CN112697713A - Microstructure mechanical behavior polarization parameter imaging system and method under multi-physical-field load - Google Patents
Microstructure mechanical behavior polarization parameter imaging system and method under multi-physical-field load Download PDFInfo
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Abstract
The invention discloses a system and a method for imaging the polarization parameters of the mechanical behavior of a microstructure under the load of multiple physical fields, wherein the system comprises a laser light source, a beam expander, a polarizer, an 1/4 wave plate, a microstructure to be tested, a first lens, a second lens, a polarization camera, a computer, a temperature loading device and a static loading device, and the method comprises the following steps: the method comprises the steps of placing a sample to be tested on a three-dimensional moving carrying platform of a static loading device, applying temperature load and static load to the sample to be tested simultaneously to change the stress state of the sample to be tested, turning on a laser light source, enabling the laser to pass through a beam expander, a polarizer and an 1/4 wave plate, collecting images by a polarization camera after loading the microstructure to be tested, a first lens and a second lens, and processing the images by a computer, so that a microstructure mechanical behavior polarization parameter image under a physical field coupling load is obtained. The invention has the advantages of high stability, high imaging efficiency, non-contact nondestructive measurement, high resolution and capability of carrying out full-field measurement.
Description
Technical Field
The invention belongs to the field of microstructure mechanics parameter measurement and optical imaging, and particularly relates to a microstructure mechanics behavior polarization parameter imaging system and method under multi-physical-field load.
Background
With the continuous expansion of the application fields of Micro Electro Mechanical Systems (MEMS) devices and flexible electronic devices, the accurate measurement and evaluation of the material characteristics, mechanical behavior, structural stability and reliability of the devices in the actual use environment is one of the problems generally concerned in the technical fields of theory and engineering at present. In actual measurement, on one hand, mechanical behaviors of the MEMS microstructure in different environments such as wet, thermal, electric, magnetic and force environments and complex environments are complex and complicated, on the other hand, factors of the severe complex environment have great influence on measurement, great difficulty is brought to a measurement method, and a mechanical parameter measurement method in a traditional normal environment is difficult to be applied to a complex abnormal environment, so that dynamic test and characterization method research of the mechanical behaviors of the microstructure in the complex abnormal environment needs to be carried out urgently, and the method has important significance for researching failure mechanisms, reliability, preparation processes and engineering application of the microstructure.
The traditional contact type measuring method based on piezoelectric, strain and other effects cannot meet the dynamic detection requirements of small-size and high-integration MEMS structures, is easily influenced by the environment, and has larger measuring errors. The optical measurement method has the advantages of non-contact, quick response, high precision, full-field measurement and the like, and becomes a main dynamic test means in the MEMS. Optical vibration measurement methods represented by a laser Doppler vibration measurement technology, a stroboscopic interference vibration measurement technology and a computer micro-vision technology are mature, accurate measurement of most of micro-structure out-of-plane and in-plane motion parameters can be achieved, but mechanical behaviors of the micro-structure such as stress fields cannot be measured, and the problems of low measurement efficiency, poor environmental adaptability and the like exist to a certain extent. Non-contact measurement methods such as a holographic interference method, a speckle interference method, a moire method, a geometric phase method and a photoelastic method need good shock insulation environment, the number of optical elements is large, the precision requirement of an optical instrument is high, the optical path arrangement is complex, the measurement precision is easy to be influenced by severe complex environments such as high temperature, and the measurement precision is reduced, and the stability is poor. Raman spectroscopy, digital image correlation methods and the like are also greatly influenced by the ring, cannot ensure the measurement accuracy, and are difficult to be applied to complex and abnormal environments.
Disclosure of Invention
The invention aims to provide a microstructure mechanical behavior polarization parameter imaging system and method under multi-physical-field load so as to obtain mechanical behavior information of a loaded microstructure.
The technical solution for realizing the purpose of the invention is as follows:
a microstructure mechanical behavior polarization parameter imaging system under multi-physical field load comprises an imaging light path, a temperature loading device and a static loading device;
the imaging light path is arranged on the vibration isolation table and used for collecting light intensity images with different polarization angles and carrying out subsequent image processing on the images, and comprises a laser light source, a beam expander, a polarizer, an 1/4 wave plate, a microstructure to be detected, a first lens, a second lens and a polarization camera which are sequentially arranged; the polarization camera can simultaneously and repeatedly acquire images with polarization information of 0 degrees, 45 degrees, 90 degrees and 135 degrees and transmit the images to an image processing system;
the temperature loading device is used for heating and controlling the constant temperature of the surface of the microstructure to be tested;
the static loading device is used for applying static load to the microstructure to be tested;
the image processing system is used for processing the collected light intensity images with different polarization angles to obtain a phase difference image, a phase angle image and a Stokes parameter image.
A microstructure mechanical behavior polarization parameter imaging system under multi-physical-field load comprises the following steps:
step 1, debugging a light path: adjusting the distance between the optical devices until the image collected by the polarization camera can be clearly displayed on a computer;
step 2, arranging a temperature loading device and a static loading device, wherein the microstructure to be tested can be completely covered by the light expanded by the beam expander;
step 3, load application and image acquisition: heating the lower surface of the microstructure to be tested by a temperature loading device, and simultaneously carrying out pressure loading operation on the upper surface of the microstructure to be tested by a static loading device to obtain a plurality of polarized light intensity images of the microstructure to be tested in different directions under a loaded state, which are acquired by a polarization camera;
step 4, image processing: and carrying out Stokes parameter image processing on the collected light intensity images with different polarization angles to obtain a phase difference image, a phase angle image and a Stokes parameter image.
Compared with the prior art, the invention has the following remarkable advantages:
(1) the stability is high: the polarization parameter imaging is adopted, only light is directly irradiated on the loaded microstructure to be measured to obtain a light intensity image, and interference treatment is not needed to obtain an interference fringe image, so that a light path is not easily influenced by external vibration and temperature, and special vibration isolation and constant temperature environment are not needed; (2) the imaging efficiency is high: by adopting an optical imaging method, a light intensity image can be obtained instantly after a light path is built, and the time consumed in polarization state modulation is almost 0 by adopting a polarization camera which can obtain various polarization angles by one-time exposure; (3) non-contact nondestructive measurement: the optical imaging method is adopted, the surface treatment of the microstructure to be detected is not needed, the sample to be detected cannot be damaged, and the stress state of the sample to be detected cannot be influenced; (4) the resolution is high: the method utilizes polarization parameter imaging to calculate a plurality of images with different polarization states and to reduce the weight of the point spread function, thereby bypassing the diffraction limit and obtaining a false color image with high resolution; (5) full field measurement: according to the invention, the beam is expanded by the beam expander before the light irradiates the sample to be measured, so that the light can be ensured to cover the microstructure to be measured meeting the measurement size, and the minimum pixel size of the polarization camera in charge of image acquisition can reach 3.45 micrometers, so that a high-precision result can be obtained under full-field measurement.
Drawings
FIG. 1 is a schematic diagram of an optical path of a microstructure mechanical behavior polarization parameter imaging system under multi-physical field loading.
FIG. 2 is a schematic diagram of a temperature loading device in a microstructure mechanical behavior polarization parameter imaging system under multi-physical field loading according to the present invention.
FIG. 3 is a schematic diagram of a static loading device in a polarization parameter imaging system of microstructure mechanical behavior under multi-physical field loading.
FIG. 4 is an overall schematic diagram of the microstructure mechanical behavior polarization parameter imaging system under the multi-physical field load.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
With reference to fig. 1, the microstructure mechanical behavior polarization parameter imaging system under the multi-physical field load of the invention is composed of an imaging light path, a temperature loading device and a static loading device.
The imaging light path is arranged on the vibration isolation table and used for collecting light intensity images with different polarization angles and performing subsequent image processing on the images, and comprises a laser light source 1, a beam expander 2, a polarizer 3, an 1/4 wave plate 4, a microstructure 5 to be detected, a first lens 6, a second lens 7, a polarization camera 8 and a computer 9 which are sequentially arranged, wherein the microstructure 5 to be detected is arranged between the 1/4 wave plate 4 and the first lens 6.
The laser light source 1 adopts a continuous laser, and is suitable for the condition that the load applied to the microstructure to be tested is quasi-static load, wherein the wavelength of the laser light source is 532 nm.
In this embodiment, the microstructure 5 to be measured is made of quartz glass, and has a rectangular parallelepiped shape and a temporary birefringence effect, and there is no stress in the microstructure of the quartz glass before being loaded, so that refractive indexes at various positions in the quartz glass are uniform and consistent, and optical isotropy is exhibited, and under the combined action of a temperature load and a static load, mechanical stress and thermal stress occur in the quartz glass, so that refractive indexes at various positions in the quartz glass are changed, and optical anisotropy is exhibited.
The polarization camera 8 can simultaneously and repeatedly acquire images with polarization information of 0 °, 45 °, 90 °, 135 °.
Referring to fig. 2, the temperature loading device adopts a high-temperature ceramic heating plate 10 as a temperature control element, a direct-current voltage stabilizing voltage source 11 as an excitation source, and a digital display type micro temperature sensor 12 as a temperature signal acquisition device, so that the surface of the microstructure to be measured can be heated and thermostatically controlled, the highest temperature of temperature control is 130 ℃, the temperature can be directly set and monitored, wherein the upper surface of the high-temperature ceramic heating plate 10 is in contact with the lower surface of the microstructure to be measured, the lower surface of the high-temperature ceramic heating plate 10 is in contact with a thermocouple electrode of the digital display type micro temperature sensor 12, and the temperature value of the surface of the high-temperature ceramic can be seen on a digital display panel in real time, so that the value of the temperature load applied to the.
Referring to fig. 3, the static loading device is composed of a three-dimensional object carrying platform 13 and a digital display type push-pull dynamometer 14, both of which are fixed on the vibration isolation platform, the microstructure 5 to be measured is placed on the three-dimensional object carrying platform 13, the three-dimensional object carrying platform 13 can manually adjust the position of the object carrying platform through X, Y, Z knobs in three directions so that light can better image after irradiating the microstructure 5 to be measured, the digital display type push-pull dynamometer 14 is arranged on the three-dimensional object carrying platform 13, a detecting head of the digital display type push-pull dynamometer 14 is in contact with the upper surface of the microstructure 5 to be measured, and static loading operation is applied downwards to the microstructure 5 to be measured, wherein the resolution of the digital display type push-pull dynamometer 14.
Referring to fig. 4, an overall schematic diagram of a microstructure mechanical behavior imaging system under the action of multi-physical field loading is shown. The polarization camera 8 transmits the collected light intensity images polarized in different directions to the computer 9, and the computer 9 processes the images to obtain S0、S1、S2、S3、δ、
The image with six polarization parameters comprises the following specific processes:
carrying out Stokes parameter image processing on the collected light intensity images polarized in different directions:
in the formula, I (0 degree), I (90 degree), I (45 degree) and I (135 degree) are light intensity images of different polarization angles collected by a polarization camera, and IRCPIntensity image of right-handed circularly polarized light, ILCPIntensity image of left-handed circularly polarized light; s0、S1、S2And S3To output an observed value of a polarization field, where S0Is the total intensity of the light beam, S1Is the intensity difference of the linearly horizontally polarized light and the linearly vertically polarized light, S2Is the intensity difference between the linearly vertically polarized +45 DEG polarized light component and the linearly vertically polarized-45 DEG polarized light component, S3The intensity difference of the right-handed circularly polarized light and the left-handed circularly polarized light; δ is a phase difference between horizontally polarized light and vertically polarized light; eoxAnd EoyThe amplitudes of the output light along the X-axis and Y-axis, respectively.
Based on the above definition, the phase difference δ can be given by the Stokes parameter, and the formula is:
azimuth angle of elliptically polarized light
May be given by the elliptical fillet formula:
after the image is processed by the formula, S can be obtained0、S1、S2、S3、δ、
The six images of the six polarization parameters can reflect the mechanical behavior information of the loaded microstructure from six different angles, and comprehensive mechanical behavior information of the loaded microstructure can be obtained after comprehensive analysis.
The imaging method of the microstructure mechanical behavior imaging system based on the multi-physical-field loading effect comprises the following steps of:
step 1, debugging a light path: and opening the laser light source and the polarization camera, adjusting the distance between the optical devices until the image acquired by the polarization camera can be clearly displayed on a computer, wherein the distance between the first lens and the microstructure to be tested is 1 time of the lens focal length after adjustment, the distance between the first lens and the second lens is 2 times of the lens focal length, the distance between the second lens and the polarization camera is 1 time of the lens focal length, and closing the laser light source and the polarization camera after debugging is successful.
Step 2, arranging a temperature loading device and a static force loading device: the microstructure to be measured is placed on a three-dimensional moving platform of the static loading device and placed between the 1/4 wave plate and the first lens, and the position of the microstructure to be measured on the loading platform is manually adjusted through knobs in three directions of the three-dimensional loading platform X, Y, Z, so that the microstructure to be measured can be completely covered by light rays expanded by the beam expander. The upper surface of a high-temperature ceramic heating plate of the temperature loading device is contacted with the lower surface of the microstructure to be measured, and the lower surface of the high-temperature ceramic heating plate is contacted with a thermocouple electrode of the digital display type micro temperature sensor. And finally, a probe of a digital display type push-pull dynamometer of the static loading device is contacted with the upper surface of the microstructure to be tested.
Step 3, load application and image acquisition: the method comprises the steps that the lower surface of a microstructure to be measured is heated through a temperature loading device, the upper surface of the microstructure to be measured is subjected to pressure loading operation through a static loading device, a laser light source and a polarization camera are turned on simultaneously, a computer obtains a plurality of light intensity images of the microstructure to be measured in different directions under a loaded state, the light intensity images are collected by the polarization camera, the light intensity images contain stress distribution information of the microstructure to be measured after being loaded, the light intensity images of the same polarization angle under different loads are different, and the light intensity images of different polarization angles under the same load are also different.
Step 4, image processing: performing Stokes parameter image on the light intensity images with different polarization directions collected in the step 3Processing to obtain S0、S1、S2、S3、δ、
An image of six polarization parameters, the formula adopted being:
in the formula, I (0 degree), I (90 degree), I (45 degree) and I (135 degree) are light intensity images of different polarization angles collected by a polarization camera, and IRCPIntensity image of right-handed circularly polarized light, ILCPIntensity image of left-handed circularly polarized light; s0、S1、S2And S3To output an observed value of a polarization field, where S0Is the total intensity of the light beam, S1Is the intensity difference of the linearly horizontally polarized light and the linearly vertically polarized light, S2Is the intensity difference between the linearly vertically polarized +45 DEG polarized light component and the linearly vertically polarized-45 DEG polarized light component, S3The intensity difference of the right-handed circularly polarized light and the left-handed circularly polarized light; δ is a phase difference between horizontally polarized light and vertically polarized light; eoxAnd EoyThe amplitudes of the output light along the X-axis and Y-axis, respectively.
Based on the above definition, the phase difference δ can be given by the Stokes parameter, and the formula is:
azimuth angle of elliptically polarized light
May be given by the elliptical fillet formula:
after the image is processed by the formula, the image can be processedTo obtain S0、S1、S2、S3、δ、
The six images of the six polarization parameters can reflect the mechanical behavior information of the loaded microstructure from six different angles, and comprehensive mechanical behavior information of the loaded microstructure can be obtained after comprehensive analysis.
The invention utilizes the polarization parameter image of the optical wave to analyze the mechanical behavior of the microstructure under the loading state, wherein the polarization parameter image of the optical wave refers to a phase difference image, a phase angle image and a Stokes parameter image which are obtained by processing the collected light intensity images with different polarization angles, and the mechanical behavior information of the structure can be reflected by different polarization parameter images from different angles. The microstructure mechanics behavior imaging system under the action of the multi-physical-field load has the advantages that the light path is simple and convenient to build and debug, the interference of the external environment is not easy to occur, the imaging efficiency and the resolution ratio are high, and full-field non-contact nondestructive measurement can be achieved.
Claims (6)
1. A microstructure mechanical behavior polarization parameter imaging system under multi-physical field load is characterized by comprising an imaging light path, a temperature loading device and a static loading device;
the imaging light path is arranged on the vibration isolation table and used for collecting light intensity images with different polarization angles and carrying out subsequent image processing on the images, and comprises a laser light source, a beam expander, a polarizer, an 1/4 wave plate, a microstructure to be detected, a first lens, a second lens and a polarization camera which are sequentially arranged; the polarization camera can simultaneously and repeatedly acquire images with polarization information of 0 degrees, 45 degrees, 90 degrees and 135 degrees and transmit the images to an image processing system;
the temperature loading device is used for heating and controlling the constant temperature of the surface of the microstructure to be tested;
the static loading device is used for applying static load to the microstructure to be tested;
the image processing system is used for processing the collected light intensity images with different polarization angles to obtain a phase difference image, a phase angle image and a Stokes parameter image.
2. The system for imaging the polarization parameters of the mechanical behaviors of the microstructure under the multi-physical-field load according to claim 1, wherein the image processing system processes:
carrying out Stokes parameter image processing on the collected light intensity images polarized in different directions:
the phase difference δ is:
azimuth angle
Comprises the following steps:
wherein S0Is the total intensity of the light beam, S1Is the intensity difference of the linearly horizontally polarized light and the linearly vertically polarized light, S2Is the intensity difference between the linearly vertically polarized +45 DEG polarized light component and the linearly vertically polarized-45 DEG polarized light component, S3The intensity difference of the right-handed circularly polarized light and the left-handed circularly polarized light; δ is a phase difference between horizontally polarized light and vertically polarized light; eoxAnd EoyThe amplitudes of the output light along the X-axis and Y-axis, respectively; i isRCPIntensity image of right-handed circularly polarized light, ILCPIntensity image of left-handed circularly polarized light.
3. The microstructure mechanical behavior polarization parameter imaging system under the multi-physical-field load as claimed in claim 1, wherein the temperature loading device adopts a high-temperature ceramic heating plate 10 as a temperature control element, a direct-current voltage stabilizing voltage source 11 as an excitation source, and a digital display type micro temperature sensor 12 as a temperature signal acquisition device.
4. The system for imaging polarization parameters of mechanical behaviors of microstructures under multi-physical-field load according to claim 1, wherein the static loading device comprises a three-dimensional object stage 13 and a digital display type push-pull dynamometer 14, and the digital display type push-pull dynamometer 14 is disposed on the three-dimensional object stage 13.
5. A polarization parameter imaging system for microstructure mechanical behavior under multi-physical-field load is characterized by comprising the following steps:
step 1, debugging a light path: adjusting the distance between the optical devices until the image collected by the polarization camera can be clearly displayed on a computer;
step 2, arranging a temperature loading device and a static loading device, wherein the microstructure to be tested can be completely covered by the light expanded by the beam expander;
step 3, load application and image acquisition: heating the lower surface of the microstructure to be tested by a temperature loading device, and simultaneously carrying out pressure loading operation on the upper surface of the microstructure to be tested by a static loading device to obtain a plurality of polarized light intensity images of the microstructure to be tested in different directions under a loaded state, which are acquired by a polarization camera;
step 4, image processing: and carrying out Stokes parameter image processing on the collected light intensity images with different polarization angles to obtain a phase difference image, a phase angle image and a Stokes parameter image.
6. The system for imaging the polarization parameters of the mechanical behaviors of the microstructure under the multi-physical-field load according to claim 5, wherein the image processing process in the step 4 is as follows:
carrying out Stokes parameter image processing on the collected light intensity images polarized in different directions:
the phase difference δ is:
azimuth angle
Comprises the following steps:
wherein S0Is the total intensity of the light beam, S1Is the intensity difference of the linearly horizontally polarized light and the linearly vertically polarized light, S2Is the intensity difference between the linearly vertically polarized +45 DEG polarized light component and the linearly vertically polarized-45 DEG polarized light component, S3The intensity difference of the right-handed circularly polarized light and the left-handed circularly polarized light; δ is a phase difference between horizontally polarized light and vertically polarized light; eoxAnd EoyThe amplitudes of the output light along the X-axis and Y-axis, respectively; i isRCPIntensity image of right-handed circularly polarized light, ILCPIntensity image of left-handed circularly polarized light.
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| CN1696604A (en) * | 2005-06-16 | 2005-11-16 | 华中科技大学 | Device of measuring dynamic characteristics of micro electromechanical system possessing environment-loading function |
| CN103528524A (en) * | 2013-09-16 | 2014-01-22 | 广东工业大学 | Device and method of perspective measurement of distribution of out-of-plane displacement field in resin matrix composite |
| CN110243784A (en) * | 2018-11-21 | 2019-09-17 | 湖北大学 | Crystalline ceramics elasto-optical coefficient test method based on Stokes vector |
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Application publication date: 20210423 |