CN112779506A - Titanium-aluminum-magnesium-silicon alloy target material and preparation method thereof - Google Patents
Titanium-aluminum-magnesium-silicon alloy target material and preparation method thereof Download PDFInfo
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- CN112779506A CN112779506A CN201911088564.4A CN201911088564A CN112779506A CN 112779506 A CN112779506 A CN 112779506A CN 201911088564 A CN201911088564 A CN 201911088564A CN 112779506 A CN112779506 A CN 112779506A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C14/00—Alloys based on titanium
Abstract
The invention relates to a titanium-aluminum-magnesium-silicon alloy target material and a preparation method thereof. The titanium-aluminum-magnesium-silicon alloy target material comprises the following components in percentage by mass: 57-97% of titanium, 0.1-20% of aluminum, 0.7-26.9% of magnesium and 0.3-16% of silicon; the target material is prepared by a hot-pressing sintering method. Adopting a hot-pressing sintering preparation method, firstly mixing materials according to the proportion; then, carrying out two-section hot-pressing sintering on the mixed powder in a vacuum atmosphere; and machining the blank to obtain the titanium-aluminum-magnesium-silicon alloy target. The titanium-aluminum-magnesium-silicon alloy target material has the advantages of uniform alloy components, high density and stable quality.
Description
Technical Field
The invention relates to a target material for surface coating of a material and a preparation method thereof, in particular to a titanium-aluminum-magnesium-silicon alloy target material and a preparation method thereof.
Background
The surface decoration of materials is an important method for widening the application field of the materials, and various metals, alloys, inorganic materials and high polymer materials can improve the surface hardness, the wear resistance and the corrosion resistance through surface coating, change the surface color of the materials and improve the decorative performance of the materials. The target material is a key material used for coating, and the components of the target material are transferred to the surface of the material to be coated by impacting the surface of the target material with high-energy beams, so that various film layers with different properties are obtained.
The titanium aluminum magnesium silicon target has application value in medicine by sputtering and film formation, and because titanium has biocompatibility and the addition of magnesium and aluminum can enable calcium in a human body to easily grow on the surface of the titanium aluminum magnesium silicon film, the titanium aluminum magnesium silicon film is plated on the surface of an artificial bone material, so that the use effect of the artificial bone material can be improved.
A TiAlMgSi (N), TiAlMgSi (C) or TiAlMgSi (C) (N) film layer is plated on the surface of metal, plastic, glass and other materials to improve the wear resistance of the materials and have very beautiful decorative effect. At present, pure titanium or titanium-aluminum alloy, metal magnesium, silicon and other coating materials are generally used for preparing the film. The method has the defects of complex process and poor consistency of the coating color, and can not meet the requirements of industrial production. In order to meet the coating requirements, titanium aluminum magnesium silicon is required to be prepared into alloy to be used as a target material.
The titanium-aluminum-magnesium-silicon can also be used for light structural materials, and the materials have the advantages of light weight, high strength and good wear resistance, so the preparation technology of the alloy is the key to use the materials.
At present, the titanium-aluminum-magnesium-silicon alloy is prepared by a fusion casting method and a normal pressure sintering process.
(1) Melt casting method
The method mainly considers that the melting points of Mg and Ti are different greatly, the vapor pressure of Mg is high, and the Mg is generally required to be smelted at 1000-1600 ℃. The metal Mg is seriously volatilized, the titanium-aluminum-magnesium-silicon alloy prepared by the method has uneven components, the cast part has the defects of pores, coarse grains and the like, and the yield is low.
(2) Atmospheric sintering process
The titanium-aluminum-magnesium-silicon alloy adopts a normal pressure sintering process, namely titanium powder, aluminum powder, magnesium powder and silicon powder are firstly cold-pressed to a certain shape and then are put into an atmosphere furnace for sintering, the process flow is long, the loss of a die in the cold pressing process is large, and a plurality of devices are needed by the process. Because the melting point of Mg is low, the general sintering temperature is low, the contact area of Ti with Mg, Al and Si is small, mutual diffusion is not easy, the product density is low, the product porosity is too high, the film coating process is unstable, the obtained film layer is not smooth, and the like, the process is not suitable for preparing the high-quality titanium-aluminum-magnesium-silicon target material.
The process is difficult to prepare the high-quality titanium aluminum magnesium silicon alloy target material, but the application of the titanium aluminum magnesium silicon alloy is very valuable, so that the development of the method for preparing the titanium aluminum magnesium silicon alloy target material has a particularly important meaning.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the normal pressure sintering process technology and providing the titanium aluminum magnesium silicon alloy target material hot-pressing sintering preparation method which is short in process flow, low in production cost and stable in quality.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a titanium-aluminum-magnesium-silicon alloy target material comprises the following alloy components in percentage by mass: 57-97% of titanium, 0.1-20% of aluminum, 0.7-26.9% of magnesium and 0.3-16% of silicon; the target material is prepared by a hot-pressing sintering method.
The preparation method of the titanium-aluminum-magnesium-silicon alloy target material adopts a hot-pressing sintering preparation method, and comprises the following steps:
(1) weighing titanium powder or Ti according to the proportion3Al alloy powder, aluminum powder, magnesium powder or Mg2Mixing Si powder and silicon powder in a mixer to obtain mixed powder;
(2) mixing titanium powder or Ti3Al alloy powder, aluminum powder, magnesium powder or Mg2Putting the mixed powder of Si powder and silicon powder into a sintering mold, putting the mold into a vacuum hot-pressing furnace, vacuumizing until the vacuum degree is less than 1Pa, heating up to 400 ℃ from room temperature (25 ℃), keeping the heating rate at 3-10 ℃/min, and keeping the pressure of a pressure head of the hot-pressing furnace at5-10 MPa; then continuously heating to 500-640 ℃, simultaneously raising the pressure of a pressure head of the hot pressing furnace to 15-20 MPa, preserving heat and pressure for 30-120 minutes, then starting cooling, releasing pressure, and naturally cooling to room temperature;
(3) and removing the vacuum, demolding to obtain a sintered and molded titanium-aluminum-magnesium-silicon quaternary alloy target blank, and then machining to obtain the titanium-aluminum-magnesium-silicon alloy target meeting the requirements.
In the step (1) of the preparation method of the titanium-aluminum-magnesium-silicon alloy target material, titanium powder and Ti3Al alloy powder, aluminum powder, magnesium powder and Mg2The granularity of the Si powder and the silicon powder is-200 meshes, and the purity is more than 99 percent (w percent). In the powder mixing process, filling hydrogen or argon into the mixing cylinder to reduce the oxidation of the raw material powder in the mixing process; the powder is mixed in a mixer for 12-48 hours.
The invention has the advantages that:
1) the components of the titanium-aluminum-magnesium-silicon quaternary alloy target material can be adjusted and controlled in a larger range according to the performance requirement of a coating film layer.
2) According to the titanium-aluminum-magnesium-silicon alloy target and the hot-pressing sintering preparation method thereof, the titanium-aluminum-magnesium-silicon quaternary alloy target has the advantages of uniform alloy components, high alloy target density, stable quality and low preparation difficulty.
3) According to the titanium aluminum magnesium silicon alloy target and the hot-pressing sintering preparation method thereof, the titanium aluminum magnesium silicon quaternary alloy target is heated and pressurized in a two-section mode in the hot-pressing process, the target blank can be uniformly heated through the two-section heating, and the target density distribution can be uniformly distributed through the two-section pressurizing.
The titanium-aluminum-magnesium-silicon alloy target and the hot-pressing sintering preparation method thereof have the advantages of uniform alloy components, high density of the alloy target and stable quality.
Drawings
FIG. 1 shows the composition of Ti: 73%, Al: 0.1%, Mg: 16%, Si: 10.9% of the appearance of the titanium-aluminum-magnesium-silicon alloy target material.
Detailed Description
The preparation method of the titanium-aluminum-magnesium-silicon alloy target material adopts a hot-pressing sintering preparation method, and firstly, the materials are mixed according to the proportion; then, carrying out two-section hot-pressing sintering on the mixed powder in a vacuum atmosphere; and machining the blank to obtain the titanium-aluminum-magnesium-silicon alloy target. The method comprises the following specific steps:
(1) weighing 200 mesh titanium powder or Ti with purity more than 99 percent (w percent)3Al alloy powder, aluminum powder, magnesium powder or Mg2Mixing Si powder and silicon powder in a mixer uniformly;
(2) mixing Ti3Al alloy powder or titanium powder, aluminum powder, magnesium powder or Mg2The mixed powder of the Si powder and the silicon powder is loaded in a sintering mold, the mold is placed in a vacuum hot pressing furnace, the vacuum degree is vacuumized to be less than 1Pa, then the temperature is raised, when the temperature is raised from room temperature (25 ℃) to 400 ℃, the temperature raising rate is kept at 3-10 ℃/min, and the pressure of a pressure head of the hot pressing furnace is kept at 5-10 MPa; then continuously heating to 500-640 ℃, simultaneously raising the pressure of a pressure head of the hot pressing furnace to 15-20 MPa, preserving heat and pressure for 30-120 minutes, then starting cooling, releasing pressure, and naturally cooling to room temperature;
(3) and removing the vacuum, demolding to obtain a sintered and molded titanium-aluminum-magnesium-silicon quaternary alloy target blank, and then machining to obtain the titanium-aluminum-magnesium-silicon alloy target meeting the requirements.
The present invention will be described in further detail with reference to specific examples.
Example 1
(1) The components are Ti: 73%, Al: 0.1%, Mg: 16%, Si: 10.9 percent, weighing 1000 grams of 200-mesh powder with the purity of more than 99 percent, and the mixture ratio is as follows: 730 g of titanium powder, 1 g of Al powder, 160 g of magnesium powder and 109 g of silicon powder, and filling argon into a mixer to mix for 24 hours;
(2) loading the mixed powder of titanium powder, aluminum powder, magnesium powder and silicon powder which are uniformly mixed into a mould for sintering, putting the mould into a vacuum hot-pressing furnace, vacuumizing, starting to heat up after the vacuum degree is less than 1Pa, keeping the heating rate at 5 ℃/min and the pressure of a pressure head of the hot-pressing furnace at 5MPa when the temperature is raised from room temperature to 400 ℃; the temperature was then increased to 580 ℃. And simultaneously, the pressure head pressure of the hot pressing furnace is increased to 15 MPa. Preserving heat and pressure for 120 minutes, then cooling, releasing pressure, and naturally cooling to room temperature;
(4) removing vacuum, demoulding to obtain a sintered and molded titanium-aluminum-magnesium-silicon quaternary alloy target blank, and then machining to obtain the titanium-aluminum-magnesium-silicon alloy target meeting the requirements. The target density reaches 97%, the target strength is high, and the appearance is silvery white, as shown in figure 1.
Example 2
(1) The components are as follows: ti: 97%, Al: 1%, Mg: 1%, Si: 1 percent, weighing 1000 grams of powder with 200 meshes and purity of more than 99 percent, and the mixture ratio is as follows: 970 g of titanium powder, 10 g of Al powder and Mg215.8 g of Si powder and 4.2 g of silicon powder, and filling argon into a mixer to mix for 48 hours;
(2) mixing uniformly titanium powder, aluminum powder and Mg2The mixed powder of Si powder and silicon powder is loaded in a mould for sintering, the mould is placed in a vacuum hot-pressing furnace, the vacuum is pumped, the temperature is raised after the vacuum degree is less than 1Pa, the temperature is raised from room temperature to 400 ℃, the temperature raising rate is kept at 5 ℃/min, and the pressure of a pressure head of the hot-pressing furnace is kept at 5 MPa; the temperature was then increased to 630 ℃. And simultaneously, the pressure head pressure of the hot pressing furnace is increased to 20 MPa. Preserving heat and pressure for 120 minutes, then cooling, releasing pressure, and naturally cooling to room temperature;
(4) removing vacuum, demoulding to obtain a sintered and molded titanium-aluminum-magnesium-silicon quaternary alloy target blank, and then machining to obtain the titanium-aluminum-magnesium-silicon alloy target meeting the requirements. The target material density reaches 99.2%, the target material strength is high, and the appearance is silver gray.
Example 3
(1) The components are as follows: ti: 79%, Al: 20%, Mg: 0.7%, Si: 0.3 percent, weighing 1000 grams of 200-mesh powder with the purity of more than 99 percent, and the mixture ratio is as follows: ti3938 g of Al alloy powder, 52 g of Al powder, 7 g of magnesium powder and 3 g of silicon powder, and filling hydrogen into a mixer to mix for 12 hours;
(2) mixing the evenly mixed Ti3The mixed powder of Al alloy powder, aluminum powder, magnesium powder and silicon powder is loaded in a mould for sintering, the mould is placed in a vacuum hot-pressing furnace, the vacuum is pumped, the temperature is raised after the vacuum degree is less than 1Pa, the temperature is raised from room temperature to 400 ℃, the temperature raising rate is kept at 3 ℃/min, and the pressure of a pressure head of the hot-pressing furnace is kept at 5 MPa; however, the device is not suitable for use in a kitchenThen the temperature is continuously increased to 640 ℃. And simultaneously, the pressure head pressure of the hot pressing furnace is increased to 15 MPa. Preserving heat and pressure for 30 minutes, then cooling, releasing pressure, and naturally cooling to room temperature;
(4) removing vacuum, demoulding to obtain a sintered and molded titanium-aluminum-magnesium-silicon quaternary alloy target blank, and then machining to obtain the titanium-aluminum-magnesium-silicon alloy target meeting the requirements. The density of the target material reaches 96%, the strength of the target material is high, and the appearance is silver gray.
Example 4
(1) The components are as follows: ti: 57%, Al: 1%, Mg: 26%, Si: weighing 1000 g of powder with the purity of more than 99 percent of-200 meshes, wherein the weight ratio is as follows: 570 g of Ti powder, 10 g of Al powder and Mg2Filling 410 g of Si powder and 10 g of Si powder into a mixer, and mixing for 20 hours;
(2) mixing uniformly titanium powder, aluminum powder and Mg2The mixed powder of Si powder and silicon powder is loaded in a mould for sintering, the mould is placed in a vacuum hot-pressing furnace, the vacuum is pumped, the temperature is raised after the vacuum degree is less than 1Pa, the temperature is raised from room temperature to 400 ℃, the temperature raising rate is kept at 10 ℃/min, and the pressure of a pressure head of the hot-pressing furnace is kept at 10 MPa; then the temperature was further raised to 620 ℃. And simultaneously, the pressure head pressure of the hot pressing furnace is increased to 20 MPa. Preserving heat and pressure for 60 minutes, then cooling, releasing pressure, and naturally cooling to room temperature;
(4) removing vacuum, demoulding to obtain a sintered and molded titanium-aluminum-magnesium-silicon quaternary alloy target blank, and then machining to obtain the titanium-aluminum-magnesium-silicon alloy target meeting the requirements. The density of the target material reaches 99.1 percent, the target material has high strength and silvery white appearance.
Example 5
(1) The components are as follows: ti: 70%, Al: 0.1%, Mg: 26.9%, Si: weighing 1000 g of 200-mesh powder with purity of more than 99%, wherein the weight ratio is as follows: 700 g of Ti powder, 1 g of Al powder, 269 g of magnesium powder and 30g of silicon powder, and filling hydrogen into a mixer to mix for 12 hours;
(2) loading the mixed powder of titanium powder, aluminum powder, magnesium powder and silicon powder which are uniformly mixed into a mould for sintering, putting the mould into a vacuum hot-pressing furnace, vacuumizing, starting to heat up after the vacuum degree is less than 1Pa, keeping the heating rate at 6 ℃/min and the pressure of a pressure head of the hot-pressing furnace at 5MPa when the temperature is raised from room temperature to 400 ℃; the temperature was then increased to 630 ℃. And simultaneously, the pressure head pressure of the hot pressing furnace is increased to 15 MPa. Preserving heat and pressure for 120 minutes, then cooling, releasing pressure, and naturally cooling to room temperature;
(4) and removing the vacuum, demolding to obtain a sintered and molded titanium-aluminum-magnesium-silicon quaternary alloy blank, and then machining to obtain the required titanium-aluminum-magnesium-silicon quaternary alloy target. The target material density reaches 98%, the target material strength is high, and the appearance is silvery white.
The method has the advantages of short process flow, low production cost, uniform components of the prepared titanium-aluminum-magnesium-silicon alloy target material, high density of the alloy target material and stable quality.
The titanium-aluminum-magnesium-silicon alloy target material belongs to light metal alloy, has low alloy density and high strength, has very high hardness, stable color and very high corrosion resistance and light radiation resistance when being combined with nitrogen or carbon-containing gas during film coating, is an ideal structural material and a film coating functional material, and has very wide development prospect.
According to the titanium-aluminum-magnesium-silicon alloy target and the hot-pressing sintering preparation method thereof, the quaternary alloy target is prepared by adopting a hot-pressing process, the hot-pressing process adopts two-stage heating and pressurizing, the two-stage heating can ensure that a target blank is uniformly heated, and the two-stage pressurizing can ensure that the target density is uniformly distributed, so that the target has uniform components, high density and low product porosity. When the target material is used for coating films on the surfaces of materials such as metal, plastic, glass and the like, the film coating process is stable, the obtained film layer is smooth, and the components of the alloy are uniformly distributed.
Claims (5)
1. A titanium-aluminum-magnesium-silicon alloy target material is characterized in that: the weight percentage composition of it is: 57-97% of titanium, 0.1-20% of aluminum, 0.7-26.9% of magnesium and 0.3-16% of silicon; the target material is prepared by a hot-pressing sintering method.
2. The method for preparing the titanium-aluminum-magnesium-silicon alloy target material according to claim 1, comprising the following steps:
(1) weighing titanium powder or Ti according to the proportion3Al alloy powder, aluminum powder, magnesium powder or Mg2Mixing Si powder and silicon powder in a mixer to obtain mixed powder;
(2) mixing titanium powder or Ti3Al alloy powder, aluminum powder, magnesium powder or Mg2Putting the mixed powder of Si powder and silicon powder into a sintering mold, putting the mold into a vacuum hot-pressing furnace, vacuumizing to ensure that the vacuum degree is less than 1Pa, heating, keeping the heating rate at 3-10 ℃/min when the temperature is increased from room temperature to 400 ℃, and keeping the pressure of a pressure head of the hot-pressing furnace at 5-10 MPa; then continuously heating to 500-640 ℃, simultaneously raising the pressure of a pressure head of the hot pressing furnace to 15-20 MPa, preserving heat and pressure for 30-120 minutes, then starting cooling, releasing pressure, and naturally cooling to room temperature;
(3) and removing the vacuum, demolding to obtain a sintered and molded titanium-aluminum-magnesium-silicon quaternary alloy target blank, and then machining to obtain the titanium-aluminum-magnesium-silicon alloy target meeting the requirements.
3. The method for preparing the titanium-aluminum-magnesium-silicon alloy target material according to claim 2, wherein the method comprises the following steps: titanium powder, Ti3Al alloy powder, aluminum powder, magnesium powder and Mg2The granularity of the Si powder and the silicon powder is-200 meshes, and the purity is more than 99 w%.
4. The method for preparing the titanium-aluminum-magnesium-silicon alloy target material according to claim 2, wherein the method comprises the following steps: and in the powder mixing process, filling hydrogen or argon into the mixing cylinder.
5. The method for preparing the titanium-aluminum-magnesium-silicon alloy target material according to claim 2, wherein the method comprises the following steps: the powder is mixed in a mixer for 12-48 hours.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4619697A (en) * | 1984-08-30 | 1986-10-28 | Mitsubishi Kinzoku Kabushiki Kaisha | Sputtering target material and process for producing the same |
| JPH08134635A (en) * | 1994-11-15 | 1996-05-28 | Kobe Steel Ltd | Aluminum-titanium alloy target materia for dry-process vapor deposition |
| CN1777690A (en) * | 2003-03-28 | 2006-05-24 | Ppg工业俄亥俄公司 | Substrates coated with mixtures of titanium and aluminum materials,methods for making the substrates,and cathode targets of titanium and aluminum metal |
| CN102321833A (en) * | 2011-09-29 | 2012-01-18 | 余鹏 | Al-Ti-Si alloy target material and preparation method thereof |
| CN103898358A (en) * | 2012-12-27 | 2014-07-02 | 北京有色金属研究总院 | Titanium-aluminum-silicon alloy coating material and preparation method thereof |
| CN104878244A (en) * | 2014-02-27 | 2015-09-02 | 北京有色金属研究总院 | Titanium-aluminum-magnesium alloy target material and preparation method thereof |
-
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- 2019-11-08 CN CN201911088564.4A patent/CN112779506A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4619697A (en) * | 1984-08-30 | 1986-10-28 | Mitsubishi Kinzoku Kabushiki Kaisha | Sputtering target material and process for producing the same |
| JPH08134635A (en) * | 1994-11-15 | 1996-05-28 | Kobe Steel Ltd | Aluminum-titanium alloy target materia for dry-process vapor deposition |
| CN1777690A (en) * | 2003-03-28 | 2006-05-24 | Ppg工业俄亥俄公司 | Substrates coated with mixtures of titanium and aluminum materials,methods for making the substrates,and cathode targets of titanium and aluminum metal |
| CN102321833A (en) * | 2011-09-29 | 2012-01-18 | 余鹏 | Al-Ti-Si alloy target material and preparation method thereof |
| CN103898358A (en) * | 2012-12-27 | 2014-07-02 | 北京有色金属研究总院 | Titanium-aluminum-silicon alloy coating material and preparation method thereof |
| CN104878244A (en) * | 2014-02-27 | 2015-09-02 | 北京有色金属研究总院 | Titanium-aluminum-magnesium alloy target material and preparation method thereof |
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