CN112720969A - Encapsulating tool and encapsulating method for electronic product - Google Patents
Encapsulating tool and encapsulating method for electronic product Download PDFInfo
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- CN112720969A CN112720969A CN202011453745.5A CN202011453745A CN112720969A CN 112720969 A CN112720969 A CN 112720969A CN 202011453745 A CN202011453745 A CN 202011453745A CN 112720969 A CN112720969 A CN 112720969A
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 25
- 238000004140 cleaning Methods 0.000 claims description 18
- 238000007664 blowing Methods 0.000 claims description 16
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 10
- 238000004513 sizing Methods 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 238000004382 potting Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000443 aerosol Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 5
- 238000007603 infrared drying Methods 0.000 claims description 5
- 239000004570 mortar (masonry) Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- -1 polytetrafluoroethylene Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- 238000011049 filling Methods 0.000 abstract description 11
- 238000005538 encapsulation Methods 0.000 description 8
- 239000003292 glue Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Abstract
The invention relates to the technical field of filling and sealing devices, in particular to a filling and sealing tool for electronic products and a filling and sealing method.
Description
Technical Field
The invention relates to the technical field of filling and sealing devices, in particular to a filling and sealing tool and a filling and sealing method for an electronic product.
Background
In order to ensure the normal work of electronic products and prevent the circuit board and devices from being damaged or failed in connection due to impact and vibration, the currently adopted method is that the whole electronic assembly is encapsulated in a cavity for reinforcement, but some devices can be assembled after encapsulation, so that the devices need to be replaced by tools for simulated assembly during encapsulation, the effect of leaking stoppage can be achieved, and the purpose of occupying the space positions of the devices can be achieved.
During integral encapsulation, due to functional requirements, a tool is required to be used for isolation, the encapsulation is carried out by adopting glue, due to the performance of the glue and the high insulation requirement of an electronic product after encapsulation, the tool is usually made of a non-metal material, the tool is very easy to deform when being impacted by external force during demolding, the normal demolding cannot be carried out after encapsulation and curing, the service life of the tool is short, the glue can flow to the part of a circuit board which does not need encapsulation to influence the product performance due to good fluidity of the glue, a large amount of time can be spent on removing the redundant glue after the curing is finished, excessive materials and products are easy to generate and damage, and the operation is tedious and unsafe.
Disclosure of Invention
The invention provides an electronic product encapsulating tool and an encapsulating method, which can effectively solve the technical defects, can realize quick demoulding after encapsulation and solidification, and also achieve the encapsulating performance and requirements of products, and the tool has strong impact resistance, low manufacturing cost and long service life, the encapsulating method is simple and practical, the stress is uniform during demoulding, the service life of the tool can be obviously prolonged, the encapsulating surface quality can be protected, and the product quality and the production efficiency are improved, and the encapsulating method specifically comprises the following steps:
(1) pre-baking: mixing Fe2O3Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;
(2) preparing materials: weighing the organosilicon gel and Fe2O3Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;
(3) cleaning: cleaning the electronic component and the encapsulating tool;
(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;
(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;
(6) pressurizing and blowing balls: treating under gauge pressure of 0.092MPa for 10-15 min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;
(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;
(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.
The organosilicone gel and Fe2O3The weight ratio of 254: (0.5-1).
The silicone gel is GN522A, GN522B, GN502M, GN502N, and the silicone gel product is provided by Zhonghao Chen photochemical research institute, Inc.
The mass ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.
Further, when preparing the materials, firstly, the GN522A component is weighed, the GN522B component is added, the mixture is quickly and uniformly stirred by an electric stirrer, and then GN502M, GN502N and prebaked Fe are added2O3Stirring for 2min, placing in a vacuum defoaming machine, and vacuumizing to minus 0.092MPa for 5 min.
The pre-drying temperature is 100-110 ℃, the time is 2-3 h, and after power failure, the temperature is naturally reduced to 25-30 ℃.
And (3) curing at the temperature of (45 +/-2) ℃ for 2h, and after the oven is powered off, continuously curing for 20h under the conditions of the temperature of 25-30 ℃ and the relative humidity of 30-70 percent and taking out.
The electronic product comprises a cavity 1, a through cavity 2, a blind cavity 3 and an electronic component 8, wherein the electronic component 8 is fastened in the cavity 1 through a screw, and a concave platform is arranged on the reverse side of the through cavity 3.
The encapsulating tool is divided into a blind cavity encapsulating tool and a through cavity encapsulating tool, the blind cavity encapsulating tool consists of a clamp body 4 and a base 5, the through cavity encapsulating tool consists of a clamp body 6 and a base 7, and the clamp body 4 and the clamp body 6 are made of polytetrafluoroethylene; the base 5 and the base 7 are made of stainless steel.
The contact surfaces of the clamp body 4 and the base 5 have the same overall dimension and are connected through countersunk screws; the contact surface of the clamp body 6 is consistent with the contact surface of the base serial number 7 in shape and size and is connected through a countersunk head screw.
The cavity filling and sealing tool is composed of a main body part and a flange part, the main body part is matched with the structural characteristics and the size of the cavity 2, the flange part is matched with the sunken platform, and screws are used for installing and fastening through threaded holes in the sunken platform on the back surface of the cavity.
Advantageous effects
1. Short process time and simple and convenient operation.
2. After curing and demolding, the cleaning process is greatly reduced, so that the use amount of the organic solvent is reduced, potential safety hazards in operation are eliminated, and the product quality and reliability are greatly improved.
3. After curing and demolding, the demolding time and the cleaning time are reduced, and the production efficiency is improved by 80%.
4. The tool is strong in impact resistance, convenient and fast to demold, capable of effectively occupying space and preventing rubber materials from overflowing, long in service life, 2/3 is reduced compared with an original method by using an organic solvent for organically cleaning the tool, and production cost is greatly reduced.
5. The encapsulating glue stock with excellent insulativity and impact resistance is prepared, the density is low, the fluidity is good, and the encapsulating performance and the safety of the product are improved.
6. And the cavity phenomenon after the sizing material is solidified is prevented by adjusting the technological parameters of the pressurizing and ball blowing.
Drawings
FIG. 1 is a process flow diagram of the present invention
FIG. 2 is a schematic diagram of an electronic product;
FIG. 3 is a schematic diagram of an electronic product;
FIG. 4 is a schematic structural view of a blind cavity potting tool of the present invention;
FIG. 5 is a left side view of FIG. 4;
FIG. 6 is a schematic structural view of a through-cavity potting tool of the present invention;
FIG. 7 is a left side view of FIG. 6;
reference numerals:
1-cavity, 2-through cavity, 3-blind cavity, 4-clamp body, 5-base, 6-clamp body, 7-base, 8-electronic component
Detailed Description
The technical solution of the present invention is further limited by the following specific embodiments, but the scope of the claims is not limited to the description.
(1) Pre-baking: mixing Fe2O3Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;
(2) preparing materials: weighing the organosilicon gel and Fe2O3Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;
(3) cleaning: cleaning the electronic component and the encapsulating tool;
(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;
(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;
(6) pressurizing and blowing balls: treating at gauge pressure below 0.092MPa for 10min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;
(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;
(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.
The organosilicone gel and Fe2O3The weight ratio of 254: 0.5.
the silicone gel is GN522A, GN522B, GN502M, GN 502N.
The mass ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.
During compounding, GN522A component is first weighed, GN522B component is added, the mixture is stirred quickly and evenly by an electric stirrer, and then GN502M, GN502N and prebaked Fe are added2O3Stirring for 2min, placing in a vacuum defoaming machine, and vacuumizing to minus 0.092MPa for 5 min.
The pre-drying temperature is 100 ℃, the time is 2hh, and after power failure, the temperature is naturally reduced to 25 ℃.
And (3) curing at 43 ℃ for 2h, and after the oven is powered off, continuously curing for 20h under the conditions of 25 ℃ and 30% of relative humidity and taking out.
Example 2
(1) Pre-baking: mixing Fe2O3Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;
(2) preparing materials: weighing the organosilicon gel and Fe2O3Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;
(3) cleaning: cleaning the electronic component and the encapsulating tool;
(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;
(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;
(6) pressurizing and blowing balls: treating at gauge pressure below 0.092MPa for 15min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;
(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;
(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.
The organosilicone gel and Fe2O3The weight ratio of 254: 1.
the silicone gel is GN522A, GN522B, GN502M, GN 502N.
The mass ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.
And vacuumizing to minus 0.092MPa and keeping for 5 min.
The pre-drying temperature is 110 ℃, the time is 3 hours, and after power failure, the temperature is naturally reduced to 30 ℃.
And (3) curing at 47 ℃ for 2h, and after the oven is powered off, continuously curing for 20h under the conditions of the temperature of 30 ℃ and the relative humidity of 70 percent and taking out.
Example 3
(1) Pre-baking: mixing Fe2O3Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;
(2) preparing materials: weighing the organosilicon gel and Fe2O3Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;
(3) cleaning: cleaning the electronic component and the encapsulating tool;
(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;
(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;
(6) pressurizing and blowing balls: treating at gauge pressure below 0.092MPa for 12min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;
(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;
(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.
The organosilicone gel and Fe2O3The weight ratio of 254: 0.8.
the silicone gel is GN522A, GN522B, GN502M, GN 502N.
The mass ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.
And vacuumizing to minus 0.092MPa and keeping for 5 min.
The pre-drying temperature is 105 ℃, the time is 2.5 hours, and after power failure, the temperature is naturally reduced to 28 ℃.
And (3) curing at 45 ℃ for 2h, and after the oven is powered off, continuously curing for 20h under the conditions of 28 ℃ and 50% of relative humidity and taking out.
In the embodiment 1-3, the tool is sprayed with the aerial fog release agent, and a static lubricant film layer is generated due to adsorption, so that the friction force between a polymer and processing equipment is reduced, a remarkable demoulding effect is generated, the surface smoothness of the tool made of special materials is improved, and the tool is protected from being damaged; by preparing the encapsulating rubber material with excellent insulativity and impact resistance, the viscosity is low, the fluidity is good, and the encapsulating performance and the safety of the product are improved.
Example 4
The utility model provides an electronic product embedment frock, including cavity 1, logical chamber 2, blind chamber 3, electronic component 8 in the electronic product, electronic component 8 passes through the screw fastening in cavity 1, leads to 3 reverse sides in chamber and is provided with sunken platform.
The encapsulating tool is a blind cavity encapsulating tool and consists of a clamp body 4 and a base 5, wherein the clamp body 4 is made of polytetrafluoroethylene; the base 5 is made of stainless steel.
The contact surfaces of the clamp body 4 and the base 5 have the same overall dimension and are connected through countersunk screws;
example 5
The utility model provides an electronic product embedment frock, including cavity 1, logical chamber 2, blind chamber 3, electronic component 8 in the electronic product, electronic component 8 passes through the screw fastening in cavity 1, leads to 3 reverse sides in chamber and is provided with sunken platform.
The filling and sealing tool is divided into a through cavity filling and sealing tool, the through cavity filling and sealing tool is composed of a clamp body 6 and a base 7, and the clamp body 6 is made of polytetrafluoroethylene; the base 7 is made of stainless steel.
The contact surface of the clamp body 6 and the base 7 has the same overall dimension and is connected through a countersunk head screw.
The clamp bodies 4 and 6 are made of non-metallic materials such as polytetrafluoroethylene, so that the effects of static electricity prevention and insulation can be achieved, and meanwhile, the strength is high, and the corrosion resistance is high
Stainless steel material is selected for use to base 5 and base 7, and intensity is high, and corrosion resistance is strong, and is difficult for rustting, reduces the bonding volume of sizing material on the frock simultaneously, is convenient for the drawing of patterns and gets rid of the sizing material.
Through adopting the scheme of implementing 4 and embodiment 6, the embedment frock of preparation is strong to shock resistance, and the drawing of patterns is convenient, has effectually played the effect of taking place and preventing the sizing material overflow, frock long service life.
Example 6
In some embodiments, the cavity filling and sealing tool is composed of a main body part and a flange part, the main body part is matched with the structural characteristics and the size of the cavity 2, the flange part is matched with the sunken platform, and screws are used for installing and fastening through threaded holes in the sunken platform on the back surface of the cavity.
It should be noted that the above examples and test examples are only for further illustration and understanding of the technical solutions of the present invention, and are not to be construed as further limitations of the technical solutions of the present invention, and the invention which does not highlight essential features and significant advances made by those skilled in the art still belongs to the protection scope of the present invention.
Claims (10)
1. An electronic product encapsulating method is characterized by comprising the following steps:
(1) pre-baking: mixing Fe2O3Placing the mixture in a mortar for full grinding, placing the mixture in an infrared drying oven or a baking oven for pre-baking, and keeping the temperature for later use;
(2) preparing materials: weighing the organosilicon gel and Fe2O3Uniformly mixing, and then placing in a vacuum defoaming machine for vacuumizing to obtain a sizing material;
(3) cleaning: cleaning the electronic component and the encapsulating tool;
(4) installing an encapsulating tool: coating a spraying aerosol release agent on the peripheral wall of the main body part of the encapsulating tool, and installing the encapsulating tool in an electronic product;
(5) encapsulating: placing the electronic product on an adjusted platform, and injecting the prepared rubber material into the product from one direction;
(6) pressurizing and blowing balls: treating under gauge pressure of 0.092MPa for 10-15 min, standing for 20min, and blowing surface bubbles with a blowing ball while standing;
(7) and (3) curing: putting the encapsulated product into an infrared oven for curing;
(8) demolding: and demolding, disassembling the tool and cleaning the adhesive on the tool.
2. The method for encapsulating electronic products according to claim 1, wherein the method further comprisesThe organosilicone gel and Fe2O3The weight ratio of 254: (0.5-1).
3. The method for encapsulating electronic products according to claim 1, wherein the silicone gel is GN522A, GN522B, GN502M, GN 502N.
4. The method for encapsulating electronic products according to claim 2, wherein the weight ratio of GN522A: GN522B: GN502M: GN502N is 50g:4g:100g:100 g.
5. The method for encapsulating and sealing the electronic product according to claim 1, wherein the pre-drying temperature is 100 ℃ to 110 ℃ and the time is 2h to 3h, and after the power failure, the temperature is naturally reduced to 25 ℃ to 30 ℃.
6. The method for encapsulating and sealing the electronic product according to claim 1, wherein the curing is carried out at a temperature of (45 ± 2 ℃) for 2 hours, and after the oven is powered off, the curing is carried out for 20 hours under the conditions that the temperature is 25 ℃ to 30 ℃ and the relative humidity is 30% to 70%.
7. The electronic product potting method according to claim 1, wherein the electronic product comprises a cavity 1, a through cavity 2, a blind cavity 3 and an electronic component 8, the electronic component 8 is fastened in the cavity 1 by a screw, and a recessed platform is arranged on the reverse side of the through cavity 3.
8. The encapsulating tool for the electronic product is characterized by being divided into a blind cavity encapsulating tool and a through cavity encapsulating tool, wherein the blind cavity encapsulating tool consists of a clamp body 4 and a base 5, the through cavity encapsulating tool consists of a clamp body 6 and a base 7, and the clamp body 4 and the clamp body 6 are made of polytetrafluoroethylene; the base 5 and the base 7 are made of stainless steel.
9. The electronic product potting tool of claim 8, wherein the contact surfaces of the clamp body 4 and the base 5 have the same physical dimensions and are connected by countersunk screws; the contact surface of the clamp body 6 is consistent with the contact surface of the base serial number 7 in shape and size and is connected through a countersunk head screw.
10. The electronic product potting tool of claim 1, wherein the through cavity potting tool is comprised of a main body portion and a flange portion, the main body portion matches with the through cavity 2 in terms of structural characteristics and dimensions, the flange portion matches with the recessed platform, and the flange portion is mounted and fastened with screws through threaded holes in the recessed platform on the back side of the cavity.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311454A (en) * | 2021-12-03 | 2022-04-12 | 西安电子工程研究所 | High overload vibration resistant encapsulating device and encapsulating method for missile-borne electronic equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0470396A2 (en) * | 1990-08-07 | 1992-02-12 | Delphi Automotive Systems Deutschland GmbH | Mould |
| DE19731579A1 (en) * | 1997-07-23 | 1999-01-28 | Wolfcraft Gmbh | Clamping tool, especially clamp, vice or table |
| CN103633528A (en) * | 2013-11-22 | 2014-03-12 | 北京机械设备研究所 | Potting process method for electric connector potting adhesive |
| CN204243441U (en) * | 2014-12-08 | 2015-04-01 | 贵州航天电子科技有限公司 | A kind of circular electric connector socket embedding frock |
| CN105965738A (en) * | 2016-06-03 | 2016-09-28 | 西安北方光电科技防务有限公司 | Pouring method for pouring molding of special-shaped coil former |
| CN107900930A (en) * | 2017-10-12 | 2018-04-13 | 重庆长安工业(集团)有限责任公司 | A kind of multi-functional embedding solidification equipment |
| CN109490755A (en) * | 2018-11-29 | 2019-03-19 | 贵州航天电子科技有限公司 | A kind of microwave circuit functions of modules test fixture and application method |
| CN109590159A (en) * | 2018-11-05 | 2019-04-09 | 贵州航天电子科技有限公司 | A kind of electronic product encapsulation device and method |
| CN110948753A (en) * | 2019-11-05 | 2020-04-03 | 新乡航空工业(集团)有限公司 | Manufacturing method of encapsulation mold |
-
2020
- 2020-12-12 CN CN202011453745.5A patent/CN112720969A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0470396A2 (en) * | 1990-08-07 | 1992-02-12 | Delphi Automotive Systems Deutschland GmbH | Mould |
| DE19731579A1 (en) * | 1997-07-23 | 1999-01-28 | Wolfcraft Gmbh | Clamping tool, especially clamp, vice or table |
| CN103633528A (en) * | 2013-11-22 | 2014-03-12 | 北京机械设备研究所 | Potting process method for electric connector potting adhesive |
| CN204243441U (en) * | 2014-12-08 | 2015-04-01 | 贵州航天电子科技有限公司 | A kind of circular electric connector socket embedding frock |
| CN105965738A (en) * | 2016-06-03 | 2016-09-28 | 西安北方光电科技防务有限公司 | Pouring method for pouring molding of special-shaped coil former |
| CN107900930A (en) * | 2017-10-12 | 2018-04-13 | 重庆长安工业(集团)有限责任公司 | A kind of multi-functional embedding solidification equipment |
| CN109590159A (en) * | 2018-11-05 | 2019-04-09 | 贵州航天电子科技有限公司 | A kind of electronic product encapsulation device and method |
| CN109490755A (en) * | 2018-11-29 | 2019-03-19 | 贵州航天电子科技有限公司 | A kind of microwave circuit functions of modules test fixture and application method |
| CN110948753A (en) * | 2019-11-05 | 2020-04-03 | 新乡航空工业(集团)有限公司 | Manufacturing method of encapsulation mold |
Non-Patent Citations (4)
| Title |
|---|
| 吴清等: "《物理药剂学》", 30 November 2019, 中国中医药出版社 * |
| 孙酣经: "《化工新材料产品及应用手册》", 31 January 2002, 中国石化出版社 * |
| 张华等: "《航天器电磁兼容性技术》", 31 March 2018, 北京理工大学出版社 * |
| 曹云来: "《密封胶》", 30 September 2001, 化学工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311454A (en) * | 2021-12-03 | 2022-04-12 | 西安电子工程研究所 | High overload vibration resistant encapsulating device and encapsulating method for missile-borne electronic equipment |
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