CN112756848A - Solder wire with flux coating outside and preparation method thereof - Google Patents
Solder wire with flux coating outside and preparation method thereof Download PDFInfo
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- CN112756848A CN112756848A CN202110047438.5A CN202110047438A CN112756848A CN 112756848 A CN112756848 A CN 112756848A CN 202110047438 A CN202110047438 A CN 202110047438A CN 112756848 A CN112756848 A CN 112756848A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0272—Rods, electrodes, wires with more than one layer of coating or sheathing material
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Abstract
The application relates to a soldering tin technology, in particular to a soldering tin wire with a flux-assisting coating on the outer part and a preparation method thereof. A method for preparing a solder wire with a flux coating on the outer part comprises the following steps: s1: forming tin alloy wires from tin solder alloy under the action of an extruder; s2: heating the soldering flux at 90-110 ℃; s3: and (4) coating the soldering flux treated in the step (S2) outside the tin alloy wire in the step (S1), and solidifying the soldering flux in cold air at the temperature of 0-10 ℃ to form the soldering wire with the soldering flux coating on the outer part. This application can not blast the outer solder alloy of scaling powder in the twinkling of an eye at the tin alloy silk of tin alloy silk surface coating one deck scaling powder, and the scaling powder does not splash during soldering tin, can not form the tin pearl, and is totally clean and tidy by the weldment behind the soldering tin, does not influence electronic apparatus's function.
Description
Technical Field
The application relates to a soldering tin technology, in particular to a soldering tin wire with a flux-assisting coating on the outer part and a preparation method thereof.
Background
With the rapid development of the electronic industry, the improvement of light weight, miniaturization and miniaturization of electronic products has more strict requirements on the quality of the electronic products, particularly the appearance of environment-friendly products, the tin-lead solder is required to be gradually replaced by the lead-free solder, and the current lead-free solder has a very fast development speed, particularly the lead-free ultrafine welding wire. In electronic packaging, solder wires are common solder materials used for hand soldering or semi-automated machine soldering. Solder wires are commonly used to electrically or mechanically connect electronic devices and electronic components.
In the soldering tin application of the electronic and electrical industry, cleaning of the pad oxide of a soldered element needs rosin soldering flux to be completed, at present, a soldering tin wire with the rosin soldering flux is injected into metal, because the softening point of the rosin is only 78-80 ℃, the melting point of lead-free solder alloy is 217-232 ℃, the spreading of the solder alloy is facilitated when the temperature of a soldering iron is 360-400 ℃, and the rosin can expand rapidly at the temperature to explode the solder alloy on the outer layer of the rosin instantly, so that the rosin splashes.
The rosin can be prevented from splashing by adopting the non-rosin carrier, but the tin bead still splashes. And the solder wire with the soldering flux coating on the outer part can completely prevent the splashing of rosin or tin balls. However, the soldering flux coating prepared by the common carrier and the soldering flux activator has poor compatibility with tin solder alloy, the formed coating has poor adhesive force, and the soldering flux coating is easy to fall off especially in the environments of alkalinity, moisture absorption and the like.
Aiming at the related technology, the existing solder wire with the flux coating on the outer part has the problem that the coating is easy to fall off.
Disclosure of Invention
In order to solve the problem that a solder wire coating with a soldering flux coating on the outer part is easy to fall off, the application provides a solder wire with a soldering flux coating on the outer part and a preparation method thereof.
In a first aspect, the present application provides a method for preparing a solder wire with a flux-assisting coating on the outer surface, which is implemented by the following technical scheme:
a method for preparing a solder wire with a flux coating on the outer part comprises the following steps:
s1: forming tin alloy wires from tin solder alloy under the action of an extruder;
s2: heating the soldering flux at 90-110 ℃;
s3: and (4) coating the soldering flux treated in the step (S2) outside the tin alloy wire in the step (S1), and solidifying the soldering flux in cold air at the temperature of 0-10 ℃ to form the soldering wire with the soldering flux coating on the outer part.
Through adopting above-mentioned technical scheme, at the solder wire of tin alloy silk surface coating one deck scaling powder, can not blast the outer solder alloy of scaling powder in the twinkling of an eye, the scaling powder does not splash during soldering tin, can not form the tin pearl, is clean and tidy by the weldment behind the soldering tin, does not influence electronic apparatus's function. The heating temperature of the soldering flux is too high, so that the activity of the soldering flux activator is reduced, and the heating temperature of the soldering flux is too low, so that the soldering flux is not easy to cool to form a film layer, and the adhesive force between the coating and the tin alloy wire is reduced. The temperature of the cold air is too low, so that not only is energy wasted greatly, but also the speed of forming the soldering flux film is too high, the adhesive force between the coating and the tin alloy wire can be reduced, and the coating can easily fall off under the conditions of alkali liquor and moisture absorption; the temperature of the cold air is too high, the soldering flux is not easy to solidify to form a film, the adhesive force of the coating and the tin alloy wire is influenced, the proportion of defective products caused by empty welding can be increased, and the yield is reduced.
Preferably, in the step S1, the parameters of the extruder are: the temperature of the rosin barrel is set to be 125-140 ℃, the temperature of the rosin guide pipe is set to be 130-145 ℃, and the temperature of the front beam of the extruder is set to be 60-110 ℃.
By adopting the technical scheme, the temperature of the rosin barrel is set to be 140 ℃ in 125-140 ℃, the temperature of the rosin guide pipe is set to be 145 ℃ in 130-110 ℃, the temperature of the front beam of the extruding machine is set to be 60-110 ℃, the original crystallization system of the tin solder alloy is not damaged, the activity effect of the soldering flux is not consumed, and the yield during soldering and the adhesive force between the coating with the soldering flux outside and the tin alloy wire are improved.
Preferably, in the step S1, the extrusion speed is set to 5 to 7 minutes for one tin wire.
Preferably, in the step S3, the coating amount of the soldering flux processed by the step S2 is 2-3 wt%.
By adopting the technical scheme, the coating thickness is influenced by the content of the soldering flux sprayed on the surface of the tin alloy wire, the amount of residues is increased by too large coating amount, and the probability of bridging defective products is easy to occur during soldering; too small a coating amount of flux may cover the surface of incomplete tin wire alloy and may reduce the adhesion between the outer flux-bearing coating and the tin wire.
Preferably, the soldering flux comprises, by mass, 95:5, a carrier and a fluxing active agent; the preparation method of the soldering flux comprises the following steps: heating the carrier to the temperature of 100-145 ℃, adding the flux activator, and stirring to obtain the soldering flux.
By adopting the technical scheme, the mass ratio of the carrier to the soldering flux activator is adjusted, the solid carrier is heated to be liquid at the temperature of 100-145 ℃, and the liquid is mixed with the soldering flux activator to prepare the soldering flux, so that the active effect of the soldering flux activator can be kept, the adhesive force between the coating with the soldering flux outside and the tin alloy wire is improved, and the yield is increased during soldering.
Preferably, the carrier is prepared from the following raw materials in parts by weight: 15-25 parts of methyl cellulose, 25-35 parts of ethyl cellulose, 20-30 parts of polyamide wax, 6-9 parts of dipropylene glycol methyl ether, 3-5 parts of dipropylene glycol ethyl ether and 0.8-1.2 parts of n-butyl ether.
By adopting the technical scheme, the methyl cellulose, the ethyl cellulose and the polyamide wax act together, are not easy to burn, have good thermal stability and excellent thermoplasticity, not only improve the adhesive force in alkaline and moisture absorption environments, but also reduce the appearance of defective products such as empty welding, bridging and the like during soldering, and also improve the yield of the soldering tin.
Preferably, the viscosity of the 2wt% aqueous solution of the methylcellulose at 20 ℃ is 3500-.
By adopting the technical scheme, the methyl cellulose with the viscosity of 3500-5600mPa.s in 2wt% aqueous solution at 20 ℃ can improve the adhesive force between the coating with the flux and the tin alloy wire, and under the action of ethyl cellulose and polyamide wax with high etherification degree, the probability of bridging defective products during soldering can be reduced, and the yield during soldering can be improved.
Preferably, the polyamide wax is prepared from MT 6650 and SUNMIDE 50 in a mass ratio of 1: (1.2-1.4) mixing; more preferably, the polyamide wax is a mixture of XK9001 and MT 6650; most preferably, the polyamide wax is prepared by mixing XK9001 and MT 6650 according to a mass ratio of 1: 1.4.
By adopting the technical scheme, the polyamide wax MT 6650 and the polyamide wax SUNMIDE 50 are compounded and the mass ratio of the polyamide wax MT 6650 and the polyamide wax SUNMIDE 50 is controlled, so that the adhesive force between the external soldering flux coating and the tin alloy wires can be further improved, and the yield of the tin alloy wires during soldering can be further improved.
Preferably, the flux activator is prepared from the following raw materials in parts by weight: 18-22 parts of suberic acid, 12-16 parts of adipic acid, 1-2 parts of maleic anhydride, 6-10 parts of cyclohexylamine hydrochloride, 15-20 parts of ethanol, 5-10 parts of phenoxyethanol, 3-5 parts of ethylene diamine tetraacetic acid and 2-4 parts of fluorocarbon surfactant.
By adopting the technical scheme, the welding-assistant activator is prepared by compounding suberic acid, adipic acid, maleic anhydride, cyclohexylamine hydrochloride, ethanol, phenoxyethanol, ethylene diamine tetraacetic acid and fluorocarbon surfactant, and the content of each component is controlled, so that the activity of the welding-assistant activator can be greatly improved.
In a second aspect, the present application provides a solder wire with flux coating on the outside, which adopts the following technical solution:
a solder wire with a soldering flux coating on the outer part is prepared by the preparation method of the solder wire with the soldering flux coating on the outer part.
In summary, the present application has the following beneficial effects:
1. this application can not blast the outer solder alloy of scaling powder in the twinkling of an eye at the tin alloy silk of tin alloy silk surface coating one deck scaling powder, and the scaling powder does not splash during soldering tin, can not form the tin pearl, and is totally clean and tidy by the weldment behind the soldering tin, does not influence electronic apparatus's function.
2. According to the soldering tin wire, the heating temperature of the soldering flux, the solidification temperature of cold air and the coating weight of the soldering flux are controlled, the adhesive force between the coating and the tin alloy wire is improved, and the yield is high during soldering tin.
3. This application adopts methyl cellulose, ethyl cellulose and polyamide wax combined action, and is difficult for burning, thermal stability is good to have good thermoplasticity, not only improved the adhesive force under alkaline, moisture absorption environment, the while has reduced the appearance of defective products such as empty solder and bridging during soldering tin, yields during soldering tin is high.
Detailed Description
The present application will be described in further detail with reference to examples and comparative examples.
The raw materials used in the examples and comparative examples of the present application are commercially available, and unless otherwise specified, the raw materials used in the examples and comparative examples of the present application are derived from table 1 below, and the raw materials not mentioned in table 1 below are all purchased from pharmaceutical company chemical agents ltd.
TABLE 1
Examples
Examples 1-11 provide a method for preparing solder wires with flux coating on the outside, and are described below with reference to example 1.
Example 1 provides a method for preparing a solder wire with flux coating on the outer surface, which comprises the following steps:
(1) sn is added96.5Ag3.0Cu0.5Putting the extruder into the extruder, and setting parameters of the extruder: setting the temperature of a rosin barrel to be 125 ℃, the temperature of a rosin guide pipe to be 130 ℃, the temperature of a front beam of an extruder to be 60 ℃, and the extrusion speed to be 5 minutes to obtain a tin alloy wire with the diameter of 0.8mm, and weighing the mass of each tin alloy wire;
(2) mixing 6g of dipropylene glycol methyl ether, 3g of dipropylene glycol ethyl ether and 0.8g of n-butyl ether, heating to 65 ℃, preserving heat for 1h, adding 20g of polyamide wax SUNMIDE 50, uniformly stirring, finally adding 15g of methyl cellulose (the viscosity of a 2wt% aqueous solution at 20 ℃ is 1400mPa.s) and 25g of ethyl cellulose (the DS is 48.5), and stirring until complete dissolution to obtain a carrier;
(3) mixing 18g of suberic acid, 12g of adipic acid, 1g of maleic anhydride, 6g of cyclohexylamine hydrochloride, 15g of ethanol, 5g of phenoxyethanol, 3g of ethylenediamine tetraacetic acid and 2g of fluorocarbon surfactant FC-4430(3M) to obtain a soldering flux activator;
(4) heating the carrier to 100 ℃, adding the flux activator into the heated carrier according to the mass ratio of the carrier to the flux activator of 95:5, and stirring to obtain the soldering flux;
(5) heating the soldering flux at 90 ℃ for 30min, weighing the heated soldering flux accounting for 2wt% of the total mass of the tin alloy wires, uniformly spraying the soldering flux on the exterior of the tin alloy wires at a spraying speed of 1g/min, and solidifying for 12h in cold air at the temperature of 0 ℃ to obtain the soldering wire with the soldering flux coating on the exterior.
Examples 2-4, like example 1, differ only in that: the reaction parameters of each step are set differently, and are shown in Table 2.
TABLE 2
Examples 5-6, like example 4, differ only in that: the raw materials of each step are different in quality, and are specifically shown in Table 3.
TABLE 3
Example 7, like example 6, differs only in that: the methylcellulose (viscosity of a 2wt% aqueous solution at 20 ℃ of 1400mpa.s) was replaced by methylcellulose (viscosity of a 2wt% aqueous solution at 20 ℃ of 4500 mpa.s).
Examples 8-10, like example 7, differ only in that: the polyamide waxes described differ in their composition and are shown in Table 4.
TABLE 4
Example 11, like example 9, differs only in that: the ethylcellulose (DS of 48.5) was replaced by ethylcellulose (DS of 2.4).
Comparative example
Comparative example 1, like example 1, differs only in that: and (3) replacing the carrier in the step (2) and the step (4) with water white hydrogenated rosin (model: H103).
Comparative example 2, like example 1, differs only in that: the mass of the ethyl cellulose (DS of 48.5) in the step (2) is replaced by 0g from 25 g.
Comparative example 3, like example 1, differs only in that: the mass of the methylcellulose (the viscosity of a 2wt% aqueous solution at 20 ℃ is 1400mPa.s) in the step (2) is replaced by 0g from 15 g.
Comparative example 4, like example 1, differs only in that: the mass of the polyamide wax sumnide 50 in the step (2) is changed from 20g to 0 g.
Comparative example 5, like example 1, differs only in that: in the step (5), the soldering flux is heated at 90 ℃ for 30min instead of being heated at 70 ℃ for 30 min.
Comparative example 6, like example 1, differs only in that: in the step (5), the soldering flux is heated at 90 ℃ for 30min instead of being heated at 130 ℃ for 30 min.
Comparative example 7, like example 1, differs only in that: and (5) solidifying for 12 hours under cold air with the temperature of 0 ℃ instead of solidifying for 12 hours under cold air with the temperature of-15 ℃.
Comparative example 8, like example 1, differs only in that: and (3) in the step (5), the solidification is carried out for 12h under cold air with the temperature of 0 ℃ instead of the solidification for 12h under air with the temperature of 20 ℃.
Comparative example 9 provides a method for preparing a solder wire comprising the steps of:
(1) mixing 6g of dipropylene glycol methyl ether, 3g of dipropylene glycol ethyl ether and 0.8g of n-butyl ether, heating to 65 ℃, preserving heat for 1h, adding 20g of polyamide wax SUNMIDE 50, uniformly stirring, finally adding 15g of methyl cellulose (the viscosity of a 2wt% aqueous solution at 20 ℃ is 1400mPa.s) and 25g of ethyl cellulose (the DS is 48.5), and stirring until complete dissolution to obtain a carrier;
(2) mixing 18g of suberic acid, 12g of adipic acid, 1g of maleic anhydride, 6g of cyclohexylamine hydrochloride, 15g of ethanol, 5g of phenoxyethanol, 3g of ethylenediamine tetraacetic acid and 2g of fluorocarbon surfactant FC-4430(3M) to obtain a soldering flux activator;
(3) heating the carrier to 100 ℃, adding the flux activator into the heated carrier according to the mass ratio of the carrier to the flux activator of 95:5, and stirring to obtain the soldering flux;
(4) setting parameters of an extruder: setting the temperature of a rosin barrel to be 125 ℃, the temperature of a rosin guide pipe to be 130 ℃, the temperature of a front beam of an extruder to be 60 ℃ and the extrusion speed to be 5 minutes and one tin wire; injecting the smokeless soldering flux and Sn into a designed mold96.5Ag3.0Cu0.5The rosin diversion pipe is arranged in the alloy, and soldering flux is poured into Sn96.5Ag3.0Cu0.5Core (flux, Sn)96.5Ag3.0Cu0.5The mass ratio of (1) to (5: 95), and drawing the extruded material by a drawing machine by adopting a rolling and drawing technology, wherein the temperature of the drawing process is set to be 50 ℃, so that the solder wire with the diameter of 0.8mm is obtained.
Performance test
The following performance tests were performed on the solder wires provided in examples 1 to 11 and comparative examples 1 to 9 of the present application.
1. Splashing property: the solder wires of examples 1 to 11 and comparative examples 1 to 9 were subjected to a spattering test according to SJ/T11389-2009 lead-free soldering flux, wherein the spattering degree was classified into 1 to 5, wherein 1 indicates no spattering, 5 indicates spattering, and the smaller the value, the more slight the spattering, and the test results are shown in Table 5.
2. Alkali resistance: after the solder wires described in examples 1-11 and comparative examples 1-8 were placed in 0.01mol/L aqueous sodium hydroxide solution for 1 hour, whether the flux coating was peeled off was observed, each solder wire was tested 100 times, the number of times the flux coating was peeled off was recorded, and the test results are shown in Table 5.
3. Moisture absorption resistance: after the solder wires described in examples 1 to 11 and comparative examples 1 to 8 were left in air with a relative humidity of 90% at 25 ℃ for 6 months, the solder flux coatings were observed for peeling, each solder wire was tested 100 times, and the number of times the solder flux coatings peeled was recorded, and the test results are shown in table 5.
4. Smoke: the solder wires of examples 1 to 11 and comparative examples 1 to 9 were subjected to a smoke test in accordance with SJ/T11389-2009 flux for lead-free soldering, wherein the degree of smoke was classified into 1 to 5, wherein 1 indicates no smoke, 5 indicates smoke, and the smaller the value, the lighter the smoke, and the test results are shown in Table 7.
5. Yield: the solder wires described in examples 1 to 11 and comparative examples 1 to 9 were soldered at 1000 points at 400 ℃ according to JIS Z3197 using an automatic mechanical soldering and HST-9 type constant temperature and humidity machine (purchased from Shanghai Shiteng electric appliances Co., Ltd.), and the occurrence of empty soldering or bridging was recorded as defective, the number of defective was recorded, the yield was counted, and the test results are shown in Table 5.
TABLE 5
The present application is described in detail below with reference to the test data provided in table 5.
As can be seen from example 1 and comparative example 9, the solder wire having a layer of flux applied to the surface of the tin alloy wire generates less splashing of tin balls than the solder wire having an inner layer of flux.
It can be seen from example 1 and comparative example 1 that the carrier prepared by the method replaces rosin, so that smog is not easily generated, and splashing of rosin and splashing of tin beads are obviously reduced.
From the application example 1 and the comparative examples 2 to 4, the methyl cellulose, the ethyl cellulose and the polyamide wax have the combined action, are not easy to burn, have good thermal stability and excellent thermoplasticity, not only improve the adhesive force under the alkaline and moisture absorption environments, but also reduce the appearance of defective products such as empty welding, bridging and the like during soldering, and also improve the yield of the soldering tin.
It can be seen from the present application, example 1 and comparative examples 5-6, that too high heating temperature of the flux can reduce the activity of the flux activator, while too low heating temperature of the flux can not be easily cooled to form a film layer, and can reduce the adhesion between the coating and the tin alloy wire.
As can be seen from the application example 1 and the comparative examples 7 to 8, the temperature of the cold air is too low, which not only greatly wastes energy and causes too high speed of forming the flux film, but also reduces the adhesive force between the coating and the tin alloy wire and causes the coating to easily fall off under the conditions of alkali liquor and moisture absorption; the temperature of the cold air is too high, the soldering flux is not easy to solidify to form a film, the adhesive force of the coating and the tin alloy wire is influenced, the proportion of defective products caused by empty welding can be increased, and the yield is reduced.
As can be seen from examples 1 to 6 of the present application, the solder wire with the external soldering flux coating prepared by the present application has no splashing of solder balls and no smoke, is not easy to fall off in alkaline and hygroscopic environments, has low probability of empty soldering and bridging during soldering, and has high yield of soldering tin by adjusting the process parameters of each reaction step, the content of the carrier preparation raw material and the content of the soldering flux preparation raw material.
From examples 7 to 10 of the present application, it is known that by compounding polyamide wax MT 6650 and polyamide wax sumide 50 and controlling the mass ratio of the two, the adhesion between the external flux-containing coating and the tin alloy wire can be further improved, and the yield of the solder wire during soldering can be improved.
As is clear from examples 9 and 11 of the present application, ethyl cellulose having a DS of 48.5 has a higher etherification degree than ethyl cellulose having a DS of 2.4, and the effects between ethyl cellulose, methyl cellulose and polyamide wax can be improved, and further, the adhesion between the outer flux-containing coating layer and the tin alloy wire and the yield in soldering can be improved.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.
Claims (10)
1. A preparation method of a solder wire with a flux coating outside is characterized by comprising the following steps:
s1: forming tin alloy wires from tin solder alloy under the action of an extruder;
s2: heating the soldering flux at 90-110 ℃;
s3: and (4) coating the soldering flux treated in the step (S2) outside the tin alloy wire in the step (S1), and solidifying the soldering flux in cold air at the temperature of 0-10 ℃ to form the soldering wire with the soldering flux coating on the outer part.
2. The method as set forth in claim 1, wherein the extruder parameters in step S1 are as follows: the temperature of the rosin barrel is set to be 125-140 ℃, the temperature of the rosin guide pipe is set to be 130-145 ℃, and the temperature of the front beam of the extruder is set to be 60-110 ℃.
3. The method as set forth in claim 2, wherein the extrusion speed is set to 5-7 minutes for one tin wire in the step of S1.
4. The method as set forth in claim 1, wherein the flux is applied in an amount of 2-3wt% in the step S3 after the step S2.
5. The method as set forth in claim 1, wherein the flux comprises the following components in a mass ratio of 95:5, a carrier and a fluxing active agent; the preparation method of the soldering flux comprises the following steps: heating the carrier to the temperature of 100-145 ℃, adding the flux activator, and stirring to obtain the soldering flux.
6. The method for preparing a solder wire with flux coating on the outside as claimed in claim 5, wherein the carrier is prepared from the following raw materials in parts by weight: 15-25 parts of methyl cellulose, 25-35 parts of ethyl cellulose, 20-30 parts of polyamide wax, 6-9 parts of dipropylene glycol methyl ether, 3-5 parts of dipropylene glycol ethyl ether and 0.8-1.2 parts of n-butyl ether.
7. The method for preparing a solder wire with an external fluxing agent coating as recited in claim 6, wherein the viscosity of the 2wt% aqueous solution of methylcellulose at 20 ℃ is 3500-.
8. The method for preparing a solder wire with flux coating outside as claimed in claim 6, wherein the polyamide wax is prepared from MT 6650 and SUNMIDE 50 in a mass ratio of 1: (1.2-1.4) mixing.
9. A method for preparing a solder wire with flux coating on the outside according to any of claims 5-8, characterized in that the flux activator is prepared from the following raw materials in parts by weight: 18-22 parts of suberic acid, 12-16 parts of adipic acid, 1-2 parts of maleic anhydride, 6-10 parts of cyclohexylamine hydrochloride, 15-20 parts of ethanol, 5-10 parts of phenoxyethanol, 3-5 parts of ethylene diamine tetraacetic acid and 2-4 parts of fluorocarbon surfactant.
10. Solder wire with an external flux coating, characterized in that it is produced by the method for the production of a solder wire with an external flux coating according to any one of claims 1-9.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114406524A (en) * | 2022-01-28 | 2022-04-29 | 无锡市斯威克科技有限公司 | Water-based precoating flux, precoating photovoltaic solder strip and preparation method thereof |
| JP7199769B1 (en) * | 2022-09-15 | 2023-01-06 | 株式会社小島半田製造所 | solder wire |
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| CN105252173A (en) * | 2015-11-13 | 2016-01-20 | 广东中实金属有限公司 | Preparation method of pre-molding soldering flake with uniform coatings |
| CN106181106A (en) * | 2016-08-30 | 2016-12-07 | 郑州机械研究所 | A kind of strip solder of moistening guide and preparation method thereof |
| CN108962486A (en) * | 2018-05-31 | 2018-12-07 | 浙江技鸣电工器材有限公司 | A kind of ultra tiny polyurethane enamelled wire production technology |
| CN108994485A (en) * | 2018-10-26 | 2018-12-14 | 长沙浩然医疗科技有限公司 | A kind of scaling powder and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114406524A (en) * | 2022-01-28 | 2022-04-29 | 无锡市斯威克科技有限公司 | Water-based precoating flux, precoating photovoltaic solder strip and preparation method thereof |
| JP7199769B1 (en) * | 2022-09-15 | 2023-01-06 | 株式会社小島半田製造所 | solder wire |
| WO2024057765A1 (en) * | 2022-09-15 | 2024-03-21 | 株式会社小島半田製造所 | Solder wire |
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