CN112724930A - Adhesive for SMC (sheet molding compound) molded products, preparation method thereof and bonding method thereof - Google Patents
Adhesive for SMC (sheet molding compound) molded products, preparation method thereof and bonding method thereof Download PDFInfo
- Publication number
- CN112724930A CN112724930A CN202110144695.0A CN202110144695A CN112724930A CN 112724930 A CN112724930 A CN 112724930A CN 202110144695 A CN202110144695 A CN 202110144695A CN 112724930 A CN112724930 A CN 112724930A
- Authority
- CN
- China
- Prior art keywords
- smc
- adhesive
- parts
- bonding
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
Abstract
The invention belongs to the technical field of SMC (sheet molding compound) bonding, and particularly relates to an adhesive for an SMC (sheet molding compound) molded product, and a preparation method and a bonding method thereof. The adhesive comprises the following components of vinyl resin, an organic solvent, filler powder, a curing agent and an accelerator; wherein, the weight portion of the vinyl resin is 35 to 40 portions; 10-15 parts of an organic solvent; 40-50 parts of filler powder; 2-3 parts of a curing agent; 1-2 parts of an accelerator; the organic solvent is acetone, the curing agent is cyclohexanone peroxide, and the accelerator is cobalt naphthenate; the filler powder comprises 20-25 parts of silica powder and 20-25 parts of Morus alba powder. The novel SMC (sheet molding compound) adhesive is particularly suitable for mutual adhesion of SMC molded products, and has the advantages of firm adhesion, strict sealing, impact resistance, excellent bearing capacity, simple and convenient production and quick adhesion operation.
Description
Technical Field
The invention belongs to the technical field of SMC (sheet molding compound) bonding, and particularly relates to an adhesive for an SMC (sheet molding compound) molded product, and a preparation method and a bonding method thereof.
Background
In the molding process of the glass fiber reinforced plastic, the SMC glass fiber reinforced plastic molding method occupies a considerable proportion, and the SMC glass fiber reinforced plastic molding is a halogen-free environment-friendly green composite material and has strong corrosion resistance to acid, dilute alkali, salt, organic solvent, seawater and the like; the product has light weight, high specific strength and specific modulus and good bearing capacity; excellent fire resistance and ageing resistance. In recent years, about 50 percent of SMC (sheet molding compound) molded products are produced in composite materials at home and abroad, and the types of the molded products are more and more along with the gradual maturity of an SMC glass fiber reinforced plastic molding process, so that the application range is wider and more.
The SMC glass steel molded product is molded by internal pressure curing in a mold under a high-temperature and high-pressure state, has quite high density, various raw material molecular structures are tightly connected without any gap, bolts are generally adopted for mutual connection, but the bolts are generally made of galvanized or stainless steel, even if the bolts are stainless steel, corrosion can be generated in an erosion environment or under the working condition containing chloride ions, and the bolts can fall off in the long-time use process to cause the looseness of a connecting port; secondly, the bolted connection mode needs the moulded product to connect the face and sets up to flange or turn-ups structure, and some products need many to assemble, and can not have flange protrusion face, just so can't carry out bolted connection. Some SMC glass fiber reinforced plastic molded products are arranged into socket structures at the connecting parts, but the connecting mode is only suitable for batch production of shaped products, pre-processing is needed, technological parameters such as molds and pressing are greatly adjusted, and the production cost is obviously improved; and the socket joint is difficult to ensure sealed, and is not shock-resistant, and the difficult looseness that appears, breaks away from the problem, influences equipment normal work.
The existing SMC mould pressing glass fiber reinforced plastic product adhesive mostly adopts vinyl resin, bisphenol A type resin, epoxy resin and other soluble materials, but the adhesive effect is not ideal, the firm adhesion and complete sealing effects can not be realized, even if the adhesive can be adhered together at a moment, the adhesive surface can crack again after the adhesive is impacted by stress.
Disclosure of Invention
The invention aims to provide the adhesive which is particularly suitable for mutual adhesion of SMC (sheet molding compound) molded products, and the preparation and use methods thereof, and the adhesive has the advantages of firm adhesion, strict sealing, impact resistance and excellent pressure bearing capacity, and is simple and convenient to produce and quick in adhesion operation.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the adhesive for SMC molded products comprises the following components of vinyl resin, organic solvent, filler powder, curing agent and accelerator; wherein, the weight portion of the vinyl resin is 35 to 40 portions; 10-15 parts of an organic solvent; 40-50 parts of filler powder; 2-3 parts of a curing agent; 1-2 parts of an accelerator.
Additional features of the adhesive forming one of the above-described SMC molded articles include:
-the organic solvent is acetone, the curing agent is cyclohexanone peroxide, and the accelerator is cobalt naphthenate;
-the filler powder comprises fine silica powder and/or morusite powder, the particle size of the filler powder is not less than 200 mesh;
the filler powder comprises 20-25 parts of silica powder and 20-25 parts of Morus alba powder.
The invention also provides a method for preparing the SMC die-pressed product adhesive, which is characterized by comprising the following steps: the main process is as follows,
weighing various components for forming the SMC die-pressing product adhesive according to the weight part ratio;
step two, adding the silicon micropowder and the morus stone powder into the vinyl resin in a stirrer; stirring and heating to above 30 deg.C, adding acetone; continuously adding the cycloethanone peroxide and the cobalt naphthenate, and uniformly stirring to obtain a mixture;
and step three, adding the mixture obtained in the step two into a grinder, and grinding the mixture until the fluid is free from granular sensation.
-in step two, the rotation speed of the stirrer is 400 to 500r/min, and the stirring time is between 10 and 20 minutes;
-in step three, the rotation speed of the mill is 40 to 60r/min, 5 to 15 minutes is one cycle, milling is 1 to 5 cycles.
The invention further provides a use method of the SMC molded product adhesive, which is characterized in that: the main process is as follows,
firstly, roughening the part to be bonded of an SMC (sheet molding compound) molded product;
secondly, coating the SMC mould pressing product adhesive on the surface to be adhered of the SMC mould pressing product;
and step three, attaching and compacting the surface of the SMC mould pressing product coated with the adhesive, and curing the adhesive.
Step four is added in the step one, after the part to be bonded of the SMC die-pressed product is subjected to napping treatment, the surface roughness Rz of the napped part is not less than 100, and the napped part is coated with acetone solution;
in the fourth step, the part to be bonded is heated while brushing the acetone solution, and the temperature is kept to be not lower than 30 ℃.
And step five is added after the step three, after the adhesive of the SMC mould pressing product is solidified, a layer of reinforcing resin is coated on the bonding position, at least three layers of alkali-free knitted felts are laid, and the three layers of alkali-free knitted felts are infiltrated and compacted.
Compared with the prior art, the adhesive for SMC molded products and the preparation and bonding methods thereof provided by the invention have the following advantages: firstly, the adhesive special for the SMC molded product comprises vinyl resin, organic solvent, filler powder, curing agent and accelerator; wherein, the weight portion of the vinyl resin is 35 to 40 portions; 10-15 parts of an organic solvent; 40-50 parts of filler powder; 2-3 parts of a curing agent; 1-2 parts of accelerator, wherein the resin bonding material is prepared by mixing the components in a ratio, can well infiltrate and adhere to the bonding surface of an SMC (sheet molding compound) molded product, and has the advantages of firm bonding, strict sealing, impact resistance and strong bearing capacity; secondly, acetone is selected as an organic solvent, so that the organic solvent has the capability of decomposing and corroding the surface of the SMC glass fiber reinforced plastic product, but does not damage glass fibers, and only decomposes resin on the surface layer, so that a rough surface is formed, and a prerequisite condition is created for resin bonding; the filler powder is a mixture of silicon powder and Morus alba powder, the silicon powder has a thickening effect and promotes the tensile force between resin molecules, and the Morus alba powder can remarkably enhance the wear resistance and hardness, ensure the adhesive strength of an adhesive layer and realize tight adhesion; the curing agent is cyclohexanone peroxide, so that cross-linking reaction occurs between adhesive molecules to cause resin curing, and the promoter is cobalt naphthenate to promote the adhesive to be rapidly cured at low temperature and improve the use efficiency.
Detailed Description
The adhesive for SMC molded products, the preparation thereof and the bonding method according to the present invention will be described in detail by way of examples
Example one
Weighing raw material components according to parts by weight, wherein 35 parts of vinyl resin, 14.8 parts of acetone as an organic solvent, 22 parts of silicon micropowder as filler powder and 23 parts of morus powder (the particle sizes are 300 meshes), 2.3 parts of cyclohexanone peroxide as a curing agent and 1.1 parts of cobalt naphthenate as an accelerator are weighed;
the preparation process comprises the following steps:
weighing the components for forming the adhesive according to the weight part ratio;
in a stirrer, adding the silicon micropowder and the morus stone powder into the vinyl resin; stirring and heating to 30-35 deg.C, adding acetone; continuously adding the cycloethanone peroxide and the cobalt naphthenate, and uniformly stirring to obtain a mixture; the rotating speed of the stirrer is maintained at about 450r/min, and the stirring time is about 15 minutes;
adding the obtained mixture into a grinder, and grinding to obtain fluid without granular sensation; the rotation speed of the grinder is maintained at about 50r/min, 10 minutes is one period, and the grinding is carried out for 3 periods. Grinder power: 2.2kw, can grind 80-100kg per hour, the resin paste after grinding, have fine infiltration nature and cohesiveness, grind simultaneously and make resin and add the more even mixture of material, and abundant fusion, remove the bubble in the resin material, the resin paste after grinding is than before grinding the reduction of viscosity, is favorable to the bonding more.
The bonding process is as follows:
after the part to be bonded of the SMC die-pressed product is subjected to roughening treatment, the surface roughness Rz of the roughened part is not less than 100 (N11), the roughened part is coated with acetone, the acetone is organically dissolved, resin components in a glass fiber reinforced plastic finished product can be decomposed, and the fiber surface inside is exposed, so that a plurality of tiny gaps and bubbles are formed on the surface, the bonding resin can permeate into the voids, the part to be bonded is heated (such as hot air, a baking lamp and the like) while the acetone solution is coated, the temperature is kept to be not less than 30 ℃, the molecular activity is increased, and the bonding effect is improved;
brushing the SMC molded product adhesive on the surface to be bonded of the SMC molded product, and keeping the heating treatment;
attaching and compacting the surface of the SMC mould pressing product coated with the adhesive, and curing the adhesive;
coating a layer of reinforcing resin on the outer layer of the bonding part, laying three to five layers of alkali-free knitted felts, and infiltrating and compacting the alkali-free knitted felts.
Example two
Different from the first embodiment, the raw material components are weighed according to the parts by weight, wherein 37.5 parts of vinyl resin, 13.5 parts of acetone as an organic solvent, 24 parts of silicon micropowder as filler powder and 20 parts of morus powder (the particle sizes are 250 meshes), 2.7 parts of cyclohexanone peroxide as a curing agent and 1.7 parts of cobalt naphthenate as an accelerator are used.
EXAMPLE III
Different from the first embodiment, the raw material components are weighed according to the parts by weight, wherein 40 parts of vinyl resin, 14.5 parts of acetone as an organic solvent, 25 parts of silicon micropowder as a filler powder and 23 parts of morus alba powder (the particle sizes are 250 meshes), 2.9 parts of cyclohexanone peroxide as a curing agent and 1.9 parts of cobalt naphthenate as an accelerating agent.
Example four
Different from the first embodiment, the raw material components are weighed according to the parts by weight, wherein 33.5 parts of vinyl resin, 12 parts of acetone as an organic solvent, 22.5 parts of silicon micropowder as filler powder and 22.5 parts of morus powder (the particle sizes are both 400 meshes), 2.5 parts of cyclohexanone peroxide as a curing agent and 1.5 parts of cobalt naphthenate as an accelerator are weighed.
The SMC molded products successfully bonded according to the above procedure were subjected to field test experiments:
cutting a circular plate with the thickness of phi 600 of 6mm manufactured by an SMC (sheet molding compound) mould pressing process into two circular plates from the center, bonding the two circular plates into the phi 600 circular plate on one side again according to the steps, wherein the bonding thickness is also 6mm, after the circular plate is completely cured, suspending the circular plate and placing the circular plate on two cushion blocks in the same direction with the cutting seam, the bonding surface of the circular plate is upward, the bonding seam is punched down, the distance between the two cushion blocks is 400mm, performing free falling body impact test on the central part of the cutting seam by using a weight of 80-100kg, when the weight is higher than the circular plate by more than 300mm, freely falling onto the circular plate, and the stress impact point of the circular.
After continuous 5-10 times of impact tests, the cutting joint does not crack or break, and the using requirements are met, wherein the bonding strength of the test products in the four embodiments is more than 100MPa, the bending strength is not lower than 147MPa, the Babbitt hardness is not lower than 35, the resin content (rich resin layer) is not lower than 50%, and the flame retardant property (oxygen index) is not lower than 28%; for the experimental article adopting double-sided bonding, the strength of the interface even exceeds the strength of the original material.
In practical application, a flat plate manufactured by SMC die pressing is assembled into a square water tank, seams are formed in the bottom and the side faces of the square water tank, single-face bonding is adopted, bonding is conducted inwards, after more than 1m of liquid is injected into the water tank, the seam does not leak, the experimental water tank is used for more than 1 year at present, no leakage, cracking or deformation phenomena exist, and bonding sealing performance is tested in practical application.
Claims (11)
1. An adhesive for SMC molded products, characterized in that: the adhesive comprises the following components of vinyl resin, organic solvent, filler powder, curing agent and accelerator;
wherein, the weight portion of the vinyl resin is 35 to 40 portions; 10-15 parts of an organic solvent; 40-50 parts of filler powder; 2-3 parts of a curing agent; 1-2 parts of an accelerator.
2. An adhesive for SMC moulded articles as in claim 1, wherein: the organic solvent is acetone, the curing agent is cyclohexanone peroxide, and the accelerator is cobalt naphthenate.
3. An adhesive for SMC moulded articles as in claim 1, wherein: the filler powder comprises silicon micropowder and/or morusite powder, and the particle size of the filler powder is not less than 200 meshes.
4. An adhesive for SMC moulded articles as in claim 3 wherein: the filler powder comprises 20-25 parts of silica powder and 20-25 parts of Morus alba powder.
5. A method for preparing an adhesive for SMC molded products is characterized by comprising the following steps: for the preparation of the SMC moulded article adhesive according to claims 1 to 4,
weighing various components for forming the SMC die-pressing product adhesive according to the weight part ratio;
step two, adding the silicon micropowder and the morus stone powder into the vinyl resin in a stirrer; stirring and heating to above 30 deg.C, adding acetone; continuously adding the cycloethanone peroxide and the cobalt naphthenate, and uniformly stirring to obtain a mixture;
and step three, adding the mixture obtained in the step two into a grinder, and grinding the mixture until the fluid is free from granular sensation.
6. A method of making an adhesive for SMC molded articles according to claim 5, wherein: in the second step, the rotating speed of the stirrer is 400 to 500r/min, and the stirring time is between 10 and 20 minutes.
7. A method of making an adhesive for SMC molded articles according to claim 5, wherein: in the third step, the rotating speed of the grinding machine is 40 to 60r/min, 5 to 15 minutes is one period, and the grinding time is 1 to 5 periods.
8. A method of bonding SMC molded articles, characterized by: use of the SMC molded article adhesive of claims 1 to 4,
firstly, roughening the part to be bonded of an SMC (sheet molding compound) molded product;
secondly, coating the SMC mould pressing product adhesive on the surface to be adhered of the SMC mould pressing product;
and step three, attaching and compacting the surface of the SMC mould pressing product coated with the adhesive, and curing the adhesive.
9. A method of bonding SMC molded articles as in claim 8 wherein:
and adding a fourth step in the first step, after roughening treatment is carried out on the part to be bonded of the SMC molded product, wherein the surface roughness Rz of the roughened part is not less than 100, and the roughened part is coated with an acetone solution.
10. A method of bonding SMC molded articles as in claim 9 wherein: in the fourth step, the part to be bonded is heated while brushing the acetone solution, and the temperature is kept to be not lower than 30 ℃.
11. A method of bonding SMC molded articles as in claim 8 wherein: and step five is added after the step three, after the adhesive of the SMC mould pressing product is solidified, a layer of reinforcing resin is coated on the bonding position, at least three layers of alkali-free knitted felts are laid, and the three layers of alkali-free knitted felts are infiltrated and compacted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110144695.0A CN112724930A (en) | 2021-02-03 | 2021-02-03 | Adhesive for SMC (sheet molding compound) molded products, preparation method thereof and bonding method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110144695.0A CN112724930A (en) | 2021-02-03 | 2021-02-03 | Adhesive for SMC (sheet molding compound) molded products, preparation method thereof and bonding method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112724930A true CN112724930A (en) | 2021-04-30 |
Family
ID=75595522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110144695.0A Pending CN112724930A (en) | 2021-02-03 | 2021-02-03 | Adhesive for SMC (sheet molding compound) molded products, preparation method thereof and bonding method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112724930A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050072335A1 (en) * | 2003-10-02 | 2005-04-07 | Zhang Yue S. | Primer composition for bonding polymer composites with urethane adhesives and sealants |
| CN102092163A (en) * | 2010-12-09 | 2011-06-15 | 苏州工业园区科逸卫浴设备有限公司 | Glassfibre reinforced plastics and preparation method thereof |
| CN109608671A (en) * | 2018-12-05 | 2019-04-12 | 镇江利德尔复合材料有限公司 | A kind of preparation method of carbon fiber vinylite SMC composite material |
-
2021
- 2021-02-03 CN CN202110144695.0A patent/CN112724930A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050072335A1 (en) * | 2003-10-02 | 2005-04-07 | Zhang Yue S. | Primer composition for bonding polymer composites with urethane adhesives and sealants |
| CN102092163A (en) * | 2010-12-09 | 2011-06-15 | 苏州工业园区科逸卫浴设备有限公司 | Glassfibre reinforced plastics and preparation method thereof |
| CN109608671A (en) * | 2018-12-05 | 2019-04-12 | 镇江利德尔复合材料有限公司 | A kind of preparation method of carbon fiber vinylite SMC composite material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102153833B (en) | Carbon fiber (powder)/epoxy resin composite material used for rapid prototyping die | |
| CN110253996B (en) | Fireproof flame-retardant aluminum-plastic plate and preparation method thereof | |
| CN106478019A (en) | A kind of bonding mortar of utilization cullet Stainless-steel fibre | |
| CN111484255A (en) | FOAMG L AS composite veneering foam glass insulation board and processing method thereof | |
| CN114231013A (en) | Environment-friendly plastic building template material and preparation method thereof | |
| CN103481567B (en) | Biomass polymer hybrid laminated composite material and preparation method | |
| CN116144053A (en) | Preparation method of continuous basalt fiber reinforced modified resin environment-friendly composite material | |
| CN114426767B (en) | Sheet molding compound and preparation method thereof | |
| CN113183386B (en) | High-compression-resistance fiber-reinforced polyurethane composite board and preparation method thereof | |
| CN112724930A (en) | Adhesive for SMC (sheet molding compound) molded products, preparation method thereof and bonding method thereof | |
| CN107652645A (en) | A kind of low-temp low-pressure shaping unsaturated polyester resin glass fiber prepreg and preparation method thereof | |
| CN107119721A (en) | A kind of intensity reinforced fibre glass well cover | |
| CN114773814B (en) | Unsaturated polyester resin material for glass fiber reinforced plastic pipeline and preparation method thereof | |
| CN104786575B (en) | A kind of asbestos base lamilate, its manufacturing method and its application | |
| CN110590275A (en) | Graphite polyphenyl particle non-combustible heat preservation plate and preparation method thereof | |
| CN110342878A (en) | A kind of ventilative high-intensity inorganic quartz and preparation method thereof | |
| CN111499309A (en) | Concrete mixed with basalt fibers and metakaolin and preparation method thereof | |
| CN115725155A (en) | Glass fiber reinforced thermosetting resin material | |
| CN107718842A (en) | Based on graphene and nonmetallic tailings fretting map science and technology wood plank and preparation method thereof | |
| CN114292496A (en) | Transparent epoxy resin matrix for pultrusion and preparation method thereof | |
| CN103483551B (en) | The preparation method of the interpolymer of a kind of epoxy resin and unsaturated polyester and application thereof | |
| CN112092421A (en) | SMC sheet preparation method and application | |
| CN107965106B (en) | Manufacturing process of environment-friendly decorative stone | |
| CN107379363B (en) | Forming process of polymer concrete pipeline | |
| CN112824444A (en) | Phenolic resin bamboo plywood manufacturing process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |