CN112670222A - Wafer cleaning system - Google Patents
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- CN112670222A CN112670222A CN202011553797.XA CN202011553797A CN112670222A CN 112670222 A CN112670222 A CN 112670222A CN 202011553797 A CN202011553797 A CN 202011553797A CN 112670222 A CN112670222 A CN 112670222A
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- 230000005540 biological transmission Effects 0.000 claims abstract description 94
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- 230000008569 process Effects 0.000 claims abstract description 55
- 238000007599 discharging Methods 0.000 claims abstract description 27
- 235000012431 wafers Nutrition 0.000 claims description 148
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Abstract
The invention discloses a wafer cleaning system, which comprises a feeding control module, a discharging control module, a manipulator control module, a lower computer, a feeding module, a discharging module, a process tank module and a manipulator transmission module, wherein the feeding control module is connected with the feeding control module; the feeding control module, the discharging control module and the manipulator control module are all connected with the lower computer; the loading module is in control connection with the loading control module and is used for transmitting the wafer bearing device from the loading position to the loading transmission position; the blanking module is in control connection with the blanking control module and is used for transmitting the wafer bearing device from the blanking transmission position to the discharging position; the process tank module is positioned between the feeding module and the discharging module; and the manipulator transmission module is in control connection with the manipulator control module and is used for transmitting the wafer bearing device among the feeding transmission position, the process tank module and the discharging transmission position. The scheme can solve the problem of poor safety performance of the cleaning system.
Description
Technical Field
The invention relates to the technical field of semiconductor chip manufacturing, in particular to a wafer cleaning system.
Background
In a semiconductor chip manufacturing process, after a wafer is subjected to an etching process, the wafer needs to be cleaned to remove residues on the surface of the wafer.
In the related art, the wafer is often cleaned by a tank cleaning method, which can clean a plurality of wafers at the same time. The wafer cleaning system comprises a feeding machine table, a wafer transmission system and a technological mechanical clamping device, wherein in the specific working process, a manipulator in the wafer transmission system transmits a wafer on the feeding machine table into the wafer transmission device, the wafer is clamped by the manipulator in the technological mechanical clamping device after the position of the wafer is adjusted by the wafer transmission device, the wafer is placed into a technological groove to be cleaned, then the wafer is transmitted back to the wafer transmission system, and the wafer is transmitted back to the feeding machine table by the manipulator in the wafer transmission system, so that the cleaning of the wafer is completed.
However, the loading and unloading of the wafer are both on the same side of the cleaning system, and therefore, the wafer needs to be transferred back after the wafer is cleaned, so that the working steps of the mechanical clamping device are increased, the control difficulty of the mechanical clamping device is further increased, and the safety of the cleaning system is poor.
Disclosure of Invention
The invention discloses a wafer cleaning system, which aims to solve the problem of poor safety of the cleaning system.
In order to solve the problems, the invention adopts the following technical scheme:
a system for cleaning a wafer, comprising:
the feeding control module, the discharging control module and the manipulator control module are all connected with the lower computer;
the loading module is in control connection with the loading control module and is used for transmitting the wafer bearing device from the loading position to the loading transmission position;
the blanking module is in control connection with the blanking control module and is used for transmitting the wafer bearing device from a blanking transmission position to a discharging position;
the process tank module is positioned between the feeding module and the discharging module;
and the manipulator transmission module is in control connection with the manipulator control module and is used for transmitting the wafer bearing device among the feeding transmission position, the process groove module and the discharging transmission position.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the cleaning system disclosed by the invention, the cleaning process of the wafer is that the loading module firstly transmits the wafer bearing device from the feeding position to the loading transmission position, then the manipulator transmission module clamps the wafer bearing device from the loading transmission position and transmits the wafer bearing device to the process tank module for cleaning, then the manipulator transmission module transmits the cleaned wafer bearing device to the unloading transmission position, and the unloading module transmits the wafer bearing device from the unloading transmission position to the unloading position, so that the cleaning of the wafer is finished. In the scheme, the blanking and loading of the wafer are positioned at two sides of the process tank, so that the wafer bearing device is loaded at one side and unloaded at the other side, return is not needed, the working steps of the manipulator transmission module are reduced, the control difficulty of the manipulator transmission module is smaller, and the safety performance of the cleaning system is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a wafer cleaning system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a robot transport module of a wafer cleaning system according to an embodiment of the present invention;
fig. 3 is a schematic hardware configuration diagram of a wafer cleaning system according to an embodiment of the present invention.
Description of reference numerals:
100-a feeding module, 110-a first motor transmission device, 120-a first cylinder transmission device,
200 parts of blanking module, 210 parts of second motor transmission device, 220 parts of second cylinder transmission device,
300-process tank module,
400-robot transfer module, 410-first robot, 420-second robot, 430-first proximity switch, 440-second proximity switch, 450-third proximity switch, 460-fourth proximity switch,
510-feeding position, 520-feeding transmission position, 530-blanking transmission position and 540-blanking position.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 3, an embodiment of the present invention discloses a wafer cleaning system, which is used for cleaning a wafer, and the disclosed cleaning system includes a feeding control module, a discharging control module, a robot control module, a lower computer, a feeding module 100, a discharging module 200, a process tank module, and a robot transmission module 400.
The feeding control module is connected with the feeding module 100 in a control mode and is used for controlling the feeding module 100 to act. The loading module 100 is used to transfer the wafer carrier from the loading station 510 to the loading transfer station 520. The loading position 510 refers to the inlet end of the loading module 100, and the operator places the wafer carrier into the loading position 510. The loading transfer station 520 is the exit end of the loading module and is also the clamping position of the robot module.
The blanking control module is connected with the blanking module 200 in a control way and is used for controlling the action of the blanking module 200. The unloading module 200 is used for transferring the wafer carrier from the unloading transfer station 530 to the unloading station 540. The unloading transfer station 530 is an inlet end of the unloading module 200, and the robot transfer module 400 places the cleaned wafer carrier in the unloading transfer station 530. The unloading position 540 refers to the outlet end of the unloading module 200, and the operator takes out the wafer carrier.
The process tank module 300 is located between the feeding module 100 and the discharging module 200. The wafer carrier is placed in the process tank module 300 to clean the wafer.
The robot transfer module 400 is used for transferring the wafer carrier, and the robot transfer module 400 transfers the wafer carrier among the loading transfer station 520, the process tank module 300, and the unloading transfer station 530. The manipulator control module is in control connection with the manipulator transmission module 400 and is thus used for controlling the action of the manipulator transmission module 400.
The lower computer is a control main body of the cleaning system. The feeding control module, the discharging control module and the manipulator control module are all connected with the lower computer. The lower computer is used for sending control information to the feeding control module, the discharging control module and the manipulator control module.
In the specific operation process, the loading module 100 first transfers the wafer carrier from the loading position 510 to the loading transmission position 520, then the robot transmission module 400 picks up the wafer carrier from the loading transmission position 520, and transfers the wafer carrier to the process tank module for cleaning, and then the robot transmission module 400 transfers the cleaned wafer carrier to the unloading transmission position 530. The unloading module 200 transfers the wafer carrier from the unloading transfer station 530 to the unloading station 540, thereby completing the cleaning of the wafer.
In the embodiment of the present application, the unloading and loading of the wafer are located at two sides of the process tank module 300, so that the wafer carrying device loads the wafer at one side and unloads the wafer at the other side without passing back, thereby reducing the working steps of the manipulator transmission module 400, further making the control difficulty of the manipulator transmission module 400 smaller, and further improving the safety performance of the cleaning system.
In addition, the wafer bearing device is loaded on one side and unloaded on the other side, return is not needed, and collision between the loaded wafer bearing device and the unloaded wafer bearing device is avoided.
In another alternative embodiment, the loading module 100 may include a first motor transfer device 110 and a first cylinder transfer device 120, the first motor transfer device 110 transferring the wafer carrier from the loading station 510 to the first transfer station, and the first cylinder transfer device 120 transferring the wafer carrier from the first transfer station to the loading station 520.
In a specific operation process, a user puts the wafer carrier into the loading position 510, and the first motor driving device transports the wafer carrier to a first transfer position, which is the farthest end that can be transported by the first motor driving device. The first cylinder transfer device 120 then transports the wafer carrier on the first transfer station to the infeed transfer station 520. The first transfer position is here the transfer position of the first motor drive and the first cylinder drive.
In this scheme, there are a plurality of detection links between reinforced position 510 of material loading module 100 and the first transfer position, and a plurality of detection links need to detect wafer carrier's position and the quantity and the position of wafer, consequently need higher control accuracy, use first motor drive can improve control accuracy. And the wafer carrying device is only conveyed to the clamping position of the manipulator transmission module 400 between the first transferring position and the loading transmission position 520 of the loading module 100, so that the transmission precision is low, and further, the cylinder transmission is adopted, and the control mode of the cylinder transmission is simple.
Optionally, the first motor driving device includes a servo motor and a transmission belt device, the servo motor is connected to the transmission belt device, and the servo motor drives the transmission belt to rotate. Of course, the first motor driving device may also adopt other power structures without limitation. The cylinder of the first cylinder transfer device 120 may be a single-acting cylinder, a double-acting cylinder, or a rodless cylinder, but the first cylinder transfer device 120 may also be another cylinder, which is not limited herein.
In another alternative embodiment, the unloading module 200 may include a second motor transmission device 210 and a second air cylinder transmission device 220, the second air cylinder transmission device 220 may transmit the wafer carrier from the unloading transmission position 530 to the second transfer position, and the second motor transmission device 210 may transmit the wafer carrier from the second transfer position to the unloading position 540.
In a specific operation process, the robot transmission module 400 transports the wafer carrier to the unloading transmission position 530, and the second cylinder transmission device 220 transports the wafer carrier to a second transfer position, which is a switching position of the second motor driving device and the first cylinder driving device. The second motor drive then transports the wafer carrier at the second transfer station to the unload station 540 where the operator can remove the wafer carrier at the unload station 540.
In this scheme, there are a plurality of detection links between unloading position 540 of unloading module 200 and the second reprinting position, and a plurality of detection links need detect wafer carrier's position and the quantity and the position of wafer, consequently need higher control accuracy, use the control of second motor drive device to improve control accuracy. And the wafer bearing device is only conveyed to the transmission position of the second motor driving device between the second transfer position and the blanking transmission position 530 of the blanking module 200, so that the transmission precision is low, and further, the cylinder transmission is adopted, and the control mode of the cylinder transmission is simple.
Alternatively, the second motor transmission device 210 includes a servo electrode and a transmission belt device, the servo motor is connected to the transmission belt device, and the servo motor drives the transmission belt to rotate, however, the second motor transmission device 210 may also adopt other power structures without limitation. The air cylinder in the second air cylinder transmission device 220 may be a single-acting air cylinder, a double-acting air cylinder or a rodless air cylinder, although other air cylinders may also be used for the second air cylinder transmission device 220, and the disclosure is not limited thereto.
The feeding machine in the related art integrates feeding and discharging, so that the volume of the feeding machine is large. The motor transmission device and the cylinder transmission device of material loading and unloading in this application separately set up, and consequently motor transmission device and cylinder transmission device's volume is less to the mounted position that makes cleaning system occupy is less.
In another alternative embodiment, the loading module 100 may further include a first detection component, which is in control connection with the loading control module, and the first detection component may be used to detect information parameters of the wafers in the wafer carrier on the loading level 510, where the information parameters may include the number of the wafers and the position status of the wafers. In the scheme, the first detection assembly can be used for detecting the number of the wafers and the position states of the wafers, and further, a cleaning process formula can be configured according to the detected information parameters of the wafers, so that the cleaning effect of the wafers is improved.
In a specific operation process, when the wafer transfer device is placed in the loading position 510, the first detection assembly may perform scanning detection on the wafer transfer device, so as to obtain information parameters of the wafer. After the first detecting assembly completes the detection, the feeding control module sends control signals to the first motor transmission device 110 and the first cylinder transmission device 120, and the first motor transmission device 110 and the first cylinder transmission device 120 transmit the wafer carrying device to the feeding transmission position 520 after receiving the control signals. And the lower computer transmits the process formula to the manipulator control module. After the robot control module receives the process recipe, the wafer carrier is transported to the process tank module 300. When the wafer is cleaned, the robot control module receives the control information, takes the wafer carrier out of the process tank module 300, and transmits the wafer carrier to the unloading conveyor. The control device of the blanking module 200 receives the control signal from the lower computer, and controls the second motor transmission device 210 and the second cylinder transmission device 220 to convey the wafer carrier to the discharging position 540.
Further, the first sensing assembly may include a first sensor for sensing the presence of a wafer carrier at the loading level 510 and a second sensor. The second sensor is used for scanning each wafer carried by the wafer carrying device to obtain a scanning image. The loading control module calculates the number of wafers and the position state of the wafers based on the scanned image. At the moment, the first sensor is used for detecting whether the cleaning system is loaded or not, and the second sensor is used for detecting the number of the wafers and the position states of the wafers, so that the artificial intelligence of the cleaning system is further improved.
In another optional embodiment, the unloading module 200 further includes a second detecting component, which is connected to the unloading control module and is used for detecting parameter information of the wafers in the wafer carrier at the unloading position 540. The parameter information includes the number of wafers and the positions of the wafers. In the scheme, the second detection assembly is used for detecting the number of the wafers in the cleaned wafer bearing device and the positions of the wafers, so that detection information can be fed back to the lower computer, whether the positions and the numbers of the cleaned wafers are changed or not is judged, and whether the wafers are damaged or not in the cleaning process can be judged.
Further, the second sensing assembly includes a third sensor for sensing whether a wafer carrier is present at the discharge level 540 and a fourth sensor. The fourth sensor can be used for scanning each wafer carried by the wafer carrying device to obtain a scanning image, and the blanking control module calculates the number of the wafers and the position state of the wafers based on the scanning image. At this time, the third sensor is used for detecting whether the cleaning system is used for blanking, and the fourth sensor is used for detecting the number of the cleaned wafers and the position states of the wafers, so that the artificial intelligence of the cleaning system is further improved.
In the above embodiment, when the robot transmission module 400 has only one robot, the robot can only capture in a single step, that is, when the robot captures the wafer carrier at the loading position 520, the wafer carrier in the process tank module 300 cannot be taken out, so that it is necessary to wait for the robot to capture the wafer carrier at the loading position into the process tank module 300 before taking out the cleaned wafer carrier, which makes the cleaning efficiency of the cleaning system slow.
In another alternative embodiment, the robot transfer module 400 may include a first robot 410 and a second robot 420, and the moving directions of the first robot 410 and the second robot 420 are parallel. The first robot 410 may be used to transfer the wafer carrier from the loading transfer station 520 to the process bowl module 300. The second robot 420 is used to transfer the wafer carrier from the process tank module 300 to the unloading transfer station 530. In this embodiment, the first robot 410 and the second robot 420 can work simultaneously, so that the wafer carrier does not need to wait when entering the process tank module 300 or when taking out the process tank module 300, thereby improving the cleaning efficiency of the cleaning system.
In another alternative embodiment, the process tank module 300 may include a plurality of process tanks, which are arranged in a straight line. At the moment, different cleaning liquids can be placed in the process tanks, so that different cleaning effects can be realized, and the cleaning performance of the cleaning system is improved. In addition, the plurality of process grooves are arranged in a straight line, so that the first robot 410 and the second robot 420 both move in a straight line, and the first robot 410 and the second robot 420 move in a simple and reliable manner.
Further, the robot control module controls the first and second robots 410 and 420 to move in the first and second strokes, respectively, and the end point of the first stroke and the start point of the second stroke are located near the center line of the process tank arranged at the last position. In this embodiment, the end point of the first stroke is located near the centerline of the last slot, i.e., the distance of the first stroke is the distance between the loading transfer station 520 and the last slot. The starting point of the second position is near the center line of the process tank at the last position, that is, the distance between the process tank at the last position and the discharging material transfer position 530 at the second stroke, and at this time, the first robot 410 and the second robot 420 can be prevented from colliding, thereby improving the safety and reliability of the robot transfer module 400.
To further improve the safety and reliability of the robot transport module 400, in an alternative embodiment,
the robot transport module 400 may further include proximity switches respectively located on both sides of the first stroke and on both sides of the second stroke, each proximity switch being in control communication with the robot control module.
In a specific working process, a movable range of the first manipulator 410, i.e., a first stroke, is provided in the manipulator control module. The robot transfer module 400 is provided with a first proximity switch 430 and a second proximity switch 440, and the first robot 410 moves between the first proximity switch 430 and the second proximity switch 440, and a distance between the first proximity switch 430 and the second proximity switch 440 is a first stroke. The second manipulator 420 is provided in the manipulator control module with a movable range, i.e., a second stroke. The robot transfer module 400 is provided with a third proximity switch 450 and a fourth proximity switch 460, and the second robot 420 moves between the third proximity switch 450 and the fourth proximity switch 460, and the distance between the third proximity switch 450 and the fourth proximity switch 460 is the second stroke.
In this scheme, due to the limitation of the proximity switch, the two manipulators cannot collide with each other in the stroke plan, thereby further improving the safety and reliability of the manipulator transmission module 400.
Further, the robot control module is used to acquire the positions of the first and second manipulators 410 and 420. The lower computer calculates an approach distance between the first manipulator 410 and the second manipulator 420, and the manipulator control module may control the first manipulator 410 and/or the second manipulator 420 to move if the approach distance is greater than or equal to a safe distance. When the approach distance is less than the safety distance, the robot control module controls the first robot 410 and/or the second robot 420 to move to a side away from each other.
The proximity switch is arranged for realizing the interlocking of hardware, and the manipulator control module can realize the control of the movement range of the manipulator on software, namely the software interlocking, wherein the movement range is within a first stroke and a second stroke and is smaller than the first stroke and the second stroke. If control goes wrong on software, lead to the manipulator to surpass the predetermined migration range of software, owing to all set up proximity switch in first stroke both sides and second stroke both sides, the accessible proximity switch further controls, stops the manipulator action, consequently, combines together through software interlocking and hardware interlocking, has further avoided first manipulator and second manipulator to bump.
Alternatively, in the case where the approach distance is less than the safety distance, the first and second manipulators 410 and 420 may move to initial positions, which may be the origin positions of the first and second manipulators 410 and 420.
In another alternative embodiment, the proximity switch may transmit an alarm signal to the manipulator control module, and the manipulator control module controls the alarm module to send out the alarm signal. At the moment, the alarm module can send out an alarm signal so as to remind an operator. Alternatively, the alarm module may be an alarm lamp and an audible alarm.
In another optional embodiment, the lower computer may be respectively in an array form to communicate data with the feeding control module, the discharging control module, and the manipulator control module, where the array includes multiple device operating state parameters. In the scheme, the control signal is transmitted in an array form, so that the information processing rate of the cleaning system can be improved, and the data transmission performance of the cleaning system is improved.
The array signal may include device status information such as sensed location information, flow, concentration, power, temperature, etc. Alternatively, the array signal may be in a real form, or may be in a boolean form.
Taking the liquid supplementing of the process tank module 300 as an example, the process tank module 300 is divided into four liquid levels, the liquid level sensor detects the liquid level change of the process tank module 300 and sends detection signals to the lower computer in an array form, the detection signals comprise a low liquid level, a heating protection liquid level, an emptying liquid level and a water cleaning liquid level, and the lower computer reads the detection signals in the array form. And the lower computer assigns the low liquid level, the heating protection liquid level, the emptying liquid level and the water cleaning liquid level and transmits the assigned array information to the process tank so as to control the liquid level change of the process tank.
In another optional embodiment, the cleaning system may further include an exchanger and an upper computer, the feeding control module, the discharging control module and the manipulator control module are all in communication connection with the exchanger, the lower computer is in communication connection with the upper computer, and all communication signals are connected by ethernet and are in the same network segment.
The upper computer is a human-computer interaction interface, an operator transmits the selected process formula to the lower computer, and the lower computer transmits control information to the feeding control module, the discharging control module and the manipulator control module through interaction, so that the cleaning system is controlled.
In the scheme, the communication signals of all the control modules are in the same network segment, so that the communication integration is unified, the output transmission is convenient, the data conversion is wirelessly carried out, and the control, the test and the maintenance of the cleaning system are convenient.
In the cleaning system, the feeding control module, the discharging control module and the manipulator control module can adopt a double-fortune controller. Controller Area Networks (CAN) CAN be used between each control module of the cleaning system.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A system for cleaning a wafer, comprising:
the feeding control module, the discharging control module and the manipulator control module are all connected with the lower computer;
the loading module (100), the loading module (100) is connected with the loading control module in a control way and is used for transmitting the wafer carrying device from the loading position (510) to the loading transmission position (520);
the blanking module (200), the blanking module (200) is connected with the blanking control module in a control mode and is used for transmitting the wafer bearing device from a blanking transmission position (530) to a blanking position (540);
a process tank module (300), the process tank module (300) being located between the feeding module (100) and the discharging module (200);
the manipulator transmission module (400) is in control connection with the manipulator control module and is used for transmitting the wafer bearing device among the feeding transmission position (520), the process tank module (300) and the discharging transmission position (530).
2. The cleaning system of claim 1, wherein the loading module (100) comprises a first motor transfer device (110) and a first cylinder transfer device (120), the first motor transfer device (110) transferring the wafer carrier from the loading location (510) to a first transfer location, the first cylinder transfer device (120) transferring the wafer carrier from the first transfer location to the loading transfer location (520);
the blanking module (200) comprises a second motor transmission device (210) and a second air cylinder transmission device (220), the second air cylinder transmission device (220) transmits the wafer carrying device to a second transferring position from the blanking transmission position (530), and the second motor transmission device (210) transmits the wafer carrying device to the discharging position (540) from the second transferring position.
3. The cleaning system of claim 2, wherein the loading module (100) further comprises a first detection component, the first detection component is in control connection with the loading control module, the first detection component is used for detecting information parameters of the wafers in the wafer bearing device on the loading position (510), and the information parameters comprise the number of the wafers and the position states of the wafers.
4. The cleaning system of claim 3, wherein the first detection assembly includes a first sensor for detecting the presence of the wafer carrier at the loading position (510) and a second sensor for scanning each of the wafers carried by the wafer carrier to obtain a scan image, and the loading control module calculates the number of the wafers and the position status of the wafers based on the scan image.
5. The cleaning system of claim 1, wherein the robot transfer module (400) comprises a first robot (410) and a second robot (420), the directions of movement of the first robot (410) and the second robot (420) being parallel, the first robot (410) being configured to transfer the wafer carrier from the loading transfer station (520) to the process tank module (300), and the second robot (420) being configured to transfer the wafer carrier from the process tank module (300) to the unloading transfer station (530).
6. The cleaning system of claim 5, wherein the process tank module (300) comprises a plurality of process tanks, the plurality of process tanks being arranged in a line;
the robot control module controls the first robot (410) and the second robot (420) to move in a first stroke and a second stroke, respectively, and an end point of the first stroke and a start point of the second stroke are located near a center line of the process tank arranged at the last position.
7. The cleaning system of claim 6, wherein the robot transport module (400) further comprises proximity switches located on either side of the first stroke and on either side of the second stroke, respectively, each of the proximity switches being in control communication with the robot control module.
8. The cleaning system according to claim 6, wherein the robot control module is configured to obtain the positions of the first manipulator (410) and the second manipulator (420), the lower computer calculates an approach distance between the first manipulator (410) and the second manipulator (420), and the robot control module is configured to control the first manipulator (410) and/or the second manipulator (420) to move if the approach distance is greater than or equal to a safety distance; and when the approaching distance is smaller than the safe distance, the manipulator control module controls the first manipulator (410) and/or the second manipulator (420) to move to a side far away from the other.
9. The cleaning system of claim 1, wherein the lower computer is in data communication with the feeding control module, the discharging control module and the manipulator control module in an array form, wherein the array comprises a plurality of equipment operation state parameters.
10. The cleaning system of claim 1, further comprising: switch and host computer, material loading control module the unloading control module with manipulator control module all with the switch communication is connected, the next machine with the host computer communication is connected, and all communication signals all adopt the ethernet to connect, and are in same network segment.
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| CN202011553797.XA CN112670222A (en) | 2020-12-24 | 2020-12-24 | Wafer cleaning system |
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