CN112824444A - Phenolic resin bamboo plywood manufacturing process - Google Patents

Phenolic resin bamboo plywood manufacturing process Download PDF

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Publication number
CN112824444A
CN112824444A CN201911143946.2A CN201911143946A CN112824444A CN 112824444 A CN112824444 A CN 112824444A CN 201911143946 A CN201911143946 A CN 201911143946A CN 112824444 A CN112824444 A CN 112824444A
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China
Prior art keywords
parts
phenolic resin
bamboo plywood
bamboo
manufacturing process
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Pending
Application number
CN201911143946.2A
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Chinese (zh)
Inventor
刘胜军
王桂章
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Taojiang Xinsheng Bamboo Industry Co ltd
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Taojiang Xinsheng Bamboo Industry Co ltd
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Priority to CN201911143946.2A priority Critical patent/CN112824444A/en
Publication of CN112824444A publication Critical patent/CN112824444A/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27DWORKING VENEER OR PLYWOOD
    • B27D1/00Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/04Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27DWORKING VENEER OR PLYWOOD
    • B27D1/00Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/04Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
    • B27D1/08Manufacture of shaped articles; Presses specially designed therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00Producing flat articles, e.g. films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28Chemically modified polycondensates
    • C08G8/32Chemically modified polycondensates by organic acids or derivatives thereof, e.g. fatty oils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C09J161/14Modified phenol-aldehyde condensates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/30Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3009Sulfides
    • C08K2003/3036Sulfides of zinc
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Veneer Processing And Manufacture Of Plywood (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a phenolic resin bamboo plywood manufacturing process which is mainly prepared by mixing 60-80 parts of bamboo powder, 80-100 parts of ethylene propylene diene monomer, 20-25 parts of polymethyl methacrylate, 5-8 parts of stearic acid, 8-10 parts of aluminum hydroxide, 6-8 parts of nano carbon fiber, 4-8 parts of nano zinc sulfide and 2-5 parts of dicumyl peroxide; the bamboo plywood is subjected to ultrasonic treatment and hot-pressing curing treatment, so that the toughness of the bamboo plywood is greatly enhanced, and the impregnation treatment of the modified phenolic resin increases the chemical bonding force between the bamboo plywood, thereby improving the cohesion of the bamboo plywood and improving the physical and mechanical strength of the bamboo plywood.

Description

Phenolic resin bamboo plywood manufacturing process
Technical Field
The invention relates to the field of plywood, in particular to a manufacturing process of a phenolic resin bamboo plywood.
Background
The bamboo plywood is a building material which is formed into a blank by taking a moso bamboo material as a main framework and a filling material through high pressure, has high bamboo strength and good toughness, rigidity and wear resistance, and can be used as an excellent engineering structure material; the bamboo plywood formwork manufactured by taking bamboo as a raw material has the advantages of good bending strength and rigidity, good overall structure, large breadth, convenience in loading and unloading, easiness in demoulding, high construction efficiency, excellent technical quality and excellent economic benefit. However, the existing preparation process for preparing the bamboo plywood has the disadvantages of multiple manual operations, complex process, low production efficiency and low strength of the prepared bamboo plywood.
The bamboo plywood can be divided into a cloth-sandwiched rubber board, a cloth-attached rubber board, an insulating rubber board, an oil-resistant rubber board and the like according to physical properties and chemical properties; the composite material has wide application, and is suitable for horizontal templates, shear walls, vertical wallboards, bridges, viaducts and the like in house buildings.
At present, common bamboo plywood generally has the defects of weaker integrity, relatively poorer performance such as strength, toughness and the like, higher requirements on the aspects that the bending strength and the impact strength cannot be met, and the surface layer is easy to crack after long-term use.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a manufacturing process of a phenolic resin bamboo plywood, which greatly enhances the toughness of the bamboo plywood by ultrasonic treatment and hot-pressing curing treatment of the bamboo plywood, and increases the chemical bonding force between the bamboo plywood by gum dipping treatment of modified phenolic resin, thereby improving the cohesion of the bamboo plywood and improving the physical and mechanical strength of the bamboo plywood.
(II) technical scheme
In order to achieve the above purpose, the invention provides the following technical scheme: a manufacturing process of a phenolic resin bamboo plywood comprises the following steps:
(1) preparation of raw materials: 60-80 parts of bamboo powder, 80-100 parts of ethylene propylene diene monomer, 20-25 parts of polymethyl methacrylate, 5-8 parts of stearic acid, 8-10 parts of aluminum hydroxide, 6-8 parts of nano carbon fiber, 4-8 parts of nano zinc sulfide and 2-5 parts of dicumyl peroxide;
(2) firstly, adding bamboo powder, ethylene propylene diene monomer and polymethyl methacrylate into an open mill, heating to 40-50 ℃, uniformly stirring, adding stearic acid, aluminum hydroxide, nano carbon fiber, nano zinc sulfide and dicumyl peroxide into the mixture, and mixing and vulcanizing; mixing for 10-12 min at 120-135 deg.C, vulcanizing for 4-6 min at 155-175 deg.C under 8-10MPa to obtain bamboo plywood;
(3) ultrasonically treating the bamboo plywood, and then performing gum dipping for 60-90min, wherein the gum dipping adopts a modified phenolic resin adhesive;
(4) and drying the bamboo plywood after gum dipping until the water content is lower than 10 wt%, and then carrying out hot-pressing curing to obtain the phenolic resin bamboo plywood.
Preferably, the raw materials are preferably 70 parts of bamboo powder, 90 parts of ethylene propylene diene monomer, 22 parts of polymethyl methacrylate, 6 parts of stearic acid, 9 parts of aluminum hydroxide, 7 parts of nano carbon fiber, 6 parts of nano zinc sulfide and 3.5 parts of dicumyl peroxide.
Preferably, the power of the ultrasonic treatment in the step (3) is 350W-400W, and the ultrasonic treatment time is 3-5 minutes.
Preferably, the preparation method of the modified phenolic resin adhesive comprises the following steps:
(1) weighing 120 parts of phenolic resin 100-one, 30-50 parts of N-methylpyrrolidone, 3-5 parts of dimethyl sulfoxide and 10-15 parts of phthalic anhydride;
(2) dispersing dimethyl sulfoxide into N-methyl pyrrolidone, then uniformly mixing with phenolic resin and phthalic anhydride, and curing for 5-6 hours at the curing temperature of 150-160 ℃ to obtain the modified phenolic resin adhesive.
Preferably, the hot-pressing curing temperature in the step (4) is 130-140 ℃, the hot-pressing pressure is 3.5-4.0MPa, and the hot-pressing time is 25-30 s.
(III) advantageous effects
Compared with the prior art, the invention provides a phenolic resin bamboo plywood manufacturing process, which has the following beneficial effects:
1. the bamboo plywood is subjected to ultrasonic treatment and hot-pressing curing treatment, so that the toughness of the bamboo plywood is greatly enhanced, and the impregnation treatment of the modified phenolic resin increases the chemical bonding force between the bamboo plywood, thereby improving the cohesion of the bamboo plywood and improving the physical and mechanical strength of the bamboo plywood.
2. The manufacturing process reduces the nutrient components in the bamboo plywood, so that the bamboo plywood can not be used as a nutrient medium of mould, and the corrosion resistance of the bamboo plywood is improved.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
a manufacturing process of a phenolic resin bamboo plywood comprises the following steps:
(1) preparation of raw materials: 60kg of bamboo powder, 80kg of ethylene propylene diene monomer, 20kg of polymethyl methacrylate, 5kg of stearic acid, 8kg of aluminum hydroxide, 6kg of nano carbon fiber, 4kg of nano zinc sulfide and 2kg of dicumyl peroxide;
(2) firstly, adding bamboo powder, ethylene propylene diene monomer and polymethyl methacrylate into an open mill, heating to 45 ℃, stirring and uniformly mixing, and then adding stearic acid, aluminum hydroxide, nano carbon fiber, nano zinc sulfide and dicumyl peroxide into the mixture for mixing and vulcanizing; mixing for 10 minutes at 125 deg.C for 5 minutes, vulcanizing at 165 deg.C under 10Mpa to obtain bamboo plywood;
(3) ultrasonically treating the bamboo plywood, wherein the power of ultrasonic treatment is 400W, the ultrasonic treatment time is 5 minutes, and then performing gum dipping, wherein the gum dipping time is 80 minutes, and the gum dipping adopts a modified phenolic resin adhesive;
(4) and drying the bamboo plywood after gum dipping until the water content is lower than 10 wt%, and then performing hot-pressing curing at the temperature of 135 ℃, under the pressure of 4.0MPa for 30s to obtain the phenolic resin bamboo plywood.
Specifically, the preparation method of the modified phenolic resin adhesive comprises the following steps:
(1) weighing 110 parts of phenolic resin, 40 parts of N-methylpyrrolidone, 4 parts of dimethyl sulfoxide and 12 parts of phthalic anhydride;
(2) dispersing dimethyl sulfoxide into N-methyl pyrrolidone, then uniformly mixing with phenolic resin and phthalic anhydride, and curing for 5 hours at the curing temperature of 155 ℃ to obtain the modified phenolic resin adhesive.
Example two:
a manufacturing process of a phenolic resin bamboo plywood comprises the following steps:
(1) preparation of raw materials: 70kg of bamboo powder, 90kg of ethylene propylene diene monomer, 22kg of polymethyl methacrylate, 6kg of stearic acid, 9kg of aluminum hydroxide, 7kg of nano carbon fiber, 6kg of nano zinc sulfide and 3.5kg of dicumyl peroxide;
(2) firstly, adding bamboo powder, ethylene propylene diene monomer and polymethyl methacrylate into an open mill, heating to 45 ℃, stirring and uniformly mixing, and then adding stearic acid, aluminum hydroxide, nano carbon fiber, nano zinc sulfide and dicumyl peroxide into the mixture for mixing and vulcanizing; mixing for 10 minutes at 125 deg.C for 5 minutes, vulcanizing at 165 deg.C under 10Mpa to obtain bamboo plywood;
(3) ultrasonically treating the bamboo plywood, wherein the power of ultrasonic treatment is 350W, the ultrasonic treatment time is 5 minutes, and then performing gum dipping, wherein the gum dipping time is 80 minutes, and the gum dipping adopts a modified phenolic resin adhesive;
(4) and drying the bamboo plywood after gum dipping until the water content is lower than 10 wt%, and then performing hot-pressing curing at the temperature of 135 ℃, under the pressure of 4.0MPa for 30s to obtain the phenolic resin bamboo plywood.
Specifically, the preparation method of the modified phenolic resin adhesive is the same as that of the first embodiment.
Example three:
a manufacturing process of a phenolic resin bamboo plywood comprises the following steps:
(1) preparation of raw materials: 80kg of bamboo powder, 100kg of ethylene propylene diene monomer, 25kg of polymethyl methacrylate, 8kg of stearic acid, 10kg of aluminum hydroxide, 8kg of nano carbon fiber, 8kg of nano zinc sulfide and 5kg of dicumyl peroxide;
(2) firstly, adding bamboo powder, ethylene propylene diene monomer and polymethyl methacrylate into an open mill, heating to 40-50 ℃, uniformly stirring, adding stearic acid, aluminum hydroxide, nano carbon fiber, nano zinc sulfide and dicumyl peroxide into the mixture, and mixing and vulcanizing; mixing for 10-12 min at 120-135 deg.C, vulcanizing for 4-6 min at 155-175 deg.C under 8-10MPa to obtain bamboo plywood;
(3) ultrasonically treating the bamboo plywood, wherein the power of ultrasonic treatment is 400W, the time of ultrasonic treatment is 5 minutes, and then performing gum dipping for 60-90 minutes, wherein the gum dipping adopts a modified phenolic resin adhesive;
(4) and drying the bamboo plywood after gum dipping until the water content is lower than 10 wt%, and then performing hot-pressing curing at the temperature of 135 ℃, under the pressure of 4.0MPa for 30s to obtain the phenolic resin bamboo plywood.
Specifically, the preparation method of the modified phenolic resin adhesive is the same as that of the first embodiment.
Experimental example four:
a manufacturing process of a phenolic resin bamboo plywood comprises the following steps:
(1) preparation of raw materials: 75kg of bamboo powder, 85kg of ethylene propylene diene monomer, 24kg of polymethyl methacrylate, 7kg of stearic acid, 8kg of aluminum hydroxide, 8kg of nano carbon fiber, 7kg of nano zinc sulfide and 4kg of dicumyl peroxide;
(2) firstly, adding bamboo powder, ethylene propylene diene monomer and polymethyl methacrylate into an open mill, heating to 45 ℃, stirring and uniformly mixing, and then adding stearic acid, aluminum hydroxide, nano carbon fiber, nano zinc sulfide and dicumyl peroxide into the mixture for mixing and vulcanizing; mixing for 10 minutes at 125 deg.C for 5 minutes, vulcanizing at 165 deg.C under 10Mpa to obtain bamboo plywood;
(3) ultrasonically treating the bamboo plywood, wherein the power of ultrasonic treatment is 400W, the ultrasonic treatment time is 5 minutes, and then performing gum dipping, wherein the gum dipping time is 80 minutes, and the gum dipping adopts a modified phenolic resin adhesive;
(4) and drying the bamboo plywood after gum dipping until the water content is lower than 10 wt%, and then performing hot-pressing curing at the temperature of 135 ℃, under the pressure of 4.0MPa for 30s to obtain the phenolic resin bamboo plywood.
Specifically, the preparation method of the modified phenolic resin adhesive is the same as that of the first embodiment.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The manufacturing process of the phenolic resin bamboo plywood is characterized by comprising the following steps:
(1) preparation of raw materials: 60-80 parts of bamboo powder, 80-100 parts of ethylene propylene diene monomer, 20-25 parts of polymethyl methacrylate, 5-8 parts of stearic acid, 8-10 parts of aluminum hydroxide, 6-8 parts of nano carbon fiber, 4-8 parts of nano zinc sulfide and 2-5 parts of dicumyl peroxide;
(2) firstly, adding bamboo powder, ethylene propylene diene monomer and polymethyl methacrylate into an open mill, heating to 40-50 ℃, uniformly stirring, adding stearic acid, aluminum hydroxide, nano carbon fiber, nano zinc sulfide and dicumyl peroxide into the mixture, and mixing and vulcanizing; mixing for 10-12 min at 120-135 deg.C, vulcanizing for 4-6 min at 155-175 deg.C under 8-10MPa to obtain bamboo plywood;
(3) ultrasonically treating the bamboo plywood, and then performing gum dipping for 60-90min, wherein the gum dipping adopts a modified phenolic resin adhesive;
(4) and drying the bamboo plywood after gum dipping until the water content is lower than 10 wt%, and then carrying out hot-pressing curing to obtain the phenolic resin bamboo plywood.
2. The manufacturing process of the phenolic resin bamboo plywood as claimed in claim 1, wherein the raw materials are preferably 70 parts of bamboo powder, 90 parts of ethylene propylene diene monomer, 22 parts of polymethyl methacrylate, 6 parts of stearic acid, 9 parts of aluminum hydroxide, 7 parts of nano carbon fiber, 6 parts of nano zinc sulfide and 3.5 parts of dicumyl peroxide.
3. The phenolic resin bamboo plywood manufacturing process according to claim 1, wherein the ultrasonic treatment power of the step (3) is 350W-400W, and the ultrasonic treatment time is 3-5 minutes.
4. The phenolic resin bamboo plywood manufacturing process according to claim 1, wherein the modified phenolic resin adhesive in the step (3) is formed by modifying N-methyl pyrrolidone, dimethyl sulfoxide and phthalic anhydride.
5. The manufacturing process of the phenolic resin bamboo plywood as claimed in claim 4, wherein the preparation method of the modified phenolic resin adhesive comprises the following steps:
(1) weighing 120 parts of phenolic resin 100-one, 30-50 parts of N-methylpyrrolidone, 3-5 parts of dimethyl sulfoxide and 10-15 parts of phthalic anhydride;
(2) dispersing dimethyl sulfoxide into N-methyl pyrrolidone, then uniformly mixing with phenolic resin and phthalic anhydride, and curing for 5-6 hours at the curing temperature of 150-160 ℃ to obtain the modified phenolic resin adhesive.
6. The manufacturing process of the phenolic resin bamboo plywood as claimed in claim 1, wherein the hot-pressing curing temperature in the step (4) is 130-140 ℃, the hot-pressing pressure is 3.5-4.0MPa, and the hot-pressing time is 25-30 s.
CN201911143946.2A 2019-11-20 2019-11-20 Phenolic resin bamboo plywood manufacturing process Pending CN112824444A (en)

Priority Applications (1)

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CN201911143946.2A CN112824444A (en) 2019-11-20 2019-11-20 Phenolic resin bamboo plywood manufacturing process

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Application Number Priority Date Filing Date Title
CN201911143946.2A CN112824444A (en) 2019-11-20 2019-11-20 Phenolic resin bamboo plywood manufacturing process

Publications (1)

Publication Number Publication Date
CN112824444A true CN112824444A (en) 2021-05-21

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Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115741908A (en) * 2022-11-22 2023-03-07 广东东方广厦模块化建筑有限公司 Corrosion-resistant plywood and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105331311A (en) * 2015-11-23 2016-02-17 安徽福佳竹木日用品有限公司 Preparation method of bamboo plywood with high bonding strength
CN107266899A (en) * 2017-06-30 2017-10-20 常州市协旺纺织品有限公司 A kind of wood-plastic composite floor and preparation method thereof
CN107310001A (en) * 2017-06-28 2017-11-03 常州市瑞泰物资有限公司 A kind of bamboo slab rubber and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105331311A (en) * 2015-11-23 2016-02-17 安徽福佳竹木日用品有限公司 Preparation method of bamboo plywood with high bonding strength
CN107310001A (en) * 2017-06-28 2017-11-03 常州市瑞泰物资有限公司 A kind of bamboo slab rubber and preparation method thereof
CN107266899A (en) * 2017-06-30 2017-10-20 常州市协旺纺织品有限公司 A kind of wood-plastic composite floor and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115741908A (en) * 2022-11-22 2023-03-07 广东东方广厦模块化建筑有限公司 Corrosion-resistant plywood and preparation method thereof

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