CN112711929B - Blind groove glue overflow control method and device, electronic equipment and storage medium - Google Patents
Blind groove glue overflow control method and device, electronic equipment and storage medium Download PDFInfo
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- CN112711929B CN112711929B CN202110063560.1A CN202110063560A CN112711929B CN 112711929 B CN112711929 B CN 112711929B CN 202110063560 A CN202110063560 A CN 202110063560A CN 112711929 B CN112711929 B CN 112711929B
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- 239000003292 glue Substances 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000003860 storage Methods 0.000 title claims abstract description 15
- 238000004364 calculation method Methods 0.000 claims description 36
- 239000000945 filler Substances 0.000 claims description 11
- 239000006071 cream Substances 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 description 27
- 230000001070 adhesive effect Effects 0.000 description 27
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/33—Design verification, e.g. functional simulation or model checking
- G06F30/3308—Design verification, e.g. functional simulation or model checking using simulation
Abstract
The invention discloses a blind groove glue overflow control method and device, electronic equipment and a storage medium, and relates to the technical field of circuit boards. According to the blind groove glue overflow control method provided by the invention, the volume of the line is calculated by obtaining the line size, the glue filling volume required for filling the line gap is calculated according to the volume of the line, and the number of bonding sheets is calculated according to the glue filling volume. And obtaining the gumming length of the single bonding sheet, and calculating the slotting size of the bonding sheet according to the number of the bonding sheets, the gumming length of the single bonding sheet and the size of the blind slot. According to the embodiment of the invention, through the method, a relation model of parameters such as the line size, the line plate size, the bonding sheet thickness, the bonding sheet glue content, the blind groove size and the like and the grooving size of the bonding sheet is established, and then the grooving size of the bonding sheet in the blind groove area is accurately calculated by combining the requirements of the circuit board product on the gummosis length (the gummosis length of a single bonding sheet), so that the gummosis length of the blind groove after the circuit board product is manufactured is in a controllable range, and the gummosis of the blind groove is accurately controlled.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a blind groove glue overflow control method, a blind groove glue overflow control device, electronic equipment and a storage medium.
Background
In recent years, with the rapid development of the electronic industry, the demand of circuit boards is increasing. Various circuit board products in the market are more and more, the structure is more and more complex, and part of circuit board products are required to be provided with blind grooves in the circuit board for saving space, so that devices are placed in the blind grooves. The adhesive sheet is adopted at present, but the adhesive length is difficult to accurately control, and particularly, the adhesive length of the adhesive sheet cannot be accurately predicted and controlled, so that the accurate prediction of the overflow adhesive of the blind groove products cannot be realized.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a blind groove glue overflow control method, a blind groove glue overflow control device, electronic equipment and a storage medium, and the blind groove glue overflow can be accurately controlled.
According to an embodiment of the first aspect of the present invention, a blind groove is provided on a circuit board, and a circuit is arranged on the circuit board, and the method includes:
calculating the volume of the line;
calculating the glue filling volume according to the volume of the circuit;
calculating the number of bonding sheets according to the filler volume;
obtaining the gumming length of a single bonding sheet;
and calculating the slotting size of the bonding sheets according to the number of the bonding sheets and the gumming length of each bonding sheet.
The blind groove glue overflow control method provided by the embodiment of the invention has at least the following beneficial effects:
according to the blind groove glue overflow control method provided by the embodiment of the invention, the volume of a circuit is calculated by obtaining the size of the circuit, the glue filling volume required for filling the gap of the circuit is calculated according to the size of the circuit, the size of the blind groove and the volume of the circuit, and the number of bonding sheets is calculated according to the glue filling volume. And obtaining the gumming length of the single bonding sheet, and calculating the slotting size of the bonding sheet according to the number of the bonding sheets, the gumming length of the single bonding sheet and the size of the blind slot. According to the embodiment of the invention, through the method, a relation model of parameters such as the line size, the line plate size, the bonding sheet thickness, the bonding sheet glue content, the blind groove size and the like and the grooving size of the bonding sheet is established, and then the grooving size of the bonding sheet in the blind groove area is accurately calculated by combining the requirements of the circuit board product on the gummosis length (the gummosis length of a single bonding sheet), so that the gummosis length of the blind groove after the circuit board product is manufactured is in a controllable range, and the gummosis of the blind groove is accurately controlled.
According to some embodiments of the invention, the line is a trapezoidal line, and the calculating the volume of the line includes:
acquiring the length of the upper bottom, the length of the lower bottom and the height of the trapezoid line;
calculating the volume of the trapezoid line according to the upper bottom length, the lower bottom length and the height of the trapezoid line;
the calculation formula of the volume of the trapezoid line is as follows:
V1＝(W1+W2)*H*L/2 (1)
wherein V1 is the volume of the trapezoid line, W1 is the length of the upper bottom of the trapezoid line, W2 is the length of the lower bottom of the trapezoid line, H is the height of the trapezoid line, and L is the length of the trapezoid line.
According to some embodiments of the invention, the calculating the filler volume from the volume of the line comprises:
acquiring the size of the circuit board and the size of the blind slot;
calculating the glue filling volume according to the size of the circuit board, the size of the blind groove and the volume of the circuit;
the calculation formula of the filling volume is as follows:
V2＝L1*L2*H-L3*L4*H-V1 (2)
wherein V2 is the volume of the filling glue, L1 is the length of the circuit board, L2 is the width of the circuit board, L3 is the length of the blind groove, and L4 is the width of the blind groove.
According to some embodiments of the invention, the calculation formula of the number of the bonding sheets is:
n＝n1+n2＝V2/(h1*a*b)+(H1-H)/h1 (3)
wherein n is the number of bonding sheets, n1 is the number of bonding sheets required for filling the line, n2 is the number of bonding sheets required for filling the cream layer, H1 is the thickness of a single Zhang Nianjie sheet, a is the area of the area except the blind slot, a=l1×l2-l3×l4, b is the glue content of a single Zhang Nianjie sheet, H1 is the thickness of the medium layer, and the height of the cream layer is H1-H.
According to some embodiments of the invention, the calculating the adhesive sheet slotting size according to the number of the adhesive sheets and the adhesive flow length of the single adhesive sheet comprises:
calculating the total gumming length according to the number of the bonding sheets and the gumming length of the single bonding sheet;
calculating the slotting size of the bonding sheet according to the total gumming length and the size of the blind slot, wherein the slotting size of the bonding sheet is equal to the sum of the size of the blind slot and the total gumming length;
the calculation formula of the total gummosis length is as follows:
L6＝n*L5＝[V2/(h1*a*b)+(H1-H)/h1]*L5 (4)
wherein L5 is the length of single Zhang Nianjie pieces of gummosis.
According to some embodiments of the invention, the method further comprises:
and milling the bonding sheet according to the grooving size of the bonding sheet so as to control glue overflow of the blind groove.
According to an embodiment of the second aspect of the present invention, a blind groove glue overflow control device, where the blind groove is disposed on a circuit board, and the circuit board is distributed with circuits, the device includes:
the first calculation module is used for calculating the volume of the circuit;
the second calculation module is used for calculating the glue filling volume according to the volume of the circuit;
the third calculation module is used for calculating the number of bonding sheets according to the filler volume;
the obtaining module is used for obtaining the gummosis length of the single bonding sheet;
and the fourth calculation module is used for calculating the slotting size of the bonding sheets according to the number of the bonding sheets and the gumming length of the single bonding sheet.
An electronic device according to an embodiment of a third aspect of the present invention includes:
at least one processor, and,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform:
the blind groove glue overflow control method according to the first aspect.
A computer-readable storage medium according to an embodiment of the fourth aspect of the present invention stores computer-executable instructions for causing a computer to execute:
the blind groove glue overflow control method according to the first aspect.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a front cross-sectional view of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic flow chart of a blind groove glue overflow control method according to an embodiment of the invention;
fig. 3 is a schematic flow chart of a blind groove glue overflow control method according to another embodiment of the invention;
fig. 4 is a top view of a circuit board according to another embodiment of the present invention;
fig. 5 is a schematic flow chart of a blind groove glue overflow control method according to another embodiment of the invention;
fig. 6 is a schematic structural diagram of a first daughter board according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a second daughter board according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a first sub-board after milling a blind slot according to an embodiment of the present invention;
FIG. 9 is a schematic structural view of an adhesive sheet according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a press-fit circuit board according to an embodiment of the invention;
fig. 11 is a schematic structural diagram of a circuit board product according to an embodiment of the present invention.
Reference numerals:
the circuit board 100, the blind groove 200, the circuit 300, the bonding sheet 400, the first sub-board 500, the second sub-board 600 and the solder resist 700.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
In the description of the present invention, the descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In recent years, with the rapid development of the electronic industry, the demand of circuit boards is increasing. Various circuit board products in the market are more and more, the structure is more and more complex, and part of circuit board products are required to be provided with blind grooves in the circuit board for saving space, so that devices are placed in the blind grooves. The adhesive sheet is adopted at present, but the adhesive length is difficult to accurately control, and particularly, the adhesive length of the adhesive sheet cannot be accurately predicted and controlled, so that the accurate prediction of the overflow adhesive of the blind groove products cannot be realized.
In the related art, the overflow of glue in the blind groove is caused by the fact that the size of the groove of the bonding sheet is not proper, so that the overflow of glue in the blind groove is caused to the bonding pad to influence the use of products. The bond pad slot size is mainly affected by the line dimensions, line height (i.e., copper thickness), bond pad thickness, bond pad gel content, etc. around the blind slot area. According to the embodiment of the invention, a relation model of parameters such as line size, line board size, bonding sheet thickness, bonding sheet glue content, blind groove size and the like and bonding sheet grooving size is established, and the grooving size of the bonding sheet in the blind groove area is accurately calculated by combining the requirements of the circuit board product on the gummosis length (single bonding sheet gummosis length), so that the gummosis length of the circuit board product after manufacturing is in a controllable range, and the gummosis of the blind groove is accurately controlled.
In a first aspect, an embodiment of the present invention provides a method for controlling glue overflow in a blind groove, where the blind groove is disposed on a circuit board (or PCB board), and the circuit board is wired with a circuit. As shown in fig. 1, a front cross-sectional view of the circuit board is shown. 100 is a circuit board, 200 is a blind slot, 300 is a circuit, and 400 is an adhesive sheet.
As shown in fig. 2, the method includes:
step S100: calculating the volume of the circuit;
step S200: calculating the glue filling volume according to the volume of the circuit;
step S300: calculating the number of bonding sheets according to the filler volume;
step S400: obtaining the gumming length of a single bonding sheet;
step S500: and calculating the slotting size of the bonding sheets according to the number of the bonding sheets and the gumming length of each bonding sheet.
In some embodiments, the blind groove glue overflow control method provided by the embodiment of the invention calculates the volume of the circuit by obtaining the size of the circuit, calculates the glue filling volume required for filling the gap of the circuit according to the volume of the circuit, and calculates the number of bonding sheets according to the glue filling volume. And obtaining the gumming length of the single bonding sheet, and calculating the slotting size of the bonding sheet according to the number of the bonding sheets, the gumming length of the single bonding sheet and the size of the blind slot. According to the embodiment of the invention, through the method, a relation model of parameters such as the line size, the line plate size, the bonding sheet thickness, the bonding sheet glue content, the blind groove size and the like and the grooving size of the bonding sheet is established, and then the grooving size of the bonding sheet in the blind groove area is accurately calculated by combining the requirements of the circuit board product on the gummosis length (the gummosis length of a single bonding sheet), so that the gummosis length of the blind groove after the circuit board product is manufactured is in a controllable range, and the gummosis of the blind groove is accurately controlled.
In some embodiments, the circuit is a trapezoid circuit, and correspondingly, as shown in fig. 3, step S100 includes:
step S110: acquiring the length of the upper bottom, the length of the lower bottom and the height of the trapezoid line;
step S120: and calculating the volume of the trapezoid line according to the upper bottom length, the lower bottom length and the height of the trapezoid line.
The calculation formula of the volume of the trapezoid line is as follows:
V1＝(W1+W2)*H*L/2 (1)
wherein V1 is the volume of the trapezoid line, W1 is the upper bottom length of the trapezoid line, W2 is the lower bottom length of the trapezoid line, H is the height of the trapezoid line, and L is the length of the trapezoid line.
In some embodiments, the circuit on the circuit board is a trapezoid circuit after etching, and then the volume=area×length of the trapezoid circuit, and the trapezoid area= (upper bottom length+lower bottom length) ×height/2. Thus, the volume v1= (w1+w2) ×h×l/2 of the trapezoid line.
It should be understood that the present embodiment is only used as an example of trapezoid, and other shapes of the etched circuit on the circuit board are possible, and the present embodiment is not limited thereto. The lines in fig. 1 are schematic only and do not represent square lines.
In some embodiments, step S200 includes:
obtaining the size of a circuit board and the size of a blind slot;
and calculating the glue filling volume according to the size of the circuit board, the size of the blind groove and the volume of the circuit.
The calculation formula of the filling volume is as follows:
V2＝L1*L2*H-L3*L4*H-V1 (2)
wherein V2 is the volume of the filling glue, L1 is the length of the circuit board, L2 is the width of the circuit board, L3 is the length of the blind groove, and L4 is the width of the blind groove.
In some embodiments, as shown in fig. 4, a top view of the circuit board is provided. L1 and L2 are the length and width of the finished circuit board, the volume of the blind groove is subtracted from the volume of the circuit board with the height H, and the volume of the circuit is subtracted, so that the glue filling volume required for glue filling is obtained. The volume of the circuit board of the part with the height of H=L1×L2×H, the volume of the blind groove=L3×L4×H, and the volume of the circuit is V1, the filler volume V2=L1×L2×H-L3×L4×H-V1.
In some embodiments, the calculation formula for the number of adhesive sheets is:
n＝n1+n2＝V2/(h1*a*b)+(H1-H)/h1 (3)
wherein n is the number of bonding sheets, n1 is the number of bonding sheets required for filling the line, n2 is the number of bonding sheets required for the cream layer, H1 is the thickness of a single Zhang Nianjie sheet, a is the area of the area except the blind slot, a=l1×l2-l3×l4, b is the glue content of a single Zhang Nianjie sheet, H1 is the thickness of the medium layer, and the height of the cream layer is H1-H.
In some embodiments, n is the total number of adhesive tabs required to fill the line of height H, n1 is the number of adhesive tabs required to fill the line, and n2 is the total number of adhesive tabs required to fill the creamer layer (creamer layer refers to the portion of the total height of adhesive tabs above the height of the line, and thus the height of the creamer layer is H1-H), then the total number of adhesive tabs required n=n1+n2. Further, since the filler volume v2=h1×b×n1×a, n1=v2/(h1×a×b). The number of adhesive sheets n2 = (H1-H)/H1 required for the cream layer, the total number of adhesive sheets n=n1+n2=v2/(h1×a) + (H1-H)/H1.
In some embodiments, the dimensions of the circuit board and the dimensions of the blind slot may be obtained from other devices or may be pre-stored values.
In some embodiments, as shown in fig. 5, step S500 includes:
step S510: calculating the total gumming length according to the number of the bonding sheets and the gumming length of the single bonding sheet;
step S520: and calculating the slotting size of the bonding sheet according to the total gumming length and the size of the blind slot, wherein the slotting size of the bonding sheet is equal to the sum of the size of the blind slot and the total gumming length.
The calculation formula of the total gummosis length is as follows:
L6＝n*L5＝[V2/(h1*a*b)+(H1-H)/h1]*L5 (4)
wherein L5 is the length of single Zhang Nianjie pieces of gummosis.
In some embodiments, the length L5 of the adhesive sheet may be obtained from other devices or may be a pre-stored value. The method for measuring the gumming length L5 of the single bonding sheet can be as follows: and taking a single bonding sheet, hollowing out the middle of the bonding sheet, coating color marks on the hollowing out area, determining the size of the hollowing out area according to the size of the blind groove, and measuring the gumming length L5 of gumming inwards in the hollowing out area after lamination.
In some embodiments, total flow length = individual bond sheet flow length x number of bond sheets, i.e., l6=n x l5 = [ V2/(h1 x a x b) + (H1-H)/H1 x L5. And calculating the sum of the size of the blind groove and the total gumming length to obtain the grooving size of the bonding sheet. The size of the blind groove is as follows: the length is L3, the width is L4, and then the slotting size of the bonding sheet is as follows: length is L3+L6 and width is L4+L6.
In some embodiments, the blind groove glue overflow control method further comprises:
and milling the bonding sheet according to the grooving size of the bonding sheet so as to control glue overflow of the blind groove.
In some embodiments, the middle areas of all the bonding sheets are milled to be empty according to the grooving sizes (the length is L3+L6 and the width is L4+L6) of the bonding sheets, and finally the total gummosis length after lamination is L6, so that the blind groove area is just reached, and the blind groove gummosis is accurately controlled.
The technical scheme of the invention is described below in a more complete embodiment:
the first step: as shown in fig. 6, after the core board is cut, a semi-gloss board is etched to form a first sub-board 500, and the circuit 300 is etched on the first sub-board 500.
And a second step of: as shown in fig. 7, the bottom surface of the core board is etched to form a light board as a second sub-board 600, and the circuit 300 is etched on the second sub-board 600.
And a third step of: as shown in fig. 8, the blind slot position of the first sub-board 500 is milled to be empty, the milling empty size is the blind slot size, and the milling empty size is the blind slot position.
Fourth step: as shown in fig. 9, the bonding sheet is milled to a size larger than the blind groove size by L6.
Fifth step: as shown in fig. 10, the first sub-board 500, the adhesive sheet 400, and the second sub-board 600 are laminated into the circuit board 100.
Sixth step: as shown in fig. 11, solder resist 700 is fabricated on the first sub-board 500 to form a circuit board finished product.
In combination with the above embodiment, the blind groove glue overflow control method provided by the invention calculates the volume of the line by obtaining the line size, calculates the glue filling volume required for filling the line gap according to the volume of the line, and calculates the number of bonding sheets according to the glue filling volume. And obtaining the gumming length of the single bonding sheet, and calculating the slotting size of the bonding sheet according to the number of the bonding sheets, the gumming length of the single bonding sheet and the size of the blind slot. According to the embodiment of the invention, through the method, a relation model of parameters such as the line size, the line plate size, the bonding sheet thickness, the bonding sheet glue content, the blind groove size and the like and the grooving size of the bonding sheet is established, and then the grooving size of the bonding sheet in the blind groove area is accurately calculated by combining the requirements of the circuit board product on the gummosis length (the gummosis length of a single bonding sheet), so that the gummosis length of the blind groove after the circuit board product is manufactured is in a controllable range, and the gummosis of the blind groove is accurately controlled.
In a second aspect, an embodiment of the invention provides a blind groove glue overflow control device. The blind groove related to the device is arranged on a circuit board (or a PCB) on which circuits are distributed. As shown in fig. 1, a front cross-sectional view of the circuit board is shown. 100 is a circuit board, 200 is a blind slot, 300 is a circuit, and 400 is an adhesive sheet.
The blind groove glue overflow control device comprises:
the first calculation module is used for calculating the volume of the circuit;
the second calculation module is used for calculating the glue filling volume according to the volume of the circuit;
the third calculation module is used for calculating the number of the bonding sheets according to the filler volume;
the obtaining module is used for obtaining the gummosis length of the single bonding sheet;
and the fourth calculation module is used for calculating the slotting size of the bonding sheets according to the number of the bonding sheets and the gumming length of each bonding sheet.
In some embodiments, the blind groove glue overflow control device comprises a first calculation module, a second calculation module, a third calculation module, an acquisition module and a fourth calculation module. The workflow of the first calculation module, the second calculation module, the third calculation module, the obtaining module, and the fourth calculation module refer to the related description of the blind groove glue overflow control method in the first aspect, and will not be repeated here.
In a third aspect, an embodiment of the present invention provides an electronic device, including:
at least one processor, and,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform:
the blind groove glue overflow control method according to the first aspect.
In some embodiments, the electronic device may be a mobile terminal device or a non-mobile terminal device. The mobile terminal equipment can be a mobile phone, a tablet personal computer, a notebook computer, a palm computer, a vehicle-mounted terminal equipment, wearable equipment, an ultra mobile personal computer, a netbook, a personal digital assistant and the like; the non-mobile terminal equipment can be a personal computer, a television, a teller machine, a self-service machine or the like; the embodiment of the present invention is not particularly limited.
In a fourth aspect, the present invention provides a computer-readable storage medium storing computer-executable instructions for causing a computer to perform:
the blind groove glue overflow control method according to the first aspect.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention. Furthermore, embodiments of the invention and features of the embodiments may be combined with each other without conflict.
Those of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Claims (4)
1. The blind groove glue overflow control method is characterized in that the blind groove is arranged on a circuit board, and circuits are distributed on the circuit board, and the method comprises the following steps:
calculating the volume of the line;
calculating the glue filling volume according to the volume of the circuit;
calculating the number of bonding sheets according to the filler volume;
obtaining the gumming length of a single bonding sheet;
calculating the slotting size of the bonding sheets according to the number of the bonding sheets and the gumming length of each bonding sheet;
wherein, the circuit is a trapezoidal circuit, the calculating the volume of the circuit includes:
acquiring the length of the upper bottom, the length of the lower bottom and the height of the trapezoid line;
calculating the volume of the trapezoid line according to the upper bottom length, the lower bottom length and the height of the trapezoid line;
the calculation formula of the volume of the trapezoid line is as follows:
V1=（W1+W2）*H*L/2（1）
wherein V1 is the volume of the trapezoid line, W1 is the length of the upper bottom of the trapezoid line, W2 is the length of the lower bottom of the trapezoid line, H is the height of the trapezoid line, and L is the length of the trapezoid line;
the calculating the filler volume according to the volume of the line comprises:
acquiring the size of the circuit board and the size of the blind slot;
calculating the glue filling volume according to the size of the circuit board, the size of the blind groove and the volume of the circuit;
the calculation formula of the filling volume is as follows:
V2=L1*L2*H-L3*L4*H-V1（2）
wherein V2 is the volume of the glue, L1 is the length of the circuit board, L2 is the width of the circuit board, L3 is the length of the blind groove, and L4 is the width of the blind groove;
the calculation formula of the number of the bonding sheets is as follows:
n=n1+n2=V2/（h1*a*b）+（H1-H）/h1（3）
wherein n is the number of bonding sheets, n1 is the number of bonding sheets required for filling the line, n2 is the number of bonding sheets required for filling the cream layer, H1 is the thickness of a single Zhang Nianjie sheet, a is the area of the area except the blind slot, a=L1, L2-L3, L4, b is the glue content of a single Zhang Nianjie sheet, H1 is the thickness of the medium layer, and the height of the cream layer is H1-H;
the calculating the slotting size of the bonding sheets according to the number of the bonding sheets and the gumming length of each bonding sheet comprises the following steps:
calculating the total gumming length according to the number of the bonding sheets and the gumming length of the single bonding sheet;
calculating the slotting size of the bonding sheet according to the total gumming length and the size of the blind slot, wherein the slotting size of the bonding sheet is equal to the sum of the size of the blind slot and the total gumming length;
the calculation formula of the total gummosis length is as follows:
L6=n*L5=[V2/（h1*a*b）+（H1-H）/h1 ]*L5（4）
wherein L5 is the length of a single Zhang Nianjie piece gummosis;
the method further comprises the steps of:
and milling the bonding sheet according to the grooving size of the bonding sheet so as to control glue overflow of the blind groove.
2. Blind groove glue overflow controlling means, its characterized in that, blind groove sets up on the circuit board, it has the circuit to distribute on the circuit board, the device includes:
the first calculation module is used for calculating the volume of the circuit;
the second calculation module is used for calculating the glue filling volume according to the volume of the circuit;
the third calculation module is used for calculating the number of bonding sheets according to the filler volume;
the obtaining module is used for obtaining the gummosis length of the single bonding sheet;
the fourth calculation module is used for calculating the slotting size of the bonding sheets according to the number of the bonding sheets and the gumming length of the single bonding sheet;
wherein, the circuit is a trapezoidal circuit, the calculating the volume of the circuit includes:
acquiring the length of the upper bottom, the length of the lower bottom and the height of the trapezoid line;
calculating the volume of the trapezoid line according to the upper bottom length, the lower bottom length and the height of the trapezoid line;
the calculation formula of the volume of the trapezoid line is as follows:
V1=（W1+W2）*H*L/2（1）
wherein V1 is the volume of the trapezoid line, W1 is the length of the upper bottom of the trapezoid line, W2 is the length of the lower bottom of the trapezoid line, H is the height of the trapezoid line, and L is the length of the trapezoid line;
the calculating the filler volume according to the volume of the line comprises:
acquiring the size of the circuit board and the size of the blind slot;
calculating the glue filling volume according to the size of the circuit board, the size of the blind groove and the volume of the circuit;
the calculation formula of the filling volume is as follows:
V2=L1*L2*H-L3*L4*H-V1（2）
wherein V2 is the volume of the glue, L1 is the length of the circuit board, L2 is the width of the circuit board, L3 is the length of the blind groove, and L4 is the width of the blind groove;
the calculation formula of the number of the bonding sheets is as follows:
n=n1+n2=V2/（h1*a*b）+（H1-H）/h1（3）
wherein n is the number of bonding sheets, n1 is the number of bonding sheets required for filling the line, n2 is the number of bonding sheets required for filling the cream layer, H1 is the thickness of a single Zhang Nianjie sheet, a is the area of the area except the blind slot, a=L1, L2-L3, L4, b is the glue content of a single Zhang Nianjie sheet, H1 is the thickness of the medium layer, and the height of the cream layer is H1-H;
the calculating the slotting size of the bonding sheets according to the number of the bonding sheets and the gumming length of each bonding sheet comprises the following steps:
calculating the total gumming length according to the number of the bonding sheets and the gumming length of the single bonding sheet;
calculating the slotting size of the bonding sheet according to the total gumming length and the size of the blind slot, wherein the slotting size of the bonding sheet is equal to the sum of the size of the blind slot and the total gumming length;
the calculation formula of the total gummosis length is as follows:
L6=n*L5=[V2/（h1*a*b）+（H1-H）/h1 ]*L5（4）
wherein L5 is the length of a single Zhang Nianjie piece gummosis;
and milling the bonding sheet according to the grooving size of the bonding sheet so as to control glue overflow of the blind groove.
3. An electronic device, comprising:
at least one processor, and,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform:
the blind groove glue overflow control method of claim 1.
4. A computer-readable storage medium storing computer-executable instructions for causing a computer to perform:
the blind groove glue overflow control method of claim 1.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339661A (en) * | 2006-06-13 | 2006-12-14 | Kaneka Corp | Manufacturing method of multilayer bonding sheet and flexible double-sided metal-clad laminate |
| CN107529292A (en) * | 2017-08-25 | 2017-12-29 | 深南电路股份有限公司 | A kind of random layer interconnection PCB preparation method |
| CN111295053A (en) * | 2020-03-31 | 2020-06-16 | 生益电子股份有限公司 | PCB (printed circuit board) with embedded heat conductor and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5978682B2 (en) * | 2012-03-19 | 2016-08-24 | 富士通株式会社 | Calculation method and calculation program |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339661A (en) * | 2006-06-13 | 2006-12-14 | Kaneka Corp | Manufacturing method of multilayer bonding sheet and flexible double-sided metal-clad laminate |
| CN107529292A (en) * | 2017-08-25 | 2017-12-29 | 深南电路股份有限公司 | A kind of random layer interconnection PCB preparation method |
| CN111295053A (en) * | 2020-03-31 | 2020-06-16 | 生益电子股份有限公司 | PCB (printed circuit board) with embedded heat conductor and preparation method thereof |
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