CN112782518A - Chip calibration equipment - Google Patents

Chip calibration equipment Download PDF

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Publication number
CN112782518A
CN112782518A CN202011607744.1A CN202011607744A CN112782518A CN 112782518 A CN112782518 A CN 112782518A CN 202011607744 A CN202011607744 A CN 202011607744A CN 112782518 A CN112782518 A CN 112782518A
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CN
China
Prior art keywords
module
chip
detection
controller
transportation
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Pending
Application number
CN202011607744.1A
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Chinese (zh)
Inventor
张宾
邱国财
陈新准
马鹏飞
何伟生
郑晓银
刘光亮
刘新雅
张运龙
奉贞丽
李宁子
傅凯强
吴瑾鹏
王明锦
傅王勇
李国宁
周海岽
吴凯萍
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Aosong Guangzhou Electronics Co ltd
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Aosong Guangzhou Electronics Co ltd
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Application filed by Aosong Guangzhou Electronics Co ltd filed Critical Aosong Guangzhou Electronics Co ltd
Priority to CN202011607744.1A priority Critical patent/CN112782518A/en
Publication of CN112782518A publication Critical patent/CN112782518A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862Chambers or ovens; Tanks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868Complete testing stations; systems; procedures; software aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2881Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to the technical field of automatic detection, and provides a chip calibration device which comprises a controller; the detection table is connected with the controller and is provided with a detection position; the transportation module is arranged at a certain distance from the detection table; the carrying module is connected with the controller, is connected with the transportation module in a sliding manner, can move along the transportation module, and is used for carrying chips; the test module is connected with the controller, is connected with the transportation module in a sliding way, and can move along the transportation module; and the carrying module moves along the transportation module, carries the chip to the detection position, and then moves the test module to the position above the detection position along the transportation module and detects the chip. The invention improves the detection efficiency of the chip by replacing the manual detection means with a machine, reduces the manual intervention, avoids the influence of manual operation on the chip detection and improves the accuracy of the detection result.

Description

Chip calibration equipment
Technical Field
The invention relates to the technical field of automatic detection, in particular to a chip calibration device.
Background
In the chip manufacturing industry, chips are produced and detected, and only qualified chips can be delivered or applied.
In the prior art, the detection of the chip mainly adopts a detection mode of combining manual operation and equipment, wherein the degree of manual operation participation is large. Because the manual detection operation steps are complicated, the detection efficiency is low, and the accuracy of the detection result is easily influenced by the personal operation skill and proficiency.
Disclosure of Invention
The invention aims to overcome the defects of low detection efficiency and low accuracy of detection results of the chip in the prior art, and provides the chip calibration equipment which is used for improving the detection efficiency and the accuracy of the detection results of the chip.
The technical scheme adopted by the invention is that the chip calibration equipment is improved and comprises a controller, a chip calibration module and a chip calibration module, wherein the controller is used for detecting the chip; the detection table is connected with the controller and is provided with a detection position; the transportation module is arranged above the detection table and has a certain distance with the detection table; the carrying module is connected with the controller, is connected with the transportation module in a sliding manner, can move along the transportation module, and is used for carrying chips; the test module is connected with the controller, is connected with the transportation module in a sliding way, and can move along the transportation module; and the carrying module moves along the transportation module, carries the chip to the detection position, and then moves the test module to the position above the detection position along the transportation module and detects the chip.
This scheme adopts the machine to replace the technological means of artifical detection, has improved the detection efficiency of chip. And the technical means of machine detection is adopted, so that the manual intervention is reduced, the influence of manual operation on chip detection is avoided, and the accuracy of the detection result is improved.
Preferably, the chip calibration equipment further comprises a feeding module and a receiving module which are both connected with the controller, and the feeding module and the receiving module are both arranged outside the detection platform and below the transportation module; the conveying module moves to the feeding module along the transportation module to obtain the chip, and conveys the chip to the detection position; when the chip is detected, the carrying module moves to the detection position along the transportation module to obtain the chip, and carries the chip to the material receiving module. This scheme combines the feed module and receipts material module and test module, transportation module, detection platform, forms an album feed and receives the material and detect integrative automatic check out system, and each module functions in coordination to improve the degree of automation of system, further reduced artificial intervention, improved detection efficiency.
Preferably, the feeding module and the receiving module are distributed on two sides of the detection table, and each of the feeding module and the receiving module comprises a first connecting rod which is provided with at least one pair of parallel and opposite arrangement; the second connecting rods are provided with a pair of parallel and opposite connecting rods, and the second connecting rods are arranged below the first connecting rods; the conveying belts are provided with at least one pair, and each conveying belt is arranged on the first connecting rod and the second connecting rod; a first clamping structure is arranged on one side of the conveying belt, which is far away from the first connecting rod and the second connecting rod, and the first clamping structures on the conveying belts which are different from the conveying belt are correspondingly arranged to place the chips; the driving mechanism is connected with the second connecting rod and drives the second connecting rod to operate so as to enable the conveying belt to operate; and a motor which is connected with the driving mechanism and the controller and enables the driving mechanism to operate. In this scheme, the feed module with receive the material module group and distribute in detect the platform both sides, form the automatic operation assembly line of feed, detection, receipts material promptly according to certain order, the operation of being convenient for. This scheme is under the control of controller, and the motor drives actuating mechanism operation, and actuating mechanism drive second connecting rod operation, second connecting rod drive transmission band operation to realize the feed and receive the material. The feeding module and the receiving module are opposite in operation direction, and the functions of the feeding module and the receiving module can be changed according to requirements, namely the original operation direction of the feeding module is opposite to that of the receiving module, so that the receiving function is realized; the original running direction of the material receiving module is opposite to that of the material receiving module, so that the feeding function is realized.
Preferably, the chip calibration equipment further comprises a chip loading clamp and a push plate, wherein the chip loading clamp is positioned on one side of the feeding module and is provided with a placing cavity communicated with two opposite side surfaces of the chip loading clamp, and two opposite side walls of the placing cavity are correspondingly provided with second clamping structures for placing the chip; the push plate pushes the chip in the chip loading clamp to move the chip into the feeding module. This scheme is passed through the combination of dress piece holder and push pedal is with a plurality of chips transport simultaneously extremely in the feed module to efficiency has been improved.
Preferably, the chip calibration device further comprises a correction table, wherein the correction table is positioned on one side of the detection table and below the transportation module; the correction table is provided with a correction groove, and the correction groove is matched with the outline of the chip; the carrying module can move along the transportation module to carry the chip to the correction groove for correction; and after the correction is finished, the carrying module acquires the chip and carries the chip to the detection position. According to the scheme, the position of the chip is corrected through the correction table, so that subsequent detection is facilitated, interference factors are reduced, and the accuracy of a detection result is improved.
Preferably, the detection table is provided with a sealed cavity; the detection table is further provided with a temperature sensor and a dew point sensor which are connected with the controller, and the detection end of the temperature sensor and the detection end of the dew point sensor are both positioned in the sealing cavity. In this scheme, the seal chamber forms a standard environment, temperature sensor and dew point transducer detect the standard environment, obtain standard temperature value and standard humidity value to as the reference value of chip that awaits measuring, be used for judging whether qualified chip awaits measuring. The standard environment in the sealed cavity can be changed and adjusted according to requirements, and the sealed cavity adopts a smaller volume design, so that the control efficiency of the temperature and humidity is improved, and the stability of the temperature and humidity is ensured.
Preferably, the test module is provided with two detection joints; a plurality of detection ports are distributed on both sides of the detection position, and two detection connectors are respectively inserted into the detection ports on both sides of the detection position for detection; and after the chip is arranged on the detection position, the test module moves along the transportation module, and the detection ports are sequentially detected through the detection joints.
Preferably, the chip calibration device further comprises a pressure plate, a pressure plate mounting rack, a lifting mechanism and a moving mechanism which are connected with the controller; the pressing plate is movably connected with the pressing plate mounting frame through the lifting mechanism, and the moving mechanism is arranged at the bottom of the pressing plate mounting frame; when the chip is arranged in the detection position, the pressing plate mounting frame moves to a preset position through the moving mechanism, and the pressing plate is arranged above the chip through the lifting mechanism, and the chip is detected by the testing module. In this scheme, through the clamp plate crimping is in the chip top of detecting the position, can avoid being the testing process, detects the module and presses the chip, causes the damage to the chip.
Preferably, the pressing plate is provided with a first hollow area and a second hollow area, the first hollow area covers the chip, and the second hollow area covers the detection port. This scheme sets up first fretwork district and avoids causing the damage to the chip, and the second fretwork district is avoided causing the influence to the testing process. By combining the above, the scheme can ensure normal detection of detection while protecting the chip.
Preferably, the chip calibration device further comprises an identification module, wherein the identification module is connected with the controller, is connected with the transportation module in a sliding manner, and can move along the transportation module; the chip is provided with an identification code, and after the chip is arranged on the detection position, the identification module scans the chip. According to the scheme, the chip is scanned through the identification module so as to determine the identity of the chip.
Compared with the prior art, the invention has the beneficial effects that: the invention adopts the technical means of a controller, a detection table, a transportation module, a carrying module, a test module, a feeding module, a receiving module, a correction table and the like, optimizes all components, and replaces the manual detection means with a machine, thereby improving the detection efficiency of the chip, reducing the manual intervention, avoiding the influence of the manual operation on the chip detection and improving the accuracy of the detection result.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a perspective view of the present invention.
Fig. 3 is a side view of the present invention.
Reference numerals: the detection device comprises a detection table 100, a detection position 101, a temperature sensor 102, a dew point sensor 103, a detection port 104, a transportation module 200, a carrying module 300, a test module 400, a feeding module 500, a first connecting rod 501, a second connecting rod 502, a conveying belt 503, a first clamping structure 5031, a motor 504, a driving wheel 505, a first driving wheel 506, a second driving wheel 507, a driven wheel 508, a baffle 509, a receiving module 600, a correction table 700, a correction groove 701, a pressing plate 801, a first hollowed-out area 8011, a second hollowed-out area 8012, a pressing plate mounting rack 802, a lifting mechanism 803, a moving mechanism 804, an identification module 900, a chip mounting clamp 110, a placing cavity 111, a second clamping structure 1111, a pressing plate 120, a base 130, a support column 140 and a sliding mechanism 150.
Detailed Description
The drawings are only for purposes of illustration and are not to be construed as limiting the invention. For a better understanding of the following embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example 1
As shown in fig. 1 and fig. 2, the present embodiment provides a chip calibration apparatus for detecting a chip, which includes a controller, a detection platform 100, a transportation module 200, a carrying module 300, a testing module 400, a feeding module 500, a receiving module 600, a loading clamp 110, a pushing plate 120, a calibration platform 700, a pressing module, and an identification module 900.
To facilitate understanding of the embodiments of the present application, an operation process of the chip calibration apparatus described in the embodiments of the present application is first described. The chip calibration equipment is used for detecting whether the chip is qualified or not. First, before the chip is inspected, the chip is placed in the loading clamp 110, and the chip in the loading clamp 110 is transferred into the feeding module 500 by the pushing plate 120. Next, under the control of the controller, the carrying module 300 moves along the transporting module 200 and obtains the chip, and places the chip on the calibration stage 700 for position calibration. Again, the carrying module 300 moves along the transporting module 200 and acquires the corrected chip and places the chip on the inspection position 101 on the inspection station 100. Again, the identification module 900 scans the chip to determine the identity information of the chip. Thirdly, the pressing module moves to a preset position and is pressed above the chip on the detection position 101; then, the testing module 400 moves along the transporting module 300 to a position above the detecting position 101, and detects the chip on the detecting position 101. And thirdly, after the detection is finished, the pressing module moves away from the chip. Thirdly, the carrying module 300 moves along the transporting module 200 and obtains the detected chip, and places the chip in the receiving module 600.
Wherein, the detecting table 100 is connected with the controller and is arranged on the base 130. The upper surface of the detection table 100 is provided with a detection position 101, and the size of the detection position 101 is matched with that of the chip. A sealed cavity is arranged in the detection table 100, and a standard environment is formed in the sealed cavity. The detection table 100 is further provided with a temperature sensor 102 and a dew point sensor 103 connected with a uniform controller, but not limited to the two sensors, and the types of the sensors can be set according to requirements. The detection end of the temperature sensor 102 and the detection end of the dew point sensor 103 are inserted into through holes in the side wall of the sealed cavity, communicated to the sealed cavity and form a sealed environment with the sealed cavity. The temperature sensor 102 and the dew point sensor 103 detect a standard environment in the sealed cavity to obtain a standard temperature value and a standard humidity value respectively, wherein the standard temperature value and the standard humidity value are reference values corresponding to a chip to be detected. The standard environment in the sealed cavity can be adjusted according to requirements. A plurality of detection ports 104 are distributed on both sides of a detection position 101 on the detection table 100, and the detection ports 104 on both sides of the detection position 101 are respectively a signal input port and a signal output port.
Wherein, the transportation module 200 is installed on the base 130 through the supporting column 140. The transport module 200 is a transverse transport screw module. The transportation module 200 is located above the inspection station 100 and has a certain distance from the inspection station 100. The transportation module 200 is further provided with a sliding mechanism 150, and the sliding mechanism 150 is connected with the controller and moves on the transportation module 200 under the control of the controller.
The carrying module 300 is connected to the controller and connected to the transporting module 200 through the sliding mechanism 150. The carrying module 300 includes a cylinder and a vacuum chuck. Through cylinder control, transport module 300 can reciprocate to adsorb the chip through vacuum chuck, with the transport this chip.
In another embodiment, the handling module 300 can directly grasp the chip by means of a robot.
The test module 400 is connected to the controller and connected to the transport module 200 through the sliding mechanism 150. The test module 400 is provided with a cylinder, and the test module 400 can move up and down by cylinder control. The test module 400 has two test connectors, i.e., a signal input connector and a signal output connector. The signal input connector and the signal output connector are simultaneously inserted into the corresponding group of signal input ports and signal output ports to detect the chip. When the detection of one group of signal input ports and signal output ports is completed, the test module 400 ascends and moves a certain distance along the transport module 200, and then the test module 400 descends, so that the detection connector detects the next group of signal input ports and signal output ports.
The identification module 900 is connected to the controller and connected to the transportation module 200 through the sliding mechanism 150. The recognition module 900 is provided with a cylinder, and the recognition module 900 can move up and down by cylinder control. The chip is provided with an identification code which can be a two-dimensional code or a bar code. The identification module 900 scans the chip on the detection site 101 by infrared rays to determine the identity of the chip.
In another embodiment, the carrying module 300, the testing module 400, and the identification module 900 respectively include a sliding mechanism, and are slidably connected to the transportation module 200 through the sliding mechanism.
In another embodiment, the transportation module 200 is provided with a plurality of modules, and is slidably connected to the carrying module 300, the testing module 400, the identification module 900, or any combination thereof.
Wherein, the feeding module 500 and the receiving module 600 are both disposed outside the detecting table 100, and can be disposed on the same side or different sides of the detecting table 100, preferably, the feeding module 500 and the receiving module 600 are disposed on both sides of the detecting table 100. The feeding module 500 and the receiving module 600 each include a first link 501, a second link 502, a conveyor 503, a driving mechanism, a motor 504, and a baffle 509. Specifically, the first link 501 is provided with at least one pair and is arranged in parallel and opposite. When the first link 501 is provided with a plurality of pairs, they are arranged in parallel in order from top to bottom. Specifically, at least one pair of parallel and opposite second links 502 are provided, and the second links 502 are disposed below the first links 501. Specifically, a pair of the conveyor belts 503 is provided, and each conveyor belt 503 is mounted on the first link 501 and the second link 502. A first blocking structure 5031 is arranged on one side of the transmission belt 503, which is far away from the first connecting rod 501 and the second connecting rod 502, and the first blocking structures 5031 on the transmission belt 503 of the same pair of transmission belts 503 are correspondingly arranged to place the chip. Specifically, a driving mechanism is connected to the second link 502 and drives the second link 502 to operate, so as to operate the conveyor belt 503. As shown in fig. 3, the driving mechanism may include a plurality of gears, respectively, a driving pulley 505, a first driving pulley 506, a second driving pulley 507, and a driven pulley 508. The driving wheel 505, the first driving wheel 506, the second driving wheel 507 and the driven wheel 508 are meshed in sequence. The second link 502 is connected to the driving pulley 505 and the driven pulley 508, respectively. Specifically, the motor 504 connects a driving wheel 505 of the driving mechanism and the controller, and operates the driving wheel 505. Specifically, the baffle 509 is disposed on the same side of and between the same pair of belts.
The sheet loading clamp 110 is located at one side of the feeding module 500, and the sheet loading clamp 110 is provided with a placing cavity 111 communicating two opposite side surfaces thereof. Two opposite side walls of the placing cavity 111 are correspondingly provided with second clamping structures 1111 for placing the chip. The push plate 120 is sized to match the placement cavity 111. The chip placed in the loading clamp 110 is pushed by the pushing plate 120 to move the chip into the feeding module 500.
The calibration table 700 is located at one side of the detection table 100 close to the feeding module and below the transportation module 200. The calibration table 700 has a calibration recess 701 thereon, and the calibration recess 701 matches the contour of the chip. The correction process of the chip is as follows: the carrying module 300 sucks the chip from the feeding module through the vacuum chuck and moves along the transporting module 200 onto the aligning table 700, and places the chip in the aligning groove 701 on the aligning table 700. After the calibration is completed, the vacuum chuck again sucks the calibrated chip and conveys the chip to the inspection station 100.
As shown in fig. 3, the pressing module includes a pressing plate 801, a pressing plate mounting rack 802, and a lifting mechanism 803 and a moving mechanism 804 both connected to the controller. The lifting mechanism 803 and the moving mechanism 804 each include a cylinder. The pressing plate 801801 is provided with a first hollow-out area 8011 and a second hollow-out area 8012, the first hollow-out area 8011 is provided with one, the second hollow-out area 8012 is provided with two, after the pressing plate 801 is pressed on the detection platform 100, the first hollow-out area 8011 covers the chip, and the second hollow-out area 8012 covers the detection port 104. The pressing plate 801 is movably connected with the pressing plate mounting rack 802 through a lifting mechanism 803, and the moving mechanism 804 is arranged at the bottom of the pressing plate mounting rack 802. The operation process of the pressing module comprises the following steps: when the chip is placed at the detection position 101, the pressing plate mounting rack 802 is moved to a preset position through the moving mechanism 804, and the pressing plate 801 is placed above the chip through the lifting mechanism 803, and then the chip is detected by the test module 400.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention claims should be included in the protection scope of the present invention claims.

Claims (10)

1. A chip calibration device for detecting a chip comprises
A controller;
a detection table (100) which is connected with the controller and is provided with a detection position (101);
the transportation module (200) is arranged above the detection table (100) and has a certain distance with the detection table (100);
the carrying module (300) is connected with the controller, is connected with the transportation module (200) in a sliding way, can move along the transportation module (200), and is used for carrying chips;
a test module (400) connected to the controller and slidably connected to the transport module (200) and movable along the transport module (200);
the carrying module (300) moves along the transportation module, and after the chip is carried to the detection position, the test module moves to the position above the detection position (101) along the transportation module, and the chip is detected.
2. The chip calibration device according to claim 1, further comprising a feeding module (500) and a receiving module (600) both connected to the controller, wherein the feeding module (500) and the receiving module (600) are both disposed outside the inspection table (100) and below the transportation module (200);
the carrying module (300) moves to the feeding module (500) along the transportation module (200) to obtain the chip, and carries the chip to the detection position (101);
when the chip is detected, the carrying module (300) moves to the detection position (101) along the transportation module (200) to obtain the chip, and carries the chip to the receiving module (600).
3. The chip calibration apparatus according to claim 2, wherein the feeding module (500) and the receiving module (600) are distributed on two sides of the inspection table (100), and the feeding module (500) and the receiving module (600) each comprise
A first link (501) provided with at least one pair and arranged in parallel and opposite to each other;
a pair of second connecting rods (502) which are arranged in parallel and opposite to each other, wherein the second connecting rods (502) are arranged below the first connecting rods (501);
the conveying belts (503) are provided with at least one pair, and each conveying belt (503) is installed on the first connecting rod (501) and the second connecting rod (502); a first clamping structure (5011) is arranged on one side, away from the first connecting rod (501) and the second connecting rod (502), of the conveying belt (503), and the first clamping structures (5031) on the conveying belts (503) different from the conveying belt (503) are correspondingly arranged to place the chips;
a driving mechanism which is connected with the second connecting rod (502) and drives the second connecting rod (502) to operate so as to drive the conveying belt (503) to operate;
a motor (504) that connects the drive mechanism and the controller and operates the drive mechanism.
4. The chip calibration device according to claim 3, further comprising a loading clamp (110) and a pushing plate (120), wherein the loading clamp (110) is located at one side of the feeding module (500), the loading clamp (110) is provided with a placing cavity (111) communicated with two opposite side surfaces of the loading clamp, and two opposite side walls of the placing cavity (111) are correspondingly provided with second clamping structures (1111) for placing the chip;
the push plate (120) pushes the chip in the loading clamp (110) to move the chip into the feeding module (500).
5. The chip calibration apparatus according to claim 1, further comprising a calibration table (700), wherein the calibration table (700) is located at one side of the inspection table (100) and below the transportation module (200);
the correction table (700) is provided with a correction groove (701), and the correction groove (701) is matched with the outline of the chip;
the carrying module (300) can move along the transportation module (200) to carry the chip to the correction groove (701) for correction; after the calibration is completed, the carrying module (300) acquires the chip and carries the chip to the detection position (101).
6. The chip calibration apparatus according to claim 1, wherein the inspection table (100) is provided with a sealed cavity; the detection table (100) is further provided with a temperature sensor (102) and a dew point sensor (103) which are both connected with the controller, and the detection end of the temperature sensor (102) and the detection end of the dew point sensor (103) are both positioned in the sealing cavity.
7. The chip calibration apparatus according to claim 1, wherein the test module (400) is provided with two detection connectors; a plurality of detection ports (104) are distributed on both sides of the detection position (101), and two detection connectors are respectively inserted into the detection ports (104) on both sides of the detection position (101) for detection;
after the chip is arranged on the detection position (101), the test module (400) moves along the transportation module (200), and the detection port (104) is sequentially detected through the detection joint.
8. The chip calibration apparatus according to claim 7, further comprising a pressing plate (801), a pressing plate mounting rack (802), and a lifting mechanism (803) and a moving mechanism (804) both connected to the controller;
the pressing plate (801) is movably connected with the pressing plate mounting rack (802) through the lifting mechanism (803), and the moving mechanism (804) is arranged at the bottom of the pressing plate mounting rack (802);
when the chip is arranged at the detection position (101), the pressing plate mounting frame (802) is moved to a preset position through the moving mechanism (804), and the pressing plate (801) is arranged above the chip through the lifting mechanism (803), and then the chip is detected by the test module (400).
9. The chip calibration device according to claim 8, wherein the pressing plate (801) is provided with a first hollowed-out area (8011) and a second hollowed-out area (8012), the first hollowed-out area (8011) covers the chip, and the second hollowed-out area (8012) covers the detection port (104).
10. The chip calibration apparatus according to claim 1, further comprising an identification module (900), wherein the identification module (900) is connected to the controller, slidably connected to the transportation module (200), and movable along the transportation module (200); the chip is provided with an identity identification code;
and when the chip is placed on the detection position (101), the identification module (900) scans the chip.
CN202011607744.1A 2020-12-30 2020-12-30 Chip calibration equipment Pending CN112782518A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011607744.1A CN112782518A (en) 2020-12-30 2020-12-30 Chip calibration equipment

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Application Number Priority Date Filing Date Title
CN202011607744.1A CN112782518A (en) 2020-12-30 2020-12-30 Chip calibration equipment

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CN112782518A true CN112782518A (en) 2021-05-11

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CN202011607744.1A Pending CN112782518A (en) 2020-12-30 2020-12-30 Chip calibration equipment

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