CN112776079A

CN112776079A - Method for processing Chinese character 'kou' shaped glue

Info

Publication number: CN112776079A
Application number: CN202011572749.5A
Authority: CN
Inventors: 张炎
Original assignee: Jaehyun Electronic Suzhou Co ltd
Current assignee: Jaehyun Electronic Suzhou Co ltd
Priority date: 2020-12-23
Filing date: 2020-12-23
Publication date: 2021-05-11
Anticipated expiration: 2040-12-23
Also published as: CN112776079B

Abstract

The invention discloses a method for processing a Chinese character 'kou' shaped adhesive, the Chinese character 'kou' shaped adhesive adopts a double-sided adhesive without a base material, and the viscosity is better compared with the common double-sided adhesive with the base material, so that the width of each edge strip of the Chinese character 'kou' shaped adhesive can be made narrower, the use requirement of small electronic products is met, meanwhile, the double-sided adhesive without the base material is easier to strip after attachment error compared with the common double-sided adhesive, residual adhesive is not generated, the mounting difficulty is favorably reduced, and the mounting quality is ensured; and, through the ambient temperature during control production, can reduce the viscidity of no substrate double faced adhesive tape in the course of working to make the cull after the cutting more easily with the separation of mouth style of calligraphy gluey part, take the mouth style of calligraphy gluey part up when avoiding getting rid of the cull, adopt the mode of substep cutting shaping and substep to get rid of the cull in the course of working, also can reduce one-step cutting and tear the risk that non-product part caused the colloid part to be taken up, both reduced the processing degree of difficulty, also be favorable to guaranteeing machining efficiency and improving product quality.

Description

Method for processing Chinese character 'kou' shaped glue

Technical Field

The invention relates to the field of electronic product accessories, in particular to a method for processing a square glue.

Background

The adhesive is widely used in electronic devices, and can be used to bond panels, display modules or a combination thereof to complete the assembly of the electronic devices. For example, a frame-shaped adhesive with continuous patterns may be provided on the display module, the frame-shaped adhesive is located in the peripheral region of the display module and is disposed around the active region of the display module, so that the frame-shaped adhesive will not affect the display frame of the touch display device, and then the touch panel is attached to the display module through the frame-shaped adhesive to complete the assembly of the touch display device.

The existing square adhesive usually adopts a substrate double faced adhesive tape to realize the bonding performance, at the moment, the substrate double faced adhesive tape needs to have enough width to ensure enough viscosity, and the larger width is unfavorable for the use of liquid crystal screens with relatively smaller sizes, such as a tablet personal computer, a smart phone, a notebook computer and the like.

In addition, the conventional frame-shaped glue needs to be precisely aligned when being attached to the peripheral region to reduce the occurrence of improper attachment. In actual operation, often need revise many times just can paste the word in the mouth glue accurately, and current have substrate double faced adhesive tape to paste the back very difficult aversion again, tear by force, appear damaged, pollute attached position scheduling problem easily, use comparatively inconvenient.

Disclosure of Invention

The invention aims to solve the problems in the prior art and provide a method for processing a Chinese character 'kou' glue.

The purpose of the invention is realized by the following technical scheme:

the method for processing the adhesive for the Chinese character 'kou' comprises a 14-inch rectangular frame adhesive body made of a substrate-free double-faced adhesive tape, a first protective film and a second protective film, wherein the first protective film and the second protective film cover two sides of the adhesive body, the width of one long edge of the adhesive body is 1-1.35mm, the width of the other three edges is not more than 0.8mm, during processing, the environmental temperature is controlled to be 4-15 ℃, the environmental humidity is not more than 40%, and after two short edges of the adhesive body are cut, waste materials beside the two short edges are manually removed through an adhesive tape.

Preferably, in the method for processing the offset printing glue, the environmental temperature is controlled to be 4-5 ℃ during processing.

Preferably, in the method for processing the offset printing glue, the environmental humidity does not exceed 20% during processing.

Preferably, in the method for processing the square glue, the length of the two short edge strips is smaller than the distance between the two long edge strips, a gap is kept between each short edge strip and the two long edge strips, and the distance between the outer edges of the two short edge strips is the same as the length of the long edge strips.

Preferably, in the method for processing the square glue, when the waste outside the short side strips is removed, the adhesive tapes are manually pasted at the two ends of the waste simultaneously, and the waste is torn off by pulling the adhesive tapes at the two ends towards the middle simultaneously.

Preferably, the method for processing the offset printing glue comprises the following steps:

s01, cutting a first to-be-cut adhesive material with the width larger than two times of the width of the short edge strip from the adhesive material without the base material through a cutting machine according to a set frequency, and attaching the first to-be-cut adhesive material to a first protective film base material, wherein the length of the adhesive material without the base material is larger than that of the short edge strip, and the first protective film base material is conveyed by being driven by a driving roller;

s02, moving each first glue material to be cut to a first die cutting machine along with a first protective film base material, wherein the first die cutting machine cuts each first glue material to be cut to obtain two symmetrical cutting marks, and each cutting mark comprises an outer side edge of one short edge strip and short edges at two ends;

s03, moving the first to-be-cut adhesive material cut by the first die cutting machine along with the first protective film base material, and removing the release paper on the first to-be-cut adhesive material through the adhesive tape wound by the first winding roller;

s04, manually attaching an adhesive tape to the non-base material adhesive material at the outer end of the first cut and removing the non-base material adhesive material;

s05, moving the cut short edge strip along with a first protective film base material, and compounding two second materials to be subjected to glue cutting which are positioned at the outer sides of two ends of the short edge strip on the first protective film base material, wherein the width of each second material to be subjected to glue cutting is larger than that of the corresponding long edge strip;

s06, when the second material to be cut is moved to a second die cutting machine along with the first protective film base material, the second die cutting machine respectively cuts second cut marks on the two second materials to be cut, and each second cut mark comprises the outer side edge of one long edge strip and the short edges at the two ends;

s07, the second material to be cut which is cut by the second die cutting machine moves continuously along with the first protective film base material, and the release paper on the surfaces of the two second materials to be cut is removed through the adhesive tape wound by the second winding roller;

s08, removing a second material to be cut of the release paper, continuously moving along with the first protective film base material, and removing waste materials on the outer sides of the two second cuts through an adhesive tape wound by a third winding roller to obtain a colloid;

s09, compounding a second protective film substrate on the cut colloid, wherein the width of the second protective film substrate is larger than that of the colloid and does not exceed that of the second protective film substrate;

and S011, when one colloid on the first conveying film substrate moves to the outer side of a cutter of a tail end cutting machine, the tail end cutting machine cuts to obtain the square glue.

Preferably, in the method for processing a square offset, the method further includes S010 between S09 and S011, the second protective film is cut when the second protective film substrate moves to a third die cutter, the second protective film has a contour that is consistent with the contour of the offset and has a handle extending out of the offset, and the waste material cut off from the second protective film substrate is removed by an adhesive tape wound by a third winding roller.

The technical scheme of the invention has the advantages that:

this scheme adopts and does not have the substrate double faced adhesive tape, for ordinary substrate double faced adhesive tape that has, its viscidity is better, consequently even 14 very little mouth words of support glue the main part, can accomplish narrowly with the width of each strake of mouth words glue to satisfy little electronic product's use needs, still can have sufficient viscidity in order to guarantee sufficient stability when accomplishing many strakes and not exceeding 1 mm's small-size, and the required attached space that occupies is littleer. Meanwhile, compared with the common double-sided adhesive tape, the double-sided adhesive tape without the base material is easier to strip after attachment error, no residual adhesive is generated, the attachment difficulty is favorably reduced, and the attachment quality is ensured; and, through the ambient temperature during control production, can reduce the viscidity of no substrate double faced adhesive tape in the course of working to make the cull after the cutting more easily with the separation of mouth style of calligraphy gluey part, take the mouth style of calligraphy gluey part up when avoiding getting rid of the cull, adopt the mode of substep cutting shaping and substep to get rid of the cull in the course of working, also can reduce one-step cutting and tear the risk that non-product part caused the colloid part to be taken up, both reduced the processing degree of difficulty, also be favorable to guaranteeing machining efficiency and improving product quality.

The mouth style of calligraphy of this scheme is glued, keeps the clearance between each strake, on satisfying the attached basis of disposable, is difficult for attached problem when can avoiding the regional body structure of corner, also can avoid simultaneously when an strake needs the adjustment effectively, can influence the attached stability of other strakes, has avoided the mutual interference between four strakes, and the flexibility of adjustment is better to even when an strake goes wrong, can need not change other strakes, material saving.

The environmental humidity during this scheme further control production can with the temperature cooperation, reduces the viscidity that does not have the substrate to glue in the production process better to further reduce the probability of bringing up the product when cutting, getting rid of the waste material, guarantee the qualification rate of product.

According to the scheme, through the design of the processing sequence, the processing process steps can be effectively simplified, the processing efficiency is improved, corresponding equipment can be simplified, and the processing equipment cost is reduced.

When the scheme adopts the adhesive tape to remove the waste materials on two short sides, the product can be effectively prevented from being taken up through the design of the removing method, and the quality of the product is ensured.

Drawings

FIG. 1 is a cross-sectional view of a colloform of the present invention;

FIG. 2 is a top view of the offset of the present invention (the product scale is not the only limitation on the configuration of the embodiment);

FIG. 3 is a partial schematic view of the present invention after processing at step S01;

FIG. 4 is a partial schematic view of the invention after processing at step S02;

FIG. 5 is a partial schematic view of the invention after processing at step S04;

FIG. 6 is a partial schematic view of the invention after processing at step S05;

FIG. 7 is a partial schematic view of the invention after processing at step S06;

FIG. 8 is a partial schematic view of the invention after processing at step S07;

fig. 9 is a partial schematic view of the present invention after processing in step S08.

Detailed Description

Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.

In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the embodiment, the operator is used as a reference, and the direction close to the operator is a proximal end, and the direction away from the operator is a distal end.

The method for processing the glue according to the present invention is described below with reference to the accompanying drawings, and is used for processing a glue, as shown in fig. 1 and fig. 2, the glue includes a rectangular frame-shaped glue body 1 made of a double-sided glue without a base material, and a first protective film 2 and a second protective film 3 covering both sides of the glue body, the width of one long side bar 11 of the glue body 1 is not more than 1.35mm, the width of the other three

bars

12, 13, 14 is not more than 1mm, preferably, the width of the long side bar 11 is greater than the width of the other three bars, and is not less than 1mm, and the widths of the other three

bars

12, 13, 14 are the same and are not more than 0.8mm, more preferably between 0.6 mm and 0.7 mm.

The colloid 1 can be a closed frame shape, namely four edge strips are sequentially connected end to end. In a more preferred embodiment, as shown in fig. 2, the colloid 1 is not a closed rectangular frame, the lengths of the two

short edge strips

12 and 14 are smaller than the distance between the two

long edge strips

11 and 13, each

short edge strip

12 and 14 maintains a gap with the two

long edge strips

11 and 13, and the distance between the outer edges 121 and 141 of the two

short edge strips

12 and 14 is the same as the length of the

long edge strips

11 and 13, i.e. the four vertex angles of the colloid 1 have notches, so that the four edge strips are separated from each other and do not interfere with each other.

The second protection film 3 is a release film, the width and the length of the second protection film are matched with those of the colloid 1, and meanwhile, in order to facilitate subsequent use, the second protection film 3 is provided with a pull lug extending to the outside of the colloid 1 so as to separate the second protection film 3 from the colloid 1 in the subsequent use.

Due to the fact that the double-sided adhesive without the base material is adopted, the viscosity of the double-sided adhesive is larger, and meanwhile, the width of the edge strip of the adhesive body 1 is very narrow, so that the edge strip is easily lifted by the cutter and/or the waste materials to deform when the waste materials are cut and removed, and the product is unqualified.

Therefore, in specific processing, the inventors have conducted extensive studies to solve this problem:

in the first aspect, namely the aspect of production environment factors, the inventor finds out through a great deal of research that: in processing, the optimum temperature conditions are when the ambient temperature is controlled between 4 and 15 ℃, more preferably when the ambient temperature is controlled between 4 and 5 ℃: this is because the tackiness of the non-substrate adhesive is lower than that of the normal room temperature (20-25 ℃) under such a temperature condition, and therefore, when cutting and removing waste, particularly when removing waste, the problem that the waste and the desired adhesive portion are brought up due to excessive tackiness can be effectively reduced. Meanwhile, under the temperature condition, the non-substrate adhesive still has certain viscosity to ensure that the non-substrate adhesive can be effectively compounded with the first protective film substrate and the second protective film substrate and is adhered together, and compared with the lower temperature condition, the viscosity of the non-substrate adhesive is lost or too low, the non-substrate adhesive cannot be effectively compounded with the first protective film, the non-substrate adhesive cannot be conveyed and effectively keeps the shape of the cut colloid part in subsequent processing, and the non-substrate adhesive is not favorable for being adhered with a release film so as to remove the waste of the release film in the subsequent processing and is not favorable for stable processing.

Further, when the ambient humidity is controlled to be not more than 40%, more preferably not more than 20%, the control of the adhesiveness of the substrate-free double-sided adhesive can be effectively realized in cooperation with the temperature condition.

In a second aspect, the above problem is solved from the aspect of process steps, and the processing method of the offset in the present embodiment is described in detail below, specifically including the following steps:

s01, cutting the first to-be-cut adhesive material 10 with a width greater than two times of the width of the short edge strip from the base material-free adhesive material by a cutting machine according to a predetermined frequency, and attaching the first to-be-cut adhesive material to the first protective film base material 20, as shown in fig. 3, the cutting machine performs cutting of the base material-free adhesive material by using an asynchronous die cutting process in a die holder, and the specific structure of the cutting machine is known in the art and is not described herein. The length of the base material-free adhesive material is greater than that of the short edge strips, so that waste materials on two sides of the short edge strips can be removed conveniently; the first protective film substrate is driven by a driving roller to be conveyed, and a specific conveying structure is known in the art and is not described herein.

S02, moving the first material to be cut to a first die cutter along with the first protective film substrate, where the first die cutter cuts the first material to be cut to obtain two symmetrical cuts 30, each cut including an outer side 31 of a short edge and short sides 32 at two ends, as shown in fig. 4.

S03, the first material to be cut moves along with the first protective film substrate, and the release paper on the first material to be cut is removed by the tape wound by the first winding roller, where the process of removing the release paper and the waste material by the tape is a known technology and is not described herein again.

And S04, manually attaching the adhesive tape to the non-base material adhesive material at the outer end of the first cut and removing the non-base material adhesive material to obtain two adjacent short edge strips 12 and 14 of two adhesives, as shown in the attached figure 5.

S05, the cut short edge strips 12 and 14 move with the first protective film substrate, and two second materials to be cut 40 located at the outer sides of the two ends of the short edge strips are compounded on the first protective film substrate 10. The width of each second material 40 to be cut is larger than that of the corresponding long side bar, as shown in fig. 6.

S06, when the second material to be die-cut 40 moves to a second die-cutting machine along with the first protective film substrate 10, the second die-cutting machine cuts second cuts 50 on the two second materials to be die-cut 40, where the second cuts 50 include an outer side 51 of a long edge and short sides 52 at two ends, as shown in fig. 7.

S07, the second material to be cut 40 cut by the second die-cutting machine moves continuously along with the first protective film base material, and the release paper on the surfaces of the two second materials to be cut is removed through the adhesive tape wound by the second winding roller;

s08, the second material to be cut of the release paper is removed and moves continuously with the first protective film substrate, and the waste material outside the two second cuts 50 is removed by the adhesive tape wound by the third winding roller, so as to obtain two long side strips 11 and 13 located outside the two ends of the two short side strips 12 and 14, as shown in fig. 8.

S09, laminating a second protective film substrate 60 on the cut colloid 1, wherein the width of the second protective film substrate is greater than the width of the colloid and does not exceed the width of the second protective film substrate, as shown in fig. 9;

and S011, when one colloid on the first conveying film substrate moves to the outer side of a cutter of a tail end cutting machine, the tail end cutting machine cuts the colloid to obtain the glue with the shape of the Chinese character 'kou', as shown in the attached figure 2.

Preferably, in the method for processing a square offset, the method further includes S010 between S09 and S011, the second protective film is cut when the second protective film substrate moves to a third die cutter, the second protective film has a contour that is consistent with the contour of the offset and has a handle extending out of the offset, and the waste material cut off from the second protective film substrate is removed by an adhesive tape wound by a third winding roller. Of course, in other embodiments, this step is not necessary, and may be omitted, or the processed die adhesive may be directly wound into a roll by a winding roller. Or after passing through the third die cutting machine, the waste material is not cleared, and the waste material is cleared manually in the following process.

Of course, the step numbers are not the only limitation to the processing process of the scheme, for example, in other embodiments, the long side strips of the square glue may be processed first, and the short side strips may be processed. In other embodiments, the first protective film base material 20 may be first combined with a transport mold and transported by the transport mold.

The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.

Claims

1. The method for processing the adhesive tape is characterized by comprising the following steps: the adhesive tape for the Chinese character 'kou' comprises a 14-inch rectangular frame adhesive body made of a substrate-free double-faced adhesive tape, a first protective film and a second protective film, wherein the first protective film and the second protective film are covered on two sides of the adhesive body, the width of one long edge of the adhesive body is 1-1.35mm, the width of the other three edge strips is not more than 0.8mm, the environmental temperature is controlled to be 4-15 ℃ during processing, the environmental humidity is not more than 40%, and after two short edge strips of the adhesive body are cut out, waste materials beside the two short edge strips are manually removed through an adhesive.

2. The offset printing process of claim 1, wherein: and during processing, the environment temperature is controlled to be 4-5 ℃.

3. The offset printing process of claim 1, wherein: and when the material is processed, the ambient humidity is not more than 20%.

4. The offset printing process of claim 1, wherein: the length of two short strakes is less than the interval of two long strakes, and every short strake all keeps the clearance with two long strakes, the interval of the outside of two short strakes with the length of long strake is the same.

5. The offset printing process of claim 1, wherein: when the waste material outside the short edge strip is cleared away, the two ends of the waste material are simultaneously pasted with adhesive tapes manually, and the waste material is torn off by simultaneously pulling the adhesive tapes at the two ends to the middle.

6. The offset printing process of any one of claims 1 to 5, wherein: the method comprises the following steps:

7. The offset printing process of claim 6, wherein: and S010 is further included between the S09 and the S011, when the second protective film base material moves to a third die cutting machine, the second protective film is cut, the outline of the second protective film is consistent with the outline of the colloid, a handle extends out of the colloid, and waste materials cut off from the second protective film base material are removed through an adhesive tape wound by a third winding roller.