CN109556515B - A kind of systematic error calibration method, system and equipment based on machine vision - Google Patents
A kind of systematic error calibration method, system and equipment based on machine vision Download PDFInfo
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- CN109556515B CN109556515B CN201811470183.8A CN201811470183A CN109556515B CN 109556515 B CN109556515 B CN 109556515B CN 201811470183 A CN201811470183 A CN 201811470183A CN 109556515 B CN109556515 B CN 109556515B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
Abstract
The invention discloses a kind of systematic error calibration method based on machine vision, plugged applied to patch it is standby, the method includes the steps: according to error pattern, create different calibration dot array datas；It identifies the electronic component picked up, obtains electronic component identification position mechanical coordinate and corresponding electronic component jack position mechanical coordinate；Select Error type is based on corresponding calibration dot array data, identifies that location information and corresponding electronic component jack position information carry out processing calculating to electronic component, and the electronic component calibrated, which pastes, inserts position correction actual coordinate.The invention also discloses a kind of systematic error calibration system and equipment based on machine vision.The present invention relates to industrial accurate control technique field, a kind of systematic error calibration method, system and equipment based on machine vision, according to error pattern, select corresponding calibration dot array data, calibration system error reduces the cost of systematic error calibration, improves the simplicity of systematic error calibration.
Description
Technical field
The present invention relates to industrial accurate control technique field more particularly to a kind of systematic error calibrations based on machine vision
Method, system and equipment.
Background technique
In high-accuracy industrial production, equipment precision is one of most important performance indicator, and the precision of equipment often depends on
In total system error, total system error is from foozle, rigging error and control soft-error.Some errors can
Effectively evaded by promoting manufacturing process or assembly technology, some errors are due to material property, manufacture or assembler
The limitation of the skill limit and can not eliminate well.General patch, which plugs, controls the movement of feeding heads for using two kinds of motor schemes, the
A kind of motor scheme be it is mobile using screw rod, guide rail and Serve Motor Control feeding head, plugged using the patch of such motor scheme
Standby, systematic error is mainly the pitch error of screw rod, and pitch error is limited by manufacturing process and abrasion causes, therefore in reality
In the application of border, distance change amount error can be generated；Second of motor scheme is, use mobile using linear motor control feeding head
The patch of such motor scheme plugs standby, and systematic error is mainly linear motor grating scale/magnetic railings ruler manufacturing and fixing error,
I.e. in practical applications, position coordinates error can be generated.Although the systematic error of above two scheme is different, it can all make axis
Instruct positional value and actual position value unequal in motion process, so as to cause accuracy decline.The prior art is dry using laser
Interferometer carries out point sampling to axis running track, obtains the instruction value of axis and the offset distance of measured value, and forms migration text
Part carries out position correction using migration value by software approach.But laser interferometer is more expensive, only transports every time to single shaft
Dynamic rail mark measures, operate with step also relatively precisely and it is cumbersome, generally require the higher operator's ability of professional degree
It carries out.In addition, since the system accuracy of equipment is also easy to be influenced by ambient temperature and humidity, if environmental condition changes
, it is necessary to measurement is re-started, just can ensure that the precision of software calibration, laser interferometer is as a kind of professional equipment, also not
Facilitate very much and is commonly used in curstomer's site.
Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention
One purpose is to provide a kind of systematic error calibration method, system and equipment based on machine vision, reduces systematic error calibration
Cost, improve systematic error calibration simplicity.
The technical scheme adopted by the invention is that: a kind of systematic error calibration method based on machine vision is applied to patch
Plug standby, the patch plugs the standby first area being above provided with for placing circuit substrate and for placing electronic component material
Second area, it includes feeding device that the patch, which plugs standby, and the feeding device is for picking up electronic component and pasting electronic component
It is inserted to corresponding position on circuit substrate, it includes material recognizing device and image collecting device that the patch, which plugs standby, and the material is known
The electronic component that other device picks up for identification, described image acquisition device is for electronic component letter each on Acquisition Circuit substrate
Breath, the method includes the steps:
According to error pattern, different calibration dot array datas is created；
It obtains the electronic component information table of circuit substrate and stores；
It identifies the electronic component picked up, obtains electronic component identification location information and obtained according to the electronic component information table
To corresponding electronic component jack position information；
Select Error type is based on corresponding calibration dot array data, identifies location information and corresponding electricity to electronic component
Subcomponent jack position information carries out processing calculating, and the electronic component calibrated, which pastes, inserts position correction actual coordinate.
As a further improvement of the foregoing solution, the error pattern includes that distance change amount error and position coordinates miss
Difference, it is described according to error pattern, it creates different calibration dot array datas and specifically includes:
Selection calibration auxiliary tool, obtains standard mechanical coordinate dot array data；
According to the standard mechanical coordinate dot array data and distance change amount error, creation the first calibration dot array data；
According to the standard mechanical coordinate dot array data and position coordinates error, creation the second calibration dot array data.
As a further improvement of the foregoing solution, auxiliary tool is calibrated in the selection, obtains standard mechanical coordinate dot matrix number
According to specifically including:
It selects dot matrix scaling board as calibration auxiliary tool, obtains dot matrix and demarcate board parameter, the dot matrix scaling board is installed
So that the first area where dot matrix scaling board covering identification position and circuit substrate；
Image collecting device scans all the points on the dot matrix scaling board, obtains the machine of all the points on the dot matrix scaling board
Tool coordinate, using the mechanical coordinate of all the points on dot matrix scaling board as standard mechanical coordinate dot array data.
As a further improvement of the foregoing solution, described to be missed according to standard mechanical coordinate dot array data and distance change amount
Difference, creation the first calibration dot array data specifically include:
The coordinate of shooting identification position is as the first datum mark, mechanical coordinate O where determining material recognizing device1
(0,0) calculates the first location of instruction M1(mx, my) is to the first datum mark O1(0,0) the first instruction distance Md(dmx,dmy)；
Board parameter is demarcated according to the standard mechanical coordinate dot array data and the dot matrix, obtains the first location of instruction M1
(mx, my) is to the first datum mark O1(0,0) the first actual range Ad(dAx,dAy)；
According to the first instruction distance Md(dmx, dmy) and the first actual range Ad(dAx, dAy), creation first
Dot array data is calibrated, the first calibration dot matrix data cell coordinate is Pd(dmx,dmy,dAx,dAy)。
It is as a further improvement of the foregoing solution, described according to standard mechanical coordinate dot array data and position coordinates error,
Creation the second calibration dot array data specifically includes:
The coordinate of shooting identification position is as the second datum mark, mechanical coordinate O where determining material recognizing device2
(refx, refy), according to the standard mechanical coordinate dot array data, the machinery of dot matrix in the standard mechanical coordinate dot array data
Coordinate is the second location of instruction mechanical coordinate, and second location of instruction mechanical coordinate is M (mx, my)；
Board parameter is demarcated according to the standard mechanical coordinate dot array data and the dot matrix, obtains the second actual position coordinate
A(Ax,Ay)；
According to the second location of instruction mechanical coordinate M (mx, my) and the second actual position coordinate A (Ax, Ay), the second school is created
Quasi- dot array data, the second calibration dot matrix data cell coordinate is P (mx, my, Ax, Ay).
As a further improvement of the foregoing solution, the electronic component information table includes electronic component types information, electronics
Element numbers information, electronic component pin information, electronic component jack position information and the electronic component types information,
The corresponding relationship of the electronic component label information, the electronic component pin information, the electronic component jack position information,
The electronic component information table for obtaining circuit substrate specifically includes:
It obtains electronic component types information, electronic component label information, electronic component pin information and stores；
Select Error type is based on corresponding calibration dot array data, obtains electronic component jack position information and stores, locates
Reason obtains the electronic component types information, the electronic component label information, the electronic component pin information, the electronics
The corresponding relationship of element receptacles location information and storage.
As a further improvement of the foregoing solution, the Select Error type is based on corresponding calibration dot array data, to electricity
Subcomponent identification location information and corresponding electronic component jack position information carry out processing calculating, the electronic component calibrated
Slotting position correction actual coordinate is pasted to specifically include:
Distance change amount error is selected, using the coordinate of material recognizing device place shooting identification position as the first benchmark
Point obtains the position that the electronic component of current pickup is taken when identifying, obtains electronic component current location mechanical coordinate, according to
Electronic component information table obtains corresponding electronic component jack position actual machine coordinate, calculates corresponding electronic component jack
The distance between position actual machine coordinate and electronic component current location mechanical coordinate are described as the first instruction distance
First calibration dot matrix data packet includes the multiple first minimum matrixes, and the described first minimum matrix includes four the first vertex, according to the
Unit of first instruction described in one calibration dot matrix data acquisition apart from corresponding four the first vertex of locating first minimum matrix is sat
The unit coordinate of the first instruction distance and four first vertex is substituted into range error calibration function, obtains the by mark
One actual range, the first electronic component that calibration is calculated, which pastes, inserts position correction actual coordinate；
Or selection position coordinates error, using the coordinate of material recognizing device place shooting identification position as the second benchmark
Point obtains the position that the electronic component of current pickup is taken when identifying, obtains electronic component current location mechanical coordinate, according to
Electronic component information table obtains corresponding electronic component jack position actual machine coordinate, calculates corresponding electronic component jack
The distance between position actual machine coordinate and the electronic component current location mechanical coordinate difference, according to the distance difference
With second datum mark, electronic component instruction patch slot is calculated and sets mechanical coordinate, the second calibration dot matrix data packet
The multiple second minimum matrixes are included, the described second minimum matrix includes four the second vertex, according to the second calibration dot matrix data acquisition
The electronic component instruction patch slot sets the unit coordinate on corresponding four the second vertex of the second minimum matrix locating for mechanical coordinate,
It instructs patch slot to set in the electronic component to substitute into position coordinates with the unit coordinate on four second vertex and calibrate for error letter
Number, the second electronic component that calibration is calculated, which pastes, inserts position correction actual coordinate.
A kind of systematic error calibration system based on machine vision, the system comprises:
Creation module, for creating different calibration dot array datas according to error pattern；
First obtains module, for obtaining the electronic component information table of circuit substrate and storing；
Second obtains module, and the electronic component picked up for identification obtains electronic component and identifies location information, according to described
Electronic component information table obtains corresponding electronic component jack position information；
Calibration module is selected, Select Error type is used for, is based on corresponding calibration dot array data, position is identified to electronic component
Confidence breath and corresponding electronic component jack position information carry out processing calculating, and the electronic component calibrated, which pastes, inserts position correction
Actual coordinate.
As a further improvement of the foregoing solution, the creation module includes:
Storage unit is obtained, for obtaining and storing standard mechanical coordinate dot array data；
First creating unit, for creating the first school according to standard mechanical coordinate dot array data and distance change amount error
Quasi- dot array data；
Second creating unit, for according to standard mechanical coordinate dot array data and position coordinates error, the second calibration of creation
Dot array data.
As a further improvement of the foregoing solution, it includes material pick device and material recognition dress that the identification, which obtains module,
It sets, the material pick device is for picking up electronic component and moving the electronic component of pickup to the material recognizing device position
It sets, the material recognizing device electronic component that the material pick device picks up for identification obtains electronic component and identifies position
Confidence breath.
A kind of systematic error calibrator (-ter) unit based on machine vision, comprising:
At least one processor, and the memory being connect at least one described processor communication；Wherein,
The memory is stored with the instruction that can be executed by least one processor, and described instruction is by described at least one
It manages device to execute, so that at least one described processor is able to carry out the systematic error calibration side as above-mentioned based on machine vision
Method.
The beneficial effects of the present invention are:
A kind of systematic error calibration method, system and equipment based on machine vision selects corresponding according to error pattern
Dot array data is calibrated, calibration system error reduces the cost of systematic error calibration, the simplicity of systematic error calibration is improved, with
The prior art is compared using laser interferometer, using the technology that is automatically aligned to of machine vision, lowers calibration system error operation
Complexity.
Detailed description of the invention
Specific embodiments of the present invention will be further explained with reference to the accompanying drawing:
Fig. 1 is that existing patch plugs the standby structural schematic diagram with dot matrix scaling board in the present invention；
Fig. 2 is a kind of systematic error calibration method flow chart based on machine vision of the present invention；
Fig. 3 is the schematic diagram of centre point and associated point in a coordinate system in bilinear interpolation function of the present invention；
Fig. 4 is a kind of systematic error calibration method system structure diagram based on machine vision of the present invention.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
Embodiment one
A kind of systematic error calibration method based on machine vision, plugged applied to patch it is standby, referring to Fig.1, Fig. 1 be the present invention
In existing patch plug the standby structural schematic diagram with dot matrix scaling board, patch plugs standby to include dot matrix scaling board 1, first element feeding position
2, second element feeding position 3, material recognizing device 4, circuit substrate 5, feeding device 6 and image collecting device 7 are set, patch plugs
It is standby to be above provided with the first area for placing circuit substrate 5 and the second area for placing electronic component material, feeding dress
6 are set for picking up electronic component and electronic component patch being inserted to corresponding position on circuit substrate, material recognizing device 4 is for identification
The electronic component of pickup, image collecting device 7 is for each electronic component information on Acquisition Circuit substrate 5.
In a particular embodiment, material recognizing device 4 is fixed camera, and image collecting device 5 is mobile camera.
Fig. 2 is a kind of systematic error calibration method flow chart based on machine vision of the present invention, referring to Fig. 2, this method packet
Step S1 is included to step S4.
S1 creates different calibration dot array datas according to error pattern；
S2 obtains the electronic component information table of circuit substrate and stores；
S3 identifies the electronic component of pickup, obtains electronic component and identifies location information, according to the electronic component information
Table obtains corresponding electronic component jack position information；
S4, Select Error type are based on corresponding calibration dot array data, to electronic component identification location information and accordingly
Electronic component jack position information carries out processing calculating, and the electronic component calibrated, which pastes, inserts position correction actual coordinate.
In the present embodiment, error pattern includes distance change amount error and position coordinates error, and step S1 is specifically included:
Selection calibration auxiliary tool, obtains standard mechanical coordinate dot array data；
According to standard mechanical coordinate dot array data and distance change amount error, creation the first calibration dot array data；
According to standard mechanical coordinate dot array data and position coordinates error, creation the second calibration dot array data.
Embodiment two
The purpose of the present embodiment is to illustrate selection calibration auxiliary tool step on the basis of example 1.
In the present embodiment, selection calibration auxiliary tool step specifically includes sub-step:
A1 analyzes the precision index for determining dot matrix scaling board according to the precision of calibration；
A2 selects the mobile camera of adequate resolution and suitable low aberration rate according to the precision index of dot matrix scaling board
Industrial lens；
A3, by the dot matrix scaling board of selection be mounted on patch plug it is standby upper so that dot matrix scaling board covering identification position and electricity
First area where base board, dot matrix scaling board and circuit substrate are contour, and the row of dot matrix scaling board and patch plug standby X-axis
It is parallel as far as possible；
A4, patch plug standby progress heat engine movement, preheat one hour；
A5 records current environment data, including atmospheric pressure, room temperature, relative humidity, screw rod/motor temperature.
In order to guarantee the precision of calibration, choice accuracy is not more than the dot matrix scaling board of 0.001mm, and image collecting device uses
Pixel uses the industrial lens of low aberration rate in 0.01mm/pixel mobile camera below, the camera lens of mobile camera.
In a particular embodiment, with the length of circuit substrate and wide respectively 400mm and 320mm, fixed camera is apart from circuit
For the edges of boards of substrate are 200mm:
The dot matrix scaling board having a size of 450mm*570mm is selected, is point spacing, the circle that design ranks are 44*56 with 10mm
The form point system of battle formations, wherein the diameter of circular dot is 4mm, and precision 0.001mm, dot matrix scaling board is using glass material or ceramic material
Matter.
Mobile camera (or directly using patch plug standby upper mobile camera) of the selection resolution ratio greater than 1,300,000.Selection figure
As the visual field is about 6*4.8mm, camera resolution 1280*1024, pixel equivalent is the low aberration rate work of 0.0047mm/pixel
Industry camera lens.
By the dot matrix scaling board of selection be mounted on patch plug it is standby upper so that dot matrix scaling board covering identification position and circuit base
First area where plate, dot matrix scaling board and circuit substrate are contour, and the row of dot matrix scaling board and patch plug standby X-axis as far as possible
In parallel.
Patch plugs standby progress heat engine movement, preheats one hour.
Current environment data are recorded, including atmospheric pressure, room temperature, relative humidity, screw rod/motor temperature.
It selects dot matrix scaling board as calibration auxiliary tool, directly acquires corresponding dot matrix calibration board parameter, dot matrix calibration
Board parameter includes the circle center distance between dot matrix scaling board any two points.
Embodiment three
The purpose of the present embodiment is to illustrate to obtain standard mechanical coordinate dot matrix data step on the basis of example 2.
In a particular embodiment, it obtains standard mechanical coordinate dot matrix data step and specifically includes sub-step:
B1 is automatically aligned to algorithm in the mobile camera setting center center of circle, and mobile camera is automatically aligned in the image in the visual field
The circular dot center of circle on the heart and dot matrix scaling board；
B2 selects initial baseline point, and the implementation center center of circle is automatically aligned to algorithm, obtains the mechanical coordinate of datum mark
The ranks value of (mrefx, mrefy) and datum mark；
B3 selects initial target point, mobile camera is moved to initial target point position, the implementation center center of circle is automatically aligned to
Algorithm, obtains the mechanical coordinate of target point, and mobile camera returns to initial baseline point；
B4 repeats step B2 to step B3, until all the points on mobile camera scanning dot matrix scaling board；
B5 as standard mechanical coordinate dot array data and saves the mechanical coordinate of all the points on dot matrix scaling board.
In a particular embodiment, it includes: quasi- with circle positioning and circle for being automatically aligned to algorithm in the mobile camera setting center center of circle
It is combined into combinational algorithm, on the image, first searches for circle position, it is rear to obtain the accurate center of circle using circle fitting tool；Calculate the center of circle and
The deviation (dx, dy) of picture centre guides equipment to be moved according to deviation, repeats the detection center of circle and picture centre is inclined
Difference just stops until its deviation is respectively less than 0.2 pixel of preset value (about 0.001mm).
Example IV
The purpose of the present embodiment is to illustrate to create different calibration dot matrix data steps on the basis of embodiment three.
In example 2, the row of dot matrix scaling board plugs that standby X-axis is parallel with patch, in actual installation dot matrix scaling board
In the process, patch plugs standby X-axis there may be angles with dot matrix scaling board, it is therefore desirable to by standard mechanical coordinate dot array data into
Row rotation, so that standard mechanical coordinate dot array data is more matched with the dot matrix of dot matrix scaling board.
Specifically, each dot matrix row mechanical coordinate carries out line fitting in extraction standard mechanical coordinate dot array data, obtain a plurality of
" row " line calculates the angle of a plurality of " row " line and X-axis, acquires average angle, initial baseline point is based on, by other points in dot matrix
It is rotated according to the angle of average angle, and updates standard mechanical coordinate dot array data.Standard mechanical coordinate described below
Dot array data is updated standard mechanical coordinate dot array data.
In the present embodiment, according to standard mechanical coordinate dot array data and distance change amount error, the first calibration point is created
Battle array data step specifically includes sub-step:
C1, according to standard mechanical coordinate dot array data, the coordinate of shooting identification position where determining material recognizing device the
One datum mark, mechanical coordinate O1(0,0) calculates the first location of instruction M1(mx, my) is to the first datum mark O1(0,0)
One instruction distance Md(dmx, dmy) (i.e. first location of instruction M1With the first datum mark O1Coordinate points difference)；
C2 demarcates board parameter according to the standard mechanical coordinate dot array data and dot matrix, obtains the first location of instruction M1
(mx, my) is to the first datum mark O1(0,0) the first actual range Ad(dAx, dAy) (i.e. on dot matrix scaling board any two points away from
From for actual range)；
C3, according to the first instruction distance Md(dmx, dmy) and the first actual range Ad(dAx, dAy) creates the first calibration point
Battle array data, the first calibration dot matrix data cell coordinate is Pd(dmx,dmy,dAx,dAy)。
In the present embodiment, according to standard mechanical coordinate dot array data and position coordinates error, creation the second calibration dot matrix
Data step specifically includes sub-step:
D1, as the second datum mark, mechanical coordinate is the coordinate of shooting identification position where determining material recognizing device
O2(refx, refy), according to standard mechanical coordinate dot array data, the mechanical coordinate of dot matrix is in standard mechanical coordinate dot array data
For the second location of instruction mechanical coordinate, the second location of instruction mechanical coordinate is M (mx, my)；
D2 demarcates board parameter according to standard mechanical coordinate dot array data and dot matrix, obtain the second actual position coordinate A (Ax,
Ay)；
D3, according to second according to location of instruction mechanical coordinate M (mx, my) and the second actual position coordinate A (Ax, Ay), creation
Second calibration dot array data, the second calibration dot matrix data cell coordinate is P (mx, my, Ax, Ay).
Embodiment five
The purpose of the present embodiment is to illustrate to obtain the electronic component information table step of circuit substrate on the basis of example IV
Suddenly.
In the present embodiment, electronic component information table includes electronic component types information, electronic component label information, electronics
Element receptacles location information, electronic component pin information, electronic component jack position information and electronic component types information,
Electronic component label information, electronic component jack position information, electronic component pin information, electronic component jack position information
Corresponding relationship.
The electronic component information table for obtaining circuit substrate specifically includes:
It obtains electronic component types information, electronic component label information, electronic component pin information and stores；
Select Error type is based on corresponding calibration dot array data, obtains electronic component jack information and stores, handles
To electronic component type information, electronic component label information, electronic component pin information, electronic component jack position information
Corresponding relationship and storage.
Acquisition to electronic component jack information on circuit substrate plugs standby, selection according to the patch of motor type not of the same race
Corresponding error pattern.Specific steps process is as follows:
It is plugged based on the patch using screw rod, guide rail and servo motor standby:
E1, mobile camera, so that mobile camera photographic subjects electronic component jack, records current goal electronic component
Jack position command coordinate M1(mx,my)；
E2, mobile camera are moved to the first datum mark O1(0,0) calculates target electronic components jack position command coordinate M1
(mx, my) is to the first datum mark O1(0,0) distance is as instruction distance Md(dmx, dmy) selects distance change amount error, base
Dot array data is calibrated in first, the first calibration dot matrix data packet includes the multiple first minimum matrixes, and the first minimum matrix includes four
First vertex, acquisition instruction distance MdThe unit coordinate on corresponding four the first vertex of the first minimum matrix locating for (dmx, dmy),
Distance M will be instructeddThe unit coordinate on (dmx, dmy) and four the first vertex substitutes into range error calibration function, obtain it is practical away from
From AdThe target electronic components jack position actual machine coordinate A (Ax, Ay) of calibration is calculated in (dAx, dAy)；
In the present embodiment, range error calibration function is piecewise linear interpolation function, is divided in respective axis direction
The linear interpolation in section, piecewise linear interpolation function are as follows:
E3, mobile camera is moved to target electronic components jack position to be calibrated, to target electronic components to be calibrated
Jack carries out capture and calculating；
E4 repeats step E1 to step E3, until obtaining all electronic component jack position information on circuit substrate.
It is plugged based on the patch using linear motor standby:
F1, mobile camera, so that mobile camera photographic subjects electronic component jack, records current goal electronic component
Jack command coordinate M (mx, my)；
F2, mobile camera are moved to the second datum mark O2(refx, refy) selects position coordinates error, is based on the second school
Quasi- dot array data, the second calibration dot matrix data packet include the multiple second minimum matrixes, and the second minimum matrix includes four the second vertex,
It obtains target electronic components jack and instructs mechanical coordinate A1(A1x,A1Y) and target electronic components jack instructs mechanical coordinate A1
(A1x,A1Y) the unit coordinate on corresponding four the second vertex of the second minimum matrix locating for, by target electronic components jack dictating machine
Tool coordinate A1(A1x,A1Y) the unit coordinate on four the second vertex corresponding with its substitutes into error of coordinate calibration function, obtains target
Electronic component jack actual machine coordinate A (Ax, Ay)；
In the present embodiment, position coordinates calibrate for error function for bilinear interpolation function, in X-axis and Y-axis both direction point
Not carry out once linear interpolation, Fig. 3 is centre point and associated point showing in a coordinate system in bilinear interpolation function of the present invention
It is intended to, is centre point referring to Fig. 3, point P, four vertex of the minimum matrix where point P is respectively point Q11, point Q12, point Q13, point
Q14, point R1With point R2Interpolation point for point P in X-direction and Y direction, point Q11, point Q12, point Q13, point Q14It is associated for point P
Calibration data point, (i.e. the target electronic components jack position center of circle is point P, needs the four associations calibration nearest according to range points P
Data point is point Q11, point Q12, point Q13, point Q14Calibrated, obtain the central coordinate of circle of point P) then bilinear interpolation function are as follows:
F3, mobile camera is moved to target electronic components jack position to be calibrated, to target electronic components to be calibrated
Jack carries out capture and calculating；
F4 repeats step F1 to step F3, until obtaining all electronic component jack position information on circuit substrate.
The present embodiment carries out study sampling to the electronic component information on circuit substrate using calibration dot array data, obtains
Electronic component information table is more accurate, reduces the influence that patch plugs standby systematic error.
Embodiment six
The purpose of the present embodiment is to illustrate Select Error type on the basis of embodiment five, is based on corresponding calibration dot matrix
Data identify that location information and corresponding electronic component jack position information carry out processing calculating to electronic component, are calibrated
Electronic component paste insert position correction actual coordinate step.
Select Error type is based on corresponding calibration dot array data, identifies location information and corresponding electricity to electronic component
Subcomponent jack position information carries out processing calculating, and the electronic component calibrated pastes slotting position correction actual coordinate and specifically wraps
It includes:
Distance change amount error is selected, using the coordinate of material recognizing device place shooting identification position as the first benchmark
Point obtains the position that the electronic component of current pickup is taken when identifying, obtains electronic component current location mechanical coordinate, obtaining
Take the electronic component of current pickup be taken position when identifying while, identify electronic component types, believed according to electronic component
Table is ceased, corresponding electronic component jack position actual machine coordinate is obtained, calculates the corresponding practical machine of electronic component jack position
The distance between tool coordinate and electronic component current location mechanical coordinate are as the first instruction distance, the first calibration dot matrix data packet
The multiple first minimum matrixes are included, the first minimum matrix includes four the first vertex, is instructed according to the first calibration dot array data first
Unit coordinate apart from corresponding four the first vertex of locating first minimum matrix, by the first instruction distance and four the first vertex
Unit coordinate substitute into range error calibration function, obtain the first actual range, be calculated calibration the first electronic component patch
Insert position correction actual coordinate；
Or selection position coordinates error, using the coordinate of material recognizing device place shooting identification position as the second benchmark
Point obtains the position that the electronic component of current pickup is taken when identifying, obtains electronic component current location mechanical coordinate, obtaining
Take the electronic component of current pickup be taken position when identifying while, identify electronic component types, believed according to electronic component
Table is ceased, corresponding electronic component jack position actual machine coordinate is obtained, calculates the corresponding practical machine of electronic component jack position
The distance between tool coordinate and the electronic component current location mechanical coordinate difference, according to distance difference and the second datum mark,
Electronic component instruction patch slot is calculated and sets mechanical coordinate, the second calibration dot matrix data packet includes the multiple second minimum matrixes, the
Two minimum matrixes include four the second vertex, according to the second calibration dot array data, obtain electronic component instruction patch slot and set machinery
The unit coordinate on corresponding four the second vertex of the second minimum matrix, instructs patch slot to set mechanical seat in electronic component locating for coordinate
Mark and the unit coordinate on four the second vertex substitute into position coordinates and calibrate for error function, and the second electronic component of calibration is calculated
It pastes and inserts position correction actual coordinate.
It is plugged for for by the existing patch mobile using screw rod, guide rail and Serve Motor Control feeding device:
After patch plugs standby feeding device pickup electronic component, detected by electronic component of the fixed camera to pickup
Identification, using the coordinate of fixed camera place shooting identification position as the first datum mark O1(0,0) obtains the electronics of current pickup
Element is taken position when identifying, obtains electronic component current location mechanical coordinate, according to electronic component information table, obtains phase
The electronic component jack position actual machine coordinate answered, calculates corresponding electronic component jack position actual machine coordinate and electronics
The distance between element current location mechanical coordinate is as the first instruction distance Md(dmx, dmy) calculates the electronic component jack
Angu-lar deviation dA between position actual machine coordinate and identification positions of electronic parts mechanical coordinate, selects distance change amount to miss
Difference obtains the first instruction distance M according to the first calibration dot array datadFirst minimum matrix locating for (dmx, dmy) is four corresponding
The unit coordinate on the first vertex instructs distance M for firstd(dmx, dmy) and the unit coordinate on four the first vertex substitute into distance
Calibrate for error function, obtains the first actual range Ad(dAx, dAy), the electronic component patch slot that the first calibration is calculated set school
Quasi- actual coordinate A1 (Ax, Ay), actual angle deviation are dA.
In the present embodiment, range error calibration function still uses above-mentioned range error calibration function.Range error calibration
Function is piecewise linear interpolation function, and the linear interpolation of by stages, piecewise linear interpolation function are carried out in respective axis direction
It is as follows:
It is plugged for for by using the mobile patch of linear motor control feeding device:
After patch plugs standby feeding device pickup electronic component, detected by electronic component of the fixed camera to pickup
Identification, using the coordinate of fixed camera place shooting identification position as the second datum mark O2(refx, refy) obtains current pickup
Electronic component be taken position when identifying, obtain electronic component current location mechanical coordinate, according to electronic component information table,
Corresponding electronic component jack position actual machine coordinate is obtained, distance difference A is calculatedd(dmx, dmy) (i.e. corresponding electricity
Subcomponent jack position actual machine coordinate is to the distance between electronic component current location mechanical coordinate difference), calculate the electricity
Angu-lar deviation dB between subcomponent jack position actual machine coordinate and electronic component current location mechanical coordinate passes through
Two datum mark O2(refx, refy) and distance difference Ad(dmx, dmy) is calculated electronic component instruction patch slot and sets mechanical seat
It marks M (refx+dmx, refy+dmy), selects position coordinates error, according to the second calibration dot array data, obtain electronic component instruction
Patch slot sets the unit coordinate on corresponding four the second vertex of the second minimum matrix locating for mechanical coordinate, and electronic component is instructed and is pasted
The unit coordinate that slot sets mechanical coordinate and corresponding four the second vertex substitutes into position coordinates and calibrates for error function, is calculated
The electronic component of second calibration, which pastes, inserts position correction actual coordinate A2 (Ax, Ay), and actual angle deviation is dB.
In the present embodiment, the position coordinates function that calibrates for error still uses the position coordinates of above-described embodiment to calibrate for error letter
Number, position coordinates calibrate for error function as bilinear interpolation function, carry out once linear respectively in X-axis and Y-axis both direction and insert
Value, is centre point referring to Fig. 3, point P, and four vertex of the minimum matrix where point P are respectively point Q11, point Q12, point Q13, point Q14,
Point R1With point R2Interpolation point for point P in X-direction and Y direction, point Q11, point Q12, point Q13, point Q14For the associated calibration of point P
Data point, (it is point P that i.e. electronic component instruction patch slot, which sets actual coordinate point, needs the four association schools nearest according to range points P
Quasi- data point is point Q11, point Q12, point Q13, point Q14Calibrated, obtain the central coordinate of circle of point P) then bilinear interpolation function are as follows:
A kind of systematic error calibration method based on machine vision selects corresponding calibration dot matrix number according to error pattern
According to calibration system error reduces the cost of systematic error calibration, improves the simplicity of systematic error calibration, is demarcated using dot matrix
Plate guarantees the accuracy of systematic error calibration to obtain standard mechanical coordinate dot array data, uses laser interference with the prior art
Instrument is compared, and using the technology that is automatically aligned to of machine vision, lowers the complexity of calibration system error operation.
Also, the systematic error calibration method is suitable for plugging using the mobile patch of different type motor control feeding device
It is standby, there is preferable universal compatibility.
Embodiment seven
Fig. 4 is a kind of systematic error calibration method system structure diagram based on machine vision of the present invention, referring to Fig. 4, one
Systematic error calibration system of the kind based on machine vision, comprising:
Creation module, for creating different calibration dot array datas according to error pattern；
First obtains module, for obtaining the electronic component information table of circuit substrate and storing；
Second obtains module, and the electronic component picked up for identification obtains electronic component and identifies location information, according to described
Electronic component information table obtains corresponding electronic component jack position information；
Calibration module is selected, Select Error type is used for, is based on corresponding calibration dot array data, position is identified to electronic component
Confidence breath and corresponding electronic component jack position information carry out processing calculating, and the electronic component calibrated, which pastes, inserts position correction
Actual coordinate.
In a particular embodiment, creation module includes:
Storage unit is obtained, for obtaining and storing standard mechanical coordinate dot array data；
First creating unit, for creating the first school according to standard mechanical coordinate dot array data and distance change amount error
Quasi- dot array data；
Second creating unit, for according to standard mechanical coordinate dot array data and position coordinates error, the second calibration of creation
Dot array data.
In a particular embodiment, it includes material pick device and material recognizing device that identification, which obtains module, and material picks up dress
It sets for picking up electronic component and moving the electronic component of pickup to material recognizing device position, material recognizing device is for knowing
The electronic component that other material pick device picks up, obtains identification position mechanical coordinate and corresponding positions of electronic parts machinery is sat
Mark.
A kind of systematic error calibration system based on machine vision provided in an embodiment of the present invention is for executing above-mentioned base
In the systematic error calibration method of machine vision, working principle and beneficial effect are corresponded, thus repeat no more.
Embodiment eight
A kind of systematic error calibrator (-ter) unit based on machine vision, comprising:
At least one processor, and the memory being connect at least one described processor communication；Wherein,
The memory is stored with the instruction that can be executed by least one processor, and described instruction is by described at least one
It manages device to execute, so that at least one described processor is able to carry out the systematic error calibration side as above-mentioned based on machine vision
Method.
A kind of systematic error calibration method, system and equipment based on machine vision selects corresponding according to error pattern
Dot array data is calibrated, calibration system error reduces the cost of systematic error calibration, the simplicity of systematic error calibration is improved, with
The prior art is compared using laser interferometer, using the technology that is automatically aligned to of machine vision, lowers calibration system error operation
Complexity.
It is to be illustrated to preferable implementation of the invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (11)
1. a kind of systematic error calibration method based on machine vision, plugged applied to patch standby, the patch, which plugs, standby to be above provided with
Second area for placing the first area of circuit substrate and for placing electronic component material, it includes taking that the patch, which plugs standby,
Expect device, the feeding device is described for picking up electronic component and electronic component patch being inserted to corresponding position on circuit substrate
It includes material recognizing device and image collecting device, the electronics member that the material recognizing device is picked up for identification that patch, which plugs standby,
Part, described image acquisition device is for each electronic component information on Acquisition Circuit substrate, which is characterized in that the method includes steps
It is rapid:
According to error pattern, different calibration dot array datas is created, the error pattern includes distance change amount error and position
Error of coordinate；
It obtains the electronic component information table of circuit substrate and stores；
It identifies the electronic component picked up, obtains electronic component identification location information according to the electronic component information table and obtain phase
The electronic component jack position information answered；
Select Error type is based on corresponding calibration dot array data, identifies location information and corresponding electronics member to electronic component
Part jack position information carries out processing calculating, and the electronic component calibrated, which pastes, inserts position correction actual coordinate.
2. a kind of systematic error calibration method based on machine vision according to claim 1, which is characterized in that the mistake
Poor type includes distance change amount error and position coordinates error, described according to error pattern, creates different calibration dot matrix numbers
According to specifically including:
Selection calibration auxiliary tool, obtains standard mechanical coordinate dot array data；
According to the standard mechanical coordinate dot array data and distance change amount error, creation the first calibration dot array data；
According to the standard mechanical coordinate dot array data and position coordinates error, creation the second calibration dot array data.
3. a kind of systematic error calibration method based on machine vision according to claim 2, which is characterized in that the choosing
It selects a school quasi- auxiliary tool, obtains standard mechanical coordinate dot array data and specifically include:
It selects dot matrix scaling board as calibration auxiliary tool, obtains dot matrix and demarcate board parameter, the dot matrix scaling board is installed and is made
First area where dot matrix scaling board covering identification position and circuit substrate；
Image collecting device scans all the points on the dot matrix scaling board, obtains the mechanical of all the points on the dot matrix scaling board and sits
Mark, using the mechanical coordinate of all the points on dot matrix scaling board as standard mechanical coordinate dot array data.
4. a kind of systematic error calibration method based on machine vision according to claim 2 or 3, which is characterized in that institute
It states according to standard mechanical coordinate dot array data and distance change amount error, creation the first calibration dot array data specifically includes:
The coordinate of shooting identification position is as the first datum mark, mechanical coordinate O where determining material recognizing device1(0,0),
Calculate the first location of instruction M1(mx, my) is to the first datum mark O1(0,0) the first instruction distance Md(dmx,dmy)；
Board parameter is demarcated according to the standard mechanical coordinate dot array data and the dot matrix, obtains the first location of instruction M1(mx,my)
To the first datum mark O1(0,0) the first actual range Ad(dAx,dAy)；
According to the first instruction distance Md(dmx, dmy) and the first actual range Ad(dAx, dAy), the first calibration of creation
Dot array data, the first calibration dot matrix data cell coordinate is Pd(dmx,dmy,dAx,dAy)。
5. a kind of systematic error calibration method based on machine vision according to claim 4, which is characterized in that described
According to standard mechanical coordinate dot array data and position coordinates error, creation the second calibration dot array data is specifically included:
The coordinate of shooting identification position is as the second datum mark, mechanical coordinate O where determining material recognizing device2(refx,
Refy), according to the standard mechanical coordinate dot array data, the mechanical coordinate of dot matrix is in the standard mechanical coordinate dot array data
Second location of instruction mechanical coordinate, second location of instruction mechanical coordinate are M (mx, my)；
Board parameter is demarcated according to the standard mechanical coordinate dot array data and the dot matrix, obtains the second actual position coordinate A
(Ax,Ay)；
According to the second location of instruction mechanical coordinate M (mx, my) and the second actual position coordinate A (Ax, Ay), the second calibration point is created
Battle array data, the second calibration dot matrix data cell coordinate is P (mx, my, Ax, Ay).
6. a kind of systematic error calibration method based on machine vision according to claim 5, which is characterized in that the electricity
Subcomponent information table include electronic component types information, electronic component label information, electronic component pin information, electronic component insert
Hole site information and the electronic component types information, the electronic component label information, electronic component pin letter
The corresponding relationship of breath, the electronic component jack position information, the electronic component information table for obtaining circuit substrate specifically wrap
It includes:
It obtains electronic component types information, electronic component label information, electronic component pin information and stores；
Select Error type is based on corresponding calibration dot array data, obtains electronic component jack position information and stores, handles
To the electronic component types information, the electronic component label information, the electronic component pin information, the electronic component
The corresponding relationship of jack position information and storage.
7. a kind of systematic error calibration method based on machine vision according to claim 6, which is characterized in that the choosing
Error pattern is selected, corresponding calibration dot array data is based on, location information and corresponding electronic component jack are identified to electronic component
Location information carries out processing calculating, and the electronic component calibrated pastes slotting position correction actual coordinate and specifically includes:
Distance change amount error is selected, the coordinate of shooting identification position is obtained as the first datum mark where using material recognizing device
It takes the electronic component of current pickup to be taken position when identifying, electronic component current location mechanical coordinate is obtained, according to electronics
Component information table obtains corresponding electronic component jack position actual machine coordinate, calculates corresponding electronic component jack position
The distance between actual machine coordinate and the electronic component current location mechanical coordinate conduct the first instruction distance, described first
Calibration dot matrix data packet includes the multiple first minimum matrixes, and the described first minimum matrix includes four the first vertex, according to the first school
Unit coordinate of first instruction described in battle array data acquisition apart from corresponding four the first vertex of locating first minimum matrix on schedule, will
The unit coordinate on the first instruction distance and four first vertex substitutes into range error calibration function, and it is practical to obtain first
Distance, the first electronic component that calibration is calculated, which pastes, inserts position correction actual coordinate；
Or selection position coordinates error, the coordinate of shooting identification position is obtained as the second datum mark where using material recognizing device
It takes the electronic component of current pickup to be taken position when identifying, electronic component current location mechanical coordinate is obtained, according to electronics
Component information table obtains corresponding electronic component jack position actual machine coordinate, calculates corresponding electronic component jack position
The distance between actual machine coordinate and the electronic component current location mechanical coordinate difference, according to the distance difference and institute
The second datum mark is stated, electronic component instruction patch slot is calculated and sets mechanical coordinate, the second calibration dot matrix data packet includes more
A second minimum matrix, the described second minimum matrix includes four the second vertex, according to the second calibration dot matrix data acquisition
Electronic component instruction patch slot sets the unit coordinate on corresponding four the second vertex of the second minimum matrix locating for mechanical coordinate, by institute
State the unit coordinate substitution position coordinates error school that electronic component instruction patch slot sets mechanical coordinate and four second vertex
Quasi-function, the second electronic component that calibration is calculated, which pastes, inserts position correction actual coordinate.
8. a kind of systematic error calibration system based on machine vision, which is characterized in that the system comprises:
Creation module, for creating different calibration dot array datas, the error pattern includes distance change according to error pattern
Measure error and position coordinates error；
First obtains module, for obtaining the electronic component information table of circuit substrate and storing；
Second obtains module, and the electronic component picked up for identification obtains electronic component and identifies location information, according to the electronics
Component information table obtains corresponding electronic component jack position information；
Calibration module is selected, Select Error type is used for, is based on corresponding calibration dot array data, to electronic component identification position letter
Breath and corresponding electronic component jack position information carry out processing calculating, and the electronic component calibrated, which pastes, inserts position correction reality
Coordinate.
9. a kind of systematic error calibration system based on machine vision according to claim 8, which is characterized in that the wound
Modeling block includes:
Storage unit is obtained, for obtaining and storing standard mechanical coordinate dot array data；
First creating unit, for creating the first calibration point according to standard mechanical coordinate dot array data and distance change amount error
Battle array data；
Second creating unit, for according to standard mechanical coordinate dot array data and position coordinates error, creation the second calibration dot matrix
Data.
10. a kind of systematic error calibration system based on machine vision according to claim 8, which is characterized in that described
It includes material pick device and material recognizing device that identification, which obtains module, and the material pick device is for picking up electronic component simultaneously
The electronic component of pickup is moved to the material recognizing device position, the material picks up the material recognizing device for identification
The electronic component for taking device to pick up obtains electronic component and identifies location information.
11. a kind of systematic error calibrator (-ter) unit based on machine vision, characterized in that it comprises:
At least one processor, and the memory being connect at least one described processor communication；Wherein,
The memory is stored with the instruction that can be executed by least one processor, and described instruction is by least one described processor
It executes, so that at least one described processor is able to carry out and as described in any one of claim 1 to 7 is based on machine vision
System error calibrating method.
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| CN110719129B (en) * | 2019-10-14 | 2020-06-23 | 沈阳市电信规划设计院股份有限公司 | Point location correction system based on communication basic resource intelligent management data |
| CN113030821A (en) * | 2019-12-24 | 2021-06-25 | 中移物联网有限公司 | Electric quantity calibration method and device |
| CN111152216B (en) * | 2019-12-30 | 2022-04-26 | 福州国化智能技术有限公司 | Method for automatically correcting tool center point of industrial robot |
| CN114543669B (en) * | 2022-01-27 | 2023-08-01 | 珠海亿智电子科技有限公司 | Mechanical arm calibration method, device, equipment and storage medium |
| CN114571455A (en) * | 2022-03-14 | 2022-06-03 | 博众精工科技股份有限公司 | System and method for calibrating motion of motion module and robot |
| CN114998334B (en) * | 2022-08-02 | 2023-05-26 | 苏州华兴源创科技股份有限公司 | Workpiece through hole position calibration method and detection device |
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