CN112731772B - Alignment method of double-table laser direct writing exposure machine - Google Patents
Alignment method of double-table laser direct writing exposure machine Download PDFInfo
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- CN112731772B CN112731772B CN202011616080.5A CN202011616080A CN112731772B CN 112731772 B CN112731772 B CN 112731772B CN 202011616080 A CN202011616080 A CN 202011616080A CN 112731772 B CN112731772 B CN 112731772B
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000000007 visual effect Effects 0.000 claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses an alignment method of a double-mesa laser direct writing exposure machine, which changes the setting position of a visual calibration point, so that the visual calibration point can move along the X direction, when the position of a visual unit is calibrated, the visual unit does not need to move, and after calibration, the visual unit does not need to move to the range where a mark point can be seen for alignment, thereby reducing the accumulated error of motion and improving the alignment precision; because the position calibration of the visual unit is realized by moving the visual calibration point, and the moving precision of the exposure engine is very high, the moving mechanism of the visual unit does not need very high precision any more, and the difficulty of the control of the visual unit is reduced.
Description
Technical Field
The invention relates to a digital laser direct writing exposure system, in particular to a high-efficiency double-table exposure machine and an exposure method.
Background
A double-table laser direct-writing exposure machine is disclosed, wherein an alignment mechanism of the double-table exposure machine is generally placed in front of an exposure engine in the market, the alignment mechanism comprises two to three visual units which can move in the stepping direction of the exposure engine, and moving routes of the exposure engine and the visual units are parallel and can only move in the X direction; the relative position of the visual unit and the exposure engine needs to be determined firstly, then the position coordinate of the visual unit relative to the circuit board can be converted into the position coordinate of the exposure engine relative to the circuit board, and only when the exposure engine and the suction cup move, the exposure engine can expose a preset pattern on the circuit board at an accurate position through the movement of the exposure engine and the suction cup, the relative position determination of the exposure engine and the visual unit is to see the visual calibration point through the visual unit and determine the relative position with the visual calibration point, then the exposure engine projects an engine calibration point on the sucker, the camera simultaneously sees the engine calibration point and the visual calibration point, and then the relative position relationship between the exposure engine and the visual unit is obtained through calculation.
Because the table top is large, the vision units need to respectively mark a position on the left table top and the right table top, so that the circuit boards on the left table top and the right table top can be aligned, the vision system moves from the left table top to the right table top, the general moving distance is long, the alignment precision of the whole system is influenced by the vision system moving mechanism, the alignment precision of the system is greatly influenced, and the alignment precision of the system is reduced. However, because the specifications of the circuit boards are different, the mark points on the circuit board have a large difference in the X-direction position, and the vision unit still needs to move from the calibration position to the position where the mark points can be seen to perform alignment when the vision unit performs alignment on the mark points.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the alignment method of the double-table laser direct writing exposure machine, which not only has high efficiency, but also can improve the exposure precision.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides a counterpoint method of double-deck laser direct writing exposure machine, includes exposure engine, visual element, sucking disc and sets up the camera on the sucking disc, its characterized in that: the method comprises the following steps:
s1: a visual calibration point is set on the exposure engine,
s2: loading production data into the exposure machine, moving the vision unit to a corresponding position through coordinate data in the production data, and identifying Mark points on the circuit board to be exposed at the position, wherein the position is a temporary calibration position set for processing the circuit board with the specification,
s3: moving the exposure engine in the X direction to enable the visual unit to see the visual calibration point and calibrate the position of the visual unit at the moment; and moving the sucker along the Y direction to enable the camera to see the visual calibration point and enable the exposure engine to project the engine calibration point on the sucker, wherein the camera simultaneously sees the engine calibration point, and then the relative position relationship between the exposure engine and the visual unit is obtained through calculation.
Two lines of Mark points are oppositely arranged on the circuit board and are respectively positioned on two sides of the circuit board, two sets of vision units are correspondingly arranged, and each set of vision unit corresponds to one line of Mark points.
The invention has the beneficial effects that: the method changes the setting position of the visual calibration point, so that the visual calibration point can move along the X direction, when the position of the visual unit is calibrated, the visual unit does not need to move, and after calibration, the visual unit does not need to move to the range where the mark point can be seen for alignment, thereby reducing the accumulated error of movement and improving the alignment precision; because the position calibration of the visual unit is realized by moving the visual calibration point, and the moving precision of the exposure engine is very high, the moving mechanism of the visual unit does not need very high precision any more, and the difficulty of the control of the visual unit is reduced.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic diagram of the position relationship of the present invention.
Detailed Description
Referring to fig. 1, the invention discloses an alignment method of a double-table laser direct writing exposure machine, which comprises an exposure engine 1, a visual unit 2, a sucker 3 and a camera 4 arranged on the sucker 3, and is characterized in that: the method comprises the following steps:
s1: the visual calibration point 5 is set on the exposure engine 1, and can be any position on the exposure engine 1 which can be seen by the visual unit 2, the setting can be direct setting or indirect setting, the indirect setting means that the visual calibration point 5 can be set on an object connected with the exposure engine 1, the setting mode of the visual calibration point 5 is the same as before, thus not detailed,
s2: loading production data into an exposure machine, wherein the production data are coordinates and dimension parameters of a graph to be exposed by an exposure engine 1 on a circuit board, moving a visual unit 2 to a corresponding position through coordinate data in the production data, identifying Mark points on the circuit board to be exposed at the position, wherein the position is a temporary calibration position set for processing the circuit board of the specification, the precision of the temporary calibration position is low, so that the precision of a moving mechanism of the visual unit 2 is also low, the circuit board is generally provided with four Mark points which are divided into two rows and are respectively positioned at four corners of the circuit board, the visual unit 2 is correspondingly provided with two sets, each set of visual unit 2 corresponds to one row of Mark points, and because the shooting range of the visual unit 2 is not large and can not move, one set corresponds to one row of Mark points,
s3: moving the exposure engine 1 in the X direction so that the vision unit 2 can see the vision calibration point 5 and calibrate the position of the vision unit 2 at that time; the suction cup 3 is moved along the Y direction to enable the camera 4 to see the visual calibration point 5 and enable the exposure engine 1 to project the engine calibration point on the suction cup 3, the camera 4 simultaneously sees the engine calibration point, and then the relative position relationship between the exposure engine 1 and the visual unit 2 is obtained through calculation, and the calculation mode is the same as the conventional mode in principle, so that the description is omitted.
For convenience of description, the term "see" is used to mean that the term "see" is within the shooting range of the vision unit 2 or the camera 4.
The temporary calibration position can only be used for producing circuit boards of the same specification, if the specification of the circuit board is changed because the position of the Mark point changes, the Mark point of the circuit board with the changed specification cannot be seen by the vision unit 2 at the previous position, so the vision unit 2 needs to find a new temporary calibration position by inputting new production data, and then recalibrate the relative position relation with the exposure engine 1 at the position, therefore, although the method needs to recalibrate during the specification change of the circuit board, the accuracy is improved and the cost is reduced.
The alignment method of the double-mesa laser direct writing exposure machine provided by the embodiment of the invention is described in detail, a specific example is applied in the text to explain the principle and the implementation of the invention, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (2)
1. The utility model provides a counterpoint method of double-deck laser direct writing exposure machine, includes exposure engine, visual element, sucking disc and sets up the camera on the sucking disc, its characterized in that: the method comprises the following steps:
s1: a visual calibration point is set on the exposure engine,
s2: loading production data into an exposure machine, moving a visual unit to a corresponding position through coordinate data in the production data, and identifying Mark points on a circuit board to be exposed at the position, wherein the position is a temporary Mark position, the temporary Mark position can only be used for producing the circuit board with the same specification, after the specification of the circuit board is changed, the Mark points of the circuit board with the changed specification cannot be seen by the visual unit at the former position because of the position change of the Mark points, and therefore the visual unit needs to find a new temporary Mark position by inputting new production data,
s3: moving the exposure engine along the X direction to enable the visual unit to see the visual calibration point and calibrate the position of the visual unit at the moment, wherein the visual unit does not need to move; and moving the sucker along the Y direction to enable the camera to see the visual calibration point and enable the exposure engine to project the engine calibration point on the sucker, wherein the camera simultaneously sees the engine calibration point, and then the accurate positions of the exposure engine and the visual calibration point are obtained through calculation, so that the relative position relationship between the exposure engine and the visual unit is calculated.
2. The alignment method of the double-mesa laser direct-writing exposure machine according to claim 1, wherein: two lines of Mark points are oppositely arranged on the circuit board and are respectively positioned on two sides of the circuit board, two sets of vision units are correspondingly arranged, and each set of vision unit corresponds to one line of Mark points.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011616080.5A CN112731772B (en) | 2020-12-30 | 2020-12-30 | Alignment method of double-table laser direct writing exposure machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011616080.5A CN112731772B (en) | 2020-12-30 | 2020-12-30 | Alignment method of double-table laser direct writing exposure machine |
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| Publication Number | Publication Date |
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| CN112731772A CN112731772A (en) | 2021-04-30 |
| CN112731772B true CN112731772B (en) | 2022-04-12 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6111646A (en) * | 1999-01-12 | 2000-08-29 | Naulleau; Patrick | Null test fourier domain alignment technique for phase-shifting point diffraction interferometer |
| US6519868B1 (en) * | 2000-12-30 | 2003-02-18 | John D Pryor | Adjustable visual media mounting |
| CN105278262A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method of demarcating positional relation of optical paths of exposure machine through chuck camera |
| CN108681213A (en) * | 2018-05-14 | 2018-10-19 | 中山新诺科技股份有限公司 | Digitize lithography system and method |
-
2020
- 2020-12-30 CN CN202011616080.5A patent/CN112731772B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6111646A (en) * | 1999-01-12 | 2000-08-29 | Naulleau; Patrick | Null test fourier domain alignment technique for phase-shifting point diffraction interferometer |
| US6519868B1 (en) * | 2000-12-30 | 2003-02-18 | John D Pryor | Adjustable visual media mounting |
| CN105278262A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method of demarcating positional relation of optical paths of exposure machine through chuck camera |
| CN108681213A (en) * | 2018-05-14 | 2018-10-19 | 中山新诺科技股份有限公司 | Digitize lithography system and method |
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| CN112731772A (en) | 2021-04-30 |
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Effective date of registration: 20240119 Address after: 528400 No. 3 Mingzhu Road, Torch Development Zone, Zhongshan City, Guangdong Province Patentee after: Zhongshan Xinnuo Microelectronics Co.,Ltd. Address before: 528400 No. 3 Mingzhu Road, Torch Development Zone, Zhongshan City, Guangdong Province Patentee before: ZHONGSHAN AISCENT TECHNOLOGIES Co.,Ltd. |