CN112768172A - Object cooling device - Google Patents
Object cooling device Download PDFInfo
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- CN112768172A CN112768172A CN202011603754.8A CN202011603754A CN112768172A CN 112768172 A CN112768172 A CN 112768172A CN 202011603754 A CN202011603754 A CN 202011603754A CN 112768172 A CN112768172 A CN 112768172A
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- cooling
- cold head
- shielding layer
- container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/04—Cooling
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- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
The invention discloses an object cooling device, which comprises a low-temperature container and a cooling pipeline, wherein the low-temperature container comprises an outer container, an inner container and a shielding layer, the inner container is arranged in the outer container and used for containing a first cooling medium and an object to be cooled, which is in thermal contact with the first cooling medium, and the shielding layer is arranged between the outer container and the inner container; the cooling pipeline is in thermal contact with the shielding layer and is internally provided with a second cooling medium which flows circularly. The invention can uniformly cool the shielding layer.
Description
Technical Field
The invention relates to the technical field of cooling, in particular to an object cooling device.
Background
The basic principle of the magnetic resonance imaging system, also called magnetic resonance imaging, is that a magnet is used to generate a uniform strong magnetic field, hydrogen atoms in the body of a diagnostic object are polarized under the coordination of a gradient field generated by a gradient coil, then a radio frequency coil emits radio frequency pulses to excite the hydrogen nuclei, nuclear resonance is caused, energy, namely nuclear magnetic resonance, the positions and the types of the nuclei forming the object can be known by detecting the emitted electromagnetic waves through an external gradient magnetic field according to different attenuations of the released energy in different structural environments in the object, and accordingly, a structural image in the object can be drawn.
In the conventional superconducting MRI system, most of the superconducting magnets are NbTi superconducting magnets, and such superconducting magnets (or coils) are usually enclosed in a liquid helium container, and are fully or partially immersed by liquid helium, so as to ensure stable operation of the superconducting magnets. A low-temperature cold screen is arranged on the outer side of the liquid helium tank and used for isolating the heat radiation of the 300K outer container to the 4.2K liquid helium tank, and the lower the temperature of the cold screen is, the better the radiation isolation effect is. At present, the cold shield is cooled through a cold head, and the temperature of the cold shield can be generally reduced to 50-70K.
In this kind of structure, because the cold screen is bulky, can produce the difference in temperature on the cold screen, it is lower to be close to cold head end temperature, and it is higher to keep away from cold head end temperature, especially to the magnet of high field strength, because superconducting coil volume increases, the cold screen is bigger thereupon, leads to producing great difference in temperature on the cold screen, if keep away from cold head end to 70 to 100K, heat shielding effect weakens greatly, increases the heat burden of liquid helium jar.
Disclosure of Invention
In view of the above, there is a need for a cooling device for a superconducting coil, which solves the problem of uneven cold shield temperature in the prior art.
In order to achieve the above object, an aspect of the present invention provides an object cooling apparatus, including:
a low-temperature container which comprises an outer container, an inner container and a shielding layer, wherein the inner container is arranged in the outer container and is used for containing a first cooling medium and an object to be cooled in thermal contact with the first cooling medium, and the shielding layer is arranged between the outer container and the inner container;
and the cooling pipeline is in thermal contact with the shielding layer and is internally provided with a second cooling medium which flows in a circulating mode.
In one embodiment, the object cooling device further comprises a refrigerator for cooling the first cooling medium and/or the shielding layer.
In one embodiment, the object cooling device further comprises a power source connected to both ends of the cooling duct for circulating the second cooling medium flow in the cooling duct.
In one embodiment, the object cooling device further comprises a first heat exchanger connected to the cooling duct for transferring heat of the second cooling medium in the cooling duct to the refrigerator to cool the second cooling medium.
In one embodiment, the first heat exchanger is connected to the refrigerator through a heat conducting block.
In one embodiment, the object cooling device further includes a second heat exchanger connected to the cooling duct and disposed between the first heat exchanger and the power source, for heating the second cooling medium in the cooling duct.
In one embodiment, the cooling conduit is disposed around the shield layer.
In one of the embodiments, the inner vacuum of the outer container.
In one embodiment, the low-temperature container further comprises an installation part, the installation part is connected to the outer wall of the outer container, a cold head cavity is formed in the installation part, the cold head cavity is communicated with the inner container, the refrigerator is a cold head component, and the cold head component is arranged in the cold head cavity and used for providing cold energy for the first cooling medium and the shielding layer.
In one embodiment, the power source comprises a helium compressor, the air inlet end of the helium compressor is communicated with the air outlet ends of the cold head part and the cooling pipeline, and the air outlet end of the helium compressor is communicated with the air inlet ends of the cold head part and the cooling pipeline.
Compared with the prior art, the invention has the beneficial effects that: through setting up cooling tube between shielding layer and outer container to let in the second cooling medium of circulation flow in cooling tube, absorb the heat of shielding layer through the second cooling medium of circulation flow, make the heat distribution of shielding layer even, reduce the difference in temperature on shielding layer, reducible liquid helium's evaporation.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate preferred embodiments of the invention and together with the description, serve to explain the principles of the invention and not to limit the scope of the invention.
It should be understood that the term "and/or" as used herein is merely one type of associative relationship that describes an associated object, meaning that three types of relationships may exist, e.g., A and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
Referring to fig. 1, the present invention provides an object cooling apparatus for cooling an object 1, in this embodiment, the object 1 is a superconducting magnet or a coil of a magnetic resonance imaging system, but the object 1 to be cooled is not limited thereto.
The object cooling device comprises a low-temperature container 2 and a cooling pipeline 3, wherein the low-temperature container 2 comprises an outer container 21, an inner container 22 and a shielding layer 23, the inner container 22 is arranged in the outer container 21 and used for containing a first cooling medium and an object 1 to be cooled in thermal contact with the first cooling medium, and the shielding layer 23 is arranged between the outer container 21 and the inner container 22.
Wherein the object 1 to be cooled can be immersed in a first cooling medium.
The outer container 21, the inner container 22, and the shield layer 23 are all circular cylindrical bodies having a cavity opened therein, but the shapes and structures of the outer container 21, the inner container 22, and the shield layer 23 are not limited thereto.
In the present embodiment, the interior of the outer container 21 is evacuated.
Wherein the shielding layer 23 is placed in the vacuum between the inner container 22 and the outer container 21, and the shielding layer 23 is not in contact with the inner container 22 and the outer container 21.
By setting the interior of the outer container 21 to be vacuum, the heat convection from the outside to the shielding layer 23 through the outer container 21 can be effectively reduced, and the cooling capacity required by the shielding layer 23 can be reduced.
The first cooling medium may be a fluid having a cooling effect, and in this embodiment, the first cooling medium is liquid helium.
By soaking the superconducting magnet in the first cooling medium, the superconducting magnet can maintain the superconducting state to work at a lower temperature.
The cooling pipe 3 is in thermal contact with the shield layer 23 and has a second cooling medium circulating therein.
The cooling duct 3 is disposed between the outer container 21 and the shield layer 23.
In this embodiment, the cooling pipe 3 is disposed around the shielding layer 23, and the cooling pipe 3 is attached to the outer wall of the shielding layer 23.
In this embodiment, the cooling pipe 3 is a square pipe with a square cross section, or a circular pipe with a cross section synthesized into a circle, and the cooling pipe 3 is a square pipe with a square cross section, and the cross section of the cooling pipe 3 is square and can be better attached to the outer wall of the shielding layer 23, so that the contact area between the cooling pipe 3 and the shielding layer 23 can be increased, but the shape of the cross section of the cooling pipe 3 is not limited thereto.
The cooling pipe 3 may be circular or spiral, and in the present embodiment, the cooling pipe 3 is circular, but the shape of the cooling pipe 3 is not limited thereto; the material of the cooling duct 3 may be silver, copper, aluminum, stainless steel, or the like having a high thermal conductivity, and in the present embodiment, the cooling duct 3 is a copper pipe, but the material of the cooling duct 3 is not limited thereto.
Through surrounding the cooling pipeline 3 around the shielding layer 23 and introducing the second cooling medium which circularly flows into the cooling pipeline 3, the second cooling medium which circularly flows absorbs the heat of the shielding layer 23, so that the heat of the shielding layer 23 is uniformly distributed, the temperature difference of the shielding layer 23 is reduced, the local over-high temperature of the shielding layer 23 can be avoided, and the evaporation of liquid helium can be reduced.
The second cooling medium may be a fluid having a cooling effect, and in this embodiment, the second cooling medium is helium gas.
In this embodiment, the object cooling device further comprises a refrigerator 4, and the refrigerator 4 is used for cooling the first cooling medium and/or the shielding layer 23.
In this embodiment, the low temperature container 2 further includes a mounting portion 24, the mounting portion 24 is connected to the outer wall of the outer container 21, the mounting portion 24 is provided with a cold head cavity, the cold head cavity is communicated with the inner container 22, the refrigerator 4 is a cold head component, and the cold head component is disposed in the cold head cavity.
The cold head part and the cold head cavity can be vertically arranged and can also be obliquely arranged relative to the vertical direction device, in the embodiment, the cold head part and the cold head cavity are vertically arranged, but the arrangement modes of the cold head part and the cold head cavity are not limited to the arrangement modes.
Furthermore, the cold head cavity comprises a first cavity 24a and a second cavity 24b which are communicated, the size of the second cavity 24b is smaller than that of the first cavity 24a and is arranged below the first cavity 24a,
the cold head component comprises a first-stage cold head 41 and a second-stage cold head 42, the first-stage cold head 41 is inserted into the first cavity 24a, the refrigeration temperature of the first-stage cold head 41 is about 50K, and the first-stage cold head 41 can maintain the shielding layer 23 in a low-temperature state; the second stage cold head 42 is located below the first stage cold head 41 and inserted into the second cavity 24b, the cooling temperature of the second stage cold head 42 is about 4.2K, and the second stage cold head 42 is used for maintaining the temperature in the inner container 22 in a low-temperature environment, so that the superconducting coil 10 is stably in a low-temperature operating environment.
The first stage cold head 41 and the second stage cold head 42 are both in a truncated cone shape, but the shapes of the first stage cold head 41 and the second stage cold head 42 are not limited thereto.
In this embodiment, the cryogenic container 2 further comprises a return pipe 25, one end of the return pipe 25 is communicated with the cold head chamber, and the other end is communicated with the inner container 22.
Wherein, one end of the return pipe 25 is communicated with the bottom of the second cavity 24b, and the other end passes through the outer container 21, the shielding layer 23 and the inner container 22 and is communicated with the inner container 22.
Wherein, the object cooling device further comprises a heat conducting strip 5, and the heat conducting strip 5 is connected to the first-stage cold head 41 and the shielding layer 23.
Through setting up heat conduction strip 5, give shielding layer 23 with the cold volume transmission on the first order cold head 41, can reduce shielding layer 23's temperature for shielding layer 23's temperature maintains about 50K, and cold-screen temperature is lower, and isolated radiating effect is better, and shielding layer 23 about 50K can effectively block the heat that outer container 21 radiated for inner container 22, reduces the evaporation of liquid helium.
In this embodiment, the object cooling device further comprises a power source 6, and the power source 6 is connected to two ends of the cooling duct 3 and is used for driving the second cooling medium flow in the cooling duct 3 to circulate.
In this embodiment, the power source 6 includes a helium compressor 61, an air inlet end of the helium compressor 61 is respectively communicated with an air outlet end of the cold head component and an air outlet end of the cooling pipeline 3 through an air return pipe 62 and an air return branch pipe 63, an air outlet end of the helium compressor 61 is respectively communicated with an air inlet end of the cold head component and an air inlet end of the cooling pipeline 3 through an air inlet pipe 64 and an air inlet branch pipe 65, and the structure of the power source 6 is not limited thereto.
By introducing the high-pressure gas separated part generated by the helium gas compressor 61 into the cooling pipeline 3, the circulating helium gas in the cooling pipeline 3 is promoted to continuously absorb the heat of the shielding layer 23 through the circulating helium gas.
In this embodiment, the object cooling device further includes a first heat exchanger 7, and the first heat exchanger 7 is connected to the cooling pipeline 3 and is used for transferring heat of the second cooling medium in the cooling pipeline 3 to the refrigerator 4 to cool the second cooling medium.
In this embodiment, first heat exchanger 7 is connected with refrigerator 4 through heat conduction piece 8, and is further, first heat exchanger 7 is connected with the first order cold head 41 of cold head part through heat conduction piece 8, has realized that the heat is given first order cold head 41 through first heat exchanger 7 and heat conduction piece 8 transmission by cooling tube 3 for the temperature of the second coolant in cooling tube 3 is close to 50K, cools off shielding layer 23 through the second coolant after the cooling, avoids shielding layer 23 to have the inhomogeneous problem of temperature distribution.
Wherein, heat conduction piece 8 can be square, bar, annular etc. in this embodiment, heat conduction piece 8 becomes the ring form and sets up with first order cold head 41 is coaxial, and the cold head part is located and set up between the bottom inner wall of first cavity 24a and first order cold head 41 to heat conduction piece 8 cover, and the both ends of heat conduction piece 8 are laminated first order cold head 41 and the bottom inner wall of first cavity 24a respectively, and the shape of heat conduction piece 8 is not restricted to here.
Be annular heat conduction piece 8 through the setting, can effectually realize the thermal connection between first order cold junction 41 and the first heat exchanger 7, annular heat conduction piece 8 has increased the area of contact with first order cold junction 41, can effectively transmit the cold volume of first order cold junction 41 for first heat exchanger 7, and annular heat conduction piece 8 can seal second cavity 24b and the intercommunication department of first cavity 24a with first order cold junction 41 cooperation back, avoid helium steam to get into first cavity 24a through second cavity 24b, avoid helium to run off.
The material of the heat conducting block 8 may be silver, copper, aluminum, stainless steel, etc. with good heat conductivity, and in this embodiment, the heat conducting block 8 is a copper block, but the material of the heat conducting block 8 is not limited thereto.
In this embodiment, the object cooling device further includes a second heat exchanger 9, and the second heat exchanger 9 is connected to the cooling pipeline 3 and disposed between the first heat exchanger 7 and the power source 6, and is configured to heat the second cooling medium in the cooling pipeline 3, so that the temperature of the second cooling medium is raised to about 300K.
The second heat exchanger 9 may be built in the outer container 21 or disposed on an outer wall of the outer container 21, and realizes heat exchange between the second cooling medium and the outside, so that the temperature of the second cooling medium is raised to about 300K.
Through setting up second heat exchanger 9, can heat up the second coolant who flows out in cooling tube 3 for the temperature of second coolant heaies up to about 300K in cooling tube 3, and the temperature of the second coolant who avoids flowing out cooling tube 3 crosses lowly and leads to the outer wall of pipeline to freeze or frost, still can carry out the precooling to the second coolant who gets into cooling tube 3 simultaneously.
The working process of the invention is as follows, the helium compressor 61 respectively injects 19 to 24bar of high pressure helium into the air inlet pipe 64 and the air inlet branch pipe 65, after the high pressure helium enters the cold head part through the air inlet pipe 64, the cold head part returns about 5 to 7bar of low pressure helium, the low pressure helium returns to the helium compressor 61 through the air return pipe 62, the high pressure helium enters the cooling pipeline 3 through the air inlet branch pipe 65, the high pressure helium flows through the cooling pipeline 3 and then enters the air return branch pipe 63, and then returns to the helium compressor 61 through the air return branch pipe 63, and the helium compressor 61 is compressed into the high pressure helium again, and the process is repeated continuously.
For the magnet with high field strength, as the volume of the superconducting coil is increased, the shielding layer 23 is larger, a larger temperature difference is generated on the shielding layer 23, for example, the shielding effect is greatly weakened when the superconducting coil is far away from a cold head end to 70-100K, and the heat load of the inner container 22 is increased.
In the helium circulating process, the pressure difference generated by the helium compressor is used for circulating the helium in the cooling pipeline 3, and the cold energy of the cold head part is driven to cool the cooling pipeline 3 covering the surface of the shielding layer 23, so that the shielding layer 23 is cooled, the whole cooling temperature of the shielding layer 23 can be uniform, the condition that the temperature of the far end of the cold head part is high is avoided, and the large-scale magnet cooling device is particularly suitable for large-scale magnets.
Because the heat cannot be absolutely isolated, the inner container 22 can bear a certain amount of heat, the liquid helium is heated and evaporated to form helium vapor, the heat is absorbed when the liquid helium is converted into the helium vapor, the temperature in the inner container 22 is about 4.2K, part of the helium liquid in the inner container 22 is heated and evaporated to form the helium vapor, the helium vapor flows to the upper cavity of the inner container 22, the helium vapor enters the second cavity 24b through the return pipe 25 after reaching the upper cavity of the inner container 22, the helium vapor is liquefied after contacting the cold second-stage cold head 42 and is condensed on the outer wall of the second-stage cold head 42, the liquid helium slides down to the bottom of the second cavity 24b under the action of gravity and flows back to the inner container 22 through the return pipe 25, the second-stage cold head 42 continuously provides cold energy to continuously condense the evaporated helium vapor, the condensed liquid helium is returned to the inner container 22 to ensure that the inner cavity of the inner container 22 is always in a proper temperature range, the continuous loss of the liquid helium can be effectively avoided, and the superconducting coil can be effectively kept in a superconducting state at low temperature, so that the stability of the whole superconducting system is ensured.
The liquid helium is always positioned in the inner container 22 and the second cavity 24b in the process of firstly converting the liquid helium into the gaseous state and then converting the gaseous state into the liquid state, so that the liquid helium or helium vapor cannot enter the atmosphere, the threat to operators is small, and the leakage amount is small.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Claims (10)
1. An object cooling device, comprising:
a low-temperature container which comprises an outer container, an inner container and a shielding layer, wherein the inner container is arranged in the outer container and is used for containing a first cooling medium and an object to be cooled in thermal contact with the first cooling medium, and the shielding layer is arranged between the outer container and the inner container;
and the cooling pipeline is in thermal contact with the shielding layer and is internally provided with a second cooling medium which flows in a circulating mode.
2. An object cooling device according to claim 1, characterized in that the object cooling device further comprises a refrigerator for cooling down the first cooling medium and/or the shielding layer.
3. The object cooling device according to claim 2, further comprising a power source connected to both ends of the cooling duct for circulating the flow of the second cooling medium in the cooling duct.
4. An object cooling device according to claim 3, further comprising a first heat exchanger connected to the cooling conduit for transferring heat of the second cooling medium in the cooling conduit to the refrigerator for cooling the second cooling medium.
5. An object cooling device according to claim 4, characterized in that the first heat exchanger is connected to the refrigerator by means of a heat conducting block.
6. The object cooling device according to claim 4, further comprising a second heat exchanger connected to the cooling duct and disposed between the first heat exchanger and the power source for warming the second cooling medium in the cooling duct.
7. An object cooling device according to claim 1, wherein the cooling conduit is provided around the shielding layer.
8. An object cooling device according to claim 3, characterized in that the interior of the outer container is evacuated.
9. The object cooling device according to claim 8, wherein the low-temperature container further comprises a mounting portion, the mounting portion is connected to an outer wall of the outer container, a cold head cavity is formed in the mounting portion, the cold head cavity is communicated with the inner container, the refrigerator is a cold head component, and the cold head component is arranged in the cold head cavity and used for providing cold energy for the first cooling medium and the shielding layer.
10. The object cooling device of claim 9, wherein the power source comprises a helium compressor, an inlet end of the helium compressor is in communication with both the cold head component and the cooling conduit, and an outlet end of the helium compressor is in communication with both the cold head component and the cooling conduit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011603754.8A CN112768172B (en) | 2020-12-29 | 2020-12-29 | Object cooling device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011603754.8A CN112768172B (en) | 2020-12-29 | 2020-12-29 | Object cooling device |
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| CN112768172A true CN112768172A (en) | 2021-05-07 |
| CN112768172B CN112768172B (en) | 2023-07-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116313372A (en) * | 2023-05-23 | 2023-06-23 | 宁波健信超导科技股份有限公司 | Superconducting magnet and cooling system and method thereof |
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| CN112768172B (en) | 2023-07-28 |
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