CN112731096A - Detection device, method for detecting wafer by using detection device and test system - Google Patents
Detection device, method for detecting wafer by using detection device and test system Download PDFInfo
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- CN112731096A CN112731096A CN202011522310.1A CN202011522310A CN112731096A CN 112731096 A CN112731096 A CN 112731096A CN 202011522310 A CN202011522310 A CN 202011522310A CN 112731096 A CN112731096 A CN 112731096A
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Abstract
The application provides a detection device, a method for detecting a wafer by adopting the detection device and a test system, wherein the detection device comprises a probe card and a rotating piece, the probe card comprises a probe card body and a plurality of probes positioned on the probe card body; the rotating piece is used for driving the probe card to rotate. The detection equipment ensures that after the first direction test of the wafer is finished, the probe card is driven to rotate through the rotating piece, then the second direction of the wafer is tested, the wafer does not need to be taken out of the machine table before the test is finished, and the position of the wafer does not need to be adjusted manually.
Description
Technical Field
The present application relates to the field of semiconductors, and in particular, to a probing apparatus, a method for inspecting a wafer using the probing apparatus, a computer readable storage medium, a processor, and a test system.
Background
At present, a wafer cutting process is divided into two directions of X and Y, a wafer after cutting is tested in a Wafer Acceptance Test (WAT) mode, a test flow is shown in fig. 1, it can be seen from fig. 1 that the wafer needs to enter and exit a test machine 2 times, after the X-direction test of the wafer is completed, the position of the wafer needs to be manually adjusted, and then the Y-direction test of the wafer is performed, the test machine needs to align images of the wafer and a probe card 2 times, but data after the X-direction and Y-direction test are still at risk of merging failure, so that the test efficiency is low, the machine capacity is affected, and time and risk for manually processing large quantities of data which are merged and failed are increased.
The above information disclosed in this background section is only for enhancement of understanding of the background of the technology described herein and, therefore, certain information may be included in the background that does not form the prior art that is already known in this country to a person of ordinary skill in the art.
Disclosure of Invention
The present application mainly aims to provide a probing apparatus, a method for detecting a wafer by using the probing apparatus, a computer-readable storage medium, a processor and a testing system, so as to solve the problem of low testing efficiency of wafer WAT testing in the prior art.
According to an aspect of an embodiment of the present invention, there is provided a probing apparatus including a probe card and a rotary member, wherein the probe card includes a probe card body and a plurality of probes on the probe card body; the rotating piece is connected with the probe card and is used for driving the probe card to rotate.
Optionally, the probing apparatus further comprises a support connected to the probe card, the support being configured to support the probe card and expose the probe.
Optionally, the supporting member is provided with a groove, the probe card body is fixed in the groove, an opening penetrating through the supporting member is arranged on a groove bottom surface of the groove, and the probe is exposed through the opening.
Optionally, the rotating member includes a connecting rod, and the connecting rod is connected to the supporting member and is used for driving the supporting member to rotate.
Optionally, the rotating member further includes a controller, and the controller is in communication connection with the connecting rod, and is used for controlling the connecting rod to move, so as to drive the supporting member to rotate.
According to another aspect of the embodiments of the present invention, there is provided a method for inspecting a wafer, including: providing a test board provided with a wafer; testing a first region to be tested of the wafer by controlling a probe card to obtain first test data, wherein the first region to be tested is a region to be tested of the wafer in a first direction, and the first direction is perpendicular to the thickness direction of the wafer; and controlling the probe card to rotate, and controlling the rotated probe card to test a second region to be tested of the wafer to obtain second test data, wherein the second region to be tested is a region to be tested of the wafer in a second direction, the first direction is perpendicular to the second direction, and the second direction is perpendicular to the thickness direction of the wafer.
Optionally, the testing the first region to be tested of the wafer by controlling the probe card includes: acquiring first position information of the first region to be tested and second position information of the probe card; determining whether the probe card is aligned with the first region to be tested according to the first position information and the second position information, and adjusting the position of the wafer under the condition that the probe card is determined to be misaligned with the first region to be tested so that the probe card is aligned with the adjusted first region to be tested of the wafer and the probe card is contacted with the first region to be tested; and testing the first area to be tested.
Optionally, the controlling the probe card to rotate and the rotated probe card to test the second region of the wafer to be tested includes: determining whether the distance between the probe card and the wafer is greater than a predetermined distance; under the condition that the distance between the probe card and the wafer is determined to be larger than the preset distance, controlling the probe card to rotate and move in the preset direction, so that the moved probe card is aligned with the second region to be tested, and the moved probe card is contacted with the second region to be tested, wherein the preset direction is the thickness direction of the probe card; and testing the second region to be tested.
Optionally, in a case that it is determined that the distance between the probe card and the wafer is greater than the predetermined distance, controlling the probe card to rotate and move in a predetermined direction, so that the moved probe card is aligned with the second region to be tested, and the moved probe card is in contact with the second region to be tested, including: controlling the probe card to rotate; acquiring third position information of the second region to be tested and fourth position information of the probe card after rotation; determining whether the rotated probe card is aligned with the second region to be tested according to the third position information and the fourth position information, and adjusting the position of the wafer under the condition that the rotated probe card is determined to be misaligned with the second region to be tested so that the rotated probe card is aligned with the adjusted second region to be tested of the wafer; and controlling the rotated probe card to move towards the preset direction, so that the moved probe card is contacted with the second area to be tested.
Optionally, before controlling the probe card to rotate and controlling the rotated probe card to test the second region of the wafer to be tested, the method further includes: determining whether the test of the probe card on the first area to be tested is finished; and under the condition that the probe card is determined to finish the test on the first area to be tested, controlling the probe card to move in the preset direction, so that the distance between the moved probe card and the wafer is greater than the preset distance.
According to still another aspect of embodiments of the present invention, there is also provided a computer-readable storage medium including a stored program, wherein the program executes any one of the methods.
According to still another aspect of the embodiments of the present invention, there is further provided a processor, configured to execute a program, where the program executes any one of the methods.
According to another aspect of the embodiments of the present invention, there is also provided a test system, including a probe device and a control device, the control device being in communication connection with the probe device, the control device being configured to perform any one of the methods.
The application provides a detection device, which comprises a probe card and a rotating piece, wherein the probe card comprises a probe card body and a plurality of probes positioned on the probe card body, and the rotating piece drives the probe card to rotate. The detection equipment ensures that after the first direction test of the wafer is finished, the rotating piece drives the probe card to rotate, then the second direction of the wafer is tested, the wafer does not need to go out of the machine table before the test is finished, and the position of the wafer does not need to be adjusted manually, so that the problem that in the wafer WAT test process in the prior art, the wafer needs to go in and out of the test machine table for 2 times, and the test efficiency is lower is solved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application. In the drawings:
FIG. 1 is a schematic diagram illustrating a WAT test flow of a conventional wafer;
FIG. 2 shows a schematic view of a detection apparatus according to an embodiment of the present application;
FIG. 3 shows a schematic view of a detection apparatus according to a specific embodiment of the present application;
FIG. 4 is a schematic diagram illustrating a flowchart of a method for inspecting a wafer by using a probe apparatus according to an embodiment of the present disclosure;
FIG. 5 shows a schematic diagram of an apparatus for inspecting a wafer using a probing device according to an embodiment of the present application;
fig. 6 shows a schematic view of a region under test of a portion of a wafer according to an embodiment of the present application.
Wherein the figures include the following reference numerals:
10. a probe card; 20. a rotating member; 30. a groove; 100. a probe card body; 101. a probe; 200. a connecting rod; 201. a controller; 300. an opening; 400. a first region to be tested; 401. and a second region to be measured.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Also, in the specification and claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element or "connected" to the other element through a third element.
As mentioned in the background, the wafer WAT test in the prior art has low testing efficiency, and in order to solve the above problems, in an exemplary embodiment of the present application, a probing apparatus, a method for inspecting a wafer by using the probing apparatus, a computer-readable storage medium, a processor and a testing system are provided.
According to an exemplary embodiment of the present application, a detection device is provided.
Fig. 2 is a schematic diagram of a detection device according to an embodiment of the application. As shown in fig. 2, the probing apparatus includes a probe card 10 and a rotary member 20, wherein the probe card 10 includes a probe card body 100 and a plurality of probes 101 on the probe card body 100; the rotating member 20 is connected to the probe card 10, and the rotating member 20 is used for driving the probe card 10 to rotate.
The probe equipment comprises a probe card and a rotating piece, wherein the probe card comprises a probe card body and a plurality of probes positioned on the probe card body, and the rotating piece drives the probe card to rotate. After the first direction test of wafer is accomplished, drive through above-mentioned rotating member and drive the probe card rotatory, then test the second direction of wafer, need not the wafer before the test is accomplished and go out the board, also need not the position of manual adjustment wafer, wafer WAT test procedure among the prior art has been solved, the wafer needs 2 business turn over test board, lead to the lower problem of efficiency of software testing, this detection equipment has guaranteed that the efficiency of software testing of wafer is higher, the productivity of having guaranteed the board is higher, and, this detection equipment has solved the problem of current manual adjustment wafer position, the automation level of having guaranteed equipment is higher, the human cost has been saved.
Of course, the positional relationship between the probe card and the rotating member is not limited to the case shown in fig. 2, and the positional relationship may be other positional relationship as long as the rotating member can rotate the probe card.
In an embodiment of the present invention, the probe apparatus further includes a support connected to the probe card, and the support is configured to support the probe card and expose the probe. The supporting piece supports the probe card, and simultaneously exposes the probes, so that the probe card can be conveniently controlled to test the wafer subsequently.
In an actual application process, as shown in fig. 3, the supporting member is provided with a groove 30, the probe card body 100 is fixed in the groove 30, an opening 300 penetrating the supporting member is provided on a bottom surface of the groove 30, and the probe 101 is exposed through the opening 300. According to the probe equipment, the probe card body is fixed in the groove, and the bottom surface of the groove is provided with the opening penetrating through the supporting piece, so that all the probes are exposed through the opening, and further convenience is brought to subsequent testing.
The probe card is attached to the platform, and the probe card is disposed in a direction away from the platform.
According to another embodiment of the present application, as shown in fig. 3, the rotating member 20 includes a connecting rod 200 connected to the supporting member, and the connecting rod 200 is used for driving the supporting member to rotate. The probe card supporting the supporting piece can rotate flexibly by the detection equipment connected with the supporting piece through the connecting rod, the wafer does not need to go out of a machine table before testing is finished, the position of the wafer does not need to be adjusted manually, the problem that in the wafer WAT testing process in the prior art, the wafer needs to go in and out of the testing machine table for 2 times, so that the testing efficiency is low is solved, and the testing efficiency is high.
In one embodiment, as shown in fig. 3, the connecting rod 200 is connected to the groove 30, and the connecting rod 200 rotates the groove 30.
In another embodiment of the present application, as shown in fig. 3, the rotating member 20 further includes a controller 201, which is in communication with the connecting rod 200, and the controller 201 is configured to control the connecting rod 200 to move, so as to drive the supporting member to rotate. Above-mentioned detection equipment through above-mentioned controller and above-mentioned connecting rod communication connection, can the above-mentioned connecting rod of automatic control remove, and then drive above-mentioned support piece rotatory, need not the above-mentioned connecting rod of manual operation and remove, has further guaranteed that above-mentioned detection equipment's degree of automation is higher, has further saved the human cost.
According to another exemplary embodiment of the present application, there is provided a method of inspecting a wafer, as shown in fig. 4, the method including the steps of:
step S101, providing a test bench provided with a wafer;
step S102, testing a first region to be tested of the wafer by controlling a probe card to obtain first test data, wherein the first region to be tested is a region to be tested of the wafer in a first direction, and the first direction is perpendicular to the thickness direction of the wafer;
step S103 is to control the probe card to rotate, and control the rotated probe card to test a second region to be tested of the wafer, so as to obtain second test data, where the second region to be tested is a region to be tested of the wafer in a second direction, the first direction is perpendicular to the second direction, and the second direction is perpendicular to a thickness direction of the wafer, fig. 6 shows the first region to be tested 400 and the second region to be tested 401 of the wafer portion of the present application, the first direction is an X direction shown in fig. 6, and the second direction is a Y direction shown in fig. 6.
The method for detecting the wafer comprises the steps of firstly providing a test board provided with the wafer, then testing a first region to be tested of the wafer by controlling a probe card to obtain first test data, then controlling the probe card to rotate, and controlling the rotated probe card to test a second region to be tested of the wafer to obtain second test data. According to the method, after the first to-be-tested area of the wafer is tested, the probe card is controlled to rotate, and the rotated probe card is controlled to test the second to-be-tested area of the wafer, so that the wafer does not need to go out of a test machine table before the test is completed, and the position of the wafer does not need to be manually adjusted, the problem that in the wafer WAT test process in the prior art, the wafer needs to go in and out of the test machine table for 2 times, and therefore the test efficiency is low is solved, the method ensures that the test efficiency of the wafer is high, and ensures that the productivity of the machine table is high.
According to another specific embodiment of the present application, the controlling the probe card to test the first region to be tested of the wafer includes: acquiring first position information of the first region to be detected and second position information of the probe card; determining whether the probe card is aligned with the first region to be tested according to the first position information and the second position information, and adjusting the position of the wafer under the condition that the probe card is determined to be misaligned with the first region to be tested so that the probe card is aligned with the adjusted first region to be tested of the wafer and the probe card is in contact with the first region to be tested; and testing the first area to be tested. According to the method, whether the probe card is aligned with the first region to be tested is determined through the acquired first position information and the acquired second position information, and the position of the wafer is adjusted under the condition of misalignment, so that the probe card is aligned with and contacts the adjusted first region to be tested of the wafer, the test of the first region to be tested is facilitated, the first region to be tested of the wafer can be accurately tested, and the problem of test failure caused by inaccurate alignment is avoided.
In an actual application process, controlling the probe card to rotate, and controlling the rotated probe card to test a second region to be tested of the wafer, the method includes: determining whether the distance between the probe card and the wafer is greater than a predetermined distance; under the condition that the distance between the probe card and the wafer is determined to be larger than the preset distance, controlling the probe card to rotate and move in a preset direction, so that the moved probe card is aligned with the second region to be tested, and the moved probe card is contacted with the second region to be tested, wherein the preset direction is the thickness direction of the probe card; and testing the second region to be tested. According to the method, the probe card is controlled to rotate and move in the preset direction under the condition that whether the distance between the probe card and the wafer is larger than the preset distance or not is determined, so that the risk that the wafer is possibly scratched by rotating and moving the probe card when the distance between the probe card and the wafer is small is avoided, and the wafer is prevented from being damaged in the test process. In addition, the method controls the probe card to rotate and move in the preset direction, so that the moved probe card is aligned and contacted with the second area to be tested, the problem of low test efficiency caused by the fact that a wafer needs to enter and exit a test machine for 2 times in the wafer WAT test process in the prior art is further solved, and the high test efficiency of the wafer is further ensured.
In another specific embodiment of the present invention, when it is determined that the distance between the probe card and the wafer is greater than the predetermined distance, the probe card is controlled to rotate and move in a predetermined direction so that the moved probe card is aligned with the second region to be measured and the moved probe card is brought into contact with the second region to be measured, the method includes: controlling the probe card to rotate; acquiring third position information of the second region to be tested and fourth position information of the probe card after rotation; determining whether the rotated probe card is aligned with the second region to be measured according to the third position information and the fourth position information, and adjusting the position of the wafer under the condition that the rotated probe card is not aligned with the second region to be measured so that the rotated probe card is aligned with the adjusted second region to be measured of the wafer; and controlling the rotated probe card to move towards the preset direction so that the moved probe card is contacted with the second region to be tested. Therefore, the test of the second region to be tested is facilitated, the second region to be tested of the wafer can be accurately tested, and the problem of test failure caused by inaccurate alignment is avoided.
In order to further avoid the problem that the surface of the wafer may be scratched by rotating the probe card in the test process, before controlling the probe card to rotate and controlling the rotated probe card to test the second region of the wafer to be tested, the method further includes: determining whether the probe card tests the first area to be tested; and under the condition that the probe card is determined to finish the test of the first area to be tested, controlling the probe card to move in the preset direction, so that the distance between the moved probe card and the wafer is larger than the preset distance. After the first region to be tested of the wafer is tested, the probe card is controlled to move towards the direction far away from the wafer before being controlled to rotate, so that the distance between the probe card and the wafer is larger than the preset distance, and the wafer is further prevented from being damaged in the testing process.
It should be noted that the steps illustrated in the flowcharts of the figures may be performed in a computer system such as a set of computer-executable instructions and that, although a logical order is illustrated in the flowcharts, in some cases, the steps illustrated or described may be performed in an order different than presented herein.
According to another exemplary embodiment of the present application, there is also provided an apparatus for inspecting a wafer, where it is to be noted that the apparatus for inspecting a wafer using any one of the above-mentioned probing apparatuses according to the embodiments of the present application may be used to perform the method for inspecting a wafer using any one of the above-mentioned probing apparatuses according to the embodiments of the present application. The following describes an apparatus for inspecting a wafer by using any of the above-mentioned probing apparatuses according to an embodiment of the present application.
Fig. 5 is a schematic view of an apparatus for inspecting a wafer by using the above-mentioned probing device according to an embodiment of the present application. As shown in fig. 5, the apparatus includes a first determining unit 40, a first control unit 50, and a second control unit 60, wherein the first determining unit 40 is used for providing a test station provided with a wafer; the first control unit 50 is configured to control a probe card to test a first region to be tested of the wafer, so as to obtain first test data, where the first region to be tested is a region to be tested of the wafer in a first direction, and the first direction is perpendicular to a thickness direction of the wafer; the second control unit 60 is configured to control the probe card to rotate, and control the rotated probe card to test a second region to be tested of the wafer, so as to obtain second test data, where the second region to be tested is a region to be tested of the wafer in a second direction, the first direction is perpendicular to the second direction, and the second direction is perpendicular to a thickness direction of the wafer, fig. 6 shows the first region to be tested 400 and the second region to be tested 401 of a wafer portion of the present application, the first direction is an X direction shown in fig. 6, and the second direction is a Y direction shown in fig. 6.
In the apparatus for inspecting a wafer, the first determining unit provides a test board on which a wafer is disposed, the first control unit controls the probe card to test a first region to be inspected of the wafer in a first direction perpendicular to a thickness direction of the wafer to obtain first test data, the second control unit controls the probe card to rotate, and controls the rotated probe card to test a second region to be inspected of the wafer to obtain second test data, wherein the first region to be inspected is a region to be inspected of the wafer in a second direction. According to the device, after a first region to be tested of a wafer is tested, the probe card is controlled to rotate, and the probe card after rotation is controlled to test a second region to be tested of the wafer, so that the wafer does not need to go out of a test machine table before testing is completed, and the position of the wafer does not need to be adjusted manually, the problem that in the wafer WAT test process in the prior art, the wafer needs to go in and out of the test machine table for 2 times, and therefore the test efficiency is low is solved, the device ensures that the test efficiency of the wafer is high, and ensures that the productivity of the machine table is high.
According to another specific embodiment of the present application, the first control unit includes a first obtaining module, a first determining module, and a first testing module, where the first obtaining module is configured to obtain first position information of the first region to be tested and second position information of the probe card; the first determining module is configured to determine whether the probe card is aligned with the first region to be tested according to the first position information and the second position information, and adjust a position of the wafer so that the probe card is aligned with the adjusted first region to be tested of the wafer and the probe card is in contact with the first region to be tested when it is determined that the probe card is not aligned with the first region to be tested; the first testing module is used for testing the first area to be tested. According to the device, whether the probe card is aligned with the first region to be tested is determined through the acquired first position information and the acquired second position information, and the position of the wafer is adjusted under the condition of misalignment, so that the probe card is aligned with and contacts the adjusted first region to be tested of the wafer, the test of the first region to be tested is facilitated, the first region to be tested of the wafer can be accurately tested, and the problem of test failure caused by inaccurate alignment is avoided.
In an actual application process, the second control unit includes a second determining module, a first control module and a second testing module, wherein the second determining module is configured to determine whether a distance between the probe card and the wafer is greater than a predetermined distance; the first control module is used for controlling the probe card to rotate and move in a preset direction under the condition that the distance between the probe card and the wafer is determined to be larger than the preset distance, so that the moved probe card is aligned with the second region to be tested, and the moved probe card is contacted with the second region to be tested, wherein the preset direction is the thickness direction of the probe card; the second test module is used for testing the second region to be tested. According to the device, through the fact that whether the distance between the probe card and the wafer is larger than the preset distance or not, the probe card is controlled to rotate and move in the preset direction under the condition that the distance between the probe card and the wafer is determined to be larger than the preset distance, the risk that the wafer is possibly scratched when the probe card is rotated and moved when the distance between the probe card and the wafer is small is avoided, and the wafer is prevented from being damaged in the testing process. And the device controls the probe card to rotate and move in the preset direction, so that the moved probe card is aligned and contacted with the second area to be tested, the problem of low test efficiency caused by the fact that a wafer needs to enter and exit a test machine for 2 times in the wafer WAT test process in the prior art is further solved, and the high test efficiency of the wafer is further ensured.
In another specific embodiment of the present application, the first control module includes a first control submodule, an obtaining submodule, a determining submodule, and a second control submodule, wherein the first control submodule is configured to control the probe card to rotate; the acquisition submodule is used for acquiring third position information of the second region to be detected and fourth position information of the probe card after rotation; the determining submodule is configured to determine whether the rotated probe card is aligned with the second region to be measured according to the third position information and the fourth position information, and adjust a position of the wafer so that the rotated probe card is aligned with the adjusted second region to be measured of the wafer when it is determined that the rotated probe card is not aligned with the second region to be measured; the second control submodule is used for controlling the rotated probe card to move towards the preset direction so that the moved probe card is contacted with the second region to be tested. Therefore, the test of the second region to be tested is facilitated, the second region to be tested of the wafer can be accurately tested, and the problem of test failure caused by inaccurate alignment is avoided.
In order to further avoid the problem that the surface of the wafer is possibly scratched by rotating the probe card in the test process, the device further comprises a second determining unit and a third control unit, wherein the second determining unit is used for determining whether the test of the probe card on the first region to be tested is finished before controlling the probe card to rotate and controlling the rotated probe card to test the second region to be tested of the wafer; the third control unit is configured to control the probe card to move in the predetermined direction when it is determined that the probe card has completed testing the first region to be tested, so that a distance between the moved probe card and the wafer is greater than the predetermined distance. After the first region to be tested of the wafer is tested, the probe card is controlled to move towards the direction far away from the wafer before being controlled to rotate, so that the distance between the probe card and the wafer is larger than the preset distance, and the wafer is further prevented from being damaged in the testing process.
The apparatus for detecting a wafer by using any of the above-mentioned probing devices includes a processor and a memory, where the first determining unit, the first control unit, the second control unit, and the like are stored in the memory as program units, and the processor executes the program units stored in the memory to implement corresponding functions.
The processor comprises a kernel, and the kernel calls the corresponding program unit from the memory. One or more than one kernel can be set, and the problem of low testing efficiency of wafer WAT testing in the prior art is solved by adjusting kernel parameters.
The memory may include volatile memory in a computer readable medium, Random Access Memory (RAM) and/or nonvolatile memory such as Read Only Memory (ROM) or flash memory (flash RAM), and the memory includes at least one memory chip.
An embodiment of the present invention provides a computer-readable storage medium on which a program is stored, which, when executed by a processor, implements the above-described method.
The embodiment of the invention provides a processor, which is used for running a program, wherein the method is executed when the program runs.
The embodiment of the invention provides equipment, which comprises a processor, a memory and a program which is stored on the memory and can run on the processor, wherein when the processor executes the program, at least the following steps are realized:
step S101, providing a test bench provided with a wafer;
step S102, testing a first region to be tested of the wafer by controlling a probe card to obtain first test data, wherein the first region to be tested is a region to be tested of the wafer in a first direction, and the first direction is perpendicular to the thickness direction of the wafer;
step S103, controlling the probe card to rotate, and controlling the rotated probe card to test a second region to be tested of the wafer to obtain second test data, where the second region to be tested is a region to be tested of the wafer in a second direction, the first direction is perpendicular to the second direction, and the second direction is perpendicular to the thickness direction of the wafer.
The device herein may be a server, a PC, a PAD, a mobile phone, etc.
The present application further provides a computer program product adapted to perform a program of initializing at least the following method steps when executed on a data processing device:
step S101, providing a test bench provided with a wafer;
step S102, testing a first region to be tested of the wafer by controlling a probe card to obtain first test data, wherein the first region to be tested is a region to be tested of the wafer in a first direction, and the first direction is perpendicular to the thickness direction of the wafer;
step S103, controlling the probe card to rotate, and controlling the rotated probe card to test a second region to be tested of the wafer to obtain second test data, where the second region to be tested is a region to be tested of the wafer in a second direction, the first direction is perpendicular to the second direction, and the second direction is perpendicular to the thickness direction of the wafer.
According to yet another exemplary embodiment of the present application, there is also provided a test system comprising a probe device and a control device communicatively connected to the probe device, the control device being configured to perform any of the above-described methods.
The test system comprises the detection equipment and the control device, the control device is in communication connection with the detection equipment, and the control device executes any one of the methods to control the detection equipment to rotate after testing a first region to be tested of a wafer and control the probe card after rotation to test a second region to be tested of the wafer, so that the wafer does not need to go out of a test machine table before testing is completed and the position of the wafer does not need to be adjusted manually, the problem that in the wafer WAT test process in the prior art, the wafer needs to go in and out of the test machine table for 2 times, and the test efficiency is low is solved. Meanwhile, the testing system does not need to manually adjust the position of the wafer, so that the high automation degree is ensured, and the labor cost is saved.
In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the embodiments provided in the present application, it should be understood that the disclosed technology can be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the above-described division of the units may be a logical division, and in actual implementation, there may be another division, for example, multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, units or modules, and may be in an electrical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit may be stored in a computer-readable storage medium if it is implemented in the form of a software functional unit and sold or used as a separate product. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the above methods according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic or optical disk, and other various media capable of storing program codes.
From the above description, it can be seen that the above-described embodiments of the present application achieve the following technical effects:
1) the probe card comprises a probe card body and a plurality of probes positioned on the probe card body, and the rotating piece drives the probe card to rotate. The detection equipment ensures that after the first direction test of the wafer is finished, the probe card is driven to rotate through the rotating piece, then the second direction of the wafer is tested, the wafer does not need to go out of the machine table before the test is finished, and the position of the wafer does not need to be adjusted manually.
2) The method comprises the steps of firstly providing a test board provided with a wafer, then testing a first region to be tested of the wafer by controlling a probe card to obtain first test data, then controlling the probe card to rotate, and controlling the rotated probe card to test a second region to be tested of the wafer to obtain second test data. According to the method, after the first to-be-tested area of the wafer is tested, the probe card is controlled to rotate, and the rotated probe card is controlled to test the second to-be-tested area of the wafer, so that the wafer does not need to go out of a test machine table before the test is completed, and the position of the wafer does not need to be manually adjusted, the problem that in the wafer WAT test process in the prior art, the wafer needs to go in and out of the test machine table for 2 times, and therefore the test efficiency is low is solved, the method ensures that the test efficiency of the wafer is high, and ensures that the productivity of the machine table is high.
3) The application also provides a device for detecting a wafer, in which, in the device for detecting a wafer by using any of the above-mentioned detection apparatuses, a test board provided with a wafer is provided by the first determining unit, the first control unit controls the probe card to test a first region to be detected of the wafer to obtain first test data, the first region to be detected is a region to be detected of the wafer in a first direction, the first direction is perpendicular to the thickness direction of the wafer, the second control unit controls the probe card to rotate, and controls the rotated probe card to test a second region to be detected of the wafer to obtain second test data, and the second region to be detected is a region to be detected of the wafer in a second direction. According to the device, after a first region to be tested of a wafer is tested, the probe card is controlled to rotate, and the probe card after rotation is controlled to test a second region to be tested of the wafer, so that the wafer does not need to go out of a test machine table before testing is completed, and the position of the wafer does not need to be adjusted manually, the problem that in the wafer WAT test process in the prior art, the wafer needs to go in and out of the test machine table for 2 times, and therefore the test efficiency is low is solved, the device ensures that the test efficiency of the wafer is high, and ensures that the productivity of the machine table is high.
4) The application also provides a test system, which comprises the detection equipment and the control device, wherein the control device is in communication connection with the detection equipment, the control device executes any one of the methods to control the detection equipment to rotate after testing the first region to be tested of the wafer, and control the probe card after rotation to test the second region to be tested of the wafer, so that the wafer does not need to go out of a test machine before testing is completed, and the position of the wafer does not need to be manually adjusted. Meanwhile, the testing system does not need to manually adjust the position of the wafer, so that the high automation degree is ensured, and the labor cost is saved.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (13)
1. A detection apparatus, comprising:
the probe card comprises a probe card body and a plurality of probes positioned on the probe card body;
and the rotating piece is connected with the probe card and is used for driving the probe card to rotate.
2. The detection apparatus according to claim 1, characterized in that the detection apparatus further comprises:
and the support is connected with the probe card and used for supporting the probe card and enabling the probes to be exposed.
3. The probing apparatus according to claim 2, wherein said support member has a recess, said probe card body is fixed in said recess, and an opening is formed on a bottom surface of said recess and penetrates through said support member, and said probe is exposed through said opening.
4. The detection apparatus according to claim 2, wherein the rotating member comprises:
the connecting rod, with support piece is connected, the connecting rod is used for driving support piece is rotatory.
5. The detection apparatus of claim 4, wherein the rotating member further comprises:
the controller is in communication connection with the connecting rod and is used for controlling the connecting rod to move so as to drive the supporting piece to rotate.
6. A method for inspecting a wafer, comprising:
providing a test board provided with a wafer;
testing a first region to be tested of the wafer by controlling a probe card to obtain first test data, wherein the first region to be tested is a region to be tested of the wafer in a first direction, and the first direction is perpendicular to the thickness direction of the wafer;
and controlling the probe card to rotate, and controlling the rotated probe card to test a second region to be tested of the wafer to obtain second test data, wherein the second region to be tested is a region to be tested of the wafer in a second direction, the first direction is perpendicular to the second direction, and the second direction is perpendicular to the thickness direction of the wafer.
7. The method of claim 6, wherein testing the first region of the wafer to be tested by controlling a probe card comprises:
acquiring first position information of the first region to be tested and second position information of the probe card;
determining whether the probe card is aligned with the first region to be tested according to the first position information and the second position information, and adjusting the position of the wafer under the condition that the probe card is determined to be misaligned with the first region to be tested so that the probe card is aligned with the adjusted first region to be tested of the wafer and the probe card is contacted with the first region to be tested;
and testing the first area to be tested.
8. The method of claim 6, wherein controlling the probe card to rotate and controlling the rotated probe card to test a second region of the wafer to be tested comprises:
determining whether the distance between the probe card and the wafer is greater than a predetermined distance;
under the condition that the distance between the probe card and the wafer is determined to be larger than the preset distance, controlling the probe card to rotate and move in the preset direction, so that the moved probe card is aligned with the second region to be tested, and the moved probe card is contacted with the second region to be tested, wherein the preset direction is the thickness direction of the probe card;
and testing the second region to be tested.
9. The method of claim 8, wherein in the event that it is determined that the probe card is spaced from the wafer by a distance greater than the predetermined distance, controlling the probe card to rotate and move in a predetermined direction such that the moved probe card is aligned with the second area to be tested and such that the moved probe card is in contact with the second area to be tested comprises:
controlling the probe card to rotate;
acquiring third position information of the second region to be tested and fourth position information of the probe card after rotation;
determining whether the rotated probe card is aligned with the second region to be tested according to the third position information and the fourth position information, and adjusting the position of the wafer under the condition that the rotated probe card is determined to be misaligned with the second region to be tested so that the rotated probe card is aligned with the adjusted second region to be tested of the wafer;
and controlling the rotated probe card to move towards the preset direction, so that the moved probe card is contacted with the second area to be tested.
10. The method of claim 8, wherein before controlling the probe card to rotate and controlling the rotated probe card to test the second region of the wafer to be tested, the method further comprises:
determining whether the test of the probe card on the first area to be tested is finished;
and under the condition that the probe card is determined to finish the test on the first area to be tested, controlling the probe card to move in the preset direction, so that the distance between the moved probe card and the wafer is greater than the preset distance.
11. A computer-readable storage medium, characterized in that the computer-readable storage medium comprises a stored program, wherein the program performs the method of any one of claims 6 to 10.
12. A processor, characterized in that the processor is configured to run a program, wherein the program when running performs the method of any of claims 6 to 10.
13. A test system, comprising:
a detection device;
control means communicatively connected to the detection device for performing the method of any one of claims 6 to 10.
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| CN202011522310.1A CN112731096A (en) | 2020-12-21 | 2020-12-21 | Detection device, method for detecting wafer by using detection device and test system |
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| CN202011522310.1A CN112731096A (en) | 2020-12-21 | 2020-12-21 | Detection device, method for detecting wafer by using detection device and test system |
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| CN113866598A (en) * | 2021-09-22 | 2021-12-31 | 长江存储科技有限责任公司 | Wafer test probe card and wafer test system thereof |
| CN115308457A (en) * | 2022-06-30 | 2022-11-08 | 上海泽丰半导体科技有限公司 | Probe card manufacturing method for high and low temperature test and probe card |
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