CN112695274A

CN112695274A - Film coating machine

Info

Publication number: CN112695274A
Application number: CN202110039595.1A
Authority: CN
Inventors: 不公告发明人
Original assignee: Individual
Current assignee: Jiaxing Lewei Owen Technology Co ltd
Priority date: 2021-01-13
Filing date: 2021-01-13
Publication date: 2021-04-23
Anticipated expiration: 2041-01-13
Also published as: CN112695274B

Abstract

The invention relates to the technical field of coating, in particular to a coating machine which comprises a supporting mechanism, a cavity side wall, a wafer placing mechanism, a vacuum system, a coating cavity, an evaporation mechanism and a control system. The periphery of the supporting mechanism is fixedly connected with a cavity side wall, a film coating cavity is formed between the upper portion of the supporting mechanism and the lower portion of the top cover by the cavity side wall, a vacuum system is arranged at the top cover of the film coating cavity, an evaporation mechanism is arranged on the lower side of the inner portion of the film coating cavity, and the control system is embedded in the base mechanism. The vacuum system is arranged at the top of the film coating cavity, so that the proportion of the organic materials falling back to the inner wall of the film coating cavity or the position at the bottom of the cavity can be reduced. The method can reduce the material purity of each functional layer of the device on the wafer caused by the secondary evaporation of the organic material, and further improve the performance of the device.

Description

Film coating machine

Technical Field

The invention relates to the technical field of coating, in particular to a coating machine.

Background

An Organic Light-Emitting Diode (OLED) display, also called an Organic electroluminescent display, is a new flat panel display device, and has the advantages of low power consumption, self-luminescence, high brightness, wide application range of operating temperature, Light and thin volume, fast response speed, easy realization of color display, easy matching with an integrated circuit driver, easy realization of flexible display, and the like.

The light emission mechanism of OLEDs, which is currently generally recognized as a theoretical model of energy band, is considered to be injection type light emission, that is, holes injected from an anode and electrons injected from a cathode generate excitons after the light emitting layer is recombined, the excitons themselves release photons to return to a ground state by light radiation, or transfer energy to molecules of the light emitting layer, and electrons of an excited light emitting material transition from the ground state to an excited state and then return to the ground state by light radiation transition. The layer of luminescent material is plated on the substrate in a vacuum evaporation mode, so that the quality of the film affects the display quality of the screen. The quality of the film is greatly related to the evaporation process of the OLED, the existing plating source in the OLED evaporation process, particularly in the semiconductor display application, generally adopts point sources, according to the theory of free molecular motion, materials evaporated by the point sources are distributed in a dispersing manner, organic materials can be deposited at different positions in a coating cavity in the evaporation process, and in addition, the organic materials are evaporated and deposited again when the temperature in the coating cavity rises, so that the mutual interference is caused, the purity of materials of various functional layers is reduced, and the technical problem of negative influence on the photoelectric characteristics of devices is further formed.

Disclosure of Invention

The invention aims to solve the technical problem that in the prior art, secondary coating is formed due to the fact that the temperature inside a coating cavity of coating equipment is increased, so that the purity of materials of all functional layers is reduced, and further the photoelectric characteristics of a device are reduced.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a coating machine, includes supporting mechanism, cavity lateral wall, and the mechanism is placed to the wafer, vacuum system, coating film chamber, evaporation mechanism and control system, its characterized in that: the periphery of the supporting mechanism is fixedly connected with a cavity side wall, a film coating cavity is formed between the cavity side wall supporting mechanism and the top cover, the upper surface of the top cover is provided with a vacuum system, an evaporation mechanism is arranged on the lower side of the film coating cavity, and the control system is embedded in the base mechanism.

Furthermore, the supporting mechanism further comprises universal wheels, a motor base, a driving motor, a first bearing, a first bevel gear, a second bevel gear, a first gear, a second gear, a threaded sleeve, a second bearing, a threaded rod and a supporting disk, wherein four universal wheels are arranged on the outer ring of the bottom of the supporting mechanism at equal intervals, the motor base is fixedly connected above one universal wheel, the driving motor is fixedly welded above the motor base, the output end of the driving motor penetrates through and is rotatably connected with the first bearing, the output end of the driving motor is fixedly connected with the first bevel gear, the second bevel gear is meshed with the first bevel gear, the first gear is welded with the second bevel gear, one end of the first gear, which is far away from the second bevel gear, is rotatably connected with the supporting mechanism through the bearing, the second gear is arranged on the left side of the first gear and is meshed with the first gear, the bottom of second gear is passed through the bearing and is connected with the supporting mechanism rotation, the thread bush passes through the second bearing and is connected with the bottom rotation of supporting mechanism, the outside bottom of thread bush be provided with the dogtooth and with second gear intermeshing, the inside wall threaded connection threaded rod of thread bush, the bottom of threaded rod is passed through bearing fixed connection support disc.

Further, the cavity side wall comprises a coating cavity wall, radiating fins, auxiliary heat conducting strips, a radiating fan and a cavity, the cavity in the cavity side wall is provided with a plurality of groups of cavities in the vertical direction, the coating cavity wall is arranged on the cavity side wall, the radiating fins are fixedly connected to the surface of the coating cavity wall, the auxiliary heat conducting strips are fixedly arranged between the two radiating fins, the radiating fan is fixedly connected inside the cavity, the top end of the cavity penetrates through the top cover to be communicated with the outside, and the bottom end of the cavity penetrates through the supporting mechanism to be communicated with the outside.

Furthermore, the number of the heat dissipation fans is two, the two heat dissipation fans are respectively located at the upper and lower one-third positions of the cavity, the heat dissipation fan at the upper end blows upwards, and the heat dissipation fan at the lower end blows downwards.

Further, vacuum system includes first pump-line, second pump-line, third pump-line, molecular pump, fourth pump-line, mechanical pump, the pipeline of giving vent to anger, first pump-line is provided with four at least to the equidistance distributes in the top cap centre of a circle to the intermediate position department at edge, be equipped with in the top cap with first pump-line matched with vacuum pore, every vacuum pore communicates in second pump-line through the first pump-line of matched with, and third pump-line communicates second pump-line and molecular pump mutually, fourth pump-line communicates mechanical pump and molecular pump mutually, the molecular pump communicates with the external world through the pipeline of giving vent to anger, is located vacuum system's lower extreme fixedly connected with wafer placement mechanism, wafer placement mechanism includes wafer support and the wafer that is fixed in wafer support.

Further, the evaporation mechanism comprises an evaporation crucible, a crucible placing pit, a crucible baffle, a first connecting rod, a connecting bolt, a second connecting rod, a heat-conducting metal sheet, a ceramic base and a ceramic bracket, a plurality of crucible placing pot holes are arranged in the ceramic bracket, the evaporation crucible is movably connected with the ceramic bracket, the connecting bolt is fixed on the upper surface of the ceramic base, the second connecting rod is rotationally connected with the connecting bolt, one end of the second connecting rod is fixedly connected with the first connecting rod, one end of the first connecting rod, which is far away from the second connecting rod, is welded with the crucible baffle, one end of the second connecting rod, which is far away from the first connecting rod, is fixedly connected with the heat-conducting metal sheet, the heat-conducting metal sheet is fixedly connected with the side wall of the cavity through screws, and the materials used for manufacturing the first connecting rod, the second connecting rod and the heat-conducting metal sheet are memory alloy materials.

Furthermore, the diameter of the crucible placing pot hole is 2-3 times of that of the evaporation crucible, and the depth of the crucible placing pot hole is 5-10 cm.

Furthermore, the height of the ceramic support is flush with that of the ceramic base, and the distance from the top end of the evaporation crucible to the ceramic base is 1-2 times of the depth of the crucible placing pot hole.

Furthermore, the radius of the upper end of the evaporation crucible is larger than that of the bottom end, the included angle between the side wall and the horizontal plane is 30-75 degrees, the first connecting rod and the second connecting rod are in a straight shape, and are bent to form a bending structure after the temperature rises, and the crucible baffle, the first connecting rod, the second connecting rod and the heat conducting metal sheet are integrally formed.

Furthermore, the vacuum system, the evaporation mechanism and the cooling fan are all electrically connected with the control system.

Compared with the prior art, the invention has the beneficial effects that:

1. the vacuum system is arranged at the top cover of the coating cavity, the coating cavity is vacuumized from the upper part of the coating cavity, and as organic materials are evaporated and flown from the bottom of the coating cavity to the upper part of the coating cavity, partial organic materials with insufficient molecular energy cannot reach the top of the coating cavity or the position of a wafer, and can descend back to the inner wall of the coating cavity or the position of the bottom of the cavity under the action of gravity. The traditional method is to arrange the vacuum system at the bottom of the equipment, so that the stability of the equipment can be well maintained. However, because the direction of the air flow caused by vacuumizing inside the film coating cavity is opposite to the advancing direction of organic material molecules, the proportion of the organic material falling back to the inner wall of the film coating cavity or the position of the bottom of the cavity is improved. The probability of the organic material being secondarily evaporated on the wafer is further reduced, so that the purity of each functional layer in the manufacturing process of the device is improved, and the technical effect of improving the photoelectric performance of the device is further achieved.

2. Heat on the side wall of the film coating cavity is absorbed by the arrangement of the radiating fins, and the auxiliary heat conducting strips are arranged among the radiating fins, so that the heat on the side wall of the film coating cavity can be absorbed to a greater extent after the fan is started. Alternatively, a vortex of air may be formed within the cavity. Further improving the efficiency of radiating the side wall of the film coating chamber.

3. The technical effect that the fans with the least number form the strongest airflow to improve the heat dissipation efficiency and reduce the equipment cost can be achieved by setting the positions of the heat dissipation fans.

4. By disposing the evaporation crucible in the crucible placing pot hole, and further restricting the size of the crucible pot hole and the inclination of the side wall of the evaporation crucible, the organic material falling to the vicinity outside the evaporation crucible can be made to be distant from the evaporation crucible. Therefore, when the evaporation crucible is heated, the material outside the evaporation crucible is far away from the evaporation crucible and cannot be subjected to secondary evaporation, so that the purity of the material in the manufacturing process of each functional layer of a device on a wafer caused by the secondary evaporation of the organic material can be reduced, and the technical effect of improving the performance of the device is further achieved.

5. By adopting the memory alloy, the first connecting rod and the second connecting rod are parallel to each other at normal temperature, and are bent to form a bending structure after the temperature is increased. Even after the temperature of the side wall rises, the crucible baffle can also shield the evaporation crucible in time through the memory alloy, and evaporation coating is forcibly suspended, so that the technical effects that the coating effect is not influenced, and the evaporation coating process is continuously carried out after the abnormal phenomenon is eliminated are achieved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional view of the support mechanism;

FIG. 3 is a schematic cross-sectional view of the sidewall of the chamber shown in FIG. 1;

FIG. 4 is a schematic top cross-sectional view of the sidewall of the chamber of FIG. 1;

FIG. 5 is a schematic view of the vacuum mechanism;

FIG. 6 is a schematic view of an evaporation mechanism;

FIG. 7 is a schematic view of the first connecting rod and the second connecting rod after temperature rise;

in the figure: 1. a support mechanism; 101. a universal wheel; 102. a motor base; 103. a drive motor; 104. a first bearing; 105. a first bevel gear; 106. a second bevel gear; 107. a first gear; 108. a second gear; 109. a threaded sleeve; 110. a second bearing; 111. a threaded rod; 112. a support disc; 2. a cavity side wall; 201. the wall of the coating cavity; 202. a heat dissipating fin; 203. auxiliary heat conducting strips; 204. a heat radiation fan; 205. a cavity; 3. a wafer placement mechanism; 301. a wafer support; 302. a wafer; 4. a vacuum system; 401. a first pumping duct; 402. a second pumping duct; 403. a third pumping duct; 404. a molecular pump; 405. a fourth pumping duct; 406. a mechanical pump; 407. an air outlet pipe; 5. coating a film cavity; 6. an evaporation mechanism; 601. evaporating the crucible; 602. placing the pot in the pot hole; 603. a crucible baffle plate; 604. a first connecting rod; 605. a connecting bolt; 606. a second connecting rod; 607. a heat conductive metal sheet; 608. a ceramic base; 609. a ceramic support; 7. a control system; 8. and a top cover.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides a coating machine, includes supporting mechanism, cavity lateral wall, wafer placement machine constructs, vacuum system, coating chamber, evaporation mechanism to and control system, its characterized in that: supporting mechanism 1 fixedly connected with cavity lateral wall 2 all around, form coating film chamber 5 between cavity lateral wall 2, supporting mechanism 1 and top cap 8, top cap 8 upper surface is provided with vacuum system 4, and 5 downside in coating film chamber are equipped with evaporation plant 6, and control system 7 inlays to be established in base mechanism 1. The vacuum system is arranged at the top of the film coating cavity, so that the proportion of the organic materials falling back to the inner wall of the film coating cavity or the position at the bottom of the cavity can be reduced. The probability of the organic material being evaporated to the wafer for the second time is further reduced, so that the purity of each functional layer in the manufacturing process of the device is improved, and the photoelectric performance of the device is further improved.

The supporting mechanism 1 further comprises universal wheels 101, a motor base 102, a driving motor 103, a first bearing 104, a first bevel gear 105, a second bevel gear 106, a first gear 107, a second gear 108, a threaded sleeve 109, a second bearing 110, a threaded rod 111 and a supporting disk 112, four universal wheels 101 are arranged on the outer ring of the bottom of the supporting mechanism at equal intervals, the motor base 102 is fixedly connected above one universal wheel 101, the driving motor 103 is fixedly welded above the motor base 102, the output end of the driving motor 103 penetrates through and is rotatably connected to the first bearing 104, the output end of the driving motor 103 is fixedly connected with the first bevel gear 105, the second bevel gear 106 is meshed with the first bevel gear 105, the first gear 107 is welded with the second bevel gear 106, one end of the first gear 107 far away from the second bevel gear 106 is rotatably connected with the supporting mechanism 1 through a bearing, the second gear 108 is arranged on the left side of the first gear 107 and is meshed with the first gear 107, the bottom end of the second gear 108 is rotatably connected with the supporting mechanism 1 through a bearing, the threaded sleeve 109 is rotatably connected with the bottom end of the supporting mechanism 1 through a second bearing 110, the bottom of the outer side of the threaded sleeve 109 is provided with convex teeth and is mutually meshed with the second gear 108, the inner side wall of the threaded sleeve 109 is in threaded connection with a threaded rod 111, the bottom end of the threaded rod 111 is fixedly connected with a supporting disc 112 through a bearing, the second bevel gear can be driven by the motor to rotate, and further drives the threaded sleeve 109 to rotate through the first gear 107 and the second gear 108, thereby completing the lifting control of the supporting disk 112, when the equipment needs to be moved, the supporting disk 112 can be lifted, the equipment can be moved through the universal wheels 101, when it is desired to vaporize organic material to fabricate a device, the support disk 112 may be lowered, because the contact area of the supporting disk 112 and the ground is larger, the coating machine can be stably supported.

The cavity side wall 2 comprises a coating cavity wall 201, radiating fins 202, auxiliary heat conducting strips 203, a radiating fan 204 and a cavity 205, the cavity 205 in the cavity side wall 2 is provided with a plurality of groups of cavities 205 in the vertical direction in an array mode, the cavity 205 side wall is provided with the coating cavity wall 201, the surface of the coating cavity wall 201 is fixedly connected with the radiating fins 202, the auxiliary heat conducting strips 203 are fixedly arranged between the two radiating fins 202, the radiating fan 204 is fixedly connected inside the cavity 205, the top end of the cavity 205 penetrates through the top cover 8 to be communicated with the outside, and the bottom end of the cavity 205 penetrates through the supporting. The two cooling fans 204 are respectively located at the upper and lower one-third positions of the cavity 205, the upper cooling fan 204 blows upwards, and the lower cooling fan 204 blows downwards. The heat on the coating cavity wall 201 is absorbed by arranging the radiating fins 202, and the auxiliary heat conducting strips 203 are arranged among the radiating fins 202, so that the heat of the coating cavity wall 201 can be absorbed to a greater extent. In addition, after the fan is started, an air vortex can be formed in the cavity 205, the efficiency of heat dissipation of the coating cavity wall 201 is further improved, and the heat dissipation fan is arranged at the position 1/3, so that the technical effects that the minimum number of heat dissipation fans 204 form the strongest airflow to improve the heat dissipation efficiency and reduce the equipment cost and the energy consumption are achieved.

The vacuum system 4 comprises a first pumping duct 401, a second pumping duct 402, a third pumping duct 403, a molecular pump 404, a fourth pumping duct 405, a mechanical pump 406 and an air outlet duct 407, wherein the number of the first pumping duct 401 is at least four, and the first pumping duct 401 is equidistantly distributed from the center of the circle to the middle of the edge of the top cover 8, a vacuum duct matched with the first pumping duct 401 is arranged in the top cover 8, each vacuum duct is communicated with the second pumping duct 402 through the first pumping duct 401 matched with the vacuum duct, the second pumping duct 402 is communicated with the molecular pump 404 through the third pumping duct 403, the mechanical pump 406 is communicated with the molecular pump 404 through the fourth pumping duct 405, the molecular pump 404 is communicated with the outside through the air outlet duct 407, a wafer placing mechanism 3 is fixedly connected to the lower end of the vacuum system 4, the wafer placing mechanism 3 comprises a wafer support 301 and a wafer 302 fixed on the wafer support 301, the vacuum pore channels are positioned from the circle center of the top cover 8 to the edge center and are distributed at equal intervals, so that the air flow can be uniformly distributed, and the quality of the film coating film layer is improved. In addition, the molecular pump 404 and the mechanical pump 406 are arranged to jointly vacuumize the evaporation cavity, so that a higher vacuum degree can be formed in the evaporation cavity, and the technical effect of film coating quality is ensured.

The evaporation mechanism 6 comprises an evaporation crucible 601, a crucible placing pot hole 602, a crucible baffle 603, a first connecting rod 604, a connecting bolt 605, a second connecting rod 606, a heat-conducting metal sheet 607, a ceramic base 608 and a ceramic support 609, a plurality of crucible placing pot holes 602 are formed in the ceramic support 608, the evaporation crucibles 601 are movably connected to the ceramic support 609, the connecting bolts 605 are fixed to the upper surface of the ceramic base 608, the second connecting rods 606 are rotatably connected with the connecting bolts 605, one ends of the second connecting rods 606 are fixedly connected with the first connecting rods 604, one ends of the first connecting rods 604 far away from the second connecting rods 606 are welded with the crucible baffle 603, one ends of the second connecting rods 606 far away from the first connecting rods 604 are fixedly connected with the heat conducting metal sheets 607, the heat conducting metal sheets 607 are fixedly connected with the side wall 2 of the cavity through screws, and materials used for manufacturing the first connecting rods 604, the second connecting rods 606 and the heat conducting metal sheets 607 are memory alloy materials. The diameter of the crucible placing pot hole 602 is 2-3 times of the diameter of the evaporation crucible 601, and the depth of the crucible placing pot hole 602 is 5-10 cm; the height of the ceramic support 609 is equal to that of the ceramic base 608, and the distance from the top end of the evaporation crucible 601 to the ceramic base 608 is 1-2 times of the depth of the crucible placing pit 602; the radius of the upper end of the evaporation crucible 601 is larger than that of the bottom end, the included angle between the side wall and the horizontal plane is 30-75 degrees, the first connecting rod 604 and the second connecting rod 606 are in a straight shape at normal temperature, when the temperature rises, the first connecting rod 604 and the second connecting rod 606 are bent mutually to form a bending structure, memory alloy is adopted, the first connecting rod 604 and the second connecting rod 606 are in a straight shape at normal temperature, and when the temperature rises, the first connecting rod 604 and the second connecting rod 606 are bent mutually to form a bending structure. Even can also make crucible baffle 603 in time shelter from evaporation crucible 601 through memory alloy after coating film chamber wall 201 temperature rises, force suspension evaporation coating film, can not influence the coating film quality, can continue evaporation coating film operation after getting rid of abnormal phenomenon, in addition, second connecting rod 606 rotates with connecting bolt 605 to be connected, can conveniently when the position of crucible baffle 603 needs to be adjusted, will connect the screw of heat conduction sheetmetal 607 and cavity lateral wall 2 and demolish, adjust the position of crucible baffle 603 again.

The vacuum system 4, the evaporation mechanism 6 and the cooling fan 204 are electrically connected with the control system 7, and the vacuum system, the evaporation mechanism and the cooling fan can be directly controlled by the control system 7, so that the operation of an operator is more convenient during working.

Example two

On the basis of the first embodiment, the plurality of vacuum ducts provided in the top cover 8 are arranged as circular rings located at the middle positions from the center to the edge of the top cover 8. The air flow in the film coating cavity 5 is more uniform, and the material is more uniformly deposited on the wafer, so that the performance of the device can be improved. On the other hand, the proportion of the material falling into the coating chamber 5 can be further reduced to reduce the influence of secondary evaporation.

EXAMPLE III

In the first embodiment, the mechanical pump 406 and the molecular pump 404 of the vacuum system 4 are both disposed on the ground, and the vacuum duct is connected to the molecular pump 404 through a plurality of pipes. The vacuum port is connected to the molecular pump by a plurality of pipes by placing the mechanical pump 406 and the molecular pump 404 on the ground while maintaining the placement of the vacuum port on the top cover 8. Not only can improve the quality of coating film, but also can reduce the vibrations of whole equipment and keep the stability of equipment simultaneously.

The working principle is as follows: when the equipment needs to be moved, the supporting disc 112 can be controlled by the driving motor 103 to move upwards, the film coating machine is moved by the universal wheel 101, after the equipment is moved to a specified position, when a film coating device needs to be manufactured, the evaporation crucible 601 in the evaporation system can be heated by the control system 7, and because the airflow in the film coating cavity 5 flows upwards, organic material molecules which are not evaporated on a wafer due to low energy in the rising process can be pumped away by a vacuum system to the maximum extent, and the possibility that secondary film forming is deposited on the surface of the wafer due to the fact that the organic material molecules fall into the film coating cavity 5 for the second time is reduced; meanwhile, the coating cavity wall 201 is cooled through the cooling fins 202, the auxiliary cooling strips 203, the cooling fan 204 and the like on the cavity side wall 2, so that the coating cavity wall 201 is maintained in a low room temperature state, and even if a small amount of organic material molecules and other impurities exist in the coating cavity wall 201, the organic material molecules and other impurities cannot be deposited on the surface of the wafer again due to the temperature rise of the cavity side wall to influence the performance of a manufactured device; meanwhile, by disposing the evaporation crucible 601 in the crucible placing pot hole, and further restricting the size of the crucible pot hole and the inclination of the side wall of the evaporation crucible, the organic material falling to the vicinity of the outside of the evaporation crucible can be made to be away from the evaporation crucible. Therefore, when the evaporation crucible is heated, the material outside the evaporation crucible is far away from the evaporation crucible, so that secondary evaporation is avoided, the purity of the material of the manufactured device function layer is reduced, and the photoelectric performance of the device is further reduced.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a coating machine, includes supporting mechanism, cavity lateral wall, and the mechanism is placed to the wafer, vacuum system, coating film chamber, evaporation mechanism and control system, its characterized in that: fixedly connected with cavity lateral wall (2) all around of supporting mechanism (1), form coating film chamber (5) between cavity lateral wall (2), supporting mechanism (1) and top cap (8), top cap (8) upper surface is provided with vacuum system (4), coating film chamber (5) downside is equipped with evaporation mechanism (6), control system (7) inlay and establish in base mechanism (1).

2. A coater as defined in claim 1 wherein: the supporting mechanism (1) further comprises universal wheels (101), a motor base (102), a driving motor (103), a first bearing (104), a first bevel gear (105), a second bevel gear (106), a first gear (107), a second gear (108), a threaded sleeve (109), a second bearing (110), a threaded rod (111) and a supporting disc (112), wherein the four universal wheels (101) are arranged on the outer ring of the bottom of the supporting mechanism at equal intervals, the motor base (102) is fixedly connected to the upper portion of the universal wheels (101), the driving motor (103) is fixedly welded to the upper portion of the motor base (102), the output end of the driving motor (103) penetrates through and is rotatably connected to the first bearing (104), the output end of the driving motor (103) is fixedly connected with the first bevel gear (105), and the second bevel gear (106) is meshed with the first bevel gear (105), first gear (107) and second bevel gear (106) weld mutually, and first gear (107) are kept away from the one end of second bevel gear (106) and are passed through the bearing and are rotated with supporting mechanism (1) and be connected, and second gear (108) set up in the left side of first gear (107) and are connected with first gear (107) meshing, and the bottom of second gear (108) is passed through the bearing and is rotated with supporting mechanism (1) and be connected, thread bush (109) are rotated with the bottom of supporting mechanism (1) through second bearing (110) and are connected, the outside bottom of thread bush (109) is provided with the dogtooth and with second gear (108) intermeshing, inside wall threaded connection threaded rod (111) of thread bush (109), bearing fixed connection support disc (112) are passed through to the bottom of threaded rod (111).

3. A coater as defined in claim 1 wherein: the cavity side wall (2) comprises a coating cavity wall (201), radiating fins (202), auxiliary heat conducting strips (203), a radiating fan (204) and a cavity (205), the cavity side wall (2) is internally provided with the cavities (205) in multiple groups of vertical directions in an array mode, the cavity (205) side wall is provided with the coating cavity wall (201), the surface of the coating cavity wall (201) is fixedly connected with the radiating fins (202), the auxiliary heat conducting strips (203) are fixedly arranged between the two radiating fins (202), the radiating fan (204) is fixedly connected inside the cavity (205), the top end of the cavity (205) penetrates through the top cover (8) and is communicated with the outside, and the bottom end of the cavity (205) penetrates through the supporting mechanism (1) and is communicated with the outside.

4. A coater as defined in claim 3 wherein: the two heat dissipation fans (204) are respectively positioned at the upper and lower one-third positions of the cavity (205), the upper end heat dissipation fan (204) blows upwards, and the lower end heat dissipation fan (204) blows downwards.

5. A coater as defined in claim 1 wherein: the vacuum system (4) comprises a first air pumping pipeline (401), a second air pumping pipeline (402), a third air pumping pipeline (403), molecular pumps (404), a fourth air pumping pipeline (405), a mechanical pump (406) and an air outlet pipeline (407), wherein at least four first air pumping pipelines (401) are arranged and are distributed at the middle position from the circle center to the edge of the top cover (8) at equal intervals, the top cover (8) is provided with vacuum pore canals matched with the first air pumping pipeline (401), each vacuum pore canal is communicated with the second air pumping pipeline (402) through the first air pumping pipeline (401) matched with the vacuum pore canal, the second air pumping pipeline (402) is communicated with the molecular pumps (404) through the third air pumping pipeline (403), the mechanical pump (406) is communicated with the molecular pumps (404) through the fourth air pumping pipeline (405), and the molecular pumps (404) are communicated with the outside through the air outlet pipeline (407), the lower end of the vacuum system (4) is fixedly connected with a wafer placing mechanism (3), and the wafer placing mechanism (3) comprises a wafer support (301) and a wafer (302) fixed on the wafer support (301).

6. A coater as defined in claim 1 wherein: the evaporation mechanism (6) comprises an evaporation crucible (601), crucible placing pot holes (602), crucible baffles (603), a first connecting rod (604), connecting bolts (605), a second connecting rod (606), a heat-conducting metal sheet (607), a ceramic base (608) and a ceramic support (609), wherein the ceramic base (608) is internally provided with a plurality of crucible placing pot holes (602), the evaporation crucible (601) is movably connected to the ceramic support (609), the connecting bolts (605) are fixed on the upper surface of the ceramic base (608), the second connecting rod (606) is rotatably connected with the connecting bolts (605), one end of the second connecting rod (606) is fixedly connected with the first connecting rod (604), one end of the first connecting rod (604), which is far away from the second connecting rod (606), is welded with the crucible baffles (603), one end of the second connecting rod (606), which is far away from the first connecting rod (604), is fixedly connected with the heat-conducting metal sheet (607), the heat-conducting metal sheet (607) is fixedly connected with the side wall (2) of the cavity through screws, and the materials used for manufacturing the first connecting rod (604), the second connecting rod (606) and the heat-conducting metal sheet (607) are memory alloy materials.

7. A coater as defined in claim 6 wherein: the diameter of the crucible placing pot hole (602) is 2-3 times of that of the evaporation crucible (601), and the depth of the crucible placing pot hole (602) is 5-10 cm.

8. A coater as defined in claim 6 wherein: the height of the ceramic support (609) is equal to that of the ceramic base (608), and the distance from the top end of the evaporation crucible (601) to the ceramic base (608) is 1-2 times of the depth of the crucible placing pit (602).

9. A coater as defined in claim 6 wherein: the radius of the upper end of the evaporation crucible (601) is larger than that of the bottom end, the included angle between the side wall and the horizontal plane is 30-75 degrees, the first connecting rod (604) and the second connecting rod (606) are in a straight shape, when the temperature rises, the first connecting rod and the second connecting rod are bent mutually to form a bending structure, and the crucible baffle (603), the first connecting rod (604), the second connecting rod (606) and the heat conducting metal sheet (607) are integrally connected.

10. A coater as defined in claim 1 wherein: the vacuum system (4), the evaporation mechanism (6) and the heat dissipation fan (204) are electrically connected with the control system (7).