CN112778918A - Mother board membrane, decorative membrane, shell, preparation method and electronic equipment - Google Patents
Mother board membrane, decorative membrane, shell, preparation method and electronic equipment Download PDFInfo
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- CN112778918A CN112778918A CN201911083716.1A CN201911083716A CN112778918A CN 112778918 A CN112778918 A CN 112778918A CN 201911083716 A CN201911083716 A CN 201911083716A CN 112778918 A CN112778918 A CN 112778918A
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- membrane
- decorative
- diaphragm
- film
- mother board
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
Abstract
The application discloses a motherboard membrane, a decorative membrane, a shell, a preparation method and electronic equipment. This motherboard diaphragm includes: the decoration diaphragm rough blank that plane portion and a plurality of interval set up decorates the diaphragm rough blank and includes the main part and a plurality of lateral walls that link to each other with the main part, and the angle of bending between at least one lateral wall and the main part place plane is greater than 88 degrees, and plane portion links to each other with the lateral wall, connects through plane portion between a plurality of decoration diaphragm rough blanks. This mother board diaphragm can be used to form the decoration diaphragm, make the decoration diaphragm have great angle of bending, with the casing base member phase-match that has great angle of bending, the fold that appears when effectively alleviating the laminating, bubble scheduling problem, and connect through plane portion between the decoration diaphragm rough blank in this mother board diaphragm, when forming the decoration diaphragm rough blank, the mother board diaphragm has sufficient surplus and takes place the bending in the great region of angle of bending, and not stretch the mother board diaphragm, can improve each rete in the decoration diaphragm rough blank and the bad problems such as crackle appear.
Description
Technical Field
The application relates to the field of electronic equipment, in particular to a motherboard membrane for preparing a decorative membrane of the electronic equipment, the decorative membrane of the electronic equipment, a preparation method of the decorative membrane, a shell, a preparation method of the shell and the electronic equipment.
Background
At present, a decorative film used in an electronic device generally adopts a polyethylene terephthalate (PET) substrate, a color layer is arranged on the PET substrate, and the decorative film is attached to a shell base body, so that the shell body has a good appearance effect.
However, the current decorative film is still in need of improvement.
Content of application
The present application is based on the discovery and recognition by the inventors of the following facts and problems:
at present, a housing base body in an electronic device is generally of a curved surface structure, the arc height of the housing base body is about 3.58mm, the bending angle is small, and a decorative film taking PET as a base material is easy to attach and cannot wrinkle when being attached to the housing base body. Along with the promotion that the user pursued, the integral type casing receives more and more favouring, and the base member of integral type casing has great bending angle, consequently, can independently constitute complete casing, need not the collocation center, however, when laminating the decoration diaphragm on above-mentioned casing base member, because the elastic modulus of PET substrate is great, the easy problem such as fold, bubble appear in the great lateral wall department of bending angle, influence the outward appearance effect of integral type casing.
The present application aims to mitigate or solve at least to some extent at least one of the above mentioned problems.
In one aspect of the present application, a master membrane for making an electronic device decorative membrane is presented. This motherboard diaphragm includes: the decoration diaphragm rough blank that plane portion and a plurality of interval set up, decorate the diaphragm rough blank include the main part and with a plurality of lateral walls that the main part links to each other, wherein, at least one the lateral wall with the angle of bending between the main part place plane is greater than 88 degrees, plane portion with decorate the diaphragm rough blank the lateral wall links to each other, and is a plurality of pass through between the decoration diaphragm rough blank plane portion connects. From this, this mother board diaphragm can be used to form the decoration diaphragm, make the decoration diaphragm that obtains have great angle of bending, can with the casing base member phase-match that has great angle of bending, the fold that appears when effectively alleviating the laminating, the bubble scheduling problem, make the integral type casing obtain good outward appearance effect, and connect through plane portion between the decoration diaphragm rough blank in this mother board diaphragm, promptly when forming the decoration diaphragm rough blank, the mother board diaphragm has sufficient surplus to take place the bending in the great region of angle of bending, and not stretch the mother board diaphragm, thereby can effectively improve bad problems such as crackle appear in each rete in the decoration diaphragm rough blank.
In another aspect of the present application, a decorative film for an electronic device is presented. The decorative film is formed using the aforementioned mother substrate film, the decorative film including: the bending angle between at least one side wall and the plane of the main body is larger than 88 degrees. From this, this decorate diaphragm has great angle of bending, can with the casing base member phase-match that has great angle of bending, effectively alleviate fold, bubble scheduling problem that appear when the laminating for the integral type casing obtains good appearance effect, and in this decoration diaphragm each rete the bad risk such as crackle appears in bending zone department is lower.
In another aspect of the present application, a housing is presented. This casing includes: the shell base body comprises a main body and a plurality of side walls connected with the main body, and the bending angle between at least one side wall and the plane of the main body is larger than 88 degrees; the decoration diaphragm is arranged on the inner side of the shell base body, and the bending angle of the decoration diaphragm is matched with the bending angle of the shell base body. From this, can realize good laminating between decoration diaphragm and the casing base member, obtain the integral type casing that has good outward appearance effect to bad risks such as crackle appear in the district department of buckling in each rete are lower in this decoration diaphragm, further promote the outward appearance effect of casing.
In another aspect of the present application, a method of making a decorative film for use in an electronic device is presented, the method comprising: preparing a mother board diaphragm rough blank which is of a plane structure; performing the rough blank of the mother board membrane to form a mother board membrane, wherein the mother board membrane comprises a plane part and a plurality of decorative membrane rough blanks arranged at intervals, the decorative membrane rough blanks comprise a main body and a plurality of side walls connected with the main body, the bending angle between at least one side wall and the plane where the main body is located is larger than 88 degrees, the plane part is connected with the side wall of the decorative membrane rough blank, and the decorative membrane rough blanks are connected through the plane part; and cutting the mother board membrane, removing the plane part in the mother board membrane, and reserving the rough blank of the decorative membrane to obtain the decorative membrane. Therefore, the decorative membrane with the large bending angle can be obtained by a simple method to be matched with the shell base body with the large bending angle, so that the integrated shell obtains a good appearance effect, and the risk of cracks and other defects of each membrane layer in the decorative membrane at the bending area is low.
In another aspect of the present application, a method of making a housing is presented. The method comprises the following steps: providing a shell base body, wherein the shell base body comprises a main body and a plurality of side walls connected with the main body, and the bending angle between at least one side wall and the plane of the main body is larger than 88 degrees; providing a decorative membrane, wherein the decorative membrane is prepared by the method, and the bending angle of the decorative membrane is matched with that of the shell substrate; and attaching the decorative film to the inner side of the shell substrate to obtain the shell. Thus, the integrated shell with good appearance effect can be obtained by a simple method.
In another aspect of the present application, an electronic device is presented. The electronic device includes: the shell is the shell, the shell comprises a back shell and a side wall connected with the back shell, and the side wall and the back shell define an accommodating space; mainboard and display screen, the mainboard and the display screen is located inside the accommodation space, the mainboard is close to the dorsal scale sets up, just the light-emitting side of display screen is kept away from the dorsal scale sets up. Therefore, the electronic equipment has the integrated shell, is simple in structure and has a good appearance effect.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the examples taken in conjunction with the accompanying drawings, in which:
FIG. 1 shows a schematic structural diagram of a motherboard membrane according to an example of the present application;
FIG. 2 shows a schematic view of a portion of a motherboard membrane according to an example of the present application;
FIG. 3 shows a schematic structural view of a decorative film sheet according to an example of the present application;
FIG. 4 shows a schematic structural view of a housing according to an example of the present application;
FIG. 5 shows a schematic view of a partial structure of a housing according to an example of the present application;
FIG. 6 shows a schematic flow diagram of a method of making a decorative film sheet according to one example of the present application;
FIG. 7 shows a schematic flow diagram of a method of preparing a shell according to one example of the present application;
fig. 8 shows a schematic structural diagram of an electronic device according to an example of the application.
Description of reference numerals:
100: decorating the membrane; 110: a substrate; 120: a photosensitive adhesive transfer layer; 130: coating a film layer; 140: a bottom covering ink layer; 150: a first glue layer; 160: a first release film layer; 170: a second adhesive layer; 180: a second release film layer; 200: a housing base; 210: a hardened layer; 220: a mirror surface silver ink layer; 1000: a housing; 2000: a motherboard diaphragm; 300: decorating the rough blank of the membrane; 330: a planar portion; 10/30/310: a main body; 20/40/320: a side wall.
Detailed Description
Reference will now be made in detail to examples of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The examples described below with reference to the drawings are illustrative only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In one aspect of the present application, a master membrane for making an electronic device decorative membrane is presented. In some examples of the present application, referring to fig. 1, a motherboard film sheet 2000 includes: a plane portion 330 and a plurality of decorative film blanks 300 arranged at intervals, wherein the decorative film blanks 300 comprise a main body 310 and a plurality of side walls 320 connected with the main body 310, the bending angle (alpha shown in fig. 1) between at least one side wall 320 and the plane of the main body 310 is larger than 88 degrees, such as 90 degrees, 100 degrees and 120 degrees, the plane portion 330 is connected with the side walls 320, and the plurality of decorative film blanks 300 are connected through the plane portion 330. From this, this mother board diaphragm can be used to form the decoration diaphragm, make the decoration diaphragm that obtains have great angle of bending, can with the casing base member phase-match that has great angle of bending, the fold that appears when effectively alleviating the laminating, the bubble scheduling problem, make the integral type casing obtain good outward appearance effect, and connect through plane portion between the decoration diaphragm rough blank in this mother board diaphragm, promptly when forming the decoration diaphragm rough blank, the mother board diaphragm has sufficient surplus to take place the bending in the great region of angle of bending, and not stretch the mother board diaphragm, thereby can effectively improve bad problems such as crackle appear in each rete in the decoration diaphragm rough blank.
It should be noted that the term "bending angle" in this application refers to an angle between the side wall and the main body (α shown in fig. 1), specifically, an angle between the side wall and a plane of the main body. In some examples of the present application, the body 310 of the decorative film blank 300 may be planar, or may also be curved. When the main body 310 includes a planar structure and an arc-shaped structure, the plane of the main body 310 is the plane of the planar structure, and when the main body 310 is an arc-shaped structure as a whole, the plane of the main body 310 is the plane of a tangent line at the highest point of the protrusion of the main body 310. The sidewall 320 may also be a plane or an arc surface, and when the outer surface of the sidewall 320 is an arc surface, the maximum value of the included angles between the tangent line at any point on the outer surface of the sidewall 320 and the plane where the main body 310 is located is the bending angle (α shown in fig. 1) at the sidewall.
In some examples of the present application, referring to fig. 1, the mother board membrane 2000 includes a plurality of decorative membrane blanks 300, the decorative membrane blanks 300 have a curved surface structure, and the bending angle between the main body 310 and the side wall 320 is greater than 88 degrees, thereby, the decorative membrane formed by using the mother board membrane has a larger bending angle, when being attached to the housing base having the larger bending angle, only the decorative membrane matched with the bending angle of the housing base needs to be selected for attachment, therefore, the problems of wrinkles, bubbles and the like occurring during attachment can be effectively alleviated, a well-attached and integrated housing is obtained (no matching middle frame is needed), so that the integrated housing obtains a good appearance effect. Moreover, the mother board membrane 2000 further comprises a plane portion 330, the plane portion 330 is connected with the side wall 320, and the plurality of decorative membrane blanks 300 are connected through the plane portion 330 to form the integrated mother board membrane 2000, that is, the mother board membrane 2000 has enough allowance to be bent at the bending area instead of stretched when each decorative membrane blank 300 is formed, so that the risk of cracks and other defects of each membrane layer in the decorative membrane blanks can be effectively reduced.
In some examples of the present application, referring to fig. 2 (fig. 2 is a partial structural schematic diagram of a motherboard film), the motherboard film 2000 may include a substrate 110, and a photosensitive adhesive transfer layer 120, a plating layer 130, and a bottom-covering ink layer 140 sequentially stacked on the substrate 110, so that a decorative film formed by using the motherboard film may exhibit a certain color effect and brightness, and the film may have a lower risk of occurrence of cracks and other undesirable phenomena at a bending region, which may further improve the color effect and brightness of the decorative film.
The mother board film includes a substrate, a photosensitive adhesive transfer layer, a coating layer, and a bottom ink layer, that is, both the planar portion and the decorative film blank include the above film layers.
In some examples of the present application, the material constituting the substrate 110 may include at least one of polyethylene terephthalate (PET), Polycarbonate (PC), polypropylene (PP), and thermoplastic polyurethane elastomer (TPU). Therefore, the base material can be used as a good carrier of a photosensitive adhesive transfer layer, a coating layer and a bottom covering ink layer, and the mother board diaphragm can be bent but not stretched in a bending area by arranging enough allowance in the mother board diaphragm, so that the base material of the mother board diaphragm is not particularly limited, and can be a hard base material (such as PET and the like) or a soft base material (such as TPU).
In some examples of the present application, the photosensitive paste transfer layer 120 may have a texture pattern, and thus, a decorative film formed using the above-described mother sheet may exhibit a texture effect. Photosensitive glue rendition layer can also have the colour, and is concrete, can utilize photosensitive glue to mix colours, then rendition, stoving form the photosensitive glue rendition layer that has the colour, perhaps, on the photosensitive glue rendition substrate earlier, then dip-dye mixing of colors, at last oven-dry again to obtain the photosensitive glue rendition layer that has the colour, make the decoration diaphragm that utilizes above-mentioned mother board diaphragm to form present certain colour.
The material of the coating layer is not particularly limited, and for example, In some examples of the present application, the coating layer 130 may be made of In/Sn material such that the coating layer exhibits metallic luster, or the coating layer 130 may be made of a high refractive index sub-layer and a low refractive index sub-layer alternately stacked, such as TiO2/SiO2Therefore, the coating layer can not only present metal color, but also present specific color.
The specific thicknesses of the substrate, the photosensitive adhesive transfer layer, the coating layer and the under-cover ink layer are not particularly limited, and those skilled in the art can design the film according to the common thicknesses of the above layers in the current decorative film. For example, in some examples of the present application, the thickness of the substrate 110 may be 25-75 μm, the thickness of the photosensitive adhesive transfer layer 120 may be 10-15 μm, the thickness of the plating layer 130 may be 260-290nm, and the thickness of the under-cover ink layer 140 may be 12-25 μm.
In some examples of the present application, referring to fig. 2, the motherboard film sheet 2000 may further comprise: first glue layer 150 and first release film layer 160, first glue layer 150 sets up the one side of keeping away from photosensitive glue transfer printing layer 120 at substrate 110, and first release film layer 160 sets up the one side of keeping away from substrate 110 at first glue layer 150. From this, this mother board diaphragm can independently be deposited to the decoration diaphragm that utilizes this mother board diaphragm to form can independently deposit, when decorating diaphragm and casing base laminating, only need will decorate the first type rete of leaving on the diaphragm and take off can.
In some examples of the present application, referring to fig. 2, the motherboard film sheet 2000 may further comprise: the second adhesive layer 170 and the second release film layer 180, the second adhesive layer 170 is disposed on the side of the bottom ink layer 140 away from the film coating layer 130, and the second release film layer 180 is disposed on the side of the second adhesive layer 170 away from the bottom ink layer 140. From this, when the mother board diaphragm independently deposits, perhaps when decorating the diaphragm and independently depositing, the second is from type the rete can the bottom of the visor ink layer, prevents to be contaminated or fish tail, when follow-up sets up other structures in decorating diaphragm lid bottom ink layer one side, can take off the second from type the rete, utilizes the second glue film to realize the fixed of bottom of the lid ink layer and other structures.
In some examples of the present application, the thicknesses of the first adhesive layer 150 and the second adhesive layer 170 may be 10-20 μm, respectively, so that the firmness of the adhesion of the decorative film to the housing substrate and the firmness of the adhesion of the decorative film to other structures can be ensured. The material of the first and second adhesive layers is not particularly limited, and for example, the first and second adhesive layers may be optical adhesive (OCA adhesive).
In another aspect of the present application, a decorative film for an electronic device is presented. In some examples of the present application, the decorative film may be formed using the mother sheet film described above, and in particular, referring to fig. 3, the decorative film 100 includes: a main body 10 and a plurality of side walls 20 connected to the main body 10, wherein a bending angle (α shown in fig. 3) between at least one side wall 20 and a plane where the main body 10 is located is greater than 88 degrees. From this, this decorate diaphragm has great angle of bending, can with the casing base member phase-match that has great angle of bending, effectively alleviate fold, bubble scheduling problem that appear when the laminating for the integral type casing obtains good appearance effect, and in this decoration diaphragm each rete the bad risk such as crackle appears in bending zone department is lower.
It should be noted that the decoration film 100 is formed by using the mother board film 2000 described above, and thus the bending angle at the sidewall of the decoration film 100 is the same as the bending angle at the sidewall of the decoration film blank 300 in the mother board film 2000, and the definition and the angle of the bending angle at the sidewall of the decoration film 100 are not described herein again.
The individual layers of the decorative film have also been described in detail above and will not be described in detail here.
In another aspect of the present application, a housing is presented. In some examples of the present application, referring to fig. 4, the housing comprises: the housing comprises a housing base 200 and a decorative membrane 100, wherein the housing base 200 comprises a main body 30 and a plurality of side walls 40 connected with the main body 30, a bending angle (beta shown in fig. 4) between at least one side wall 40 and a plane where the main body 30 is located is larger than 88 degrees, the decorative membrane 100 is the decorative membrane described above, the decorative membrane 100 is arranged on the inner side of the housing base 200, and the bending angle alpha of the decorative membrane 100 is matched with the bending angle beta of the housing base 200. From this, when decorating diaphragm and casing base member laminating, can effectively improve fold, bubble scheduling problem, make to decorate and have good laminating effect between diaphragm and the casing base member, make the casing obtain good outward appearance, promote the outward appearance performance of casing, and it is lower to appear bad risks such as crackle in the bending region department at each rete in this decoration diaphragm, further promote the outward appearance effect of casing, the angle of bending of casing base member is great simultaneously, can save structures such as center, obtain the casing of integral type.
Note that, similar to the bending angle α in the decorative film 100, the bending angle β of the housing base 200 is the angle between the side wall 40 and the plane of the main body 30. The main body 30 may be a plane, or may also be an arc surface, when the main body 30 includes a planar structure and an arc surface structure, the plane where the main body 30 is located is the plane where the planar structure is located, and when the main body 30 is an arc surface as a whole, the plane where the main body 30 is located is the plane where a tangent line of a highest point of a protrusion of the main body 30 is located. The side wall 40 may also be a plane or an arc surface, and when the outer surface of the side wall 40 is an arc surface, the maximum value of the included angles between the tangent line at any point on the outer surface of the side wall 40 and the plane where the main body 30 is located is the bending angle (β shown in fig. 4) at the side wall.
In some examples of the present application, the housing base 200 may have 4 side walls 40, and the bending angles between the 4 side walls 40 and the main body 30 may or may not be all equal. For example, the bending angles between two oppositely disposed sidewalls 40 and the main body 10 may be equal among the 4 sidewalls 40, and the bending angles between two adjacent sidewalls 40 and the main body 30 may not be equal. The bending angles between the 4 side walls 40 and the main body 30 are all larger than 88 degrees. Alternatively, in other examples of the present application, the housing base 200 may have 2 side walls 40, two side walls 40 are oppositely disposed (e.g., on the long side of the housing base), and the bending angles between the 2 side walls 40 and the main body 30 are both greater than 88 degrees. Therefore, the shell body is of an integrated structure, structures such as an additional middle frame can be omitted, and the shell body has good texture.
The specific material of the housing base is not particularly limited as long as the housing base with a bending angle larger than 88 degrees can be formed, for example, in some examples of the present application, the housing base 200 may be a glass base, or a plastic base, or a metal base, etc. Specifically, the housing base 200 may be a plastic base, which has a lower cost and is easy to process compared to other housing bases.
In some examples of the present application, the thickness of the housing base 200 may be 0.65-0.7 mm. Therefore, the shell base body can well bear the decorative membrane and has a thinner thickness.
In some examples of the present application, the number of the side walls 20 of the decorative film 100 and the degree of the bending angle α at the side walls 20 are all matched with the housing base 200, so that the decorative film and the housing base can be well attached, the problems of wrinkles, bubbles and the like can be effectively solved, and an integrated housing with a good appearance effect can be obtained.
The film layers constituting the decorative film have been described in detail above, and will not be described in detail here.
In some examples of the present application, referring to fig. 5, the decorative film 100 includes a substrate 110, a photosensitive adhesive transfer layer 120, a coating layer 130, and a cover bottom ink layer 140 sequentially stacked on the substrate 110, and a first adhesive layer 150 disposed on a side of the substrate 110 away from the photosensitive adhesive transfer layer 120, wherein the decorative film 100 is attached to the housing base 200 through the first adhesive layer 150. Therefore, the decorative film and the shell substrate can be firmly attached.
In some examples of the present application, referring to fig. 5, the housing may further include a hardened layer 210, and the hardened layer 210 is disposed on a side of the housing base 200 away from the decorative film 100, whereby the surface hardness of the housing may be increased and the housing may be highlighted.
In some examples of the present application, the thickness of the hardened layer 210 may be 3-10 μm. Thereby, it is possible to obtain a high surface hardness of the case and a high bright appearance of the case.
In some examples of the present application, referring to fig. 5, the housing may further include a mirror silver ink layer 220, the mirror silver ink layer 220 is disposed between the housing base 200 and the decorative film 100, that is, between the housing base 200 and the first glue layer 150, and the mirror silver ink layer 220 has a predetermined pattern. Therefore, the mirror silver ink layer can be utilized to form a marking pattern, such as LOGO and the like. In some examples of the present application, the thickness of the specular silver ink layer 220 may be 3-5 μm.
In another aspect of the present application, a method of making a decorative film is presented. In some examples of the present application, the decorative film prepared by the method may be the decorative film described above, and thus, the decorative film prepared by the method may have the same features and advantages as those of the decorative film described above, and will not be described herein again.
In some examples of the present application, with reference to fig. 6, the method includes:
s100: preparing a rough blank of the diaphragm of the mother plate, wherein the rough blank of the diaphragm of the mother plate is of a plane structure
In this step, a master membrane blank is prepared, which is a planar structure. In some examples of the present application, a master membrane blank may include a substrate and a photosensitive paste transfer layer, a plating layer, and a primer ink layer sequentially disposed on the substrate. The specific processes for preparing the photosensitive transfer layer, the coating layer and the under-cover ink layer are not particularly limited, and those skilled in the art can prepare the photosensitive transfer layer, the coating layer and the under-cover ink layer according to the conventional processes.
In some examples of this application, one side that photosensitive glue seal layer was kept away from to the substrate can be provided with first glue film, one side that substrate was kept away from to first glue film is provided with first from the type rete, one side that coating film layer was kept away from to the printing ink layer of covering the end can be provided with the second glue film, one side that printing ink layer was kept away from to the second glue film of covering the end is provided with the second from the type rete, therefore, this mother board diaphragm rough blank is through subsequent preforming after, the mother board diaphragm that forms can independently be deposited, thereby make the decoration diaphragm of final formation independently deposit, when decorating diaphragm and casing base laminating, only need with decorate on the diaphragm first from the type rete take off can.
S200: performing the rough blank of the motherboard membrane to form the motherboard membrane
In this step, the master membrane blank is preformed to form the master membrane. In some examples of the present application, the formed mother board film includes a planar portion and a plurality of decorative film blanks arranged at intervals, the decorative film blanks include a main body and a plurality of side walls connected to the main body, wherein a bending angle between at least one side wall and the plane of the main body is greater than 88 degrees, the planar portion is connected to the side wall of the decorative film blank, and the plurality of decorative film blanks are connected to each other through the planar portion. Therefore, when the decorative film rough blank is formed, the mother board film has enough allowance to be bent in a region with a larger bending angle, and the mother board film is not stretched, so that the defect problems of cracks and the like of each film layer in the decorative film rough blank can be effectively improved.
In some examples of the present application, preforming the motherboard membrane blank may include: firstly, baking a mother board membrane rough blank, and then, carrying out hot bending treatment on the baked mother board membrane rough blank. The mother board membrane rough blank is baked, so that each membrane layer in the mother board membrane rough blank can be softened, the hot bending treatment is convenient to carry out, and the decorative membrane rough blank with a larger bending angle can be obtained. Specifically, the rough blank of the motherboard membrane can be put into a high-pressure hot bending machine for baking treatment and hot bending treatment.
In some examples of the present application, the temperature of the baking process may be 350-. Thereby, softening of the individual film layers in the master membrane blank is facilitated.
In some examples of the present application, during the hot bending process, the acting force of the hot bending may be an inflation pressure or a suction vacuum degree, so as to deform the mother plate film blank to form a decorative film blank with a larger bending angle, and specifically, 55-65kg/cm may be applied to the side of the mother plate film blank provided with the under-cover ink layer2Or negative pressure can be applied to one side of the mother board membrane rough blank provided with the base material, so that the vacuum degree of the mother board membrane rough blank provided with the base material is-0.9 MPa to-0.8 MPa, or 10-25kg/cm can be applied to one side of the mother board membrane rough blank provided with the bottom covering ink layer2The negative pressure is applied to one side of the mother board diaphragm rough blank, which is provided with the base material, so that the vacuum degree of the mother board diaphragm rough blank, which is provided with the base material, is between-0.9 MPa and-0.8 MPa, the time of the hot bending treatment process is 2 to 5 seconds, and the temperature is 100 plus materials and 145 ℃. Therefore, the mother board diaphragm can be obtained, the decorative diaphragm rough blank in the mother board diaphragm has a large bending angle, and by adopting the process, the bending transition of the mother board diaphragm in the area with the large bending angle can be realized, instead of stretching the mother board diaphragm rough blank, so that the risk of the defects that each film layer in the decorative diaphragm rough blank cracks and the like is low.
It should be noted that, during the hot bending process, the mother plate membrane blank is placed in a profiling mold of a high-pressure hot bending machine, the profiling mold has a shape consistent with that of the mother plate membrane to form the mother plate membrane, and the temperature (100-.
S300: cutting the mother board film to form a decorative film
In this step, the master film sheet is cut to form a decorative film sheet. In some examples of the present application, the mother sheet film is cut to remove the flat portion of the mother sheet film and to leave a decorative film blank, i.e., to obtain a decorative film. From this, this decorate diaphragm has great angle of bending, can with the casing base member phase-match that has great angle of bending, effectively alleviate fold, bubble scheduling problem that appear when the laminating for the integral type casing obtains good appearance effect, and in this decoration diaphragm each rete the bad risk such as crackle appears in bending zone department is lower.
In another aspect of the present application, a method of making a housing is presented. In some examples of the present application, the housing prepared by the method may be the housing described above, and thus, the housing prepared by the method may have the same features and advantages as the housing described above, and thus, will not be described herein again.
In some examples of the present application, with reference to fig. 7, the method includes:
s400: providing a housing base
In this step, a housing base is provided. In some examples of the present application, the housing base includes a main body and a plurality of side walls connected to the main body, and a bending angle between at least one of the side walls and a plane in which the main body is located is greater than 88 degrees. Therefore, the shell base body has a large bending angle, the appearance of the shell can be formed without matching with the middle frame, and the integrated shell is obtained. The material of the housing base has already been described in detail above and is not described in detail here.
In some examples of the present application, the housing base having the larger bending angle may be a plastic base, and the manufacturing process of the plastic base is not particularly limited, for example, the plastic base having the larger bending angle may be formed by hot bending a planar plastic plate, or may be formed by injection molding using an injection mold having the larger bending angle.
S500: providing decorative film
In this step, a decorative film is provided. In some examples of the present application, the decorative film may be prepared by the method described above, and will not be described herein. The features of the individual layers of the decorative film have also been described in detail above and are not described in detail here.
S600: attaching the decorative film to the inner side of the shell substrate to obtain the shell
In this step, the decorative film is attached to the inside of the case base to obtain the case.In some examples of the present application, first, a decorative film having a bending angle matching with the housing base is selected, and then the decorative film is attached to the inner side of the housing base to obtain the housing. In some examples of the present application, attaching the decorative film to the inside of the housing base may include: first, air is drawn between the decorative film and the case base to reduce air bubbles between the decorated film and the case base after attachment, and then, pressure is applied to the decorative film so that the decorative film is attached to the case base. Wherein the air extraction time can be 2-5s, and the applied pressure can be 4-10kg/cm2The time for applying the pressure may be 3-5 s. Therefore, the decorative film can be well attached to the shell substrate.
In some examples of this application, in order to facilitate the depositing of decorating the diaphragm, can keep away from the one side setting of substrate at first glue film and leave type rete, after selecting the decoration diaphragm that bends angle and casing base member phase match to and before laminating, only need with first take off from type rete can, make the decoration diaphragm laminate to the casing base member through first glue film on.
In some examples of this application, can also be provided with the second glue film in the decoration diaphragm in the one side that the printing ink layer kept away from the coating film layer at the bottom of the lid, the one side that the printing ink layer was kept away from at the bottom of the lid on the second glue film is provided with the second and leaves type rete, follow-up when setting up other structures in printing ink layer one side at the bottom of the lid, only need with the second take off from the type membrane can for the decoration diaphragm is laminated with other structures through the second glue film.
In some examples of the present application, the method may further comprise: the shell is defoamed, specifically, the shell can be placed in a defoaming rotating disk, the temperature of the defoaming treatment is controlled to be 50-80 ℃, the pressure is controlled to be 5-10kgf, and the time is 40-80 min. Therefore, air bubbles between the shell body and the decorative membrane can be further removed, and the attaching effect between the decorative membrane and the shell body is further improved.
In some examples of the present application, the method may further comprise: and (5) carrying out shape processing and cleaning on the shell to obtain the final shell.
In another aspect of the present application, an electronic device is presented. In some examples of the present application, with reference to fig. 8, the electronic device includes: casing 1000, mainboard and display screen (not shown in the figure), wherein, casing 1000 is preceding description, and casing 1000 includes the backshell and the lateral wall that links to each other with the backshell, and accommodation space is injectd with the backshell to casing 1000's lateral wall, and inside mainboard and display screen were located above-mentioned accommodation space, and the mainboard was close to the backshell setting, and the backshell setting is kept away from to the light-emitting side of display screen. Therefore, the electronic equipment has the integrated shell, is simple in structure and has a good appearance effect.
In some examples of the application, the electronic device may be any of various types of computer system devices that are mobile or portable and perform wireless communications. In particular, the electronic device may be a mobile or smart phone, a portable gaming device, a laptop computer, a personal digital assistant, a portable internet appliance, a music player, and a data storage device, other handheld devices, and devices such as a watch. Therefore, the electronic equipment has the integrated shell and has a good appearance effect.
In the description of the present application, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present application but do not require that the present application must be constructed and operated in a specific orientation, and thus, cannot be construed as limiting the present application.
Various examples and features of different examples described in this specification can be combined and combined by one skilled in the art without contradiction. In addition, it should be noted that the terms "first" and "second" are used in this specification for descriptive purposes only and are intended to visually distinguish between two adhesive layers and two release film layers in a decorative film sheet, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (17)
1. A motherboard film for use in the manufacture of a decorative film for an electronic device, comprising:
the decoration diaphragm rough blank that plane portion and a plurality of interval set up, decorate the diaphragm rough blank include the main part and with a plurality of lateral walls that the main part links to each other, wherein, at least one the lateral wall with the angle of bending between the main part place plane is greater than 88 degrees, plane portion with decorate the diaphragm rough blank the lateral wall links to each other, and is a plurality of pass through between the decoration diaphragm rough blank plane portion connects.
2. The master membrane for preparing the electronic equipment decorative membrane as claimed in claim 1, wherein the master membrane comprises a substrate, and a photosensitive adhesive transfer printing layer, a coating layer and a bottom covering ink layer which are sequentially laminated on the substrate.
3. The master film sheet for producing an electronic device decorative film sheet according to claim 2, further comprising:
the first adhesive layer is arranged on one side, far away from the photosensitive adhesive transfer printing layer, of the base material;
the first type rete of leaving, it is in to first type rete setting first glue film is kept away from one side of substrate.
4. The master film sheet for producing an electronic device decorative film sheet according to claim 3, further comprising:
the second adhesive layer is arranged on one side, far away from the coating layer, of the bottom ink layer;
the second is from type rete, the second is in from type rete setting the second glue film is kept away from one side on the lid end printing ink layer.
5. The master film for producing an electronic device decorative film according to claim 2, wherein a material constituting the base material comprises at least one of polyethylene terephthalate, polycarbonate, polypropylene, and a thermoplastic polyurethane elastomer.
6. A decorative film for an electronic device, wherein the decorative film is formed using the mother sheet film according to any one of claims 1 to 5, the decorative film comprising:
the bending angle between at least one side wall and the plane of the main body is larger than 88 degrees.
7. A housing, comprising:
the shell base body comprises a main body and a plurality of side walls connected with the main body, and the bending angle between at least one side wall and the plane of the main body is larger than 88 degrees;
the decoration membrane of claim 6, wherein the decoration membrane is arranged on the inner side of the shell base body, and the bending angle of the decoration membrane is matched with that of the shell base body.
8. The housing of claim 7, wherein the decorative membrane comprises:
the base material, set gradually photosensitive glue rendition layer, coating film layer and the printing ink layer of covering the end on the base material, and set up the base material is kept away from the first glue film of photosensitive glue rendition layer one side, it passes through to decorate the diaphragm the laminating of first glue film is in on the casing base member.
9. The housing of claim 7, further comprising at least one of the following:
the hardening layer is arranged on one side, far away from the decorative membrane, of the shell substrate;
the mirror surface silver ink layer is arranged between the shell body and the decoration membrane, and the mirror surface silver ink layer is provided with a preset pattern.
10. A method of making a decorative film for use in an electronic device, comprising:
preparing a mother board diaphragm rough blank which is of a plane structure;
performing the rough blank of the mother board membrane to form a mother board membrane, wherein the mother board membrane comprises a plane part and a plurality of decorative membrane rough blanks arranged at intervals, the decorative membrane rough blanks comprise a main body and a plurality of side walls connected with the main body, the bending angle between at least one side wall and the plane where the main body is located is larger than 88 degrees, the plane part is connected with the side wall of the decorative membrane rough blank, and the decorative membrane rough blanks are connected through the plane part;
and cutting the mother board membrane, removing the plane part in the mother board membrane, and reserving the rough blank of the decorative membrane to obtain the decorative membrane.
11. The method of claim 10, wherein the preforming comprises:
baking the rough blank of the motherboard membrane;
and carrying out hot bending treatment on the mother board membrane rough blank subjected to the baking treatment.
12. The method as claimed in claim 11, wherein the temperature of the baking treatment is 350-380 ℃, and the time of the baking treatment is 8-12 s.
13. The method of claim 11, wherein the master membrane blank comprises a substrate and, disposed thereon in that order, a photosensitive transfer layer, a coating layer, and a subbing ink layer,
in the hot bending treatment, the mother plate film is subjected toApplying 55-65kg/cm to one side of the sheet rough blank, which is provided with the bottom ink layer2The positive pressure of (a) is,
or applying negative pressure to one side of the mother board membrane rough blank, which is provided with the base material, so that the vacuum degree of the mother board membrane rough blank, which is provided with the base material, is-0.9 MPa to-0.8 MPa,
or applying 10-25kg/cm to one side of the mother board membrane rough blank provided with the bottom covering ink layer2The negative pressure is applied to one side of the mother board diaphragm rough blank, which is provided with the base material, so that the vacuum degree of the mother board diaphragm rough blank, which is provided with the base material, is between-0.9 MPa and-0.8 MPa,
the time of the hot bending treatment is 2-5s, and the temperature of the hot bending treatment is 100-145 ℃.
14. A method of making a housing, comprising:
providing a shell base body, wherein the shell base body comprises a main body and a plurality of side walls connected with the main body, and the bending angle between at least one side wall and the plane of the main body is larger than 88 degrees;
providing a decorative membrane prepared by the method of any one of claims 10-13, the decorative membrane having a bend angle matching the bend angle of the housing substrate;
and attaching the decorative film to the inner side of the shell substrate to obtain the shell.
15. The method of claim 14, wherein the conforming comprises:
extracting air between the decorative film and the shell substrate;
applying pressure to the decorative membrane to make the decorative membrane attached to the shell substrate,
wherein the air is extracted for 2-5s under pressure of 4-10kg/cm2The pressure is applied for a period of 3-5 seconds.
16. The method of claim 14, further comprising:
and (3) defoaming the shell, wherein the temperature of the defoaming treatment is 50-80 ℃, the pressure of the defoaming treatment is 5-10kgf, and the time of the defoaming treatment is 40-80 min.
17. An electronic device, comprising:
a housing as claimed in any one of claims 7 to 9, the housing comprising a back shell and side walls connected to the back shell, the side walls and the back shell defining a receiving space;
mainboard and display screen, the mainboard and the display screen is located inside the accommodation space, the mainboard is close to the dorsal scale sets up, just the light-emitting side of display screen is kept away from the dorsal scale sets up.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911083716.1A CN112778918B (en) | 2019-11-07 | 2019-11-07 | Mother board diaphragm, decorative diaphragm, shell, preparation method and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911083716.1A CN112778918B (en) | 2019-11-07 | 2019-11-07 | Mother board diaphragm, decorative diaphragm, shell, preparation method and electronic equipment |
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| CN112778918A true CN112778918A (en) | 2021-05-11 |
| CN112778918B CN112778918B (en) | 2022-12-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114126282A (en) * | 2021-11-04 | 2022-03-01 | Oppo广东移动通信有限公司 | Shell, manufacturing method thereof and electronic equipment |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5489355A (en) * | 1992-04-14 | 1996-02-06 | Dai Nippon Insatsu Kabushiki Kaisha | Method for producing glittering decorative boards |
| TW201236887A (en) * | 2011-03-15 | 2012-09-16 | Imprinting Lithography Decoration Tech Co Ltd | Transcription method of 3D pattern solidified with UV light |
| CN105474293A (en) * | 2014-07-18 | 2016-04-06 | 日东电工株式会社 | Method for applying optical film to optical display cell |
| CN106782094A (en) * | 2017-01-12 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of motherboard and preparation method thereof, cover plate and preparation method thereof, display device |
| JP2019032415A (en) * | 2017-08-07 | 2019-02-28 | 日東電工株式会社 | Method of manufacturing optical film with pressure-sensitive adhesive |
| CN109401651A (en) * | 2018-10-26 | 2019-03-01 | 京东方科技集团股份有限公司 | A kind of protective film and preparation method thereof and display master blank component |
| CN109927471A (en) * | 2019-04-04 | 2019-06-25 | Oppo广东移动通信有限公司 | Casting of electronic device and preparation method thereof and electronic equipment |
| CN110191605A (en) * | 2019-06-27 | 2019-08-30 | Oppo广东移动通信有限公司 | Housing unit and preparation method, electronic equipment |
| CN110191604A (en) * | 2019-06-27 | 2019-08-30 | Oppo广东移动通信有限公司 | Housing unit and preparation method thereof, electronic equipment |
| CN110229631A (en) * | 2019-06-19 | 2019-09-13 | Oppo广东移动通信有限公司 | Film layer structure and preparation method thereof, casing mechanism and electronic equipment |
-
2019
- 2019-11-07 CN CN201911083716.1A patent/CN112778918B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5489355A (en) * | 1992-04-14 | 1996-02-06 | Dai Nippon Insatsu Kabushiki Kaisha | Method for producing glittering decorative boards |
| TW201236887A (en) * | 2011-03-15 | 2012-09-16 | Imprinting Lithography Decoration Tech Co Ltd | Transcription method of 3D pattern solidified with UV light |
| CN105474293A (en) * | 2014-07-18 | 2016-04-06 | 日东电工株式会社 | Method for applying optical film to optical display cell |
| CN106782094A (en) * | 2017-01-12 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of motherboard and preparation method thereof, cover plate and preparation method thereof, display device |
| JP2019032415A (en) * | 2017-08-07 | 2019-02-28 | 日東電工株式会社 | Method of manufacturing optical film with pressure-sensitive adhesive |
| CN109401651A (en) * | 2018-10-26 | 2019-03-01 | 京东方科技集团股份有限公司 | A kind of protective film and preparation method thereof and display master blank component |
| CN109927471A (en) * | 2019-04-04 | 2019-06-25 | Oppo广东移动通信有限公司 | Casting of electronic device and preparation method thereof and electronic equipment |
| CN110229631A (en) * | 2019-06-19 | 2019-09-13 | Oppo广东移动通信有限公司 | Film layer structure and preparation method thereof, casing mechanism and electronic equipment |
| CN110191605A (en) * | 2019-06-27 | 2019-08-30 | Oppo广东移动通信有限公司 | Housing unit and preparation method, electronic equipment |
| CN110191604A (en) * | 2019-06-27 | 2019-08-30 | Oppo广东移动通信有限公司 | Housing unit and preparation method thereof, electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114126282A (en) * | 2021-11-04 | 2022-03-01 | Oppo广东移动通信有限公司 | Shell, manufacturing method thereof and electronic equipment |
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| CN112778918B (en) | 2022-12-27 |
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