portion. Further, since the first photoresist portion is located at a lower side of a boundary of the first inorganic layer and the second inorganic layer, the first photoresist portion may prevent an etching material from corroding the substrate when etching materials of the first inorganic layer and the second inorganic layer to form the first inorganic layer and the second inorganic layer.
In an embodiment, the following steps may be further included before the step S20:
form the barricade on the substrate, the barricade is located the slot is close to one side in the display area, the slot with horizontal distance between the barricade is greater than 30 microns, and is less than 100 microns.
It can be understood that, because the first inorganic layer and the second inorganic layer are formed by the same optical mask, and the error range of the optical mask can be smaller than 3 microns, the horizontal distance between the groove and the retaining wall can be set to be larger than 30 microns and smaller than 100 microns, at this time, compared with the prior art, the horizontal distance between the groove and the retaining wall is reduced equivalently, the position of the retaining wall is fixed equivalently, the groove is moved toward the display area, compared with the prior art, the area of the non-display area of the display panel is reduced, and the screen occupation ratio of the display panel is improved.
The packaging layer is arranged on the first light resistance part, the gap, the retaining wall and the second light resistance part.
In one embodiment, the step S20 may include the following steps:
s201, forming a first inorganic film on the photoresist layer and the substrate.
The boundary of the first inorganic film may extend to a side of the trench away from the display region, that is, the boundary of the first inorganic film may not be considered, which reduces difficulty in forming the first inorganic film.
S202, forming an organic layer on the first inorganic film, wherein the organic layer is arranged on one side, close to the display area, of the retaining wall.
Wherein, the composition material of the organic layer may include at least one of acrylate, hexamethyldisiloxane and Alucone.
S203, forming a second inorganic film on the organic layer and the first inorganic film.
Wherein a boundary of the second inorganic film may extend to a side of the groove away from the display region, for example, the boundary of the second inorganic film may coincide with a boundary of the first inorganic film. Wherein the composition material of the first inorganic film and the second inorganic film may include at least one of SiNx, SiOx, SiOxNy, and AlOx.
S204, patterning the first inorganic film and the second inorganic film by using the same photomask to form the first inorganic layer and the second inorganic layer.
It is to be understood that, since the first inorganic film and the second inorganic film need to be patterned, a layer of photoresist material should be formed over the first inorganic film and the second inorganic film or only over the second inorganic film in order to etch the first inorganic film and the second inorganic film at a later stage to form the first inorganic layer and the second inorganic layer.
The invention provides a display panel and a manufacturing method thereof, wherein the display panel and a display device are provided with a display area and a non-display area surrounding the display area, the display panel and the display device comprise a substrate and an encapsulation layer arranged on the substrate, the substrate is provided with a groove arranged in the non-display area, and a first inorganic layer and a second inorganic layer in the encapsulation layer are prepared through the same optical mask plate, so that the first inorganic layer and the second inorganic layer have the same boundary to occupy less edge area of the display panel, and the screen occupation ratio of the display panel is improved.
The display panel and the manufacturing method thereof provided by the embodiment of the invention are described in detail, a specific example is applied in the description to explain the principle and the implementation of the invention, and the description of the embodiment is only used to help understanding the technical scheme and the core idea of the invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A display panel having a display area and a non-display area surrounding the display area, the display panel comprising:
a substrate having a groove thereon, the groove being provided in the non-display region, the groove being configured to block crack propagation when the display panel is cut from a side of the groove away from the display region;
the packaging layer is arranged on the substrate, the packaging layer is arranged on one side, close to the display area, of the groove, the packaging layer comprises a first inorganic layer and a second inorganic layer, the first inorganic layer and the second inorganic layer have the same boundary, and the first inorganic layer and the second inorganic layer are formed through the same optical mask to shorten the distance between the boundary and the display area.
2. The display panel of claim 1, wherein the display panel further comprises a photoresist layer disposed on a side of the encapsulation layer adjacent to the substrate, the photoresist layer comprising a first photoresist portion disposed opposite to the trench.
3. The display panel according to claim 2, wherein a boundary of the first inorganic layer and the second inorganic layer is located on the first photoresist portion.
4. The display panel of claim 2, wherein the display panel further comprises a retaining wall, the retaining wall is disposed between the encapsulating layer and the photoresist layer, the retaining wall is disposed on a side of the trench close to the display area, and a horizontal distance between the trench and the retaining wall is greater than 30 micrometers and less than 100 micrometers.
5. The display panel of claim 4, wherein the photoresist layer further comprises a second photoresist portion, the second photoresist portion is disposed on a side of the trench close to the display area, and the second photoresist portion supports the dam and the encapsulation layer.
6. The display panel of claim 5, wherein a gap is formed between the second photoresist portion and the first photoresist portion, and the encapsulation layer is disposed on the first photoresist portion, the gap, the dam, and the second photoresist portion.
7. The display panel of claim 4, wherein the encapsulation layer further comprises an organic layer, the organic layer is disposed between the first inorganic layer and the second inorganic layer, and the organic layer is disposed on a side of the retaining wall adjacent to the display region.
8. A method of manufacturing a display panel having a display area and a non-display area surrounding the display area according to any one of claims 1 to 7, the method comprising:
providing a substrate, wherein the substrate is provided with a groove, the groove is arranged in the non-display area, and the groove is used for blocking crack extension when the display panel is cut from the side of the groove far away from the display area;
forming a packaging layer on the substrate, wherein the packaging layer is arranged on one side of the groove close to the display area and comprises a first inorganic layer and a second inorganic layer, the first inorganic layer and the second inorganic layer have the same boundary, and the first inorganic layer and the second inorganic layer are formed through the same photomask so as to shorten the distance between the boundary and the display area.
9. The method of claim 8, wherein the step of forming an encapsulation layer on the substrate is preceded by the step of:
form the barricade on the substrate, the barricade is located the slot is close to one side in the display area, the slot with horizontal distance between the barricade is greater than 30 microns, and is less than 100 microns.
10. The method of claim 8, wherein the step of forming an encapsulation layer on the substrate is preceded by the step of:
and forming a photoresist layer on the substrate, wherein the photoresist layer comprises a first photoresist part, and the first photoresist part is arranged opposite to the groove.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010346344.3A CN111430442B (en) | 2020-04-27 | 2020-04-27 | Display panel and manufacturing method thereof |
| PCT/CN2020/096359 WO2021217815A1 (en) | 2020-04-27 | 2020-06-16 | Display panel and preparation method therefor |
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| CN202010346344.3A CN111430442B (en) | 2020-04-27 | 2020-04-27 | Display panel and manufacturing method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112018045A (en) * | 2020-08-14 | 2020-12-01 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN114284453A (en) * | 2021-12-20 | 2022-04-05 | 深圳市华星光电半导体显示技术有限公司 | OLED display panel and display panel mother board |
| WO2024016704A1 (en) * | 2022-07-18 | 2024-01-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and mobile terminal |
| WO2024016702A1 (en) * | 2022-07-19 | 2024-01-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and display terminal |
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| CN109860411A (en) * | 2017-11-30 | 2019-06-07 | 京东方科技集团股份有限公司 | A kind of OLED display panel and preparation method thereof, OLED display |
| CN109659444A (en) * | 2018-11-29 | 2019-04-19 | 昆山国显光电有限公司 | Display panel and display device |
| CN109728196A (en) * | 2018-12-29 | 2019-05-07 | 厦门天马微电子有限公司 | Display panel, its production method and display device |
| CN110391350A (en) * | 2019-07-29 | 2019-10-29 | 云谷（固安）科技有限公司 | Display panel and display device |
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| US11961845B2 (en) | 2020-08-14 | 2024-04-16 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and display device |
| CN114284453A (en) * | 2021-12-20 | 2022-04-05 | 深圳市华星光电半导体显示技术有限公司 | OLED display panel and display panel mother board |
| WO2024016704A1 (en) * | 2022-07-18 | 2024-01-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and mobile terminal |
| WO2024016702A1 (en) * | 2022-07-19 | 2024-01-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and display terminal |
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| CN111430442B (en) | 2022-11-25 |
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