CN112738992A - Printed circuit board, and printing method and debugging method of printed circuit board - Google Patents
Printed circuit board, and printing method and debugging method of printed circuit board Download PDFInfo
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- CN112738992A CN112738992A CN202011326486.XA CN202011326486A CN112738992A CN 112738992 A CN112738992 A CN 112738992A CN 202011326486 A CN202011326486 A CN 202011326486A CN 112738992 A CN112738992 A CN 112738992A
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- circuit board
- bonding pad
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a printed circuit board, the printing method and the debugging method of circuit board, the pad of the preset specification of printed circuit board of this disclosure includes relative first pad and the second pad that sets up at least, and the electric clearance between two pads is shorter, can be with first pad and second pad short circuit through the form of tin even in test and verification in carrying out earlier stage, realize zero ohmic function, accessible flatiron removes tin even can be with first pad and second pad disconnection or other subassemblies of connection in the later stage use, use a large amount of zero ohmic resistance influence production efficiency when having avoided the circuit board earlier stage design, the damage that uses short pad to cause the circuit board has been reduced again, conveniently carry out design and use, and then promote and use experience.
Description
Technical Field
The present disclosure relates to the field of electronic devices, and in particular, to a printed circuit board, a method for printing the printed circuit board, and a debugging method.
Background
In the development stage of electronic products, many zero-ohm resistors are often required to be reserved on a circuit board in a circuit, so that an engineer can conveniently test and verify the zero-ohm resistors, and the zero-ohm resistors are connected to the left bonding pad in fig. 1. In the development and production process of the circuit board of the notebook computer, 120 to 150 zero-ohm resistors are generally required in the stage of Engineering Verification Test (EVT), and only about 28 zero-ohm resistors are required in the System Verification Test (SVT), so that it can be found that many later-stage unnecessary components need to be arranged on the circuit board in the initial development stage for testing and Verification, and the production efficiency of circuit board processing is seriously influenced.
The method for replacing the zero-ohm resistor in the prior art is to use a Short pad (Short pad) to replace the zero-ohm resistor, the pad on the right side in fig. 1 is the Short pad, two adjacent pads are directly connected together, the Short circuit of the circuit can be realized without connecting the zero-ohm resistor, and the placement and routing of components of the original circuit board cannot be influenced. However, in the later debugging process, the short pad needs to be cut off, and at this time, the connected short pad is cut off only by using the cutter, so that the circuit board is easily damaged, and the short circuit is possibly caused by incomplete cutting to influence the later use.
Disclosure of Invention
In view of the above, the embodiments of the present disclosure provide a printed circuit board, a method for printing the printed circuit board, and a debugging method, so as to solve the above problems.
In one aspect, an embodiment of the present disclosure provides a printed circuit board, which at least includes: a pad with a preset specification; wherein, the pad of presetting the specification includes at least: the circuit comprises a first bonding pad and a second bonding pad, wherein the first bonding pad and the second bonding pad are oppositely arranged; wherein: the first and second pad configurations include reducing an electrical gap of the first and second pads by an arrangement of respective solder structures.
Further, the electrical gap is arranged to correspond to a first predetermined range of 2 mils to 5 mils.
Further, the preset specification of the pad further includes: a solder resist layer; the solder mask layer is arranged around the welding area formed by the first pad and the second pad.
Further, the solder resist layer is made of solder resist ink.
Further, still include: a power pad for soldering of a pin associated with a power source; wherein the power supply pad includes at least: the third bonding pad and the fourth bonding pad are oppositely arranged; wherein: the third and fourth pads are arranged to: the two are arranged close to each other.
Further, the third pad and the fourth pad have opposing edges spaced apart by a distance of 5 mils to 12 mils.
On the other hand, the embodiment of the present disclosure further provides a method for printing a circuit board, including: printing a first bonding pad and a second bonding pad on a circuit board to form a bonding pad with a preset specification, wherein the first bonding pad and the second bonding pad are oppositely arranged, and the first bonding pad and the second bonding pad are configured as follows: the electrical gap of the first and second pads is reduced by the arrangement of the respective solder structures.
Further, still include: and arranging a solder mask layer around a welding area formed by the first pad and the second pad.
Further, still include: printing a power supply bonding pad on the circuit board for welding a pin related to a power supply; wherein the power supply pad includes at least: the third bonding pad and the fourth bonding pad are oppositely arranged; wherein: the third and fourth pads are arranged to: the two are arranged close to each other.
On the other hand, the embodiment of the present disclosure further provides a debugging method based on the printed circuit board, including: covering a steel plate on a printed circuit board, wherein the steel plate is provided with a preset number of windows, each window corresponds to a welding pad with a preset specification, and the length and the width of each window are larger than those of the welding pad with the preset specification corresponding to the window; coating solder paste on the windowing position and welding to enable a first bonding pad and a second bonding pad of the bonding pad with the preset specification to be in short circuit; and debugging the printed circuit board.
The pad of specification is predetermine to printed circuit board in this embodiment includes relative first pad and the second pad that sets up at least, and the electric clearance between two pads is shorter, can be with first pad and second pad short circuit through the form that tin even in test and the verification of earlier stage carry out, realize zero ohmic function, accessible flatiron removes tin even can be with first pad and second pad disconnection or other subassemblies of connection in the later stage use, use a large amount of zero ohmic resistance influence production efficiency when having avoided the circuit board design in earlier stage, the damage that uses short pad to cause the circuit board has been reduced again, conveniently design and use, and then promote and use experience.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present disclosure, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art zero ohm resistor and short pad design;
FIG. 2 is a schematic diagram illustrating a pad design with a predetermined specification according to a first embodiment of the disclosure;
FIG. 3 is a schematic design diagram of a 0201 type pad in a first embodiment of the disclosure;
fig. 4 is a schematic view of an arrangement of a solder resist layer in a first embodiment of the present disclosure;
fig. 5 is a schematic view showing another arrangement of a solder resist layer in the first embodiment of the present disclosure;
FIG. 6 is a diagram illustrating a power pad design according to the prior art;
fig. 7 is a schematic design diagram of a power supply pad in a first embodiment of the present disclosure.
Detailed Description
Various aspects and features of the disclosure are described herein with reference to the drawings.
It will be understood that various modifications may be made to the embodiments of the present application. Accordingly, the foregoing description should not be construed as limiting, but merely as exemplifications of embodiments. Other modifications will occur to those skilled in the art within the scope and spirit of the disclosure.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and, together with a general description of the disclosure given above, and the detailed description of the embodiments given below, serve to explain the principles of the disclosure.
These and other characteristics of the present disclosure will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the attached drawings.
It should also be understood that, although the present disclosure has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of the disclosure, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.
The above and other aspects, features and advantages of the present disclosure will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.
Specific embodiments of the present disclosure are described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the disclosure that may be embodied in various forms. Well-known and/or repeated functions and structures have not been described in detail so as not to obscure the present disclosure with unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure in virtually any appropriately detailed structure.
The specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the disclosure.
In the development stage of electronic products, many zero-ohm resistors are often required to be reserved on a circuit board in a circuit, so that an engineer can conveniently test and verify the zero-ohm resistors, for example, the zero-ohm resistors are connected to the left pad in fig. 1. In the development and production process of the circuit board of the notebook computer, 120 to 150 zero ohm resistors are generally required in the EVT stage, and only about 28 zero ohm resistors are required in the SVT stage, so that it can be found that many later unnecessary components need to be arranged on the circuit board for testing and verification in the initial development stage, and the production efficiency of circuit board processing is seriously influenced.
The method for replacing the zero-ohm resistor in the prior art is to use a Short pad (Short pad) to replace the zero-ohm resistor, the pad on the right side in fig. 1 is the Short pad, two adjacent pads are directly connected together, the Short circuit of the circuit can be realized without connecting the zero-ohm resistor, and the placement and routing of components of the original circuit board cannot be influenced. However, in the later debugging process, the short pad needs to be cut off, and at this time, the connected short pad is cut off only by using the cutter, so that the circuit board is easily damaged, and the short circuit is possibly caused by incomplete cutting to influence the later use.
In order to solve the above problem, a first embodiment of the present disclosure provides a printed circuit board, the printed circuit board is at least provided with pads of a preset specification, as shown in fig. 2, the pads of the preset specification at least include a first pad 10 and a second pad 20, which are arranged opposite to each other, in order to facilitate short-circuiting by tin connection, the first pad 10 and the second pad 20 are arranged by respective soldering structures, so that an electrical gap between the first pad 10 and the second pad 20 is reduced, and in cooperation with a special steel plate design, when debugging is performed, the first pad 10 and the second pad 20 can be short-circuited by a tin connection form, so as to implement a zero-ohm function, in a later use process, the tin connection covering between the first pad 10 and the second pad 20 can be removed by using a soldering iron, so that the first pad 10 and the second pad 20 can be disconnected, or other components can be connected to the first pad 10 or the second pad 20, the problem of use a large amount of zero ohmic resistance to influence production efficiency when having avoided the circuit board design in earlier stage, solved the damage that uses short pad to cause the circuit board again, through the printed circuit board of this embodiment, can satisfy test engineer in the debugging demand of each stage to the circuit board, and then promote to use and experience.
In general, the first pad 10 and the second pad 20 are both rectangular or rounded rectangular with the same shape, and in special cases, other shapes may be used for pad printing, and in this embodiment, rectangular pads are used for description.
Further, in order to facilitate the tin connection between the first pad 10 and the second pad 20, the electrical gap formed between the first pad 10 and the second pad 20 should be arranged to be within a first predetermined range, preferably 2 mils to 5 mils, and the electrical gap between the first pad 10 and the second pad 20 should be set to be as much as possible according to the specific specification of the pad and the model and size of the circuit board, and at the same time, the size of the first pad 10 and the second pad 20 is also generally related to the model of the pad. Fig. 3 shows a preferred schematic diagram of 0201 type bonding pads, where the first bonding pad 10 and the second bonding pad 20 both have a size of 12mil by 16mil, and an electrical gap therebetween is 4mil, corresponding to a 16mil by 40mil window that can be opened on a steel plate when performing tin bonding, i.e. the 0201 type bonding pads can be completely covered, and tin bonding between the first bonding pad 10 and the second bonding pad 20 is achieved.
In order to prevent poor tin-soldering caused by the fact that tin paste is not coated on the electric gap between the first bonding pad 10 and the second bonding pad 20 in the tin-connection process, the solder mask layer 50 is arranged around the welding area formed by the first bonding pad 10 and the second bonding pad 20, the solder mask layer 50 is made of solder mask ink, the surface of the solder mask layer is not prone to being adhered with the tin paste, the tin paste can be enabled to be located in the position of the electric gap between the first bonding pad 10 and the second bonding pad 20 in the tin-connection process, and the tin-connection quality is improved. Fig. 4 and 5 show two arrangements of the solder resist layer 50, and as shown by the hatched portion in fig. 4, the solder resist layer 50 may be arranged around the periphery of the soldering region formed by the first pad 10 and the second pad 20; the solder resist layer 50 may also extend from the right side of the first pad 10 to the second pad 20 and from the left side of the second pad 20 to the first pad 10 in a manner shown by hatching in fig. 5, i.e., no provision of the solder resist layer 50 is made above the first pad 10 and below the second pad 20. Of course, in actual use, the solder resist layer 50 may be disposed around the soldering region in other manners than those shown in fig. 4 and 5, as long as the function of promoting the solder paste to be in the position of the electrical gap between the first pad 10 and the second pad 20 during the soldering process can be achieved.
In practical use, the printed circuit board is usually provided with a power supply pad specially used for welding pins related to a power supply, the shape of the power supply pad in the prior art is shown in fig. 6, that is, the power supply pad in the prior art is two zigzag pads which are oppositely arranged and matched in shape, when the pad is short-circuited (jump) through tin connection, only one end of the pad is better in tin-eating condition, and the other end of the pad is poor in tin-eating condition or not covered by tin paste, so that the rated current of equipment can be influenced; when a test resistor needs to be connected, green paint at two ends of the bonding pad needs to be scraped, the circuit board can be damaged, the piece-making time is increased, the productivity utilization rate is affected, and material loss can be caused. In the present embodiment, the zigzag pad in the prior art is replaced by a new power supply pad, as shown in fig. 7, the power supply pad in the present embodiment includes at least a third pad 30 and a fourth pad 40 which are oppositely disposed and are disposed close to each other to reduce the creepage distance therebetween, so as to facilitate the short circuit.
Specifically, the distance between the opposite edges of the third pad 30 and the fourth pad 40 is 5 mils to 12 mils, and the specific distance can be set according to the model of the power supply pad and the size of the circuit board, the power supply pad shown in fig. 7 is a modification of the power supply pad with model number JUMP _43X118, as shown in fig. 7, the third pad 30 and the fourth pad 40 are both rounded square pads with the size of 35 mils by 35 mils, and the distance between the rounded square pads is 12 mils; when the power supply bonding pad in the embodiment is subjected to tin connection, the rapid short circuit can be realized by arranging the corresponding opening on the steel plate, and in the tin connection process, the third bonding pad 30 and the fourth bonding pad 40 can be well connected only by coating tin paste on a gap between the two, so that the condition of poor tin absorption in the prior art is avoided; furthermore, during testing, only the tin is required to be disconnected and then the test resistor is connected, the green paint coated on the circuit board is not required to be damaged, and meanwhile, the operation efficiency is improved.
It should be noted that the solder mask layer 50 may also be disposed around the bonding region formed by the third pad 30 and the fourth pad 40, and the manner of disposing the solder mask layer 50 around the first pad 10 and the second pad 20 is the same, and will not be described herein again.
A second embodiment of the present disclosure provides a method for printing a circuit board, which is mainly used for printing the circuit board provided in the first embodiment of the present disclosure, and mainly includes step S1, that is, printing a first pad and a second pad on the circuit board to form a pad with a preset specification; the printed pads of the predetermined specifications are as shown in fig. 2, i.e., the first pad and the second pad are disposed opposite to each other and are configured such that the electrical gap therebetween is reduced by the arrangement of the respective soldering structures. In the time of in-service use, can cooperate special steel sheet design, in the debugging process, can be with first pad and second pad short circuit through the form that tin even, realize zero ohmic function, then the accessible uses the flatiron to detach the tin that covers between first pad and second pad in the use in later stage and even can break off first pad and second pad, perhaps connect other subassemblies on first pad or second pad, use a large amount of zero ohmic resistance influence production efficiency when having avoided the design of circuit board earlier stage, the problem of the damage that uses short pad to cause the circuit board has been solved again, printed circuit board through this embodiment, can satisfy test engineer in the debugging demand of each stage to the circuit board, and then promote and use experience.
Further, in order to facilitate the tin connection between the first pad and the second pad, the electrical gap formed between the first pad and the second pad printed in this embodiment should be arranged to be within a first preset range, preferably 2 mils to 5 mils, and the electrical gap between the first pad and the second pad should be set to be how much according to the specific specification of the pad and the model and size of the circuit board, and meanwhile, the size of the first pad and the second pad is also generally related to the model of the pad.
After the first pad and the second pad are printed, step S2 may be further included, in which a solder mask is disposed around a soldering region formed by the first pad and the second pad to prevent poor soldering caused by solder paste not being applied to an electrical gap between the first pad and the second pad during the soldering process. Specifically, the solder mask layer is made of solder resist ink, solder paste is not easy to adhere to the surface of the solder mask layer, and the solder paste can be positioned in an electric gap between the first bonding pad and the second bonding pad in the tin connection process, so that the tin connection quality is improved; when the solder mask is sprayed on the circuit board, a spraying process mature in the prior art can be used, and the specific spraying manner is not limited in this embodiment.
In practical use, the printed circuit board usually further has a power pad dedicated for power-related pin soldering, and in this embodiment, the power pad may be printed at a corresponding position of the circuit board, where the power pad includes at least a third pad and a fourth pad that are disposed opposite to each other, and the third pad and the fourth pad are disposed close to each other to reduce a creepage distance therebetween, so as to facilitate short circuit completion. Preferably, the distance between the opposite edges of the third pad and the fourth pad is 5 mils to 12 mils, and the specific distance can be set according to the model of the power pad and the size of the circuit board, and the specific size of the third pad and the fourth pad can also be set according to the size of the circuit board and the actual power requirement, as long as the relative distance between the two pads is 5 mils to 12 mils.
It should be noted that the solder mask layer may also be disposed around the bonding region formed by the third pad and the fourth pad in the same manner as the solder mask layer is disposed around the first pad and the second pad, and details thereof are not repeated herein.
The third embodiment of the present disclosure discloses a debugging method for a printed circuit board provided in the first embodiment of the present disclosure, wherein a large number of short circuits are usually required to be performed on the circuit board in the engineering verification stage, in this embodiment, the short circuits are completed by performing tin connection on pads of a preset specification in the circuit board, and the same effect as that of using a zero-ohm resistor is achieved. Specifically, the debugging method mainly includes steps S31 to S33:
s31, covering the steel plate on the printed circuit board; it should be noted that, a preset number of windows are formed in the steel plate, each window corresponds to a pad with a preset specification, and in order to ensure the tin connection effect, the length and width of each window on the steel plate are both greater than those of the corresponding pad with the preset specification;
s32, coating solder paste on the windowing position and welding to enable the first pad and the second pad of the pad with the preset specification to be in short circuit; the welding disc with the preset specification of the circuit board is penetrated out from the windowing part of the steel plate, and the circuit board and the steel plate can be conveyed to a soldering tin machine together for subsequent short-circuit operation after the solder paste is coated on the welding disc;
s33, debugging the printed circuit board; after the first bonding pad and the second bonding pad are connected in a tin mode, a short circuit is formed at the position, a test engineer can conveniently carry out early-stage design and debugging, and a specific debugging mode and means can be carried out by the test engineer according to actual design requirements.
Further, when the test is in the later stage and the short circuit is not needed to be performed at multiple positions, the tin connection between the first bonding pad and the second bonding pad can be removed through a soldering iron, the first bonding pad and the second bonding pad are restored to the disconnected state, or other circuit elements are connected to the first bonding pad or the second bonding pad to complete other tests.
This embodiment can realize the quick short circuit to predetermineeing the specification pad in the printed circuit board through combining to open the steel sheet that has the windowing of predetermineeing quantity to replace the setting of zero ohmic resistance, promoted the production and the availability factor of circuit board, and still can carry out corresponding adjustment to the connection condition between the pad in the test phase of difference, need not change or cause the damage to circuit board itself, conveniently design and use, and then promote and use experience.
While the present disclosure has been described in detail with reference to the embodiments, the present disclosure is not limited to the specific embodiments, and those skilled in the art can make various modifications and alterations based on the concept of the present disclosure, and the modifications and alterations should fall within the scope of the present disclosure as claimed.
Claims (10)
1. A printed circuit board, comprising at least:
a pad with a preset specification; wherein the content of the first and second substances,
the preset specification of the bonding pad at least comprises: the circuit comprises a first bonding pad and a second bonding pad, wherein the first bonding pad and the second bonding pad are oppositely arranged; wherein:
the first and second pad configurations include reducing an electrical gap of the first and second pads by an arrangement of respective solder structures.
2. The printed circuit board of claim 1, wherein the electrical gap is arranged to correspond to a first predetermined range of 2 mils to 5 mils.
3. The printed circuit board of claim 1, wherein the pre-defined size pads further comprise:
a solder resist layer; the solder mask layer is arranged around the welding area formed by the first pad and the second pad.
4. A printed circuit board according to claim 3, wherein the solder resist layer is made of solder resist ink.
5. The printed circuit board of claim 1, further comprising:
a power pad for soldering of a pin associated with a power source; wherein the content of the first and second substances,
the power supply pad includes at least: the third bonding pad and the fourth bonding pad are oppositely arranged; wherein:
the third and fourth pads are arranged to: the two are arranged close to each other.
6. The printed circuit board of claim 5, wherein the third and fourth pads have opposing edges that are separated by a distance of 5 mils to 12 mils.
7. A method of printing a circuit board, comprising:
printing a first bonding pad and a second bonding pad on a circuit board to form a bonding pad with a preset specification, wherein the first bonding pad and the second bonding pad are oppositely arranged, and the first bonding pad and the second bonding pad are configured as follows: the electrical gap of the first and second pads is reduced by the arrangement of the respective solder structures.
8. The printing method of claim 7, further comprising:
and arranging a solder mask layer around a welding area formed by the first pad and the second pad.
9. The printing method of claim 7, further comprising:
printing a power supply bonding pad on the circuit board for welding a pin related to a power supply; wherein the content of the first and second substances,
the power supply pad includes at least: the third bonding pad and the fourth bonding pad are oppositely arranged; wherein:
the third and fourth pads are arranged to: the two are arranged close to each other.
10. A debugging method of a printed circuit board based on any one of claims 1 to 6, comprising the following steps:
covering a steel plate on a printed circuit board, wherein the steel plate is provided with a preset number of windows, each window corresponds to a welding pad with a preset specification, and the length and the width of each window are larger than those of the welding pad with the preset specification corresponding to the window;
coating solder paste on the windowing position and welding to enable a first bonding pad and a second bonding pad of the bonding pad with the preset specification to be in short circuit;
and debugging the printed circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011326486.XA CN112738992A (en) | 2020-11-24 | 2020-11-24 | Printed circuit board, and printing method and debugging method of printed circuit board |
| CN202210049321.5A CN114501789A (en) | 2020-11-24 | 2020-11-24 | Printed circuit board, and printing method and debugging method of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011326486.XA CN112738992A (en) | 2020-11-24 | 2020-11-24 | Printed circuit board, and printing method and debugging method of printed circuit board |
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| CN202210049321.5A Division CN114501789A (en) | 2020-11-24 | 2020-11-24 | Printed circuit board, and printing method and debugging method of printed circuit board |
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| CN112738992A true CN112738992A (en) | 2021-04-30 |
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| CN202011326486.XA Pending CN112738992A (en) | 2020-11-24 | 2020-11-24 | Printed circuit board, and printing method and debugging method of printed circuit board |
| CN202210049321.5A Pending CN114501789A (en) | 2020-11-24 | 2020-11-24 | Printed circuit board, and printing method and debugging method of printed circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114280854A (en) * | 2021-12-17 | 2022-04-05 | 惠科股份有限公司 | Display panel and display |
| WO2024050814A1 (en) * | 2022-09-09 | 2024-03-14 | 京东方科技集团股份有限公司 | Wiring substrate and manufacturing method therefor, and electronic device |
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