CN112698752A - Manufacturing method of high-stability touch screen with single-layer film structure - Google Patents
Manufacturing method of high-stability touch screen with single-layer film structure Download PDFInfo
- Publication number
- CN112698752A CN112698752A CN202011636476.6A CN202011636476A CN112698752A CN 112698752 A CN112698752 A CN 112698752A CN 202011636476 A CN202011636476 A CN 202011636476A CN 112698752 A CN112698752 A CN 112698752A
- Authority
- CN
- China
- Prior art keywords
- substrate
- touch screen
- carbon
- manufacturing
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002356 single layer Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 87
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 32
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 32
- 238000012545 processing Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000007689 inspection Methods 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims description 16
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 7
- 239000011780 sodium chloride Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 4
- 229910001431 copper ion Inorganic materials 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 3
- 239000002699 waste material Substances 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 2
- 239000011259 mixed solution Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 19
- 239000010409 thin film Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007688 edging Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for manufacturing a high-stability touch screen with a single-layer film structure, which comprises the following steps of: selecting a substrate, processing the substrate, manufacturing a metal mesh surface, processing the metal mesh surface, electroplating a film, processing a single-layer film, performing secondary treatment on the substrate, adhering a flexible circuit board and assembling the flexible circuit board and the touch screen, firstly selecting a proper substrate and processing the substrate, then coating a carbon-containing solution on the surface of the substrate to obtain a carbon-containing layer, carrying out copper plating treatment on the substrate with the carbon-containing layer to obtain a metal mesh surface, assembling the ITO conductive film on the surface of the substrate through an electroplating film, and the substrate is processed for the second time, and is thinned by hydrofluoric acid mixed solution to obtain a thinned substrate, then the flexible circuit board is bonded, and electric measurement and quality inspection are carried out, finally the flexible circuit board is assembled with a terminal product module, a metal mesh surface is prepared by copper plating containing a carbon layer, and the substrate is assembled by matching with a single-layer ITO conductive film, and the substrate is processed for multiple times by utilizing a CNC (computerized numerical control) machine tool, so that the manufactured touch screen has higher stability.
Description
Technical Field
The invention relates to the field of touch screens, in particular to a method for manufacturing a high-stability touch screen with a single-layer film structure.
Background
The touch screen is an induction type liquid crystal display device capable of receiving input signals such as a touch head, is a latest computer input device, and is a simple, convenient and natural man-machine interaction mode. The touch screen gives a brand-new appearance to multimedia, is a brand-new multimedia interaction device with great attraction, is mainly applied to inquiry of public information, industrial control, military command, electronic games, multimedia teaching and the like, adopts an ITO conductive film to directly manufacture electrode patterns and conductive circuits, has high processing difficulty and insufficient stability, and is not beneficial to long-term use of the touch screen.
Disclosure of Invention
The invention mainly aims to provide a method for manufacturing a high-stability touch screen with a single-layer film structure, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
a manufacturing method of a high-stability touch screen with a single-layer film structure comprises the following steps:
s1: selecting a substrate, and selecting a substrate made of a proper material for the touch screen;
s2: processing the substrate, namely cutting and processing the substrate by using a CNC (computer numerical control) processing machine tool, and cleaning;
s3: manufacturing a metal mesh surface, coating a carbon-containing solution on one surface of a substrate, standing to obtain a carbon-containing layer, exposing and developing the carbon-containing layer according to a preset pattern, and then performing copper plating treatment on the carbon-containing layer to obtain the metal mesh surface;
s4: processing a metal mesh surface, processing the metal mesh surface by an etching technology, forming a conductive circuit, and forming a circuit interface end at one end of the substrate;
s5: electroplating a film, namely electroplating the surface of a single-layer ITO conductive film straight substrate;
s6: processing a single-layer film, and manufacturing an electrode pattern on the ITO conductive film;
s7: performing secondary treatment on the substrate, namely performing edge grinding on the substrate by using a CNC (computer numerical control) machine tool, cleaning waste materials, and then performing etching and thinning treatment on the substrate by using a hydrofluoric acid process;
s8; bonding the flexible circuit board to the circuit interface end of the substrate;
s9; and assembling the touch screen, namely assembling the single-layer film structure touch screen into the terminal product module.
Preferably, in the step S1, the selected substrate is made of a polymethyl methacrylate material.
Preferably, in the step S2, after the cutting process is completed, the substrate surface is cleaned by using an ultrasonic cleaning device to remove the debris.
Preferably, in the step S3, the carbon-containing solution is applied and then left for 30 minutes, and when the carbon-containing layer is electroplated, the carbon-containing layer is basically placed in a solution containing copper ions to be electroplated with copper, so as to obtain the metal mesh surface.
Preferably, in the step S7, the substrate after edge grinding needs to be cleaned again by using an ultrasonic cleaning device, and in the hydrofluoric acid process, a mixed liquid of hydrofluoric acid, sulfuric acid, and sodium chloride is selected for etching, wherein the ratio of hydrofluoric acid, sulfuric acid, sodium chloride, and water is 6: 1: 2: 10, and the etching and thinning time is controlled to be 3 to 8 minutes.
Preferably, in the step S8, after the flexible printed circuit board is bonded, the process is completed through electrical testing and quality inspection.
Compared with the prior art, the invention has the following beneficial effects:
prepare the base plate through selecting polymethyl methacrylate as the raw materials, difficult broken and the cost is lower, through scribbling carbonaceous layer in the base plate one side, utilize carbonaceous layer to carry out copper facing and handle and prepare the metal wire netting face, reduce cost through utilizing the hydrofluoric acid technology to carry out etching attenuate processing to the base plate, can effectively reduce the thickness of base plate, make it more ultra-thin, more pleasing to the eye, wash through utilizing ultrasonic cleaning equipment to the base plate after processing, make it cleaner and tidier, the follow-up equipment of being convenient for.
Drawings
Fig. 1 is a manufacturing flow chart of a method for manufacturing a high-stability touch screen with a single-layer film structure according to the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1, a method for manufacturing a high-stability touch screen with a single-layer film structure includes the following steps:
s1: selecting a substrate, and selecting a substrate made of a proper material for the touch screen;
s2: processing the substrate, namely cutting and processing the substrate by using a CNC (computer numerical control) processing machine tool, and cleaning;
s3: manufacturing a metal mesh surface, coating a carbon-containing solution on one surface of a substrate, standing to obtain a carbon-containing layer, exposing and developing the carbon-containing layer according to a preset pattern, and then performing copper plating treatment on the carbon-containing layer to obtain the metal mesh surface;
s4: processing a metal mesh surface, processing the metal mesh surface by an etching technology, forming a conductive circuit, and forming a circuit interface end at one end of the substrate;
s5: electroplating a film, namely electroplating the surface of a single-layer ITO conductive film straight substrate;
s6: processing a single-layer film, and manufacturing an electrode pattern on the ITO conductive film;
s7: performing secondary treatment on the substrate, namely performing edge grinding on the substrate by using a CNC (computer numerical control) machine tool, cleaning waste materials, and then performing etching and thinning treatment on the substrate by using a hydrofluoric acid process;
s8; bonding the flexible circuit board to the circuit interface end of the substrate;
s9; and assembling the touch screen, namely assembling the single-layer film structure touch screen into the terminal product module.
In the step S1, the selected substrate is made of polymethyl methacrylate material; in the step S2, after the cutting process is completed, cleaning the surface of the substrate with an ultrasonic cleaning device to remove the debris; s3, after the carbon-containing solution is smeared, the carbon-containing solution is kept still for 30 minutes, and when the carbon-containing layer is electroplated, the carbon-containing layer is basically placed in the solution containing copper ions for copper electroplating, so that a metal mesh surface is prepared; in the step of S7, the ground substrate needs to be cleaned again by ultrasonic cleaning equipment, in the hydrofluoric acid process, mixed liquid of hydrofluoric acid, sulfuric acid and sodium chloride is selected for etching treatment, wherein the ratio of hydrofluoric acid to sulfuric acid to sodium chloride to water is 6: 1: 2: 10, and the etching thinning treatment time is controlled to be 3-8 minutes; in step S8, after the flexible printed circuit board is bonded, the process is completed through electrical testing and quality inspection.
The invention is a method for manufacturing a high-stability touch screen with a single-layer film structure, which includes selecting a substrate for a touch screen, using a polymethyl methacrylate material as a substrate material, performing a first processing treatment on the selected substrate, cutting the substrate by a CNC (computerized numerical control) machine tool to obtain a substrate with a proper size for standby, cleaning the processed substrate, cleaning the substrate by using an ultrasonic cleaning device to remove surface debris powder to obtain a clean processed substrate, coating a carbon-containing solution on the surface of the substrate, standing the substrate for 30 minutes to generate a carbon-containing layer on the surface of the substrate, exposing and developing the carbon-containing layer according to a preset pattern to form a net surface prototype, preparing a copper ion-containing solution, placing the substrate with the carbon-containing layer into the solution to perform copper electroplating processing, the manufacturing method comprises the steps of obtaining a metal mesh surface, processing the metal mesh surface, forming a conductive circuit by etching and processing the metal mesh surface, forming a circuit interface end at one end of a connecting position of a substrate for subsequent assembly, assembling an ITO conductive thin film on the surface of the substrate, installing a single-layer ITO conductive thin film on the surface of the substrate by electroplating, processing the installed single-layer ITO conductive thin film, manufacturing a corresponding electrode pattern on the ITO conductive thin film, processing the substrate for the second time, using a CNC (computer numerical control) machine tool again, edging the outer ring of the substrate to smooth the substrate, using ultrasonic cleaning equipment again after edging, taking out powder scraps on the outer ring of the substrate, and thinning the substrate to reduce the thickness of the substrate so as to make the whole body more ultrathin and more attractive; selecting sufficient hydrofluoric acid, sulfuric acid, sodium chloride and water, taking the amounts according to the ratio of 6: 1: 2: 10, mixing and stirring the materials, standing the mixture to obtain corresponding mixed liquid, coating the mixed liquid on the smooth surface of the substrate, etching and thinning the mixed liquid to obtain a more ultrathin and attractive substrate, assembling a corresponding flexible circuit board on the substrate, connecting the flexible circuit board to a circuit interface end of the substrate, fixing the flexible circuit board by using viscose glue, performing quality inspection on the assembled substrate, ensuring the assembly stability, performing subsequent electrical measurement to ensure the normal operation of the touch screen, and finally assembling the substrate and a module of a corresponding terminal product to complete the installation of the whole touch screen, wherein the substrate is prepared by selecting polymethyl methacrylate as a raw material, is not easy to break and has low cost, the carbon-containing layer is coated on one side of the substrate and the copper plating treatment is carried out to prepare the metal mesh surface, so that the cost is reduced, the hydrofluoric acid process is utilized to carry out etching thinning treatment on the substrate, the thickness of the substrate can be effectively reduced, the substrate is more ultrathin and attractive, the subsequent assembly is convenient, the metal mesh surface is prepared by copper plating of the carbon-containing layer and is matched with the single-layer ITO conductive film for assembly, the CNC machine tool is utilized to carry out multiple times of processing on the substrate, and the prepared touch screen has higher stability.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A manufacturing method of a high-stability touch screen with a single-layer film structure is characterized by comprising the following steps: the method comprises the following steps:
s1: selecting a substrate, and selecting a substrate made of a proper material for the touch screen;
s2: processing the substrate, namely cutting and processing the substrate by using a CNC (computer numerical control) processing machine tool, and cleaning;
s3: manufacturing a metal mesh surface, coating a carbon-containing solution on one surface of a substrate, standing to obtain a carbon-containing layer, exposing and developing the carbon-containing layer according to a preset pattern, and then performing copper plating treatment on the carbon-containing layer to obtain the metal mesh surface;
s4: processing a metal mesh surface, processing the metal mesh surface by an etching technology, forming a conductive circuit, and forming a circuit interface end at one end of the substrate;
s5: electroplating a film, namely electroplating the surface of a single-layer ITO conductive film straight substrate;
s6: processing a single-layer film, and manufacturing an electrode pattern on the ITO conductive film;
s7: performing secondary treatment on the substrate, namely performing edge grinding on the substrate by using a CNC (computer numerical control) machine tool, cleaning waste materials, and then performing etching and thinning treatment on the substrate by using a hydrofluoric acid process;
s8; bonding the flexible circuit board to the circuit interface end of the substrate;
s9; and assembling the touch screen, namely assembling the single-layer film structure touch screen into the terminal product module.
2. The method for manufacturing a high-stability touch screen with a single-layer film structure according to claim 1, wherein the method comprises the following steps: in the step S1, the selected substrate is made of a polymethyl methacrylate material.
3. The method for manufacturing a high-stability touch screen with a single-layer film structure according to claim 1, wherein the method comprises the following steps: in the step S2, after the cutting process is completed, the substrate surface is cleaned by using an ultrasonic cleaning device to remove the debris.
4. The method for manufacturing a high-stability touch screen with a single-layer film structure according to claim 1, wherein the method comprises the following steps: in the step S3, the carbon-containing solution is smeared and then left for 30 minutes, and when the carbon-containing layer is electroplated, the carbon-containing layer is basically placed in a solution containing copper ions to be electroplated with copper, so as to obtain a metal mesh surface.
5. The method for manufacturing a high-stability touch screen with a single-layer film structure according to claim 1, wherein the method comprises the following steps: in the step S7, the substrate after edge grinding needs to be cleaned again by using an ultrasonic cleaning device, and in the hydrofluoric acid process, a mixed liquid of hydrofluoric acid, sulfuric acid, and sodium chloride is selected for etching, wherein the ratio of hydrofluoric acid, sulfuric acid, sodium chloride, and water is 6: 1: 2: 10, and the etching thinning time is controlled to be 3 to 8 minutes.
6. The method for manufacturing a high-stability touch screen with a single-layer film structure according to claim 1, wherein the method comprises the following steps: in the step S8, after the flexible printed circuit board is bonded, the process is completed through electrical testing, quality inspection, and the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011636476.6A CN112698752A (en) | 2020-12-31 | 2020-12-31 | Manufacturing method of high-stability touch screen with single-layer film structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011636476.6A CN112698752A (en) | 2020-12-31 | 2020-12-31 | Manufacturing method of high-stability touch screen with single-layer film structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112698752A true CN112698752A (en) | 2021-04-23 |
Family
ID=75513761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011636476.6A Pending CN112698752A (en) | 2020-12-31 | 2020-12-31 | Manufacturing method of high-stability touch screen with single-layer film structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112698752A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103543889A (en) * | 2012-07-17 | 2014-01-29 | 陈鸿瑜 | Method for manufacturing monolayer capacitive touch screen |
| CN103543890A (en) * | 2012-07-17 | 2014-01-29 | 沈虎 | Manufacturing technology of monolayer capacitive touch screen and processing method of electronic device with touch screen |
| CN105677115A (en) * | 2016-03-25 | 2016-06-15 | 深圳力合光电传感股份有限公司 | Ultrathin touch screen and manufacturing method thereof |
| CN107957819A (en) * | 2017-12-29 | 2018-04-24 | 信利光电股份有限公司 | A kind of production method of touch-screen |
-
2020
- 2020-12-31 CN CN202011636476.6A patent/CN112698752A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103543889A (en) * | 2012-07-17 | 2014-01-29 | 陈鸿瑜 | Method for manufacturing monolayer capacitive touch screen |
| CN103543890A (en) * | 2012-07-17 | 2014-01-29 | 沈虎 | Manufacturing technology of monolayer capacitive touch screen and processing method of electronic device with touch screen |
| CN105677115A (en) * | 2016-03-25 | 2016-06-15 | 深圳力合光电传感股份有限公司 | Ultrathin touch screen and manufacturing method thereof |
| CN107957819A (en) * | 2017-12-29 | 2018-04-24 | 信利光电股份有限公司 | A kind of production method of touch-screen |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100765363B1 (en) | Method for fabricating conductive particle | |
| CN102929462A (en) | Capacitive touch panel | |
| CN108633186A (en) | A kind of method that large-area laser direct write prepares flexible miniature telegraph circuit | |
| CN103687309B (en) | A kind of production technology of high-frequency circuit board | |
| CN103582285A (en) | ITO electric conducting film current converging electrode and manufacturing method thereof | |
| CN103002673A (en) | Manufacturing method for aluminum base and line layer communicating plate | |
| CN104902710B (en) | Housing with two-dimensional circuit structure and manufacturing method thereof | |
| CN103472945A (en) | Touch control element for touch screen and manufacturing method of touch control element | |
| KR20070106669A (en) | Circuit board and the method of its fabrication | |
| CN102776495B (en) | Chemical nickel-plating method for capacitive touch screen indium tin oxide (ITO) wiring | |
| CN110474162A (en) | Cover board of included antenna and preparation method thereof and electronic equipment | |
| CN112698752A (en) | Manufacturing method of high-stability touch screen with single-layer film structure | |
| CN104955281B (en) | A kind of method for making in three-dimensional polymer surface or repairing stereo circuit | |
| CN102945765B (en) | Method for manufacturing light-transmitting button of plated PC (polycarbonate) board | |
| KR20050001029A (en) | Method for manufacturing double side a flexible printed circuit board | |
| CN112474235A (en) | Method for improving flatness of device surface spray coating in LDS (laser direct structuring) process | |
| TW201413553A (en) | Manufacturing method of single layer capacitive touch screen | |
| CN103582306B (en) | The manufacture method of printed circuit board (PCB) | |
| CN202841679U (en) | ITO conducting film-based bus electrode | |
| CN208173951U (en) | flexible circuit board, display module and terminal | |
| CN104156117A (en) | Touch panel, method for manufacturing touch panel and touch device | |
| CN210328113U (en) | High-frequency circuit board | |
| CN203217533U (en) | Capacitive touch control panel | |
| JP2014172313A (en) | Intaglio for gravure offset printing and making method thereof | |
| CN107404811B (en) | A kind of manufacturing method, pcb board and the terminal of printing board PCB plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210423 |
|
| RJ01 | Rejection of invention patent application after publication |