CN112703596A - 显示器制造中的发光结构对准保持 - Google Patents
显示器制造中的发光结构对准保持 Download PDFInfo
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- CN112703596A CN112703596A CN201980060523.6A CN201980060523A CN112703596A CN 112703596 A CN112703596 A CN 112703596A CN 201980060523 A CN201980060523 A CN 201980060523A CN 112703596 A CN112703596 A CN 112703596A
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- light emitting
- emitting structure
- backplane
- electrical contacts
- frame structures
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Abstract
公开了用于在背板上形成框架的技术,该框架包括至少部分地包围或包封背板上的金属触头的结构。在一些实施例中,框架可以包括光致抗蚀剂。框架的尺寸和结构完整性有助于防止在将发光结构键合到背板的过程中发光结构的物理突起的未对准和/或损坏。
Description
背景
现代电子设备(诸如虚拟现实(VR)、增强现实(AR)和/或混合现实(MR)设备)可能包括具有非常小的发光二极管(LED)的显示器。根据一些技术,这些显示器的制造可以包括将发光结构(包括一个或更多个LED)键合(bond)到背板或显示器基底。
概述
实施例通过利用在背板上形成框架的技术来解决这些和其他问题,该框架包括至少部分地包围(circumscribe)或包封(enclose)背板上的金属互连部(metalinterconnects)的结构。在一些实施例中,框架可以包括光致抗蚀剂。框架的尺寸和结构完整性有助于防止在键合过程中发光结构的物理突起(physical obtrusion)的未对准和/或损坏。
根据描述,制造显示器的示例方法包括提供背板,该背板包括平坦表面、耦合到平坦表面的第一组电触头(electrical contact)、以及耦合到平坦表面的一个或更多个框架结构,该一个或更多个框架结构至少部分地包封第一组电触头,并且被配置为在将发光结构键合到背板期间限制发光结构的至少一部分的移动。该方法还包括获得发光结构,该发光结构包括具有接触表面的半导体元件和耦合到接触表面的第二组电触头。该方法还包括将发光结构放置在背板上,使得第二组电触头中的每个电触头与第一组电触头中的相应电触头物理接触;以及将发光结构键合到背板,该键合包括加热发光结构和背板,并施加力以将发光结构压到背板。
根据描述,示例背板包括平坦表面、耦合到平坦表面的第一组电触头、以及背板表面上的一个或更多个框架结构,该一个或更多个框架结构至少部分地包封第一组电触头并被配置成在键合过程中与发光结构的半导体元件的表面物理接触,在该键合过程中,包括发光结构的一个或更多个触头的第二组电触头中的每个电触头与第一组触头中的相应电触头键合。
根据本发明的第一方面,提供了一种制造显示器的方法,该方法包括:提供背板,该背板包括:平坦表面;耦合到平坦表面的第一组电触头;以及耦合到平坦表面的一个或更多个框架结构,该一个或更多个框架结构至少部分地包封第一组电触头,并且被配置为在将发光结构键合到背板期间限制发光结构的至少一部分的移动;获得发光结构,该发光结构包括:具有接触表面的半导体元件;和耦合到接触表面的第二组电触头;将发光结构放置在背板上,使得第二组电触头中的每个电触头与第一组电触头中的相应电触头物理接触;以及将发光结构键合到背板,该键合包括:加热发光结构和背板;以及施加力以将发光结构压到背板。
在一些实施例中,“施加力以将发光结构压到背板”可以使得发光结构的半导体元件的表面与背板的一个或更多个框架结构物理接触。
在一些实施例中,一个或更多个框架结构可以包括光致抗蚀剂材料。
在一些实施例中,“施加力以将发光结构压到背板”可以包括使用与发光结构耦合的拾取放置头(pick-and-place head)施加力。
在一些实施例中,该方法还可以包括,在将发光结构键合到背板之前,在背板的表面上沉积底部填充层,其中将发光结构放置在背板上还包括使用与发光结构耦合的拾取放置头将发光结构至少部分地压入底部填充层中。
在一些实施例中,该方法还可以包括将发光结构从拾取放置头解耦,其中施加力以将发光结构压到背板包括使用压力施加工具向发光结构的发光表面施加压力。在压力施加工具的表面与发光结构的发光表面的物理接触之间的摩擦水平可以允许在将发光结构键合到背板期间在压力施加基底的表面和发光结构的发光表面之间的移动。压力施加工具可以包括玻璃或熔融石英。
底部填充层可以包括聚合物基材料。
在一些实施例中,一个或更多个框架结构可以从背板的表面延伸第一高度;发光结构还可以包括从半导体元件的表面延伸第二高度的台面;并且第一高度可以大于第二高度。
一个或更多个框架结构可以位于距第一组电触头一定距离处,以允许在将发光结构键合到背板期间发光结构和背板之间在平行于背板的表面的方向上的阈值量的移动。
一个或更多个框架结构可以包括多个分立的框架结构。
根据本发明的第二方面,提供了一种背板,该背板包括:平坦表面;耦合到平坦表面的第一组电触头;以及背板的表面上的一个或更多个框架结构,该一个或更多个框架结构至少部分地包封第一组电触头,并且被配置为在键合过程中与发光结构的半导体元件的表面物理接触,在该键合过程中包括发光结构的一个或更多个触头的第二组电触头中的每个电触头与第一组触头中的相应电触头键合。
一个或更多个框架结构可以包括光致抗蚀剂材料。
背板可以包括背板的表面上的底部填充层。
底部填充层的粘性(tackiness)可以允许在使用拾取放置头将发光结构至少部分地压入底部填充层中并且拾取放置头在远离背板的方向上移动之后,将发光结构从拾取放置头解耦。
在一些实施例中,一个或更多个框架结构可以从背板的表面延伸第一高度;并且第一高度可以被配置为超过发光结构的台面的第二高度,台面从发光结构的半导体元件的表面延伸第二高度。
一个或更多个框架结构可以位于距第一组电触头一定距离处,以允许在将发光结构键合到背板期间发光结构和背板之间在平行于背板的表面的方向上的阈值量的移动。
在一些实施例中,一个或更多个框架结构可以包括多个分立的框架结构。
第一组电触头可以包括一个或更多个电触头。
应当理解,在本发明的上下文中,第二方面的背板的任何特征可以与第一方面的方法兼容,并且包括第一方面的方法的特征,并且应当理解,在反过来的情况下,经过必要的修改,也同样可以成立。
附图简述
参考以下附图描述说明性实施例。
图1是根据实施例的显示器组装系统的简化图示。
图2A是根据实施例的发光结构的示意图的截面视图。
图2B是根据实施例的发光结构的透视图。
图3A-图3C是示出根据一个实施例的制造显示设备的过程的不同阶段的截面图。
图4A和图4B是在键合过程中发光结构和背板的截面图。
图5A和图5B是根据实施例的在键合过程中发光结构、背板和框架结构的截面视图。
图6A-图6E是简化的截面图,该简化的截面图示出了制造过程的替代实施例,该制造过程可以进一步降低键合期间横向移动的有害影响的可能性。
图7是根据实施例的制造显示器的方法的流程图。
图8是根据实施例的示例LED的截面视图。
附图仅出于说明的目的描绘了本公开的实施例。本领域技术人员从以下描述中将容易认识到,在不脱离本公开的原理或所推崇的益处的情况下,可以采用所示结构和方法的替代实施例。包括两个或三个相互正交的轴(例如,XY轴、XZ轴和/或XYZ轴)的坐标框架已经被包括在一些图中,以帮助说明这些图中所示的部件相对于其他图可以如何定向。
在附图中,相似的部件和/或特征可以具有相同的附图标记。此外,可以通过在附图标记之后用短划线和在相似部件之间进行区分的第二标记来区分相同类型的各个部件。如果说明书中仅使用第一附图标记,则该描述适用于具有相同第一附图标记的任何一个相似部件,而与第二附图标记无关。此外,在附图可以示出相同类型的多个部件和/或特征的情况下,在一些情况下,可以仅标记一部分部件和/或特征,以避免附图中的混乱。
详细描述
现在将参照附图描述几个说明性实施例,附图形成了说明书的一部分。虽然下面描述了可以实现本公开的一个或更多个方面的特定实施例,但是可以使用其他实施例,并且可以在不脱离本公开的范围或所附权利要求的精神的情况下进行各种修改。
在VR、MR、AR和/或类似显示器的制造过程中,可能会在键合过程中出现问题。例如,发光结构上的金属触头可能变得与背板上相应的金属互连部不对准。附加地或替代地,在键合过程中施加到发光结构和/或背板的压力可能损坏金属互连部上或金属互连部附近的发光结构的物理突起(例如,LED台面)。本文公开的实施例通过利用在背板上形成框架的技术来解决这些和其他问题,所述框架包括至少部分地包围或包封背板上的金属互连部的结构。
在本文中参考附图描述实施例,在附图中相似的参考数字表示相同或功能相似的元件。另外,在附图中,每个附图标记的最左边的数字对应于第一次使用该附图标记的附图。
如本文所用,微LED(micro-LED)(或“μLED”)可以指具有线性尺寸小于50μm、小于20μm或小于10μm的有效发光区域的LED。例如,线性尺寸可以小到2μm或4μm。如图2B所示和本文所述,发光结构可以包括多个μLED。
图1是根据一个实施例的显示器组装系统100的简化图示。显示器组装系统100通过拾取放置技术制造显示设备。具体而言,显示器组装系统100通过从载体基底(carriersubstrate)114拾取发光结构并将它们放置在目标基底(target substrate)118上来组装显示器,该发光结构可以包括微LED(μLED)。在一些实施例中,发光结构112是发射不同颜色的LED晶片(die)。在一些实施例中,发光结构112是具有减小的光输出发散和小的发光面积的不同颜色的μLED。载体基底114或“硬手柄(hard handle)”可以包括玻璃基底或类似结构,其保持发光结构112以供拾取放置阵列104拾取。拾取放置阵列104或拾取头可以被称为拾取放置头(PPH)阵列或拾取工具(PUT)。在其他实施例中,载体基底114可以包括其上生长发光结构112的原生基底(native substrate)。可选地,如下面进一步详细讨论的,发光结构112可以生长在制造基底上,并且经由粘合层115附着到载体基底114,在这种情况下,制造基底110可以被移除,并且粘合层115可以被(完全地或部分地)移除,以能够从载体基底114取出发光结构112。
目标基底118可以是背板,或者可以是便于与背板键合的中间载体基底。显示器组装系统100将发光结构112放置在背板的位置,然后将发光结构112键合到背板。如本文所使用的,术语“背板”和“显示器基底”用于描述如下基底:在显示器制造期间,一个或更多个发光结构112被放置和键合在该基底上。这样,背板可以为一个或更多个发光结构112提供物理支撑和电连接。
如所示出的,显示器组装系统100还包括拾取放置阵列104、致动器122、载体平台116和目标平台120。载体平台116保持具有一个或更多个发光结构112的载体基底114。目标平台120保持目标基底118,以从载体基底114接收一些或所有发光结构112。
控制器106可以(例如,经由致动器122)与拾取放置阵列104通信地耦合,并控制拾取放置阵列104的操作。例如,控制器106使拾取放置阵列104拾取位于载体基底114上的一个或更多个发光结构112,并将一个或更多个半导体器件放置在目标基底118上。除其他组件外,控制器106可包括存储器130和处理器128。存储器130存储用于操作拾取放置阵列104的指令。存储器130可以是任何存储器存储装置,例如SRAM、DRAM、ROM或任何其他计算机存储器存储装置。处理器128执行存储在存储器130中的指令,并且经由信号接口(未示出)将指令发送到拾取放置阵列104。处理器128可以使显示器组装系统100执行参考图13和图14进一步详细描述的方法。
拾取放置阵列104包括多个拾取头124。每个拾取头(PPH)124可以从载体基底114拾取发光结构112,并将半导体器件放置在目标基底118上。在拾取发光结构112之后,可以将PPH 124与目标基底118上的位置对准。
致动器122可以包括机电部件,如由处理器128根据存储在存储器130中的指令所执行的那样,该机电部件基于来自控制器106的指令来控制拾取放置阵列104的移动,并因此控制发光结构112从载体基底114转移并放置在目标基底118上。例如,致动器122可以以包括上下、左右和前后的三个自由度来移动拾取放置阵列104或单个PPH 124。在一些实施例中,拾取放置阵列104具有三个以上的自由度。例如,拾取放置阵列104可以具有六个自由度,允许上下、左右、和前后的横向运动以及沿着三个不同轴的旋转运动。致动器122可以被实施为例如旋转马达、线性马达或液压缸。
控制器106可以将一个或更多个PPH 124与目标基底118对准,并将附着到一个或更多个PPH 124的发光结构112放置在目标基底118上。
显示器组装系统100可以包括一个或更多个载体基底114。例如,不同的载体基底114可以承载不同颜色的LED晶片。载体基底114可以是保持用于转移到目标基底118的切单后的(singulated)发光结构112的载体膜。系统可以包括一个或更多个目标基底118。在一些实施例中,例如当目标基底118包括用于接收发光结构112的背板时,目标平台120可以包括加热器,用于在通过拾取放置阵列104将发光结构112放置在目标基底118上之后,将发光结构112的电触头焊盘导热键合到目标基底118。在其他实施例中,显示器组装系统100可以包括激光系统,用于在通过拾取放置阵列104将发光结构112放置在目标基底118上之后,将发光结构112的电触头焊盘激光键合到目标基底118。
在一些实施例中,显示器组装系统100可以包括多个拾取头阵列104,每个拾取头阵列104位于单独的站(station)。每个站可以专用于特定颜色的LED的拾取放置阵列,例如用于绿色LED的绿色站、用于红色LED的红色站和用于蓝色LED的蓝色站等。不同颜色的LED生长在不同的原生基底上,这些不同的原生基底由于其组成和结构的不同,它们可以是不同的载体基底114(如图1所示)。
在发光结构112包括μLED的实施例中,在发光结构112的拾取表面和PPH 124之间产生足够的范德华力是重要的,因为μLED的小表面减小了可以在其上发生范德华相互作用的表面积。此外,在载体基底114的移动期间(例如,以在显示器制造过程中将发光结构112移动到另一个位置),发光结构112被理想地固定,使得当PPH 124与发光结构112的拾取表面接触时,两个表面对齐,并且发光结构112的倾斜最小。使用如图3A-图5C中所述的载体基底114上的粘合层115,显示器组装系统100的拾取放置技术可以用于成功地将发光结构112从载体基底114放置到目标基底118。
在一些实施例中,发光结构112的拾取表面和PPH 124之间的力可以是除范德华力之外或不同于范德华力的任何粘附力。例如,PPH 124可以包括抓持发光结构112并将它们从载体基底114上移除的抓持器。在其他示例中,PPH 124可以使用静电力拾取发光结构112。
显示器组装系统100包括蚀刻器(etcher)126。蚀刻器126基于从控制器106接收的指令蚀刻载体基底114上的发光结构112的粘合层115。参考图3A-图5C进一步详细描述粘合层115。蚀刻器126可以蚀刻粘合层115,而基本上不影响发光结构112。蚀刻器126可以包括例如氧干法蚀刻器(诸如射频(RF)氧等离子体反应器)。在其他实施例中,蚀刻器126可以用任何气体干法蚀刻粘合层115,该气体选择性地移除粘合层115而不影响发光结构112的结构。例如,蚀刻器126可以使用空气等离子体或氨(NH3)、氯、硼或碳氟化合物气体或能够移除粘合层115的任何其他气体。蚀刻器126可以包括进气阀和排气阀、电离板和任何其他标准蚀刻部件。
图2A是根据一个实施例的发光结构112的示意图的截面视图,该发光结构112可以包括μLED晶片。发光结构112可以包括半导体元件202和电触头206等。在一些实施例中,半导体元件202可以包括通过外延生长(外延)制成的半导体材料,例如氮化镓(GaN)、砷化镓(GaAs)等。当将发光结构112安装到背板上时,电触头206用作发光结构112的互连部。
电触头206可以以凸块或微凸块的形式被提供,用于发光结构112到电导体的互连。电触头可以布置在发光结构112的表面上,并且可以形成在半导体元件202中的LED的p触头和n触头的顶部,其可以布置在半导体元件202的一侧(例如与发光表面208相反的接触表面207)上。电触头206可以由金属(例如,铜(Cu)、锡(Sn)、金(Au)、纳米多孔Au、纳米多孔Cu和/或其他金属)和/或非金属结构(例如碳纳米管或导电聚合物)制成,以与背板上的电导体上的金属焊盘(例如,包括Au、Cu或纳米多孔Au)互连。在一些实施例中,用于LED的单个电触头206(例如,阳极)可以位于LED附近(例如,在与LED的发光表面相反的表面上),并且另一个电触头206(例如,阴极)可以与发光结构中的其他LED电连接,形成公共电触头206,其可以位于其他地方(例如,在发光结构112的一端)。
图2B是根据实施例的发光结构112的透视图。这里,发光结构112包括具有两行偏移的μLED 210的晶片(根据期望的功能,发光结构在所得显示器中可以有效地包括单个输出行)。也就是说,行可以被偏移,以在所得显示器中提供更紧凑的水平(或垂直)输出间距。另外,如图2B所示,电触头206可以从相应的μLED 210稍微偏移。也就是说,取决于制造和/或其他考虑,如中心线212所示,电触头206-1的中心可以不与电触头206-1电连接到的相应μLED 210-1的中心对齐。
可以注意到,替代实施例可以不同于图2B所示的实施例。例如,μLED210(或其他光发射器)可以不同地布置在发光结构112上,发光结构112可以具有不同的形状,可以有更多行或更少行(仅包括单个行)μLED 210,μLED 210可以各自具有两个触头(例如,而不是在多个μLED 210之间共享公共电触头),和/或可以有更多或更少个μLED 210(仅包括单个μLED210),等等。本领域普通技术人员将意识到其他这样的变化。
可以注意到,图2A和图2B是出于说明性目的而提供的简化图。发光结构112的实施例可以包括在图2A和图2B或本文的其他附图中未明确示出的附加特征。例如,实施例可以包括一个或更多个突起或台面,其可以帮助引导由发光结构112产生的光。如下所述,一些实施例可以包括位于与发光表面208相反的表面上的台面。在这样的实施例中,电触头206可以位于台面上或台面附近。
图3A-图3C是示出根据一个实施例的制造显示设备的过程的不同阶段的截面图,该过程可以由显示器组装系统(例如图1的显示器组装系统100)来执行。一旦制造基底110和粘合层115已经被移除,并且发光结构112准备好被放置并键合到背板(其可以包括图1的目标基底118)上,就可以在发光结构112的切单(singulation)之后执行图3A-图3C中所示的阶段。
由发光结构112和背板的背板触头(图3B-图3C中示出的背板触头320)的键合形成的电连接有助于确保显示器的正确功能。例如,如果没有适当的键合,该显示器将无法为发光结构112的微LED供电,因此该显示器可能无法正常工作。因此,确保适当的键合在制造显示器的过程中可能是重要的。
图3A示出了使用PPH 124将发光结构112从载体基底114解耦的阶段。在一些实施例中,弹性体层(未示出)可以沉积或以其他方式形成在发光结构112的发光表面208上,这可以有助于发光结构112附着到PPH124,以在显示器制造期间放置在目标基底上。PPH 124的组成可以根据期望的功能而变化。在一些实施例中,PPH 124还可以包括弹性体、玻璃等。可以使用额外的或替代的材料。虽然在图3A中未示出,但是在通过PPH124将发光结构112与载体基底114解耦之前,在发光结构112和载体基底114之间可以有一部分粘合层(例如,图1中示出的粘合层115),其可以有助于保持发光结构112与载体基底114耦合。
图3B示出了图3A所示阶段之后的阶段,其中发光结构112被放置在背板310上用于键合。这里,发光结构112的电触头206可以与背板310的相应背板触头320对准。根据一些实施例,电触头206可以包括铜(Cu)、锡(Sn)和/或其他导电材料。背板触头320可以附加地或替代地包括Cu和/或其他导电材料。根据所使用的设备和/或其他因素,对准的精度可能会有所不同。例如,在一些实施例中,精度可以是±1微米。其他实施例可以包括更大或更小的精度。
图3C示出了图3B所示阶段之后的阶段,其中发光结构112被键合到背板310。键合过程可以包括使用温度、时间和压力来将电触头206与背板触头320键合。根据一个实施例,例如,图3C所示的部件可以被加热到250℃-270℃,导致在电触头206和背板触头320之间形成金属键合。为了有助于确保适当的键合,在加热过程中可以(例如,通过PPH 124)施加压力以将发光结构112压到背板310。然后冷却部件,然后从发光结构112释放PPH 124。随着电触头206键合到背板触头320,发光结构112保持耦合到背板310。
可以注意到,图3A-图3C是提供的简化图,以帮助说明关于单个发光结构112的键合过程。在一些实施例中,多个发光结构112可以彼此靠近地位于背板310上。根据期望的功能,这些发光结构112可以被同时键合(例如,使用PPH阵列124的多个PPH 124)或按顺序键合。此外,对于发射不同颜色光的不同发光结构(例如,对于其中单个发光结构112的μLED发射单一颜色光的实施例),可以重复图1-图3C中示出并在上面描述的发光结构制造和放置的过程。以这种方式,不同颜色的单色发光结构112可以放置在公共背板310上,以形成具有多色像素组件的显示器,该多色像素组件包括发射例如红色、绿色和蓝色光的μLED。
如前所述,在图3A-图3C所示的键合过程中可能会出现问题。图4A和图4B说明了这些问题。
图4A是在发生横向移动的键合过程中发光结构112和背板310的示意图。构成PPH124、发光结构112(包括电触头206)和背板310(包括背板触头320)的材料可以在这些部件之间变化。因此,这些部件可能具有不同的热膨胀系数(CTE)。因此,当这些部件在键合过程中被加热时,它们可能以不同的速率膨胀。这可能导致发光结构112和背板310之间的一些横向移动Δx。这种移动可能导致一个或更多个电触头206变得与相应的背板触头320不对准。在极端情况下,一个或更多个电触头206可能完全失去与相应背板触头320的物理接触,在这种情况下,将不会形成键合。例如,在一些实施例中,电触头206和背板触头320的直径可以在0.5μm和4μm之间(例如,3μm)。因此,超过该直径(例如,3μm)的横向移动Δx可能导致在一个或更多个电触头206和一个或更多个对应的背板触头320之间形成键合失败。此外,这可能使得在键合期间难以在发光结构112和背板310之间保持期望的压力量。
在键合期间可能出现的另一个问题是发光结构112的台面的潜在损坏。图4B是发光结构112的示意图,其中台面410位于电触头206附近。如前所述,μLED可以包括台面410,台面410可以通过将光导向发光结构112的发光表面208来提高μLED的效率。这样,在发光结构112包括多个μLED的实施例中,发光结构112也可以包括相应的多个台面410。还可以注意到,尽管图4B所示的台面410位于电触头206旁边,但是替代实施例可以包括位于电触头206下方的台面410(在这种情况下,电触头206可以从台面410的表面延伸)。其他实施例可以具有设置在发光结构112上的其他位置处的台面410。
因为台面410从发光结构112向背板310延伸,所以它在键合过程中可能受到损坏。也就是说,在键合过程中,施加力或压力以将发光结构112压到背板310(例如,如图4B所示,沿Z方向向下)。如前所述,部件被加热,因此电触头206和背板触头320可以软化和压缩。如果电触头206和背板触头320压缩到小于台面高度420,台面410可能压靠背板310并被损坏。在一些实施例中,例如,台面高度420可以在1μm和6μm的高度之间,并且电触头206和背板触头320的组合高度可以在1.5μm和10μm的高度之间。
实施例通过利用在背板上形成框架的技术来解决这些和其他问题,该背板包括至少部分地包围或包封背板310的背板触头320的结构。如本文所使用的,术语“包围”和“包封”触头(例如,电触头206和/或背板触头320)意在描述在两侧或更多侧上(单独地或共同地)围绕触头。图5A和图5B示出了根据实施例如何使用框架。
图5A是发光结构112、PPH 124和背板310的截面视图,类似于图3C-图4B中的图示。然而,这里在键合过程中使用框架。根据实施例,框架可以包括一个或更多个框架结构510,其可以帮助减少横向移动Δx,和/或减少电触头206和背板触头320的压缩量(从而减少台面(未示出)在键合过程中被损坏的可能性)。这里,键合表面540可以包括背板触头320和一个或更多个框架结构510耦合到的基本平坦的表面。
框架结构510的属性可以根据期望的功能而变化。框架本身可以包括光致抗蚀剂,因此可以使用相应的光刻技术来创建框架。替代实施例可以利用包括附加或替代材料的框架。
根据一些实施例,每个框架结构525可以包括凹口530,凹口530不仅有助于减少横向移动Δx,而且减少电触头206和背板触头320的压缩量。根据一些实施例,凹口525和框架距离520的尺寸可以使得,如果发生任何横向移动,发光结构112的主体而非电触头206压靠框架结构510。这有助于防止电触头206的剪切(shearing)。
根据用于制造框架结构510的工艺,从框架结构510到背板触头320的框架距离520和/或距背板310的键合表面540的凹口高度530可以变化,并且可以根据期望的功能来被有意地控制。
例如,可以有意地包括框架距离520,以允许一定横向移动Δx。这可以降低横向移动可能从发光结构112剪切电触头206的风险。在一些实施例中,例如,框架距离520可以小于背板触头320和/或电触头206的直径。这有助于确保电触头206在键合过程中保持与相应的背板触头320接触。
凹口高度530也可以被有意地控制,以确保电触头206和背板触头320之间的适当键合,而没有不期望的压缩量。在一些实施例中,例如,凹口高度530可以小于电触头206和背板触头320的组合高度,但是凹口高度530也可以超过发光结构112的台面(未示出)的高度,以提供有助于确保台面不会在键合过程中由于过度压缩而损坏的物理阻挡。
图5B是图5A所示的发光结构112、框架结构510和背板310的俯视图。这里,发光结构112在Y方向上是细长的,并且可以包括多个μLED(未示出),每个μLED具有一个或更多个电触头206。然而,如前所述,根据期望的功能,发光结构的实施例可以包括更多或更少μLED、电触头206和/或多行电触头206。(可以进一步注意到,为了清楚起见,不是所有的电触头206或框架开口550都被标记。)
如所示出的,框架包括多个框架结构510,其可以至少部分地包封电触头206。虽然一些实施例可以包括具有完全包封电触头206的单个框架结构510的框架,但是其他实施例可以包括框架结构510之间的一个或更多个框架开口550,这可以允许在后续制造过程中接近框架结构510内部的电触头和/或其他部件。
例如,一些实施例可以包括在将发光结构112键合到背板310之后沉积底部填料。底部填料可以包括聚合物基材料,其可以是沉积在背板310上的旋涂层。附加地或替代地,可以在键合之后通过喷针(needle)或喷射来分配底部填料。框架结构510之间的框架开口550可以允许在发光结构112、电触头206和下面的背板触头320(未示出)的下方形成底部填充层,以从电触头206和背板触头320移除金属氧化物(例如,Cu、Sn、Al等),从而形成更好的键合。
可以注意到,框架的利用可以不同于参照图5A和图5B描述的实施例。尽管图5A和图5B中示出了单个发光结构112,但是实施例可以包括多个发光结构112。根据发光结构112在背板310上的接近程度,一些实施例可以在两个或更多个相邻的发光结构112之间共享框架结构510的至少一部分。附加地或替代地,框架结构510可以是永久的或临时的,这取决于所使用的材料、可用的制造能力和/或其他因素。也就是说,根据一些实施例,框架结构510可以在键合之后被移除。在其他实施例中,框架结构510可以永久保留在背板310上。
图6A-图6E是简化的截面图,该简化的截面图示出了制造过程的替代实施例,该制造过程可以进一步降低键合期间横向移动的有害影响的可能性。然而,可以注意到,其他实施例可以以不同于图6A-图6E所示的顺序采取措施。
图6A是背板310、背板触头320和框架结构510的简化截面图。这里,类似于前面讨论的实施例,框架可以包括光致抗蚀剂,并且可以使用光刻工艺制造在背板310上。附加地或替代地,可以使用直接激光写入(direct laser writing)(例如,双光子聚合)来形成框架结构。再次,取决于期望的功能,凹口高度530和/或框架距离520可以至少在某种程度上被控制。根据实施例,框架结构510可以类似于图5A和图5B所示的框架结构510。
图6B示出了制造过程的后续部分,其中底部填充层610可以沉积(或以其他方式制造)在背板310上。与图5A和图5B所示的实施例不同,可以在将发光结构(未示出)放置在背板310上之前沉积底部填充层610。如前所述,底部填充层610可以包括聚合物基材料。附加地或替代地,可以使用旋涂方法沉积底部填充层610。在使用其他材料的情况下,可以使用用于制造底部填充层610的替代技术。
如图6C中进一步示出的,该过程然后可以包括使用PPH 124将发光结构112放置到背板310上。这里,底部填充层610的粘度(viscosity)可以允许PPH 124简单地将发光结构112至少部分地压入底部填充层610中。例如,发光结构112可以被压入底部填充层610中,直到电触头206压靠背板触头320。
在图6D中,PPH 124然后与发光结构112解耦。如所示出的,当底部填充层610的粘性超过PPH 124的粘性时,这种解耦是可能的,当PPH124在远离背板的方向上移动时,将发光结构112保持在底部填充层610中。因此,可以采取措施来确保这种条件成立。在一些实施例中,例如,直到底部填充层610至少在某种程度上已经固化,从发光结构112取出PPH124才会发生。附加地或替代地,可以采取措施来确保发光结构112的大量表面区域与底部填充层610接触。还可以采取额外的或替代的措施来确保PPH 124与发光结构112解耦。在一些实施例中,例如,直到电触头206和背板触头320已经形成键合,从发光结构112取出PPH 124才会发生。
最后,如图6E所示,在键合过程中,可以使用平坦压力施加工具将发光结构112压到背板310。也就是说,平坦压力施加工具620可用于压靠发光表面208,将发光结构112压到背板310。与其他实施例一样,框架结构510可以有助于防止台面(未示出)在键合期间因过度挤压而损坏和/或有助于减少发光结构112在键合期间经历的横向移动量Δx。
在该实施例中,通过使用平坦压力施加工具620,相对于其他实施例,电触头206的潜在剪切被进一步减少。具体地,平坦压力施加工具620可以包括与发光结构112的发光表面208接触的低摩擦表面630。例如,在一些实施例中,平坦压力施加工具620可以包括具有极低粗糙度(例如,纳米尺度)的玻璃。这可以使得在键合过程中在平坦压力施加工具620和发光结构112之间发生移动。框架结构510可以限制发光结构112的移动,以帮助确保适当的键合。
图7是根据实施例的制造显示器的方法700的流程图。可以注意到,类似于本文的其他附图,图7被提供作为非限制性示例。替代实施例可以添加、分离、重新排列和/或以其他方式改变图7所示的框的功能。本领域普通技术人员将认识到这种改变。用于执行该方法的装置可以包括计算设备的硬件和/或软件部件,包括图1的控制器106和相关部件(例如,处理器128、存储器130、致动器122、拾取放置头阵列104和/或蚀刻器126)。
在框710,该功能包括提供背板,该背板包括平坦表面、耦合到该平坦表面的第一组电触头、以及耦合到该平坦表面的一个或更多个框架结构,该一个或更多个框架结构至少部分地包封该第一组电触头,并且被配置为在将发光结构键合到背板期间限制发光结构的至少一部分的移动。如在上述实施例中所指出的,背板、框架结构和/或第一组电触头中使用的材料可以根据期望的功能而变化。例如,第一组电触头(例如,图3B-图5A和图6A-图6E所示的背板触头320)可以包括Cu、Au和/或其他导电材料。一个或更多个框架结构可以包括光致抗蚀剂材料。因此,在一些实施例中,提供背板可以包括利用光刻工艺制造一个或更多个框架结构。一个或更多个框架结构可以被配置成限制半导体元件和/或发光结构的电触头的移动。
一个或更多个框架结构的尺寸和位置可以根据期望的功能而变化。例如,一个或更多个框架结构可以位于距第一组电触头一定距离处,以允许在将发光结构键合到背板期间发光结构和背板之间在平行于背板的表面的方向上的阈值量的移动(例如,如图5A所示)。在一些实施例中,一个或更多个框架结构可以包括多个分立的框架结构,这些框架结构可以用于支撑单个发光结构,并且可以由框架开口分开(例如,如图5B所示)。在一些实施例中,一个或更多个框架结构从背板的表面延伸第一高度,发光结构还包括从半导体元件的表面延伸第二高度的台面;并且第一高度大于第二高度。
在框720,方法700还包括获得发光结构,该发光结构包括具有接触表面的半导体元件和耦合到接触表面的第二组电触头。如前面描述的实施例中所指出的,第二组电触头(例如,图2A-图5B和图6C-图6E中所示的电触头206)可以包括Cu、Sn、Au和/或其他导电材料。半导体元件的组成可以不同,这取决于发光结构(light hiking emitting structure)打算发射的光的颜色。根据各种实施例,例如,半导体元件可以包括氮化镓(GaN)、砷化镓(GaAs)、AlInGaP和/或其他半导体材料(硅(Si)等)。如在上述实施例中所指出的,获得发光结构可以包括,在切单工艺(singulation process)之后,通过使用PPH将发光结构从载体基底解耦(例如,如图3A所示)。
在框730,方法700包括将发光结构放置在背板上,使得第二组电触头中的每个电触头与第一组电触头中的相应电触头物理接触。如图3B和图3C所示,并且如上所述,将发光结构的触头与背板的相应触头对准可以帮助确保适当的键合。最小公差可以被设置为低于(来自第一组电触头和/或来自第二组电触头的)电触头的直径,以帮助确保触头物理接触。
在框740,将发光结构键合到背板。这里,键合包括加热发光结构和背板,并施加力以将发光结构压到背板,使得发光结构的半导体元件的表面与背板的一个或更多个框架结构物理接触。根据一些实施例,施加力以将发光结构压到背板可以包括使用与发光结构耦合的拾取放置头施加力(例如,如图5A所示)。
根据实施例,根据期望的功能,方法700可以包括一个或更多个附加功能。例如,如图6A-图6E所示,一些实施例可以包括在将发光结构键合到背板之前,在背板的表面上沉积具有或不具有焊剂特性(flux property)的底部填充层。在这样的实施例中,将发光结构放置在背板上可以进一步包括使用与发光结构耦合的拾取头将发光结构至少部分地压入底部填充层中。在一些实施例中,底部填充层可以包括聚合物基材料。在一些实施例中,底部填充层可以包括填充有纳米粒子(纳米填料)的聚合物基材料。其他实施例可以使用没有纳米粒子的聚合物基材料。实施例可以进一步包括将发光结构从拾取头解耦,并且施加力以将发光结构压到背板可以包括使用压力施加工具向发光结构的发光表面施加压力(例如,如图6E所示)。在这样的实施例中,在压力施加工具的表面与发光结构的发光表面的物理接触之间的摩擦水平可以允许在将发光结构键合到背板期间压力施加基底的表面和发光结构的发光表面之间的移动。可选地,压力施加工具可以包括玻璃或熔融石英。
图8是根据一些实施例的示例LED 800的截面视图,该LED 800可以结合到如本文所述的发光结构112中。LED 800可以是微LED,其可以具有线性尺寸小于50μm、小于20μm或小于10μm的有效发光区域806。例如,线性尺寸可以小到2μm或4μm。它们的小尺寸使得显示系统能够具有包括三个微LED(红色微LED、绿色微LED和蓝色微LED)的单个像素。它们的小尺寸也使得微LED重量轻,使它们特别适合用于可穿戴显示系统,如手表和计算眼镜。尽管图8中仅示出了一个LED 800,但是多个LED可以同时形成在发光结构中(如图2B所示)。
LED 800包括半导体结构以及其他部件。半导体结构包括半导体层802和804以及位于半导体层802和804之间的发光层806。例如,LED 800可以包括半导体结构,其中发光层806是夹在p型氮化镓层和n型氮化镓层之间的铟镓氮化物层。在一些实施例中,半导体层802是p型半导体,并且半导体层804是n型半导体。在一些实施例中,半导体层802是n型半导体,并且半导体层804是p型半导体。
半导体层802和804分别可操作地耦合到电触头808和810(其可以对应于发光结构112的电互连部206,如图2A所示)。电触头808和810通常由导电材料(例如金属材料)制成。在图8的示例中,电触头808和810都位于半导体结构的顶面上,使得当LED 800安装在包括控制电路的基底上时,它们都能够支撑LED 800。然而,在一些实施例中,电触头可以位于半导体结构的相反表面上。
发光层806包括一个或更多个量子阱,当跨电触头808和810施加电压时,量子阱输出光816。为了定向光816的输出,半导体结构可以形成为能够使光816准直/类准直的各种形状(例如抛物面、圆柱面或圆锥面)中的任何一种。这种形状在本文被称为“台面”形状;并且准直和类准直在本文统称为“准直”。准直导致光输出亮度增加。
在图8的示例中,台面814对应于抛物面形状,其引导光816朝向并穿过半导体结构的发光表面812。更具体地,发光层806大致位于抛物面的焦点处,使得一些发射光在全内反射的临界角内从抛物面内壁向发光表面812反射。
在一些实施例中,台面形状也具有可容纳电触头的截断顶部。在图8的示例中,台面814对应于抛物面形状,其具有容纳电触头808的截顶。基部818指的是不包括在台面814中的半导体结构部分。
为了能够进一步准直光816,可以在发光表面812上形成光学元件820。在图8的示例中,光学元件820是微透镜。如下文将更详细描述的,光学元件820可以由弹性材料或光致抗蚀剂形成。
本发明的实施例可以包括人工现实系统或结合人工现实系统来被实现。人工现实是一种在呈现给用户之前已经以某种方式进行了调整的现实形式,其可以包括例如虚拟现实(VR)、增强现实(AR)、混合现实(mixed reality,MR)、混杂现实(hybrid reality)或其某种组合和/或衍生物。人工现实内容可以包括完全生成的内容或者与所捕获的(例如,现实世界)内容组合的所生成的内容。人工现实内容可以包括视频、音频、触觉反馈或它们的某种组合,它们中的任何一个都可以在单个通道或多个通道(例如向观看者产生三维效果的立体视频)中呈现。此外,在一些实施例中,人工现实还可以与应用、产品、附件、服务或其某种组合相关联,这些应用、产品、附件、服务或其某种组合用于例如在人工现实中创建内容和/或在人工现实中以其他方式被使用(例如在人工现实中执行活动)。可以在各种平台(包括连接到主计算机系统的头戴式显示器(HMD)、独立的HMD、移动设备或计算系统、或者能够向一个或更多个观看者提供人工现实内容的任何其他硬件平台)上实现提供人工现实内容的人工现实系统。
本公开的实施例的前述描述为了说明的目的被提出;它并不意图为无遗漏的或将本公开限制到所公开的精确形式。相关领域中的技术人员可以认识到,按照上面的公开,许多修改和变化是可能的。
本描述的一些部分从对信息的操作的算法和符号表示方面描述了本公开的实施例。数据处理领域的技术人员通常使用这些算法描述和表示来向本领域的其他技术人员有效地传达他们工作的实质。这些操作虽然在功能上、计算上或逻辑上进行了描述,但应理解为将由计算机程序或等效电路、微代码等来实现。此外,将操作的这些布置称为模块有时候也被证明是方便的而不失一般性。所描述的操作和它们的相关模块可以体现在软件、固件和/或硬件中。
可以利用一个或更多个硬件或软件模块单独地或与其他设备组合地来执行或实现所描述的步骤、操作或过程。在一些实施例中,利用包括包含计算机程序代码的计算机可读介质的计算机程序产品来实现软件模块,计算机程序代码可以由计算机处理器执行,用于执行所描述的任何或全部步骤、操作或过程。
本公开的实施例也可以涉及用于执行所描述操作的装置。该装置可以为所需目的而专门构造,和/或它可以包括由存储在计算机中的计算机程序选择性激活或重新配置的通用计算设备。这种计算机程序可以存储在非暂时性的、有形的计算机可读存储介质中,或者适于存储电子指令的任何类型的介质中,其可以耦合到计算机系统总线。此外,说明书中提到的任何计算系统可以包括单个处理器,或者可以是采用多处理器设计来提高计算能力的架构。
本公开的实施例也可以涉及由本文所述的计算过程产生的产品。这样的产品可以包括由计算过程产生的信息,其中信息被存储在非暂时性的、有形的计算机可读介质上且可以包括计算机程序产品或本文所述的其他数据组合的任何实施例。
在说明书中使用的语言主要出于可读性和指导性的目的而被选择,并且它可以不被选择来描绘或限制发明的主题。因此,意图是本公开的范围不由该详细描述限制,而是由在基于其的申请上发布的任何权利要求限制。因此,实施例的公开意图对本公开的范围是说明性的,而不是限制性的,在所附权利要求中阐述了本公开的范围。
Claims (15)
1.一种制造显示器的方法,所述方法包括:
提供背板,所述背板包括:
平坦表面;
耦合到所述平坦表面的第一组电触头;和
耦合到所述平坦表面的一个或更多个框架结构,所述一个或更多个框架结构至少部分地包封所述第一组电触头,并且被配置为在将发光结构键合到所述背板期间限制所述发光结构的至少一部分的移动;
获得所述发光结构,所述发光结构包括:
具有接触表面的半导体元件;和
耦合到所述接触表面的第二组电触头;
将所述发光结构放置在所述背板上,使得所述第二组电触头中的每个电触头与所述第一组电触头中的相应电触头物理接触;和
将所述发光结构键合到所述背板,所述键合包括:
加热所述发光结构和所述背板;和
施加力以将所述发光结构压到所述背板。
2.根据权利要求1所述的方法,其中,施加所述力以将所述发光结构压到所述背板使得所述发光结构的半导体元件的表面与所述背板的一个或更多个框架结构物理接触。
3.根据权利要求1或权利要求2所述的方法,其中,所述一个或更多个框架结构包括光致抗蚀剂材料。
4.根据权利要求1、权利要求2或权利要求3所述的方法,其中,施加所述力以将所述发光结构压到所述背板包括使用与所述发光结构耦合的拾取放置头施加所述力;
其中,所述方法还能够包括在将所述发光结构键合到所述背板之前,在所述背板的表面上沉积底部填充层,其中,将所述发光结构放置在所述背板上还包括使用与所述发光结构耦合的拾取放置头将所述发光结构至少部分地压入所述底部填充层中。
5.根据权利要求4所述的方法,还包括将所述发光结构从所述拾取放置头解耦,其中,施加所述力以将所述发光结构压到所述背板包括使用压力施加工具向所述发光结构的发光表面施加压力;其中,在所述压力施加工具的表面与所述发光结构的发光表面的物理接触之间的摩擦水平能够可选地允许在将所述发光结构键合到所述背板期间在压力施加基底的表面和所述发光结构的发光表面之间的移动。
6.根据权利要求5所述的方法,其中,所述压力施加工具包括玻璃或熔融石英。
7.根据权利要求4、权利要求5或权利要求6所述的方法,其中,所述底部填充层包括聚合物基材料。
8.根据前述权利要求中任一项所述的方法,其中:
所述一个或更多个框架结构从所述背板的表面延伸第一高度;
所述发光结构还包括从所述半导体元件的表面延伸第二高度的台面;和
所述第一高度大于所述第二高度。
9.根据前述权利要求中任一项所述的方法,其中,所述一个或更多个框架结构位于距所述第一组电触头一定距离处,以允许在将所述发光结构键合到所述背板期间,所述发光结构和所述背板之间在平行于所述背板的表面的方向上的阈值量的移动;
和/或其中,所述一个或更多个框架结构包括多个分立的框架结构。
10.一种背板,包括:
平坦表面;
耦合到所述平坦表面的第一组电触头;和
所述背板的表面上的一个或更多个框架结构,所述一个或更多个框架结构至少部分地包封所述第一组电触头,并且被配置为在键合过程中与发光结构的半导体元件的表面物理接触,在所述键合过程中,包括所述发光结构的一个或更多个触头的第二组电触头中的每个电触头与所述第一组触头中的相应电触头键合。
11.根据权利要求10所述的背板,其中,所述一个或更多个框架结构包括光致抗蚀剂材料;
和/或其中,所述背板还包括所述背板的表面上的底部填充层。
12.根据权利要求11所述的背板,其中,所述底部填充层的粘性允许在使用拾取放置头将所述发光结构至少部分地压入所述底部填充层中并且所述拾取放置头在远离所述背板的方向上移动之后,将所述发光结构从所述拾取放置头解耦。
13.根据权利要求10、权利要求11或权利要求12所述的背板,其中:
所述一个或更多个框架结构从所述背板的表面延伸第一高度;和
所述第一高度被配置为超过所述发光结构的台面的第二高度,所述台面从所述发光结构的半导体元件的表面延伸所述第二高度。
14.根据权利要求10至13中任一项所述的背板,其中,所述一个或更多个框架结构位于距所述第一组电触头一定距离处,以允许在将所述发光结构键合到所述背板期间所述发光结构和所述背板之间在平行于所述背板的表面的方向上的阈值量的移动。
15.根据权利要求10至14中任一项所述的背板,其中,所述一个或更多个框架结构包括多个分立的框架结构;
和/或其中,所述第一组电触头包括一个或更多个电触头。
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