CN112781345A - Drying device for silicon wafer - Google Patents
Drying device for silicon wafer Download PDFInfo
- Publication number
- CN112781345A CN112781345A CN202110161800.1A CN202110161800A CN112781345A CN 112781345 A CN112781345 A CN 112781345A CN 202110161800 A CN202110161800 A CN 202110161800A CN 112781345 A CN112781345 A CN 112781345A
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- Prior art keywords
- silicon wafer
- frame
- transverse plate
- enabling
- silicon wafers
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 162
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 162
- 239000010703 silicon Substances 0.000 title claims abstract description 162
- 238000001035 drying Methods 0.000 title claims abstract description 38
- 235000012431 wafers Nutrition 0.000 claims abstract description 161
- 230000002146 bilateral effect Effects 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
- F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
- F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
- F26B15/14—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined the objects or batches of materials being carried by trays or racks or receptacles, which may be connected to endless chains or belts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B23/00—Heating arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/02—Applications of driving mechanisms, not covered by another subclass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
- F26B25/185—Spacers; Elements for supporting the goods to be dried, i.e. positioned in-between the goods to build a ventilated stack
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a drying device for silicon wafers, which comprises: the silicon wafer carrying device comprises a bottom frame, a lower transverse plate, a silicon wafer loading frame, an upper transverse plate, a bearing frame and a carrying mechanism, wherein the lower transverse plate is arranged above the bottom frame and symmetrically arranged front and back; the silicon wafer loading frame is arranged on the bottom frame, a silicon wafer is loaded in the silicon wafer loading frame, a lead screw penetrates through the middle of the silicon wafer loading frame, and the lead screw is used for driving the silicon wafer loading frame to move; the upper transverse plate is arranged above the lower transverse plate and is symmetrically arranged front and back, and a section of interval is reserved between the upper transverse plate and the lower transverse plate; the bearing frame is arranged above the middle of the bearing frame, the front side and the rear side of the bearing frame are connected with supporting plates, and the bottom of each supporting plate is connected with an upper transverse plate; the carrying mechanism is positioned between the bearing frame and is provided with clamping plates which are arranged in bilateral symmetry and used for clamping the silicon wafers in the silicon wafer loading frame. The invention has the advantages of saving space and increasing the number of dried silicon wafers.
Description
Technical Field
The invention relates to the field of solar silicon wafer processing, in particular to a drying device for a silicon wafer.
Background
As is well known, in the whole production process flow of the solar cell, three processes of diffusion, film coating and sintering are the most important, and the solar cell adopts a co-firing process which only needs one-time sintering at present; and ohmic contacts of the upper and lower electrodes are formed at the same time. In the prior art, the sintering process of the solar cell mainly comprises three steps of drying, preheating, sintering and cooling; the equipment for sintering the solar cell slice generally adopts a sintering furnace, and the sintering furnace comprises a drying area, a sintering area and a cooling area.
Since the 21 st century, global energy consumption has been rapidly increased, traditional fossil energy has been increasingly exhausted, and energy problems and environmental problems have gradually become two major issues of global attention. In the pressure of sustainable development, the solar photovoltaic industry is put into the key point of renewable energy development and utilization in each major country. At present, a silicon wafer is cleaned in a silicon wafer production process, water on the surface of the silicon wafer is removed after the silicon wafer is cleaned, so that a clean and dry silicon wafer is obtained, and a silicon wafer dryer is the most common device for removing the water on the surface of the silicon wafer after the silicon wafer is cleaned. At present, all silicon wafer dryers are operated manually, intelligent and automatic equipment is also put into operation, but silicon wafers usually occupy a lot of spaces when being dried, so that the number of the silicon wafers dried side by side is small, and the task of drying more silicon wafers quickly and efficiently is difficult to satisfy.
Disclosure of Invention
The invention aims to provide a drying device for silicon wafers, which aims to solve the problems that the existing silicon wafers occupy more space during drying, so that the drying quantity is small, and the silicon wafers cannot be dried effectively and quickly.
In order to achieve the purpose, the embodiment of the invention adopts the following scheme:
a drying device for silicon wafers is characterized by comprising:
a chassis;
the lower transverse plates are arranged above the bottom frame and are symmetrically arranged in the front-back direction, a bearing frame is arranged on the lower transverse plates, and the front side and the back side of the bearing frame penetrate through the lower transverse plates and the bottom frame;
the silicon wafer loading frame is arranged on the bottom frame, a silicon wafer is loaded in the silicon wafer loading frame, the middle of the silicon wafer loading frame penetrates through the lead screw, and the lead screw is used for driving the silicon wafer loading frame to move;
the upper transverse plate is arranged above the lower transverse plate and symmetrically arranged front and back, and a section of interval is reserved between the upper transverse plate and the lower transverse plate;
the bearing frame is arranged above the middle of the bearing frame, the front side and the rear side of the bearing frame are connected with supporting plates, and the bottom of each supporting plate is connected with the upper transverse plate;
a carrying mechanism located between the bearing frame and having
The clamping plates are arranged in a bilateral symmetry mode and used for clamping the silicon wafers in the silicon wafer loading frame.
Preferably, the front side and the rear side of the bottom frame are provided with four lifting cylinders which are symmetrically arranged and connected with the lower transverse plate and used for driving the lower transverse plate, the upper transverse plate, the bearing frame and the carrying mechanism to move.
Preferably, servo motor is installed to the bottom of diaphragm down, servo motor is provided with six for the symmetry, servo motor's transmission end passes go up the diaphragm for drive goes up diaphragm and bearing frame and removes.
Preferably, the heating pipes are symmetrically arranged on the inner side of the lower transverse plate and used for drying the silicon wafers loaded in the silicon wafer loading frame.
Preferably, the left side of bearing frame is equipped with first driving motor, first driving motor's bottom is connected with first belt pulley, the right side of bearing frame is equipped with second driving motor, second driving motor's bottom is connected with the second belt pulley, first belt pulley with the second belt pulley is the interval setting, first belt pulley is located the top of second belt pulley.
Preferably, a turntable is arranged in the bottom of the bearing frame, the top of the turntable is connected with the first belt pulley and the second belt pulley, a track is arranged in the middle of the bottom of the bearing frame, and the track is also arranged at the bottom of the turntable.
Preferably, the carrying mechanism is also provided with
A chassis;
the rotating ring is attached above the chassis, and the middle of the clamping plate is movably connected in the rotating ring;
the pressing block is arranged above the middle of the clamping plate, the front side and the rear side of the pressing block are attached to two sides of the rotary ring, small springs are arranged at the bottoms of the front side and the rear side of the pressing block, rollers are arranged on the left side and the right side of the pressing block, the upper portion of the clamping plate is obliquely arranged, the rollers are attached to the inner side surface of the upper portion of the clamping plate, and a clamping pad is arranged on the inner side surface of the lower portion of the clamping.
Preferably, the top of bearing frame is equipped with the slide, the chassis laminating is in on the slide, bear the frame the left and right sides take-up reel, be equipped with the small motor before the take-up reel, be equipped with the stay cord in the take-up reel, the stay cord is connected the chassis.
Preferably, the front and the rear of the chassis are provided with connecting plates, the connecting plates are arranged in pairs, each pair of connecting plates is connected with two chassis, the connecting plates are connected with tightening springs, and the front ends and the rear ends of the tightening springs are connected with each pair of connecting plates. The top of briquetting is equipped with the guide pulley, open the middle of guide pulley has the guide slot, the guide pulley laminating is in orbital bottom.
A cleaning method of a drying device for silicon wafers comprises the following steps:
carrying silicon wafers, putting the silicon wafers in batches in a silicon wafer loading frame, then conveying the silicon wafer loading frame to an underframe through screw transmission, and then starting a heating pipe to heat the silicon wafers;
clamping a silicon wafer, starting a lifting cylinder, driving a lower transverse plate to move downwards by the lifting cylinder, enabling a bearing frame to move downwards, enabling a clamping plate in a carrying mechanism to move downwards, enabling the clamping plate to extend into two sides of the silicon wafer, then starting a servo motor, driving an upper transverse plate to move downwards by the servo motor, enabling a bearing frame to move downwards, enabling the bottom of the bearing frame to be attached to a guide wheel, enabling a pressing block to move downwards to push two sides of the upper portion of the clamping plate outwards, enabling the lower portion of the clamping plate to rotate inwards to clamp the silicon wafer, and taking the silicon wafer clamp out of a silicon wafer;
turning over the silicon wafer, starting a small motor, driving a take-up reel to rotate and take up wires, pulling a pull rope to pull a chassis to two sides, separating the silicon wafers side by side, enabling the central distance between the silicon wafers to be larger than the radius size of the silicon wafers, starting a second driving motor, enabling a rotary table below a second belt pulley to rotate in the clockwise direction, enabling a guide wheel and a pressing block attached to the rotary table to rotate, enabling a rotary ring and a clamping plate to rotate together, enabling the silicon wafers to rotate 90 degrees, starting a first driving motor, enabling the rotary table below a first belt pulley to rotate in the counterclockwise direction, enabling the rest silicon wafers to start to rotate, enabling the adjacent silicon wafers to start to rotate in a crossed manner;
and (4) carrying out the silicon wafer, moving the silicon wafer loading frame fed with the silicon wafer out from the left side by utilizing screw transmission, moving the right side into a new silicon wafer loading frame, then putting the dried silicon wafer into the new silicon wafer loading frame, and carrying out from the right side to finish drying.
The invention has the beneficial effects that:
the invention relates to a drying device for silicon wafers, which is characterized in that silicon wafers are clamped by a clamping plate, a pull rope is wound by a winding disc to expand and move a chassis, the silicon wafers are clamped by the clamping plate in the chassis and are scattered side by side, and adjacent silicon wafers are rotated in a crossed manner to start drying under the drive of a first driving motor and a second driving motor, so that the space is saved compared with the existing method of rotating the silicon wafers in the same direction side by side; the invention has the advantages of saving space and increasing the number of dried silicon wafers.
Drawings
Fig. 1 is a front view of the present invention.
Fig. 2 is a perspective view of the present invention.
Fig. 3 is a schematic view of the carrying mechanism of the present invention.
Fig. 4 is a schematic view of the position of the carrying mechanism in the present invention.
Fig. 5 is a schematic view of a loading ledge according to the invention.
Fig. 6 is a schematic view of a carriage in the present invention.
FIG. 7 is a schematic view showing the carrying mechanism of the present invention in an expanded state.
Fig. 8 is a schematic view of the rotation of the carrying mechanism in the present invention.
1. Bottom frame 2, lower transverse plate 3 and upper transverse plate
4. Bearing frame 5, carrying mechanism 6 and silicon wafer loading frame
7. Servo motor 8, lifting cylinder 9 and lead screw
201. Bearing frame 202, heating pipe 203 and slide way
301. Support plate 401, first drive motor 402, first pulley
403. A second driving motor 404, a second belt pulley 405 and a small motor
406. Take-up reel 407, turntable 408, track
409. Pull rope 501, chassis 502 and rotary ring
503. Clamping plate 504, pressing block 505 and guide wheel
506. Small spring 507, clamping pad 508 and connecting plate
509. Tightening spring
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of some embodiments of the invention and are not limiting of the invention, and that all other embodiments obtained by those of ordinary skill in the art without the exercise of inventive faculty are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "a," "an," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
For the purposes of simplicity and explanation, the principles of the embodiments are described by referring mainly to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. But it is obvious. To one of ordinary skill in the art, the embodiments may be practiced without limitation to these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
The first embodiment is as follows:
as shown in fig. 1-2, the present invention provides a drying apparatus for silicon wafers, comprising: the silicon wafer carrying device comprises a bottom frame 1, a lower transverse plate 2, a silicon wafer loading frame 6, an upper transverse plate 3, a bearing frame 4 and a carrying mechanism 5, wherein the lower transverse plate 2 is arranged above the bottom frame 1 and symmetrically arranged front and back, a bearing frame 201 is arranged on the lower transverse plate 2, and the front side and the back side of the bearing frame 201 penetrate through the lower transverse plate 2 and the bottom frame 1; the silicon wafer loading frame 6 is arranged on the bottom frame 1, a silicon wafer is loaded in the silicon wafer loading frame 6, a lead screw 9 penetrates through the middle of the silicon wafer loading frame 6, and the lead screw 9 is used for driving the silicon wafer loading frame 6 to move; the upper transverse plate 3 is arranged above the lower transverse plate 2 and is symmetrically arranged front and back, and the upper transverse plate 3 is spaced from the lower transverse plate 2 by a certain distance; the bearing frame 4 is arranged above the middle of the bearing frame 201, the front side and the rear side of the bearing frame 4 are connected with supporting plates 301, and the bottom of each supporting plate 301 is connected with the upper transverse plate 3; the conveying mechanism 5 is positioned between the bearing frame 4 and the bearing frame 201, the conveying mechanism 5 is provided with clamping plates 503, and the clamping plates 503 are arranged in bilateral symmetry and used for clamping the silicon wafers in the silicon wafer loading frame 6.
As shown in fig. 2, four lifting cylinders 8 are arranged on the front side and the rear side of the bottom frame 1, and the four lifting cylinders 8 are symmetrically arranged and connected with the lower transverse plate 2 for driving the lower transverse plate 2, the upper transverse plate 3, the bearing frame 4 and the carrying mechanism 5 to move.
As shown in fig. 5, the heating pipes 202 are disposed on the inner side of the lower cross plate 2, the heating pipes 202 are symmetrically disposed on the inner side of the lower cross plate 2, and the heating pipes 202 are used for drying the silicon wafers loaded on the silicon wafer loading rack 6.
As shown in fig. 6, a first driving motor 401 is disposed on the left side of the carrying frame 4, a first belt pulley 402 is connected to the bottom of the first driving motor 401, a second driving motor 403 is disposed on the right side of the carrying frame 4, a second belt pulley 404 is connected to the bottom of the second driving motor 403, the first belt pulley 402 and the second belt pulley 404 are disposed at an interval, and the first belt pulley 402 is located above the second belt pulley 404.
As shown in fig. 7, a turntable 407 is disposed in the bottom of the carriage frame 4, the top of the turntable 407 is connected to the first pulley 402 and the second pulley 404, a rail 408 is disposed in the middle of the bottom of the carriage frame 4, and the rail 408 is also disposed at the bottom of the turntable 407.
The carrying mechanism 5 is also provided with a base plate 501, a rotating ring 502 and a pressing block 504, wherein the rotating ring 502 is attached above the base plate 501, and the middle of the clamping plate 503 is movably connected in the rotating ring 502; the briquetting 504 sets up in the middle top of splint 503, and the laminating of both sides is on swivel 502 both sides around the briquetting 504, and the both sides bottom is equipped with little spring 506 around the briquetting 504, and the side is equipped with the gyro wheel about the briquetting 504, and the upper portion of splint 503 is the slant setting, and the medial surface on the upper portion of splint 503 is laminated to the gyro wheel, and the lower part medial surface of splint 503 is equipped with presss from both sides the pad 507.
As shown in fig. 8, a slide 203 is arranged on the top of the bearing frame 201, a chassis 501 is attached to the slide 203, take-up reels 406 are arranged on the left and right sides of the bearing frame 4, a small motor 405 is arranged in front of the take-up reels 406, a pull rope 409 is arranged in the take-up reels 406, and the pull rope 409 is connected with the chassis 501.
The front and back of the chassis 501 are provided with connecting plates 508, the connecting plates 508 are arranged in pairs, each pair of connecting plates 508 is connected with two chassis 501, the connecting plates 508 are connected with tightening springs 509, and the front ends and the back ends of the tightening springs 509 are connected with each pair of connecting plates 508. The top of the pressing block 504 is provided with a guide wheel 505, the middle of the guide wheel 505 is provided with a guide groove, and the guide wheel 505 is attached to the bottom of the track 408.
The silicon wafers are clamped by the clamping plates 503, the pull rope 409 is wound by the winding disc 406, the base plate 501 is expanded and moved, the clamping plates 503 in the base plate 501 clamp the silicon wafers and are scattered side by side, the adjacent silicon wafers are rotated in a cross mode to be dried under the driving of the first driving motor 401 and the second driving motor 403, the center distance between the silicon wafers is larger than the radius of the silicon wafers, the silicon wafer cross rotation is facilitated, compared with the existing mode that the silicon wafers are rotated side by side in the same direction, the silicon wafer drying device saves more space, and the number of the silicon wafers can be increased for drying.
Example two:
as in the first embodiment, as shown in fig. 7-8, a turntable 407 is disposed in the bottom of the carriage frame 4, the top of the turntable 407 is connected to the first pulley 402 and the second pulley 404, a rail 408 is disposed in the middle of the bottom of the carriage frame 4, and the rail 408 is also disposed at the bottom of the turntable 407. The carrying mechanism 5 is also provided with a base plate 501, a rotating ring 502 and a pressing block 504, wherein the rotating ring 502 is attached above the base plate 501, and the middle of the clamping plate 503 is movably connected in the rotating ring 502; the briquetting 504 sets up in the middle top of splint 503, and the laminating of both sides is on swivel 502 both sides around the briquetting 504, and the both sides bottom is equipped with little spring 506 around the briquetting 504, and the side is equipped with the gyro wheel about the briquetting 504, and the upper portion of splint 503 is the slant setting, and the medial surface on the upper portion of splint 503 is laminated to the gyro wheel, and the lower part medial surface of splint 503 is equipped with presss from both sides the pad 507.
The top of the bearing frame 201 is provided with a slideway 203, the chassis 501 is attached to the slideway 203, the take-up reels 406 on the left and right sides of the bearing frame 4 are provided with a small motor 405 in front of the take-up reels 406, and pull ropes 409 are arranged in the take-up reels 406 and connected with the chassis 501. The front and back of the chassis 501 are provided with connecting plates 508, the connecting plates 508 are arranged in pairs, each pair of connecting plates 508 is connected with two chassis 501, the connecting plates 508 are connected with tightening springs 509, and the front ends and the back ends of the tightening springs 509 are connected with each pair of connecting plates 508. The top of the pressing block 504 is provided with a guide wheel 505, the middle of the guide wheel 505 is provided with a guide groove, and the guide wheel 505 is attached to the bottom of the track 408.
After the guide wheel 505 moves to the bottom surface of the rotating disc 407, the rotating disc 407 rotates to drive the guide wheel 505, the pressing block 504 and the rotating ring 502 to rotate, so that the clamping plate 503 horizontally rotates, the silicon wafer drying process is more thorough than the existing silicon wafer drying process which rotates in the parallel vertical direction, and the moisture on the silicon wafer can freely flow down due to the horizontal rotation, so that the drying process is quicker, and the drying time is saved.
Example three:
a cleaning method of a drying device for silicon wafers comprises the following steps:
carrying silicon wafers, putting the silicon wafers in batches in the silicon wafer loading frame 6, then conveying the silicon wafer loading frame 6 to the bottom frame 1 through the transmission of a lead screw 9, and then starting a heating pipe 202 to heat the silicon wafers;
clamping a silicon wafer, starting a lifting cylinder 8, driving a lower transverse plate 2 to move downwards by the lifting cylinder 8, enabling a bearing frame 201 to move downwards, enabling a clamping plate 503 in a carrying mechanism 5 to move downwards, enabling the clamping plate 503 to extend into two sides of the silicon wafer, then starting a servo motor 7, driving an upper transverse plate 3 to move downwards by the servo motor 7, enabling a bearing frame 4 to move downwards, enabling the bottom of the bearing frame 4 to be attached to a guide wheel 505, enabling a pressing block 504 to move downwards to push two sides of the upper part of the clamping plate 503 outwards, enabling the lower part of the clamping plate 503 to rotate inwards to clamp the silicon wafer, and taking the silicon wafer clamp out of a silicon wafer loading frame 6;
turning over the silicon wafer, starting the small motor 405, driving the take-up reel 406 to rotate and take up the silicon wafer by the small motor 405, pulling the base plate 501 towards two sides by the pull rope 409, separating the silicon wafers side by side, enabling the central distance between the silicon wafers to be larger than the radius size of the silicon wafers, starting the second driving motor 403, enabling the turntable 407 below the second belt pulley 404 to rotate along the clockwise direction, enabling the guide wheel 505 and the pressing block 504 attached to the turntable 407 to rotate, enabling the rotating ring 502 and the clamping plate 503 to rotate together, enabling the silicon wafers to rotate for 90 degrees, starting the first driving motor 401, enabling the turntable 407 below the first belt pulley 402 to rotate along the counterclockwise direction, enabling the rest silicon wafers to rotate, enabling the adjacent silicon wafers to rotate in a crossed manner;
and (3) conveying out the silicon wafer, moving the silicon wafer loading frame 6 fed with the silicon wafer out from the left side by utilizing the transmission of a screw rod 9, moving the right side into a new silicon wafer loading frame 6, then putting the dried silicon wafer into the new silicon wafer loading frame 6, and conveying out from the right side to finish drying.
Although the illustrative embodiments of the present invention have been described above to enable those skilled in the art to understand the present invention, the present invention is not limited to the scope of the embodiments, and it is apparent to those skilled in the art that all the inventive concepts using the present invention are protected as long as they can be changed within the spirit and scope of the present invention as defined and defined by the appended claims.
Claims (10)
1. A drying device for silicon wafers is characterized by comprising:
a chassis;
the lower transverse plates are arranged above the bottom frame and are symmetrically arranged in the front-back direction, a bearing frame is arranged on the lower transverse plates, and the front side and the back side of the bearing frame penetrate through the lower transverse plates and the bottom frame;
the silicon wafer loading frame is arranged on the bottom frame, a silicon wafer is loaded in the silicon wafer loading frame, the middle of the silicon wafer loading frame penetrates through the lead screw, and the lead screw is used for driving the silicon wafer loading frame to move;
the upper transverse plate is arranged above the lower transverse plate and symmetrically arranged front and back, and a section of interval is reserved between the upper transverse plate and the lower transverse plate;
the bearing frame is arranged above the middle of the bearing frame, the front side and the rear side of the bearing frame are connected with supporting plates, and the bottom of each supporting plate is connected with the upper transverse plate;
a carrying mechanism located between the bearing frame and having
The clamping plates are arranged in a bilateral symmetry mode and used for clamping the silicon wafers in the silicon wafer loading frame.
2. The drying device for the silicon wafers as claimed in claim 1, wherein four lifting cylinders are symmetrically arranged on the front side and the rear side of the bottom frame, and are connected with the lower transverse plate for driving the lower transverse plate, the upper transverse plate, the bearing frame and the carrying mechanism to move.
3. The drying device for the silicon wafers as claimed in claim 1, wherein the bottom of the lower transverse plate is provided with six servo motors, the six servo motors are symmetrically arranged, and the transmission end of each servo motor penetrates through the upper transverse plate and is used for driving the upper transverse plate and the bearing frame to move.
4. The drying device for the silicon wafers as claimed in claim 1, wherein the inner side surface of the lower transverse plate is provided with heating pipes, the heating pipes are symmetrically arranged on the inner side of the lower transverse plate, and the heating pipes are used for drying the silicon wafers loaded in the silicon wafer loading frame.
5. The drying device for the silicon wafers as claimed in claim 1, wherein a first driving motor is arranged on the left side of the carrying frame, a first belt pulley is connected to the bottom of the first driving motor, a second driving motor is arranged on the right side of the carrying frame, a second belt pulley is connected to the bottom of the second driving motor, the first belt pulley and the second belt pulley are arranged at an interval, and the first belt pulley is located above the second belt pulley.
6. The drying device for silicon wafers as claimed in claim 5, wherein a turntable is provided in the bottom of the carrying frame, the top of the turntable is connected to the first belt pulley and the second belt pulley, a rail is provided in the middle of the bottom of the carrying frame, and a rail is also provided at the bottom of the turntable.
7. The silicon wafer drying apparatus according to claim 6, wherein the carrying mechanism further comprises
A chassis;
the rotating ring is attached above the chassis, and the middle of the clamping plate is movably connected in the rotating ring;
the briquetting, the briquetting sets up the centre top of splint, both sides laminating is in around the briquetting the change both sides, both sides bottom is equipped with little spring around the briquetting, the side is equipped with the gyro wheel about the briquetting, the upper portion of splint is the slant setting, the gyro wheel laminating the medial surface on splint upper portion.
8. The drying device for the silicon wafers as claimed in claim 7, wherein a slide way is arranged at the top of the bearing frame, the chassis is attached to the slide way, the take-up reels are arranged on the left side and the right side of the bearing frame, a small motor is arranged in front of the take-up reels, and pull ropes are arranged in the take-up reels and connected with the chassis.
9. The silicon wafer drying device of claim 8, wherein the chassis is provided with a pair of connecting plates at the front and back, each pair of connecting plates is connected with two chassis, the connecting plates are connected with tightening springs, and the front ends and the back ends of the tightening springs are connected with each pair of connecting plates.
10. A cleaning method of a drying device for silicon wafers comprises the following steps:
carrying silicon wafers, putting the silicon wafers in batches in a silicon wafer loading frame, then conveying the silicon wafer loading frame to an underframe through screw transmission, and then starting a heating pipe to heat the silicon wafers;
clamping a silicon wafer, starting a lifting cylinder, driving a lower transverse plate to move downwards by the lifting cylinder, enabling a bearing frame to move downwards, enabling a clamping plate in a carrying mechanism to move downwards, enabling the clamping plate to extend into two sides of the silicon wafer, then starting a servo motor, driving an upper transverse plate to move downwards by the servo motor, enabling a bearing frame to move downwards, enabling the bottom of the bearing frame to be attached to a guide wheel, enabling a pressing block to move downwards to push two sides of the upper portion of the clamping plate outwards, enabling the lower portion of the clamping plate to rotate inwards to clamp the silicon wafer, and taking the silicon wafer clamp out of a silicon wafer;
turning over the silicon wafer, starting a small motor, driving a take-up reel to rotate and take up wires, pulling a pull rope to pull a chassis to two sides, separating the silicon wafers side by side, enabling the central distance between the silicon wafers to be larger than the radius size of the silicon wafers, starting a second driving motor, enabling a rotary table below a second belt pulley to rotate in the clockwise direction, enabling a guide wheel and a pressing block attached to the rotary table to rotate, enabling a rotary ring and a clamping plate to rotate together, enabling the silicon wafers to rotate 90 degrees, starting a first driving motor, enabling the rotary table below a first belt pulley to rotate in the counterclockwise direction, enabling the rest silicon wafers to start to rotate, enabling the adjacent silicon wafers to start to rotate in a crossed manner;
and (4) carrying out the silicon wafer, moving the silicon wafer loading frame fed with the silicon wafer out from the left side by utilizing screw transmission, moving the right side into a new silicon wafer loading frame, then putting the dried silicon wafer into the new silicon wafer loading frame, and carrying out from the right side to finish drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110161800.1A CN112781345A (en) | 2021-02-05 | 2021-02-05 | Drying device for silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110161800.1A CN112781345A (en) | 2021-02-05 | 2021-02-05 | Drying device for silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112781345A true CN112781345A (en) | 2021-05-11 |
Family
ID=75761020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110161800.1A Withdrawn CN112781345A (en) | 2021-02-05 | 2021-02-05 | Drying device for silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112781345A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116062440A (en) * | 2022-12-19 | 2023-05-05 | 苏州赛森电子科技有限公司 | Feeding mechanism and silicon wafer cleaning machine |
-
2021
- 2021-02-05 CN CN202110161800.1A patent/CN112781345A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116062440A (en) * | 2022-12-19 | 2023-05-05 | 苏州赛森电子科技有限公司 | Feeding mechanism and silicon wafer cleaning machine |
| CN116062440B (en) * | 2022-12-19 | 2023-11-14 | 苏州赛森电子科技有限公司 | Feeding mechanism and silicon wafer cleaning machine |
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Application publication date: 20210511 |
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| WW01 | Invention patent application withdrawn after publication |