CN110948753A - Manufacturing method of encapsulation mold - Google Patents
Manufacturing method of encapsulation mold Download PDFInfo
- Publication number
- CN110948753A CN110948753A CN201911073913.5A CN201911073913A CN110948753A CN 110948753 A CN110948753 A CN 110948753A CN 201911073913 A CN201911073913 A CN 201911073913A CN 110948753 A CN110948753 A CN 110948753A
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- China
- Prior art keywords
- mold
- product
- manufacturing
- silicon rubber
- encapsulating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention belongs to the field of mechanical structure design. Relates to a manufacturing method of an encapsulation mold, which is characterized by comprising the following specific steps: step 1: blending and curing the silicon rubber material according to the use parameters of the silicon rubber material; step 2: manufacturing a filling and sealing sample piece with the same size as the product after filling and sealing; and step 3: performing reverse molding on the silicon rubber material to obtain a customized encapsulation mold; and 4, step 4: and (5) encapsulating the product by using an encapsulating mold and an encapsulating adhesive material. By adopting the method, the customized encapsulation of the product can be realized, the coating scratch of the product caused by reprocessing of the product is avoided, the consistency of the encapsulated product is ensured, the processing cost of the die is reduced, the reuse rate of the tool is improved, the production efficiency and the application range of the pouring sealant are improved, and the production delay is avoided.
Description
Technical Field
The invention belongs to the field of mechanical structure design and encapsulation molds, particularly relates to an encapsulation mold design and a normal encapsulation method thereof, and particularly relates to a winding or component encapsulation mold and an encapsulation method thereof.
Background
The product is subjected to epoxy resin encapsulation treatment, so that the integrity is strengthened, direct exposure of elements and windings is avoided, the impact resistance can be improved, the insulation between the windings is enhanced, and the waterproof and moistureproof capabilities of the product are improved. Because of the influence of factors such as materials, processes and the like, the direct encapsulation precision is not high, and the mode of firstly encapsulating and then cutting is generally adopted. By adopting the mode, a compact thin layer between the labels of the potting parts can be damaged, the moisture resistance and the surface voltage resistance of the potting parts are influenced, and the tooling cost and the production cost are increased. The metal combined encapsulation mold has gaps, so that the end face of an encapsulated product is not flat, and bubbles exist inside the encapsulated product. The pouring sealant is bonded with nylon and metal mold materials into a whole after contacting, so that the pouring sealant cannot be detached, and the surface coating of the part is damaged after cutting.
Disclosure of Invention
The purpose of the invention is: the method for designing the encapsulating mold is reasonable in design and high in precision; in order to solve the technical problem of product encapsulation.
In order to solve the technical problem, the technical scheme of the invention is as follows: the manufacturing method of the encapsulating mold is characterized by comprising the following specific steps of: step 1: blending and curing the silicon rubber material according to the use parameters of the silicon rubber material; step 2: manufacturing a filling and sealing sample piece with the same size as the product after filling and sealing; and step 3: performing reverse molding on the silicon rubber material to obtain a customized encapsulation mold; and 4, step 4: and (5) encapsulating the product by using an encapsulating mold and an encapsulating adhesive material.
The specific operation of the step 3 is as follows; the method comprises the following steps: 1) preparing a silicon rubber material, a curing agent, a measuring cup and an electronic scale; 2) glue mixing: respectively weighing silicon rubber and a curing agent according to the using parameter blending proportion of the silicon rubber material, pouring the curing agent into the silicon rubber, stirring and mixing for not less than 3 minutes, standing and discharging bubbles for 5-10 minutes; 3) manufacturing an insulating paper mold: manufacturing an insulating paper mould with the same shape as the encapsulation sample piece by using insulating paper, and bonding all gaps of the insulating paper mould by using a paper tape; 4) encapsulating: placing the encapsulation sample piece in the middle of an insulating paper mold, wherein the front surface of the encapsulation sample piece faces downwards, pouring the prepared silicon rubber liquid into the insulating paper mold, and the silicon rubber liquid is 5-10mm higher than the encapsulation sample piece; 5) standing and bubble discharging: puncturing the bubbles floating out of the silicone rubber liquid; 6) naturally drying: standing for 4-5 hours, and naturally drying; 7) demolding: and (4) after the insulating paper mold is dried, peeling off the insulating paper mold, taking out the filling and sealing sample piece, and manufacturing the filling and sealing mold. The excircle of the insulating paper mould is 5-10mm larger than the encapsulation sample piece. The height of the insulating paper mould is 15-20mm greater than that of the filling and sealing sample piece. And trimming edges after the encapsulation mold is manufactured.
The specific operation of step 4 is as follows: 1) preparing an epoxy resin material, an encapsulating mold, a measuring cup and an electronic scale; 2) glue mixing: respectively weighing the epoxy resin adhesive and the curing agent according to the use parameter blending proportion of the epoxy resin material, pouring the curing agent into the epoxy resin adhesive, and stirring and mixing for not less than 3 minutes; 3) standing and bubble discharging: removing bubbles for at least 10 minutes, and skimming the bubbles floating out of the epoxy resin glue solution; 4) encapsulating: putting the product into a filling and sealing mold, and pouring the prepared epoxy resin glue solution into the filling and sealing mold; 5) standing and bubble discharging: piercing the bubbles floating out of the epoxy resin glue solution; 6) naturally drying: standing for 4-5 hours, and naturally drying; 7) demolding: and taking out the product in the encapsulating mold.
And 4) adjusting the pouring speed of the epoxy resin glue solution according to the complexity of the internal mechanism of the product in the step 4), wherein the more complex the internal mechanism of the product is, the slower the pouring speed is. Including the process of trimming product edge burrs.
The invention has the technical effects that: by adopting the method, the customized encapsulation of the product can be realized, the coating scratch of the product caused by reprocessing of the product is avoided, the consistency of the encapsulated product is ensured, the processing cost of the die is reduced, the reuse rate of the tool is improved, the production efficiency and the application range of the pouring sealant are improved, and the production delay is avoided.
Drawings
FIG. 1 is a flow chart of the present invention.
Fig. 2 is a flow chart of potting mold fabrication.
Fig. 3 is a flow chart of the manufacturing of the insulating paper mold.
Detailed Description
The invention is further illustrated with reference to the following figures and examples:
the coil is generally a ring-shaped wire winding, and the coil is wound on an iron core according to technical parameter requirements, and is defined as a stator assembly or a rotor assembly according to different motor mechanisms. Because the requirements on the flame retardance, the insulativity and the safety of the product are higher and higher, the product is encapsulated by epoxy resin. The components are usually welded on the circuit board, and after the components are welded, the received signals are prevented from changing due to displacement, and meanwhile, the product insulation performance is improved, so that the components are encapsulated by epoxy resin.
Taking winding encapsulation as an example, a coil is wound on an iron core according to technical parameter requirements, an enameled wire is not allowed to be scratched during winding and coil off, and winding insulation inspection is performed before encapsulation to prevent the enameled wire from being scratched, so that a product is scrapped after encapsulation. The metal combined encapsulation mold has gaps, so that the end face of an encapsulated product is not flat, and bubbles exist inside the encapsulated product. The pouring sealant is bonded with nylon and metal mold materials into a whole after contacting, so that the pouring sealant cannot be detached, and the surface coating of the product is damaged after cutting.
The steps of the encapsulating and manufacturing process of the product are as follows: 1) preparing a filling and sealing sample piece: processing a sample piece which is consistent with the shape and the size of the product after encapsulation by using an aluminum material; 2) manufacturing an insulating paper mold: preparing insulating paper, cutting the insulating paper to be consistent with the shape of the encapsulation sample piece, wherein the excircle of the insulating paper is 5-10mm larger than the encapsulation sample piece, the height of the insulating paper is 15-20mm larger than the encapsulation sample piece, bonding the gap of the insulating paper by using a paper tape, and trimming the edge of an insulating paper mold; 3) glue mixing: mixing silicon rubber and a curing agent according to the weight ratio of 100 g: 2 ml, pouring the curing agent into the silicon rubber liquid, mixing and stirring for 3 minutes, and standing for 5-10 minutes; 4) encapsulating: putting the encapsulation sample piece into the middle of an insulating paper mold with the front surface facing downwards, pouring silicon rubber liquid from one side of the insulating paper mold, wherein the silicon rubber liquid is 5-10mm higher than the encapsulation sample piece; 5) standing and bubble discharging: puncturing the bubbles floating out of the silicone rubber liquid; 6) naturally drying: standing for 4-5 hours, and naturally drying; 7) demolding: after the insulating paper mould is dry, peel off the insulating paper mould, take out embedment appearance spare, make the embedment mould, 8) glue mixing: selecting epoxy resin glue (9311T) A: B according to a weight ratio of 2: 1 proportion, mixing and stirring the glue solution for not less than 3 minutes; 9) standing and bubble discharging: removing bubbles for at least 10 minutes, and skimming the bubbles floating out of the epoxy resin glue solution; 10) encapsulating: putting the product into a potting mold, pouring the prepared epoxy resin glue solution into the potting mold from one side, and reducing the pouring speed of the glue solution; 11) standing and bubble discharging: piercing the bubbles floating out of the epoxy resin glue solution; 12) naturally drying: standing for 4-5 hours, and naturally drying; 13) demolding: and taking out the product in the encapsulation mold, and trimming burrs at the edge of the encapsulation product.
The product is subjected to epoxy resin encapsulation treatment, so that the integrity is strengthened, direct exposure of elements and windings is avoided, the impact resistance can be improved, the insulation between the windings is enhanced, and the waterproof and moistureproof capabilities of the product are improved. Because of the influence of factors such as materials, processes and the like, the direct encapsulation precision is not high, and the mode of firstly encapsulating and then cutting is generally adopted. By adopting the mode, a compact thin layer between the labels of the potting parts can be damaged, the moisture resistance and the surface voltage resistance of the potting parts are influenced, and the tooling cost and the production cost are increased. Silica gel material can be according to product appearance customization mould as embedment mould material, and the mould has the elasticity and dismantles long and the cost of saving mould processing when convenient, guarantees the uniformity behind the product embedment.
The invention belongs to the field of mechanical structure design, and relates to a method for designing an encapsulation mold.
By adopting the method, the customized encapsulation of the product can be realized, the consistency of the product is ensured, the processing cost of the mould is reduced, the production efficiency and the application range of the encapsulation adhesive are improved, and the production delay is avoided.
Claims (8)
1. The manufacturing method of the encapsulating mold is characterized by comprising the following specific steps of: step 1: blending and curing the silicon rubber material according to the use parameters of the silicon rubber material; step 2: manufacturing a filling and sealing sample piece with the same size as the product after filling and sealing; and step 3: performing reverse molding on the silicon rubber material to obtain a customized encapsulation mold; and 4, step 4: and (5) encapsulating the product by using an encapsulating mold and an encapsulating adhesive material.
2. The method for manufacturing a potting mold as defined in claim 1, wherein step 3 is specifically performed as follows; the method comprises the following steps: 1) preparing a silicon rubber material, a curing agent, a measuring cup and an electronic scale; 2) glue mixing: respectively weighing silicon rubber and a curing agent according to the using parameter blending proportion of the silicon rubber material, pouring the curing agent into the silicon rubber, stirring and mixing for not less than 3 minutes, standing and discharging bubbles for 5-10 minutes; 3) manufacturing an insulating paper mold: manufacturing an insulating paper mould with the same shape as the encapsulation sample piece by using insulating paper, and bonding all gaps of the insulating paper mould by using a paper tape; 4) encapsulating: placing the encapsulation sample piece in the middle of an insulating paper mold, wherein the front surface of the encapsulation sample piece faces downwards, pouring the prepared silicon rubber liquid into the insulating paper mold, and the silicon rubber liquid is 5-10mm higher than the encapsulation sample piece; 5) standing and bubble discharging: puncturing the bubbles floating out of the silicone rubber liquid; 6) naturally drying: standing for 4-5 hours, and naturally drying; 7) demolding: and (4) after the insulating paper mold is dried, peeling off the insulating paper mold, taking out the filling and sealing sample piece, and manufacturing the filling and sealing mold.
3. The manufacturing method of the potting mold as set forth in claim 2, wherein the outer circumference of the insulating paper mold is 5-10mm larger than the potting sample.
4. The method of manufacturing a potting mold of claim 2, wherein the height of the insulating paper mold is 15-20mm greater than the height of the potting sample.
5. The method of manufacturing a potting mold of claim 2, wherein edge trimming is performed after the potting mold is manufactured.
6. The method for manufacturing the potting mold according to claim 2, wherein the specific operation of step 4 is as follows: 1) preparing an epoxy resin material, an encapsulating mold, a measuring cup and an electronic scale; 2) glue mixing: respectively weighing the epoxy resin adhesive and the curing agent according to the use parameter blending proportion of the epoxy resin material, pouring the curing agent into the epoxy resin adhesive, and stirring and mixing for not less than 3 minutes; 3) standing and bubble discharging: removing bubbles for at least 10 minutes, and skimming the bubbles floating out of the epoxy resin glue solution; 4) encapsulating: putting the product into a filling and sealing mold, and pouring the prepared epoxy resin glue solution into the filling and sealing mold; 5, standing and bubble discharging: piercing the bubbles floating out of the epoxy resin glue solution; 6, natural drying: standing for 4-5 hours, and naturally drying; and 7, demolding: and taking out the product in the encapsulating mold.
7. The method for manufacturing the potting mold according to claim 6, wherein the epoxy resin glue in the step 4) is poured at a speed adjusted according to the complexity of the internal mechanism of the product, and the more complicated the internal mechanism of the product, the slower the pouring speed.
8. The method of manufacturing a potting mold of claim 6, comprising a process of trimming product edge flash.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911073913.5A CN110948753A (en) | 2019-11-05 | 2019-11-05 | Manufacturing method of encapsulation mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911073913.5A CN110948753A (en) | 2019-11-05 | 2019-11-05 | Manufacturing method of encapsulation mold |
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| Publication Number | Publication Date |
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| CN110948753A true CN110948753A (en) | 2020-04-03 |
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| CN201911073913.5A Pending CN110948753A (en) | 2019-11-05 | 2019-11-05 | Manufacturing method of encapsulation mold |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111823697A (en) * | 2020-07-28 | 2020-10-27 | 李强 | Epoxy resin seal cutting art seal copying process |
| CN112720969A (en) * | 2020-12-12 | 2021-04-30 | 贵州航天电子科技有限公司 | Encapsulating tool and encapsulating method for electronic product |
| CN112999516A (en) * | 2021-04-07 | 2021-06-22 | 丹源医学科技(杭州)有限公司 | Surgical suture curved hole structure of implant device and forming method thereof |
| CN114474529A (en) * | 2021-12-29 | 2022-05-13 | 丹源医学科技(杭州)有限公司 | Preparation method of implantable pulse generator connector |
-
2019
- 2019-11-05 CN CN201911073913.5A patent/CN110948753A/en active Pending
Non-Patent Citations (2)
| Title |
|---|
| 王细洋: "《现代制造技术》", 31 August 2017, 国防工业出版社 * |
| 苏天德: "硅橡胶模具在灌封工艺中的应用研究", 《机电元件》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111823697A (en) * | 2020-07-28 | 2020-10-27 | 李强 | Epoxy resin seal cutting art seal copying process |
| CN112720969A (en) * | 2020-12-12 | 2021-04-30 | 贵州航天电子科技有限公司 | Encapsulating tool and encapsulating method for electronic product |
| CN112999516A (en) * | 2021-04-07 | 2021-06-22 | 丹源医学科技(杭州)有限公司 | Surgical suture curved hole structure of implant device and forming method thereof |
| CN114474529A (en) * | 2021-12-29 | 2022-05-13 | 丹源医学科技(杭州)有限公司 | Preparation method of implantable pulse generator connector |
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Application publication date: 20200403 |
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