CN112768172B - Object cooling device - Google Patents
Object cooling device Download PDFInfo
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- CN112768172B CN112768172B CN202011603754.8A CN202011603754A CN112768172B CN 112768172 B CN112768172 B CN 112768172B CN 202011603754 A CN202011603754 A CN 202011603754A CN 112768172 B CN112768172 B CN 112768172B
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- cooling
- shielding layer
- cooling medium
- container
- cold head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/04—Cooling
Abstract
The invention discloses an object cooling device, which comprises a low-temperature container and a cooling pipeline, wherein the low-temperature container comprises an outer container, an inner container and a shielding layer, the inner container is internally arranged in the outer container and is used for containing a first cooling medium and an object to be cooled, which is in thermal contact with the first cooling medium, and the shielding layer is arranged between the outer container and the inner container; the cooling duct is in thermal contact with the shielding layer and has a circulating second cooling medium disposed therein. The invention can uniformly cool the shielding layer.
Description
Technical Field
The invention relates to the technical field of cooling, in particular to an object cooling device.
Background
The magnetic resonance imaging system, also called magnetic resonance imaging, is widely used in medical diagnosis, and the basic principle is that a magnet is utilized to generate a uniform strong magnetic field, hydrogen atoms in a diagnosis object body are polarized under the cooperation of a specific gradient field generated by a gradient coil, then radio frequency pulses are emitted by a radio frequency coil to excite hydrogen atomic nuclei to cause nuclear resonance, energy is absorbed, namely nuclear magnetic resonance, and the position and the type of the atomic nuclei constituting the object can be known by detecting electromagnetic waves emitted by an external gradient magnetic field according to different attenuation of the released energy in different structural environments inside the object, so that a structural image of the inside of the object can be drawn.
In the current conventional superconducting MRI system, most of the superconducting magnets are NbTi superconducting magnets, and the superconducting magnets (or coils) are usually encapsulated in a liquid helium container, so that the superconducting magnets are fully immersed or partially immersed by liquid helium, and the stable operation of the superconducting magnets is ensured. The outside of the liquid helium tank is usually provided with a low-temperature cold screen for isolating the heat radiation heat of the 300K outer container to the 4.2K liquid helium tank, and the lower the temperature of the cold screen is, the better the radiation isolating effect is. At present, the cold screen is cooled by a cold head, and the temperature of the cold screen can be generally reduced to 50-70K.
In this structure, because the volume of the cold shield is larger, a temperature difference can be generated on the cold shield, the temperature near the cold head end is lower, the temperature far away from the cold head end is higher, and especially for a magnet with high field strength, because the volume of the superconducting coil is increased, the cold shield is larger, a larger temperature difference is generated on the cold shield, for example, the temperature far away from the cold head end to 70-100K, the heat shielding effect is greatly weakened, and the heat load of the liquid helium tank is increased.
Disclosure of Invention
In view of the foregoing, it is necessary to provide a superconducting coil cooling device, which solves the technical problem of uneven temperature of a cold screen in the prior art.
In order to achieve the above technical object, the present invention provides an object cooling device, including:
the low-temperature container comprises an outer container, an inner container and a shielding layer, wherein the inner container is internally arranged in the outer container and is used for containing a first cooling medium and an object to be cooled, which is in thermal contact with the first cooling medium, and the shielding layer is arranged between the outer container and the inner container;
and a cooling pipe in thermal contact with the shielding layer and having a circulating second cooling medium disposed therein.
In one embodiment, the object cooling device further comprises a refrigerator for cooling the first cooling medium and/or the shielding layer.
In one embodiment, the object cooling device further comprises a power source connected to both ends of the cooling pipe for driving the second cooling medium flow in the cooling pipe to circulate.
In one embodiment, the object cooling device further comprises a first heat exchanger connected to the cooling pipe for transferring heat of the second cooling medium in the cooling pipe to the refrigerator for cooling the second cooling medium.
In one embodiment, the first heat exchanger is connected to the refrigerator by a heat conducting block.
In one embodiment, the object cooling device further comprises a second heat exchanger, wherein the second heat exchanger is connected to the cooling pipeline and arranged between the first heat exchanger and the power source, and is used for heating the second cooling medium in the cooling pipeline.
In one embodiment, the cooling duct is disposed around the shielding layer.
In one embodiment, the interior of the outer container is evacuated.
In one embodiment, the cryogenic container further comprises a mounting portion, the mounting portion is connected to the outer wall of the outer container, a cold head cavity is formed in the mounting portion, the cold head cavity is communicated with the inner container, the refrigerator is a cold head component, and the cold head component is arranged in the cold head cavity and is used for providing cold energy for the first cooling medium and the shielding layer.
In one embodiment, the power source comprises a helium compressor, wherein an air inlet end of the helium compressor is communicated with the air outlet ends of the cold head component and the cooling pipeline, and an air outlet end of the helium compressor is communicated with the air inlet ends of the cold head component and the cooling pipeline.
Compared with the prior art, the invention has the beneficial effects that: the cooling pipeline is arranged between the shielding layer and the outer container, and the circulating second cooling medium is introduced into the cooling pipeline, so that the heat of the shielding layer is absorbed by the circulating second cooling medium, the heat of the shielding layer is uniformly distributed, the temperature difference of the shielding layer is reduced, and the evaporation of liquid helium can be reduced.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form a part hereof, and together with the description serve to explain the principles of the invention, and are not intended to limit the scope of the invention.
It should be understood that the term "and/or" as used herein is merely one way of describing an association of associated objects, meaning that there may be three relationships, e.g., a and/or b, which may represent: the first and second cases exist separately, and the first and second cases exist separately. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
Referring to fig. 1, the present invention provides an object cooling device for cooling an object 1, in which the object 1 is a superconducting magnet or coil of a magnetic resonance imaging system, but the object 1 to be cooled is not limited thereto.
The object cooling device comprises a cryogenic container 2 and a cooling pipe 3, the cryogenic container 2 comprises an outer container 21, an inner container 22 and a shielding layer 23, the inner container 22 is internally provided with the outer container 21 and is used for containing a first cooling medium and an object 1 to be cooled, which is in thermal contact with the first cooling medium, and the shielding layer 23 is arranged between the outer container 21 and the inner container 22.
Wherein the object 1 to be cooled may be immersed in a first cooling medium.
The outer container 21, the inner container 22 and the shielding layer 23 are circular tubular bodies each having a cavity formed therein, but the shape and structure of the outer container 21, the inner container 22 and the shielding layer 23 are not limited thereto.
In this embodiment, the inside of the outer container 21 is evacuated.
Wherein, namely, the shielding layer 23 is placed in vacuum between the inner container 22 and the outer container 21, and the shielding layer 23 is not contacted with the inner container 22 and the outer container 21.
By setting the inside of outer container 21 to be vacuum, heat convection from the outside to shielding layer 23 via outer container 21 can be effectively reduced, and the refrigerating capacity required for shielding layer 23 can be reduced.
The first cooling medium may be a fluid with a cooling effect, and in this embodiment, the first cooling medium is liquid helium.
By immersing the superconducting magnet in the first cooling medium, the superconducting magnet can be operated while maintaining a superconducting state at a lower temperature.
The cooling duct 3 is in thermal contact with the shielding layer 23 and is provided with a circulating second cooling medium therein.
Wherein the cooling conduit 3 is arranged between the outer vessel 21 and the shielding layer 23.
In the present embodiment, the cooling pipe 3 is disposed around the shielding layer 23, and the cooling pipe 3 is attached to the outer wall of the shielding layer 23.
In this embodiment, the cooling pipe 3 is a square pipe with a square cross section, or a circular pipe with a circular cross section, and in this embodiment, the cooling pipe 3 is a square pipe with a square cross section, and the cross section of the cooling pipe 3 is square and can be better attached to the outer wall of the shielding layer 23, so that the contact area between the cooling pipe 3 and the shielding layer 23 can be increased, but the shape of the cross section of the cooling pipe 3 is not limited thereto.
The cooling pipe 3 may be annular, spiral, or the like, and in this embodiment, the cooling pipe 3 is annular, but the shape of the cooling pipe 3 is not limited thereto; the material of the cooling pipe 3 may be silver, copper, aluminum, stainless steel, etc. with good thermal conductivity, and in this embodiment, the cooling pipe 3 is copper pipe, but the material of the cooling pipe 3 is not limited thereto.
The cooling pipeline 3 surrounds the shielding layer 23, and the circulating second cooling medium is introduced into the cooling pipeline 3, so that the heat of the shielding layer 23 is absorbed by the circulating second cooling medium, the heat of the shielding layer 23 is uniformly distributed, the temperature difference of the shielding layer 23 is reduced, the local overhigh temperature of the shielding layer 23 can be avoided, and the evaporation of liquid helium can be reduced.
The second cooling medium may be a fluid with a cooling effect, and in this embodiment, the second cooling medium is helium.
In this embodiment, the object cooling device further comprises a refrigerator 4, and the refrigerator 4 is used for cooling the first cooling medium and/or the shielding layer 23.
In this embodiment, the cryogenic container 2 further includes a mounting portion 24, the mounting portion 24 is connected to the outer wall of the outer container 21, the mounting portion 24 is provided with a coldhead cavity, the coldhead cavity is communicated with the inner container 22, the refrigerator 4 is a coldhead component, and the coldhead component is disposed in the coldhead cavity.
The cold head component and the cold head cavity can be vertically arranged, and can also be obliquely arranged relative to the vertical direction device, in the embodiment, the cold head component and the cold head cavity are both vertically arranged, but the arrangement modes of the cold head component and the cold head cavity are not limited to the above.
Further, the cold head cavity comprises a first cavity 24a and a second cavity 24b which are communicated, the second cavity 24b is smaller than the first cavity 24a in size and is arranged below the first cavity 24a,
the cold head component comprises a first-stage cold head 41 and a second-stage cold head 42, the first-stage cold head 41 is inserted into the first cavity 24a, the refrigerating temperature of the first-stage cold head 41 is about 50K, and the first-stage cold head 41 can maintain the shielding layer 23 in a low-temperature state; the second stage cold head 42 is located below the first stage cold head 41 and is inserted into the second cavity 24b, the refrigeration temperature of the second stage cold head 42 is about 4.2K, and the second stage cold head 42 is used for maintaining the temperature in the inner container 22 in a low-temperature environment, so that the superconducting coil 10 is stably in a low-temperature operation environment.
The first stage cold head 41 and the second stage cold head 42 are both in a truncated cone shape, but the shapes of the first stage cold head 41 and the second stage cold head 42 are not limited thereto.
In this embodiment, the cryogenic container 2 further comprises a return tube 25, one end of the return tube 25 being in communication with the coldhead cavity and the other end being in communication with the inner container 22.
Wherein one end of the return pipe 25 communicates with the bottom of the second chamber 24b, and the other end passes through the outer container 21, the shielding layer 23, the inner container 22 and communicates with the inner container 22.
The object cooling device further comprises a heat conducting strip 5, wherein the heat conducting strip 5 is connected to the first stage cold head 41 and the shielding layer 23.
By arranging the heat conducting strip 5, the cooling capacity on the first-stage cold head 41 is transferred to the shielding layer 23, the temperature of the shielding layer 23 can be reduced, the temperature of the shielding layer 23 is kept at about 50K, the lower the temperature of the cold screen is, the better the radiation isolation effect is, and the shielding layer 23 about 50K can effectively block the heat radiated to the inner container 22 by the outer container 21, so that the evaporation of liquid helium is reduced.
In this embodiment, the object cooling device further includes a power source 6, where the power source 6 is connected to two ends of the cooling pipe 3, and is used to drive the second cooling medium flow in the cooling pipe 3 to circulate.
In this embodiment, the power source 6 includes a helium compressor 61, an air inlet end of the helium compressor 61 is respectively communicated with an air outlet end of the cold head component and an air outlet end of the cooling pipeline 3 through an air return pipe 62 and an air return branch pipe 63, an air outlet end of the helium compressor 61 is respectively communicated with an air inlet end of the cold head component and an air inlet end of the cooling pipeline 3 through an air inlet pipe 64 and an air inlet branch pipe 65, and the structure of the power source 6 is not limited thereto.
By introducing the high-pressure gas-separated portion generated by the helium compressor 61 into the cooling pipe 3, the existence of the circulating helium in the cooling pipe 3 can be promoted, and the heat of the shielding layer 23 can be continuously absorbed by the circulating helium.
In this embodiment, the object cooling device further includes a first heat exchanger 7, where the first heat exchanger 7 is connected to the cooling pipe 3, and is configured to transfer heat of the second cooling medium in the cooling pipe 3 to the refrigerator 4 to cool the second cooling medium.
In this embodiment, the first heat exchanger 7 is connected with the refrigerator 4 through the heat conducting block 8, and further, the first heat exchanger 7 is connected with the first stage cold head 41 of the cold head component through the heat conducting block 8, so that heat is transferred from the cooling pipeline 3 to the first stage cold head 41 through the first heat exchanger 7 and the heat conducting block 8, the temperature of the second cooling medium in the cooling pipeline 3 is close to 50K, the shielding layer 23 is cooled through the cooled second cooling medium, and the problem that the temperature distribution of the shielding layer 23 is uneven is avoided.
In this embodiment, the heat conducting block 8 is annular and is coaxially disposed with the first stage cold head 41, the heat conducting block 8 is sleeved on the cold head component and disposed between the bottom inner wall of the first cavity 24a and the first stage cold head 41, two ends of the heat conducting block 8 are respectively attached to the first stage cold head 41 and the bottom inner wall of the first cavity 24a, and the shape of the heat conducting block 8 is not limited thereto.
Through setting up to be annular heat conduction piece 8, can effectually realize the heat between first order cold head 41 and the first heat exchanger 7 be connected, annular heat conduction piece 8 has increased the area of contact with first order cold head 41, can effectively give first heat exchanger 7 with the cold volume transfer of first order cold head 41, and annular heat conduction piece 8 can seal the intercommunication department of second cavity 24b and first cavity 24a after the cooperation of first order cold head 41, avoid helium steam to get into first cavity 24a through second cavity 24b, avoid helium loss.
The material of the heat conducting block 8 may be silver, copper, aluminum, stainless steel, etc. with good heat conductivity, and in this embodiment, the heat conducting block 8 is a copper block, but the material of the heat conducting block 8 is not limited thereto.
In this embodiment, the object cooling device further includes a second heat exchanger 9, where the second heat exchanger 9 is connected to the cooling pipe 3 and disposed between the first heat exchanger 7 and the power source 6, and is configured to heat a second cooling medium in the cooling pipe 3, so that the temperature of the second cooling medium is raised to about 300K.
The second heat exchanger 9 may be disposed inside the outer container 21 or on an outer wall of the outer container 21, so as to exchange heat between the second cooling medium and the outside, and raise the temperature of the second cooling medium to about 300K.
Through setting up second heat exchanger 9, can heat up the second cooling medium that flows in the cooling pipeline 3 for the temperature of second cooling medium in the cooling pipeline 3 heats up to about 300K, avoids the too low outer wall that leads to the pipeline of second cooling medium that flows out cooling pipeline 3 to freeze or frosting, still can pre-cool down the second cooling medium that gets into cooling pipeline 3 simultaneously.
The working process of the invention is that the helium compressor 61 injects high-pressure helium gas of 19 to 24bar into the air inlet pipe 64 and the air inlet branch pipe 65 respectively, the high-pressure helium gas enters the cold head part through the air inlet pipe 64, the cold head part returns low-pressure helium gas of about 5 to 7bar, the low-pressure helium gas returns to the helium compressor 61 through the air return pipe 62, the high-pressure helium gas enters the cooling pipeline 3 through the air inlet branch pipe 65, the high-pressure helium gas enters the air return branch pipe 63 after flowing through the cooling pipeline 3, and enters the air return branch pipe 63 to return to the helium compressor 61, and the helium compressor 61 is compressed into high-pressure helium gas again, and the steps are repeated continuously.
For a magnet with high field strength, as the volume of the superconducting coil is increased, the shielding layer 23 is larger, so that a larger temperature difference is generated on the shielding layer 23, for example, the shielding layer 23 which is far away from the cold head end to 70-100K, so that the heat shielding effect is greatly weakened, and the heat load of the inner container 22 is increased.
In the helium circulation process, helium in the cooling pipeline 3 is circulated by using pressure difference generated by the helium compressor, and the cooling capacity of the cold head part is driven to cool the cooling pipeline 3 covered on the surface of the shielding layer 23, so that the shielding layer 23 is cooled, the whole cooling temperature of the shielding layer 23 is uniform, the condition of high temperature far away from the far end of the cold head part is avoided, and the helium circulation device is particularly suitable for large magnets.
Because the heat can not be absolutely isolated, the inner container 22 can bear certain heat, the liquid helium evaporates to form helium vapor after being heated, the heat is absorbed when the liquid helium is converted into helium vapor, the temperature in the inner container 22 is about 4.2K, part of helium liquid in the inner container 22 is heated to evaporate into helium vapor, the helium vapor flows to the upper cavity of the inner container 22, the helium vapor enters the second cavity 24b through the return pipe 25 after reaching the upper cavity of the inner container 22, the helium vapor is liquefied after contacting the cold second-stage cold head 42 and is condensed on the outer wall of the second-stage cold head 42, the liquid helium slides to the bottom of the second cavity 24b under the action of gravity and flows back to the inner container 22 through the return pipe 25, the second-stage cold head 42 continuously provides cold energy, the evaporated helium vapor is condensed, the condensed liquid helium returns to the inner container 22, the inner cavity of the inner container 22 is always in a proper temperature range, the continuous loss of the liquid helium can be effectively avoided, the low-temperature energy can effectively keep the superconducting coil in a superconducting state, and the superconducting stability of the whole superconducting system is ensured.
In the process of converting the liquid helium into the gas state and then into the liquid state from the gas state, the liquid helium is always positioned in the inner container 22 and the second cavity 24b, the liquid helium or helium vapor cannot enter the atmosphere, the threat to operators is small, and the leakage amount is small.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (5)
1. An object cooling device, characterized by comprising:
the low-temperature container comprises an outer container, an inner container and a shielding layer, wherein the inner container is internally arranged in the outer container and is used for containing a first cooling medium and an object to be cooled, which is in thermal contact with the first cooling medium, and the shielding layer is arranged between the outer container and the inner container;
the refrigerator is used for cooling the first cooling medium;
a cooling duct in thermal contact with the shielding layer and having a circulating second cooling medium disposed therein, the cooling duct being disposed around the shielding layer;
the power source is connected to two ends of the cooling pipeline and used for driving the second cooling medium flow in the cooling pipeline to circularly flow;
the first heat exchanger is connected with the cooling pipeline and used for transferring heat of the second cooling medium in the cooling pipeline to the refrigerator so as to cool the second cooling medium;
and the second heat exchanger is connected with the cooling pipeline and arranged between the first heat exchanger and the power source and is used for realizing heat exchange between a second cooling medium and the outside so as to heat the second cooling medium in the cooling pipeline.
2. The object cooling device of claim 1, wherein the first heat exchanger is connected to the refrigerator by a heat conducting block.
3. The object cooling device of claim 1 wherein the interior of the outer container is vacuum.
4. The object cooling device according to claim 3, wherein the cryogenic container further comprises a mounting portion connected to an outer wall of the outer container, the mounting portion is provided with a coldhead cavity, the coldhead cavity is in communication with the inner container, the refrigerator is a coldhead component, and the coldhead component is disposed in the coldhead cavity and is configured to provide coldness to the first cooling medium and the shielding layer.
5. The object cooling device of claim 4 wherein the power source comprises a helium compressor, an inlet end of the helium compressor being in communication with both the cold head component and an outlet end of the cooling conduit, and an outlet end of the helium compressor being in communication with both the cold head component and the inlet end of the cooling conduit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011603754.8A CN112768172B (en) | 2020-12-29 | 2020-12-29 | Object cooling device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011603754.8A CN112768172B (en) | 2020-12-29 | 2020-12-29 | Object cooling device |
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| CN112768172A CN112768172A (en) | 2021-05-07 |
| CN112768172B true CN112768172B (en) | 2023-07-28 |
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| CN202011603754.8A Active CN112768172B (en) | 2020-12-29 | 2020-12-29 | Object cooling device |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116313372B (en) * | 2023-05-23 | 2023-08-11 | 宁波健信超导科技股份有限公司 | Superconducting magnet and cooling system and method thereof |
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| JP6165267B2 (en) * | 2013-01-11 | 2017-07-19 | スミトモ （エスエイチアイ） クライオジェニックス オブ アメリカ インコーポレイテッドＳｕｍｉｔｏｍｏ（ＳＨＩ）Ｃｒｙｏｇｅｎｉｃｓ ｏｆ Ａｍｅｒｉｃａ，Ｉｎｃ． | MRI cooling device |
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