CN112771632A - 滤波电缆 - Google Patents
滤波电缆 Download PDFInfo
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- CN112771632A CN112771632A CN201980060453.4A CN201980060453A CN112771632A CN 112771632 A CN112771632 A CN 112771632A CN 201980060453 A CN201980060453 A CN 201980060453A CN 112771632 A CN112771632 A CN 112771632A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/02—Cables with twisted pairs or quads
- H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
- H01B11/10—Screens specially adapted for reducing interference from external sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/083—Evaporation or sublimation of a compound, e.g. gas bubble generating agent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Filters And Equalizers (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
一种滤波电缆,解决相关技术中的电缆不能在具备良好的滤波性能的同时又保证结构设计简单合理的问题,在沿所述滤波电缆径向的横截面中,从内向外依次设置有芯线(1)、包围所述芯线(1)的N层缺陷导体层;其中,所述缺陷导体层上具有刻蚀图案;所述刻蚀图案沿所述滤波电缆轴向分布式设置;所述刻蚀图案用于使得滤波电缆等效成预设的滤波电路,对所述滤波电缆中传输的信号进行滤波。
Description
PCT国内申请,说明书已公开。
Claims (12)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2019/091830 WO2020252678A1 (zh) | 2019-06-19 | 2019-06-19 | 滤波电缆 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112771632A true CN112771632A (zh) | 2021-05-07 |
CN112771632B CN112771632B (zh) | 2022-08-02 |
Family
ID=74036598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980060453.4A Active CN112771632B (zh) | 2019-06-19 | 2019-06-19 | 滤波电缆 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11929189B2 (zh) |
EP (1) | EP3780018A4 (zh) |
JP (1) | JP7101261B2 (zh) |
CN (1) | CN112771632B (zh) |
CA (1) | CA3096793A1 (zh) |
WO (1) | WO2020252678A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113811960A (zh) * | 2020-04-13 | 2021-12-17 | 韩宇南 | 滤波电缆 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115714245A (zh) * | 2021-08-23 | 2023-02-24 | 华为技术有限公司 | 一种滤波器、天线、基站以及滤波器的制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003019871A1 (en) * | 2001-08-24 | 2003-03-06 | Permeo Technologies, Inc. | Network application association |
CN101038802A (zh) * | 2007-02-12 | 2007-09-19 | 孟莉 | 去耦屏蔽电缆的连接方法 |
CN102067244A (zh) * | 2008-05-19 | 2011-05-18 | 泛达公司 | 改善串扰衰减的通信电缆 |
CN102341867A (zh) * | 2009-03-03 | 2012-02-01 | 泛达公司 | 制造用于通信电缆的马赛克带的方法和设备 |
CN102629703A (zh) * | 2012-05-08 | 2012-08-08 | 重庆大学 | 一种缺陷微带线结构的微带低通滤波器 |
CN205140595U (zh) * | 2015-11-13 | 2016-04-06 | 中国西电集团公司 | 一种宽频漏泄同轴电缆 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3312774A (en) * | 1965-02-10 | 1967-04-04 | John D Drinko | Semi-insulating shielding for cables and the like and comprising discrete "floating"patches of semi-conductive material |
FR2176574B1 (zh) * | 1972-03-24 | 1974-08-02 | Prache Marie Pi Rre | |
US4223287A (en) * | 1977-02-14 | 1980-09-16 | Murata Manufacturing Co., Ltd. | Electrical filter employing transverse electromagnetic mode coaxial resonators |
JPH07131236A (ja) * | 1993-10-29 | 1995-05-19 | Fujikura Ltd | 漏洩同軸ケーブル |
US5686697A (en) | 1995-01-06 | 1997-11-11 | Metatech Corporation | Electrical circuit suspension system |
JP4833571B2 (ja) * | 2004-03-31 | 2011-12-07 | ニッタ株式会社 | 電磁波吸収体 |
DE102004042656B3 (de) * | 2004-09-03 | 2005-12-29 | Draka Comteq Germany Gmbh & Co. Kg | Mehrlagige, streifenförmige Abschirmfolie für elektrische Leitungen und damit ausgerüstetes elektrisches Kabel, insbesondere Datenübertragungskabel |
PL1872440T3 (pl) * | 2005-03-28 | 2014-03-31 | Leviton Manufacturing Co | System i sposób nieciągłego ekranowania kabla |
US7923641B2 (en) * | 2006-08-11 | 2011-04-12 | Superior Essex Communications LLP | Communication cable comprising electrically isolated patches of shielding material |
KR100817981B1 (ko) * | 2006-11-20 | 2008-03-31 | 엘에스전선 주식회사 | 광대역 누설 동축 케이블 |
AU2009221806B2 (en) * | 2008-03-06 | 2014-04-03 | General Cable Technology Corp. | Communication cable with improved crosstalk attenuation |
US8354590B2 (en) * | 2008-11-10 | 2013-01-15 | Panduit Corp. | Communication cable with improved crosstalk attenuation |
CN201303038Y (zh) * | 2008-11-14 | 2009-09-02 | 中天日立射频电缆有限公司 | 短节距交错混合开槽辐射型漏泄同轴电缆 |
EP2287964A1 (en) * | 2009-08-19 | 2011-02-23 | Alcatel Lucent | Device for filtering radio frequency signals and system thereof |
JP2011066094A (ja) * | 2009-09-15 | 2011-03-31 | Nitta Corp | 電磁波吸収体、パーティション、電波暗箱、建材、無線通信システムおよび無線通信方法 |
US10530072B2 (en) | 2015-10-09 | 2020-01-07 | Ppc Broadband, Inc. | Mini isolator |
CN205790739U (zh) | 2016-05-11 | 2016-12-07 | 安徽远征电缆科技有限公司 | 一种抗干扰电缆组件 |
US10186350B2 (en) * | 2016-07-26 | 2019-01-22 | General Cable Technologies Corporation | Cable having shielding tape with conductive shielding segments |
US20220181046A1 (en) * | 2020-12-04 | 2022-06-09 | Dongguan Ching Tai Electric Wire & Cable Co.,Ltd. | Manufacturing method of a screening tape for an unshielded signal transmission cable |
-
2019
- 2019-06-19 WO PCT/CN2019/091830 patent/WO2020252678A1/zh unknown
- 2019-06-19 CA CA3096793A patent/CA3096793A1/en active Pending
- 2019-06-19 EP EP19906589.7A patent/EP3780018A4/en active Pending
- 2019-06-19 JP JP2020564139A patent/JP7101261B2/ja active Active
- 2019-06-19 CN CN201980060453.4A patent/CN112771632B/zh active Active
- 2019-06-19 US US16/954,886 patent/US11929189B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003019871A1 (en) * | 2001-08-24 | 2003-03-06 | Permeo Technologies, Inc. | Network application association |
CN101038802A (zh) * | 2007-02-12 | 2007-09-19 | 孟莉 | 去耦屏蔽电缆的连接方法 |
CN102067244A (zh) * | 2008-05-19 | 2011-05-18 | 泛达公司 | 改善串扰衰减的通信电缆 |
CN102341867A (zh) * | 2009-03-03 | 2012-02-01 | 泛达公司 | 制造用于通信电缆的马赛克带的方法和设备 |
CN102629703A (zh) * | 2012-05-08 | 2012-08-08 | 重庆大学 | 一种缺陷微带线结构的微带低通滤波器 |
CN205140595U (zh) * | 2015-11-13 | 2016-04-06 | 中国西电集团公司 | 一种宽频漏泄同轴电缆 |
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CN113811960A (zh) * | 2020-04-13 | 2021-12-17 | 韩宇南 | 滤波电缆 |
CN113811960B (zh) * | 2020-04-13 | 2024-05-07 | 韩宇南 | 滤波电缆 |
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CN112771632B (zh) | 2022-08-02 |
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