CN112752498A - Full-automatic SMT chip mounter and chip mounting process thereof - Google Patents
Full-automatic SMT chip mounter and chip mounting process thereof Download PDFInfo
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- CN112752498A CN112752498A CN202011527447.6A CN202011527447A CN112752498A CN 112752498 A CN112752498 A CN 112752498A CN 202011527447 A CN202011527447 A CN 202011527447A CN 112752498 A CN112752498 A CN 112752498A
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- fixedly connected
- chip mounter
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a full-automatic SMT chip mounter and a chip mounting process thereof, and particularly relates to the technical field of chip mounters. According to the invention, by adopting the improved novel material conveying control mechanism, the control function is completely controlled by the displacement mechanism of the chip mounter, the full-automatic chip mounting work can be realized without additionally arranging a machine grabbing station, the chip mounting mode can be achieved by pressing down more simply, the time is greatly saved, the processing efficiency is improved, the device can achieve the limiting function while discharging, the chip mounting deviation is avoided, the chip mounting accuracy is ensured, the rework problem is reduced, and the production benefit can be better ensured.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to a full-automatic SMT chip mounter and a chip mounting process thereof.
Background
Along with the continuous development of present science and technology, full-automatic SMT paster is as the main part of production SMT to use very extensively in the production of present electronic original device, in the production line, full-automatic SMT chip mounter configuration is after some glue machines or screen printing machine, is through removing the equipment that pastes the dress head and accurately place PCB pad to surface mounting components and parts.
In the prior art, a suction nozzle mechanism of a full-automatic SMT chip mounter generally sucks materials on the surface of a material tray and then moves to a proper position on the surface of a circuit board to paste the materials, the circular movement of the suction nozzle mechanism between the material tray and the circuit board wastes longer time, and the suction nozzle mechanism is easy to incline due to other external force during adsorption or placement, so that the accuracy of chip mounting is influenced, the circuit board is easy to be unqualified in matching, even the chip mounting is deviated, and the reworking and production benefits of the circuit board are influenced.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a full-automatic SMT chip mounter and a chip mounting process thereof, and the invention aims to solve the technical problems that: in the prior art, a suction nozzle mechanism of a full-automatic SMT chip mounter generally sucks materials on the surface of a material tray and then moves to a proper position on the surface of a circuit board to paste the materials, the suction nozzle mechanism circularly moves between the material tray and the circuit board, so that long time is wasted, and the suction nozzle mechanism is easy to incline due to other external force during adsorption or placement, so that the accuracy of chip mounting is influenced, the circuit board is easy to be unqualified in matching, even the chip mounting is deviated, and the reworking and production benefits of the circuit board are influenced.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a full-automatic SMT chip mounter, includes the chip mounter, the surface of chip mounter is provided with defeated material control mechanism, defeated material control mechanism includes the casing, the casing sets up the surface at the chip mounter, the back of casing and the positive fixed connection of piston shell, two cavitys have been seted up in the piston shell, the internal surface of cavity is provided with first piston, two the lower surface of first piston and the top fixed connection of pushing down the subassembly, the left side the left surface of cavity inner wall is linked together with the one end of first connecting pipe.
The other end of the first connecting pipe is communicated with the back of the inner wall of the pushing shell, the right side face of the pushing shell is fixedly connected with the left side face of the shell, an elastic assembly is arranged on the inner surface of the pushing shell, the right end of the elastic assembly is fixedly connected with the left side face of the placing plate, the right side face of the inner wall of the cavity is communicated with one end of the second connecting pipe, and the other end of the second connecting pipe is communicated with the back of the inner wall of the fixing shell.
The internal surface of set casing is provided with the third piston, the lower surface of third piston and the top fixed connection of activity post, the lower surface of set casing and the upper surface fixed connection of two fixed blocks, two fixed block fixed connection is in the casing, the internal surface of casing is provided with a plurality of chip, one of them the upper surface of chip and the bottom overlap joint of activity post.
As a further scheme of the invention: the inner surface of chip mounter is provided with the processing platform, the upper surface of processing platform is provided with four electric chuck, the last fixed surface of processing platform is connected with the contact switch.
As a further scheme of the invention: and the surface of the chip mounter is fixedly connected with an ion fan.
As a further scheme of the invention: the elastic assembly comprises a second piston, the second piston is arranged on the inner surface of the pushing shell, the right side face of the second piston is fixedly connected with the left ends of the two telescopic rods and the left ends of the two second springs, the second springs are sleeved on the outer surfaces of the telescopic rods, and the right ends of the two springs and the right ends of the two telescopic rods are fixedly connected with the left side face of the placing plate.
As a further scheme of the invention: the outer surface of the movable column is sleeved with a movable sleeve, the left side surface and the right side surface of the movable sleeve are respectively fixedly connected with the opposite surfaces of the two fixed blocks, the inner surface of the shell is fixedly connected with a rubber ring, and the rubber ring is in lap joint with the lower surface of one chip.
As a further scheme of the invention: the outer surface of the shell is provided with a cover plate, a clamping groove is formed in the inner surface of the cover plate, a clamping block is arranged in the clamping groove, the clamping block is fixedly connected to the outer surface of the shell, the upper surface of the inner wall of the cover plate is fixedly connected with the top end of a third spring, the bottom end of the third spring is fixedly connected with the upper surface of a push plate, and the lower surface of the push plate is in lap joint with the upper surface of one chip.
As a further scheme of the invention: the inner surface of the placing plate is provided with a plurality of first rollers, the lower surface of the inner wall of the shell is provided with a groove, the inner surface of the groove is provided with a plurality of second rollers, and the second rollers are in lap joint with the lower surfaces of partial chips.
As a further scheme of the invention: the lower pressing assembly comprises two connecting rods and two connecting rods, the top ends of the connecting rods are respectively fixedly connected with the lower surfaces of two first pistons and the bottom ends of the connecting rods are fixedly connected with the upper surface of a pressing plate, the outer surface of each connecting rod is sleeved with a sliding sleeve, the sliding sleeve is connected to the lower surface of a piston shell in a clamped mode, the upper surface of each first piston is fixedly connected with the bottom end of a first spring, the top end of each first spring is fixedly connected with the upper surface of the inner wall of a cavity, and the front face of the shell is provided with an observation window.
A chip mounting process of a full-automatic SMT chip mounter comprises the following steps:
s1, when the patch is needed, the circuit board is placed on the surface of the electric sucker, the electric sucker is controlled to adsorb and fix the circuit board, the circuit board is pressed down to trigger the contact switch, and the contact switch controls the ion fan to perform blowing and static electricity removing work.
S2, then, the displacement mechanism of the chip mounter controls the material conveying control mechanism to move transversely to a proper position, and then, the material conveying control mechanism is controlled to move downwards, so that the pressing plate presses downwards to abut against the supporting surface, at the moment, the pressing plate pushes the connecting rod to move upwards, the connecting rod pushes the first piston to move upwards, the first piston compresses the first spring, the third piston moves downwards, the third piston pushes the movable column to move downwards, the movable column pushes one of the chips to move downwards, the chip extrudes the rubber ring to separate from the shell, the chip can be attached to the proper position on the surface of the circuit board, meanwhile, the second piston moves rightwards, the second piston pushes the chip to move rightwards, and under the action of the second spring and the telescopic rod, the chip abuts against the surface of the movable column, and the second spring and the telescopic rod are compressed.
S3, when the chip is attached, the material conveying control mechanism is controlled to move upwards by the displacement mechanism of the chip mounter, at the moment, the first spring pushes the first piston to move downwards by utilizing the elasticity of the first spring, the pressing plate is enabled to move downwards, the third piston is enabled to move upwards, the third piston drives the movable column to move upwards, when the movable column moves to a proper position, the second spring pushes the chip to move rightwards by utilizing the elasticity of the second spring to correspond to the position of the movable column, then the second piston moves leftwards, the second piston completes the reset leftwards, meanwhile, the elasticity of the third spring can push the chip to contact with the inner wall of the shell downwards by the push plate, the displacement of the material conveying control mechanism can be controlled again at the moment, and then the chip can continue to carry out the chip attaching.
The invention has the beneficial effects that:
1. according to the invention, by adopting the improved novel material conveying control mechanism, the control function of the material conveying control mechanism is completely controlled by the displacement mechanism of the chip mounter, the full-automatic chip mounting work can be realized without additionally arranging a machine grabbing station, and the chip mounting mode can be achieved by pressing down more simply, so that the time is greatly saved, the processing efficiency is improved, the material conveying control device can achieve the limiting function while discharging, the chip mounting deviation is avoided, the chip mounting accuracy is ensured, the rework problem is reduced, and the production benefit can be better ensured;
2. according to the chip mounter, the third spring and the push plate are arranged, so that the elastic reset force of the third spring can push the push plate to move downwards, the downward movement work of a chip can be controlled, the work of quickly supplementing materials can be achieved, the follow-up work of pasting is guaranteed, the chip can be placed into the casing by arranging the cover plate and opening the cover plate, and the normal adding work of the chip can be guaranteed.
Drawings
FIG. 1 is a schematic cross-sectional view of the front view of the present invention;
FIG. 2 is a schematic cross-sectional view of a feeding control mechanism of the present invention;
FIG. 3 is a schematic rear view of a material feeding control mechanism according to the present invention;
FIG. 4 is a front view of the housing of the present invention;
in the figure: 1 chip mounter, 2 processing platform, 3 electric suction cup, 4 contact switch, 5 ion fan, 6 defeated material control mechanism, 61 casing, 62 piston shell, 63 first piston, 64 push down subassembly, 641 clamp plate, 642 connecting rod, 643 sliding sleeve, 65 cavity, 66 first spring, 67 first connecting pipe, 68 propelling movement shell, 69 elastic component, 691 second piston, 692 telescopic link, 693 second spring, 610 fixed shell, 611 second connecting pipe, 612 first roller, 613 placing plate, 614 groove, 615 second roller, 616 third piston, 617 movable column, 618 movable sleeve, 619 fixed block, 6120 rubber ring, 6121 third spring, 6122 push plate, 6123 chip, 6124 apron, 6125 card slot, 6126 card block, 6127 observation window.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-4, the present invention provides a full-automatic SMT chip mounter, including a chip mounter 1, a material conveying control mechanism 6 is disposed on a surface of the chip mounter 1, the material conveying control mechanism 6 includes a housing 61, the housing 61 is disposed on the surface of the chip mounter 1, a back surface of the housing 61 is fixedly connected to a front surface of a piston housing 62, two cavities 65 are disposed in the piston housing 62, first pistons 63 are disposed on inner surfaces of the cavities 65, air leakage is avoided by disposing the first pistons 63, and the first pistons 63 are in close contact with inner walls of the cavities 65, lower surfaces of the two first pistons 63 are fixedly connected to top ends of a hold-down assembly 64, a left side surface of an inner wall of a left cavity 65 is communicated with one end of a first connection pipe 67, and by disposing the first connection pipe 67, the first connection pipe 67 can ensure that the cavities 65 are communicated with a push housing 68.
The other end of the first connecting pipe 67 is communicated with the back of the inner wall of the pushing shell 68, the right side of the pushing shell 68 is fixedly connected with the left side of the shell 61, the inner surface of the pushing shell 68 is provided with an elastic component 69, the right end of the elastic component 69 is fixedly connected with the left side of the placing plate 613, the right side of the inner wall of the right cavity 65 is communicated with one end of a second connecting pipe 611, through the arrangement of the second connecting pipe 611, the second connecting pipe 611 can ensure the work of communicating the cavity 65 with the fixed shell 610 and the work of ensuring the reciprocating flow of gas, and the other end of the second connecting pipe 611 is communicated with the back of the inner wall of the fixed shell 610.
The internal surface of set casing 610 is provided with third piston 616, through setting up third piston 616, make third piston 616 can ensure and propelling movement shell 68 between the leakproofness, avoid gaseous outer the leaking, and then can promote the work that the activity post 617 removed smoothly, the lower surface of third piston 616 and the top fixed connection of activity post 617, the lower surface of set casing 610 and the upper surface fixed connection of two fixed blocks 619, two fixed blocks 619 fixed connection are in casing 61, the internal surface of casing 61 is provided with a plurality of chip 6123, the upper surface of one of them chip 6123 and the bottom overlap joint of activity post 617.
As shown in fig. 1, the internal surface of chip mounter 1 is provided with processing platform 2, the upper surface of processing platform 2 is provided with four electric chuck 3, through setting up electric chuck 3, and electric chuck 3 can adsorb the circuit board, thereby can reach the fixed purpose of circuit board, processing platform 2's last fixed surface is connected with contact switch 4, through setting up contact switch 4, contact switch 4 can carry out the work of controlling to ion fan 5's operating condition, chip mounter 1's fixed surface is connected with ion fan 5, through setting up ion fan 5, and ion fan 5 works, make the air current blow off and reach the circuit board surface, can reach neutralization static and dust removal purpose.
As shown in fig. 2, the elastic component 69 includes a second piston 691, by providing the second piston 691, the second piston 691 can ensure the air tightness with the inner wall of the pushing casing 68 in the moving process, and further can smoothly push the placing plate 613 to work, the second piston 691 is disposed on the inner surface of the pushing casing 68, the right side of the second piston 691 is fixedly connected with the left ends of two telescopic rods 692 and two second springs 693, by providing the telescopic rods 692 and the second springs 693, the telescopic rods 692 can ensure the stability of the second springs 693 in extension and retraction, and the telescopic rods 692 and the second springs 693 compress to provide a moving space for the placing plate 613, and ensure the smooth operation of the device, and at the same time, the second springs 693 can push the chip 6123 to be located below the movable column 617 through the elastic restoring force, and further ensure the subsequent normal patch work, and the second springs 693 are sleeved on the outer surface of the telescopic rods, the right ends of the two second springs 693 and the two telescopic rods 692 are fixedly connected with the left side surface of the placing plate 613, the outer surface of the movable column 617 is sleeved with the movable sleeve 618, the movable sleeve 618 can ensure the smooth sliding operation of the movable column 617 by arranging the movable sleeve 618, the left and right side surfaces of the movable sleeve 618 are respectively fixedly connected with the opposite surfaces of the two fixed blocks 619, the inner surface of the housing 61 is fixedly connected with the rubber ring 6120, the rubber ring 6120 is arranged and can support the chip 6123, the chip 6123 is prevented from falling off when the chip is not mounted, the chip 6123 can be ensured to move downwards smoothly by extruding the rubber ring 6120, the chip mounting operation is facilitated, the rubber ring 6120 is overlapped with the lower surface of one chip 6123, the outer surface of the housing 61 is provided with the cover plate 6124, the cover plate 6124 is arranged, the cover plate 6124 is opened, and the chip 6123 can be placed in the housing 61, therefore, the normal adding work of the chips 6123 can be ensured, the inner surface of the cover plate 6124 is provided with the clamping groove 6125, the clamping block 6126 is arranged in the clamping groove 6125, the clamping block 6126 can be clamped in the clamping groove 6125 through extrusion by arranging the clamping block 6126, the cover plate 6124 can be limited, the supporting work of the third spring 6121 is further ensured, the clamping block 6126 is fixedly connected to the outer surface of the shell 61, the upper surface of the inner wall of the cover plate 6124 is fixedly connected with the top end of the third spring 6121, the third spring 6121 and the push plate 6122 are arranged, the elastic reset force of the third spring 6121 can push the push plate 6122 to move downwards, the downward movement work of the chips 6123 can be controlled, the work of quickly supplementing materials can be achieved, the subsequent work of chip pasting is ensured, the bottom end of the third spring 6121 is fixedly connected with the upper surface of the push plate 6122, the lower surface of the push plate 6122 is in lap joint with, the inner surface of the placing plate 613 is provided with a plurality of first rollers 612, the lower surface of the inner wall of the shell 61 is provided with a groove 614, the inner surface of the groove 614 is provided with a plurality of second rollers 615, and the first rollers 612 and the second rollers 615 are arranged to reduce the friction between the first rollers 612 and the second rollers 615 and the chips 6123, so that the placing plate 613 and the chips 6123 can be smoothly moved, and the plurality of second rollers 615 are lapped with part of the lower surfaces of the chips 6123.
As shown in fig. 3 and 4, the pressing assembly 64 includes two connecting rods 642, top ends of the two connecting rods 642 are respectively fixedly connected to lower surfaces of the two first pistons 63, bottom ends of the two connecting rods 642 are fixedly connected to an upper surface of the pressing plate 641, the pressing plate 641 presses against a supporting surface by providing the pressing plate 641 and the connecting rods 642, and further the first piston 63 can be pushed by the connecting rods 642 to move, an outer surface of the connecting rods 642 is sleeved with a sliding sleeve 643, the sliding rod can slide up and down smoothly by providing the sliding sleeve 643, the sliding sleeve 643 is engaged with a lower surface of the piston housing 62, an upper surface of the first piston 63 is fixedly connected to a bottom end of the first spring 66, the first spring 66 is arranged to push the first piston 63 downward by an elastic restoring force, a top end of the first spring 66 is fixedly connected to an upper surface of an inner wall of the cavity 65, the front surface of the housing 61 is provided with the observation window 6127, and the number of the inner wall chips 6123 is convenient to check through the observation window 6127, so that the adding work is convenient in time.
A chip mounting process of a full-automatic SMT chip mounter comprises the following steps:
s1, when the patch is needed, the circuit board is placed on the surface of the electric sucker 3, the electric sucker 3 is controlled to adsorb and fix the circuit board, the circuit board is pressed down to touch the contact switch 4, and the contact switch 4 controls the ion fan 5 to blow and remove static electricity.
S2, the displacement mechanism of the chip mounter 1 controls the material-feeding control mechanism 6 to move horizontally to a proper position, and then controls the material-feeding control mechanism 6 to move down, so that the pressing plate 641 pushes the connecting rod 642 to move up, so that the connecting rod 642 pushes the first piston 63 to move up, so that the first piston 63 compresses the first spring 66, so that the third piston 616 moves down, so that the third piston 616 pushes the movable post 617 to move down, so that the movable post 617 pushes one of the chips 6123 to move down, so that the chip 6123 pushes the rubber ring 6120 to separate from the housing 61, so that the chip 6123 can be attached to a proper position on the surface of the circuit board, and the second piston 691 moves right, so that the second piston 691 pushes the chip 6123 to move right, so that the chip 6123 pushes the surface of the movable post 617 under the action of the second spring 693 and the telescopic rod, and compresses the second spring 693 and the telescoping rod 692.
S3, when the chip 6123 is attached, the material-feeding control mechanism 6 is controlled by the displacement mechanism of the chip mounter 1 to move upward, at this time, the first spring 66 pushes the first piston 63 to move downward by its own elasticity, so that the pressing plate 641 moves downward, so that the third piston 616 moves upward, so that the third piston 616 drives the movable post 617 to move upward, when the movable post 617 moves to a proper position, the second spring 693 pushes the chip 6123 to move rightward by its own elasticity to correspond to the position of the movable post 617, and then the second piston 691 moves leftward, so that the second piston 691 completes the reset leftward, and at the same time, the elasticity of the third spring 6121 can push the chip 6123 to contact with the inner wall of the housing 61 downward by the pushing plate 6122, at this time, the displacement of the material-feeding control mechanism 6 can be controlled, and the chip mounting work can be continued.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the invention, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the invention can be combined with each other without conflict;
and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.
Claims (9)
1. The utility model provides a full-automatic SMT chip mounter, includes chip mounter (1), its characterized in that: the chip mounter is characterized in that a material conveying control mechanism (6) is arranged on the surface of the chip mounter (1), the material conveying control mechanism (6) comprises a shell (61), the shell (61) is arranged on the surface of the chip mounter (1), the back surface of the shell (61) is fixedly connected with the front surface of a piston shell (62), two cavities (65) are formed in the piston shell (62), first pistons (63) are arranged on the inner surfaces of the cavities (65), the lower surfaces of the two first pistons (63) are fixedly connected with the top ends of pressing components (64), and the left side surface of the inner wall of the cavity (65) on the left side is communicated with one end of a first connecting pipe (67);
the other end of the first connecting pipe (67) is communicated with the back of the inner wall of the pushing shell (68), the right side of the pushing shell (68) is fixedly connected with the left side of the shell (61), an elastic component (69) is arranged on the inner surface of the pushing shell (68), the right end of the elastic component (69) is fixedly connected with the left side of the placing plate (613), the right side of the inner wall of the cavity (65) on the right side is communicated with one end of a second connecting pipe (611), and the other end of the second connecting pipe (611) is communicated with the back of the inner wall of the fixing shell (610);
the internal surface of set casing (610) is provided with third piston (616), the top fixed connection of the lower surface and the activity post (617) of third piston (616), the lower surface and the upper surface fixed connection of two fixed blocks (619) of set casing (610), two fixed block (619) fixed connection is in casing (61), the internal surface of casing (61) is provided with a plurality of chip (6123), one of them the upper surface of chip (6123) and the bottom overlap joint of activity post (617).
2. The full-automatic SMT chip mounter according to claim 1, wherein: the inner surface of chip mounter (1) is provided with processing platform (2), the upper surface of processing platform (2) is provided with four electric chuck (3), the last fixed surface of processing platform (2) is connected with contact switch (4).
3. The full-automatic SMT chip mounter according to claim 1, wherein: the surface of the chip mounter (1) is fixedly connected with an ion fan (5).
4. The full-automatic SMT chip mounter according to claim 1, wherein: the elastic assembly (69) comprises a second piston (691), the second piston (691) is arranged on the inner surface of the pushing shell (68), the right side surface of the second piston (691) is fixedly connected with the left ends of the two telescopic rods (692) and the two second springs (693), the second springs (693) are sleeved on the outer surface of the telescopic rods (692), and the right ends of the two second springs (693) and the two telescopic rods (692) are fixedly connected with the left side surface of the placing plate (613).
5. The full-automatic SMT chip mounter according to claim 1, wherein: the outer surface of the movable column (617) is sleeved with a movable sleeve (618), the left side surface and the right side surface of the movable sleeve (618) are respectively and fixedly connected with the opposite surfaces of the two fixed blocks (619), the inner surface of the shell (61) is fixedly connected with a rubber ring (6120), and the rubber ring (6120) is overlapped with the lower surface of one chip (6123).
6. The full-automatic SMT chip mounter according to claim 1, wherein: the outer surface of the shell (61) is provided with a cover plate (6124), the inner surface of the cover plate (6124) is provided with a clamping groove (6125), a clamping block (6126) is arranged in the clamping groove (6125), the clamping block (6126) is fixedly connected to the outer surface of the shell (61), the upper surface of the inner wall of the cover plate (6124) is fixedly connected with the top end of a third spring (6121), the bottom end of the third spring (6121) is fixedly connected with the upper surface of a push plate (6122), and the lower surface of the push plate (6122) is overlapped with the upper surface of one chip (6123).
7. The full-automatic SMT chip mounter according to claim 1, wherein: the inner surface of the placing plate (613) is provided with a plurality of first rollers (612), the lower surface of the inner wall of the shell (61) is provided with a groove (614), the inner surface of the groove (614) is provided with a plurality of second rollers (615), and the plurality of second rollers (615) are lapped with the lower surface of part of the chips (6123).
8. The full-automatic SMT chip mounter according to claim 1, wherein: the downward pressing assembly (64) comprises two connecting rods (642), the top ends of the two connecting rods (642) are fixedly connected with the lower surfaces of the two first pistons (63) respectively, the bottom ends of the two connecting rods (642) are fixedly connected with the upper surface of the pressing plate (641), a sliding sleeve (643) is sleeved on the outer surface of each connecting rod (642), the sliding sleeve (643) is clamped on the lower surface of the piston shell (62), the upper surface of the first piston (63) is fixedly connected with the bottom end of the first spring (66), the top end of the first spring (66) is fixedly connected with the upper surface of the inner wall of the cavity (65), and an observation window (6127) is arranged on the front surface of the shell (61).
9. A chip mounting process of a full-automatic SMT chip mounter is characterized by comprising the following steps:
s1, when the surface mounting is needed, the circuit board is placed on the surface of the electric sucker (3), the electric sucker (3) is controlled to adsorb and fix the circuit board, the circuit board is pressed downwards to touch the contact switch (4), and the contact switch (4) controls the ion fan (5) to blow air and remove static electricity;
s2, controlling the material conveying control mechanism (6) to move horizontally to a proper position by the displacement mechanism of the chip mounter (1), controlling the material conveying control mechanism (6) to move downwards to enable the pressing plate (641) to press downwards to abut against the supporting surface, enabling the pressing plate (641) to push the connecting rod (642) to move upwards at the moment, enabling the connecting rod (642) to push the first piston (63) to move upwards to enable the first piston (63) to compress the first spring (66) and enable the third piston (616) to move downwards to enable the third piston (616) to push the movable column (617) to move downwards, enabling the movable column (617) to push one of the chips (6123) to move downwards to enable the chip (6123) to press the rubber ring (6120) to be separated from the shell (61), enabling the chip (6123) to be attached to a proper position on the surface of the circuit board, and enabling the second piston (691) to move rightwards at the same time to enable the second piston (691) to push the chip (6123), under the action of the second spring (693) and the telescopic rod (692), the chip (6123) is enabled to be abutted against the surface of the movable column (617), and the second spring (693) and the telescopic rod (692) are compressed;
s3, when the chip (6123) is attached, the material conveying control mechanism (6) is controlled to move upwards by the displacement mechanism of the chip mounter (1), at the moment, the first spring (66) pushes the first piston (63) to move downwards by the elasticity of the first spring, the pressing plate (641) moves downwards, the third piston (616) moves upwards, the third piston (616) drives the movable column (617) to move upwards, when the movable column (617) moves to a proper position, the second spring (693) pushes the chip (6123) to move rightwards by the elasticity of the second spring to correspond to the position of the movable column (617), then the second piston (691) moves leftwards, the second piston (691) completes the reset leftwards, meanwhile, the elasticity of the third spring (6121) can push the chip (6123) to contact with the inner wall of the shell (61) downwards by the push plate (6122), and at the moment, the material conveying control mechanism (6) can be controlled to move again, and the operation of the patch can be continued.
Priority Applications (1)
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| CN202011527447.6A CN112752498B (en) | 2020-12-22 | 2020-12-22 | Full-automatic SMT chip mounter and chip mounting method thereof |
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| CN113260250A (en) * | 2021-06-07 | 2021-08-13 | 江苏振宁半导体研究院有限公司 | Chip mounter for semiconductor electrical element production and using method |
| CN114051376A (en) * | 2021-12-10 | 2022-02-15 | 武汉飞恩微电子有限公司 | High-precision full-automatic chip mounter for machining air inlet temperature and pressure sensor |
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| CN205812645U (en) * | 2016-06-14 | 2016-12-14 | 杭州亘幄电子科技有限公司 | A kind of automatic feed mechanism of chip mounter |
| CN207519074U (en) * | 2017-11-24 | 2018-06-19 | 惠州市美特伦科技有限公司 | A kind of SMT chip mounters patch feed device |
| CN111891819A (en) * | 2020-09-01 | 2020-11-06 | 天津必利优科技发展有限公司 | Full-automatic chip mounter |
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| CN103108495A (en) * | 2013-01-15 | 2013-05-15 | 深圳市岑科实业有限公司 | Automatic feeding mechanism of mounter |
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| CN113260250B (en) * | 2021-06-07 | 2021-09-07 | 江苏振宁半导体研究院有限公司 | Chip mounter for semiconductor electrical element production and using method |
| CN114051376A (en) * | 2021-12-10 | 2022-02-15 | 武汉飞恩微电子有限公司 | High-precision full-automatic chip mounter for machining air inlet temperature and pressure sensor |
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| Publication number | Publication date |
|---|---|
| CN112752498B (en) | 2022-05-20 |
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