CN112670189A

CN112670189A - Manufacturing method and equipment of fingerprint chip module

Info

Publication number: CN112670189A
Application number: CN202011538442.3A
Authority: CN
Inventors: 杨莎
Original assignee: Lens Technology Changsha Co Ltd
Current assignee: Lens Technology Changsha Co Ltd
Priority date: 2020-12-23
Filing date: 2020-12-23
Publication date: 2021-04-16

Abstract

The invention discloses a method and equipment for manufacturing a fingerprint chip module, wherein the method comprises the following steps: cutting a large board chip to be processed according to parameter information of preset LGA fingerprint chip modules to form a plurality of LGA module areas on the large board chip, wherein a first concave step with the depth being a first preset value is arranged around each LGA module area; cleaning, spraying and baking the cut large plate chip to enable the side wall of each first concave step to be provided with a coating; cutting the large board chip after spraying and baking along the side wall of each first concave step by using an LGA module, and cutting the large board chip to the bottom of the large board chip to obtain a plurality of single LGA modules; the invention can not only manufacture the single LGA module with the coating on the side wall in the using process, but also has higher manufacturing efficiency and product quality.

Description

Manufacturing method and equipment of fingerprint chip module

Technical Field

The invention relates to the technical field of fingerprint identification, in particular to a manufacturing method and equipment of a fingerprint chip module.

Background

At present, the common spraying process of the fingerprint chip module is divided into a single module spraying mode and a large plate spraying mode according to the integration mode. The spraying mode of a single module is that the whole LGA connecting plate internally packaged with a plurality of chips is cut into a single LGA veneer through laser, wherein the LGA comprises the chips, a packaged substrate, an EMC plastic package layer and a protective layer, the LGA veneer and other components are pasted on an FPC hard board to form the module, then the module is arranged in a spraying clamp to spray a single product, not only is more manpower consumed and is low in production efficiency, but also the poor problems of salient points, oil accumulation, oil flying and the like of the single product are caused by the drainage, shielding and rebounding effects of the gap between the product and the clamp on the oil paint mist, and the oil mist can reach the bottom of the product even exceed an LGA area and extend to the FPC to form a circle of white mist which is poor when the clamp and the product are matched and have hole deviation, deformation and the like; the mode of big board spraying is the whole chip that has encapsulated a plurality of chips with inside and is packed into and carry out the spraying in the spraying anchor clamps, cut into single LGA veneer after the spraying again, later carry out the paster, the module preparation is finally accomplished to the equipment process, this kind of technology has effectively avoidd the problem that single module spraying existed, but the LGA product side of cutting after the spraying again does not have the coating and adheres to, after the finished product is assembled into to the cell-phone, after the cell-phone is started, in the gap department of LGA and cell-phone center adaptation, black problem is leaked to the marginal round of visible LGA (because the LGA edge through the spraying coating is mute black).

In recent emerging side fingerprint modules, the size of LGA is smaller, especially the width is generally below 2.5mm, and the front and side walls of LGA must have coatings attached, and the thickness of the coating on the side wall is less than or equal to 80 um. If a single spraying process is adopted, the capacity of each spraying clamp is 10 products according to the appearance of a finished product of the module, and a new spraying mold and a new spraying clamp need to be manufactured along with the iterative upgrade of the appearance of the FPC (flexible printed circuit) of the product, the whole consumption of manpower and material resources is extremely high, and the profit margin is seriously compressed for a project with a short life cycle; if a large-board spraying process is adopted, the capacity of a single clamp is about 112 products, the cost can be effectively saved, but after the sprayed chip is cut into single LGA, the side wall of the single LGA has no coating and is not attached, and the requirement of a client on the attachment of the side wall coating cannot be met.

Therefore, how to provide a method and an apparatus for manufacturing a fingerprint chip module that solve the above technical problems is a problem to be solved by those skilled in the art.

Disclosure of Invention

The embodiment of the invention aims to provide a method and equipment for manufacturing a fingerprint chip module, which can manufacture a single LGA module with a coating on the side wall in the using process, can improve the manufacturing efficiency compared with the existing spraying mode, effectively avoids the problems of convex points and oil accumulation on the edge of a product, and improves the product quality.

In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a fingerprint chip module, including:

cutting a large board chip to be processed according to parameter information of a preset LGA fingerprint chip module, so that a plurality of LGA module areas are formed on the large board chip, and a first concave step with the depth being a first preset value is arranged around each LGA module area;

cleaning, spraying and baking the cut large plate chip to enable the side wall of each first concave step to be provided with a coating;

and cutting the large board chip subjected to spraying and baking along the side wall of each first concave step by using an LGA module, and cutting the large board chip to the bottom of the large board chip to obtain a plurality of single LGA modules.

Optionally, before the parameter information according to predetermineeing LGA fingerprint chip module cuts the big board chip of handling, still includes:

and cutting the full-page chip material internally packaged with a plurality of chips into separate boards to obtain the large board chip to be processed.

Optionally, the cleaning and spraying baking treatment of the cut large board chip is performed to make the side wall of each first concave step have a coating in the following process:

carrying out ultrasonic cleaning on the cut large-plate chip;

drying the large-plate chip cleaned by the ultrasonic wave;

carrying out plasma cleaning on the large plate chip subjected to drying treatment;

and spraying and baking the cleaned large-plate chip subjected to the plasma cleaning, so that the side wall of each first concave step is provided with a coating.

Optionally, the process of performing ultrasonic cleaning on the cut large-board chip is as follows:

and putting the large plate chip into a five-groove ultrasonic cleaning machine, and cleaning the large plate chip by adopting an FCR cleaning agent.

Optionally, the process of performing plasma cleaning on the large-plate chip after the drying treatment comprises:

and carrying out plasma cleaning on the dried large plate chip by adopting mixed gas of argon and oxygen.

Optionally, the process of cutting the big board chip to be processed according to the parameter information of presetting the LGA fingerprint chip module is:

and carrying out laser cutting treatment on the large board chip to be processed according to the parameter information of the preset LGA fingerprint chip module.

Optionally, the first preset value is 0.72mm to 0.8mm, and the width of the first concave step is 0.04 mm.

Optionally, a groove with a radius R is arranged at the right-angled position of the first concave step, and R is smaller than 0.1 mm.

Optionally, carry out the cutting of LGA module to the big board chip after the spraying toasts, before obtaining a plurality of single LGA modules, still include:

and cutting the back surface of the large board chip after spraying and baking to ensure that at least one side of the back surface of each LGA module is provided with a second concave step with the depth of a second preset value.

The embodiment of the invention also correspondingly provides a manufacturing device of the fingerprint chip module, which comprises the following steps:

the first cutting device is used for cutting a large board chip to be processed according to parameter information of a preset LGA fingerprint chip module, so that a plurality of LGA module areas are formed on the large board chip, and a first concave step with the depth being a first preset value is arranged around each LGA module area;

the cleaning and spraying baking device is used for cleaning, spraying and baking the cut large plate chip to enable the side wall of each first concave step to be provided with a coating;

and the second cutting device is used for cutting the LGA module on the large-board chip after spraying and baking to obtain a plurality of single LGA modules.

The embodiment of the invention provides a method and equipment for manufacturing a fingerprint chip module, wherein the method comprises the following steps: cutting a large board chip to be processed according to parameter information of preset LGA fingerprint chip modules to form a plurality of LGA module areas on the large board chip, wherein a first concave step with the depth being a first preset value is arranged around each LGA module area; cleaning, spraying and baking the cut large plate chip to enable the side wall of each first concave step to be provided with a coating; and cutting the large board chip after spraying and baking along the side wall of each first concave step by using the LGA module, and cutting the large board chip to the bottom of the large board chip to obtain a plurality of single LGA modules.

It can be seen that, in the present application, a large board chip to be processed can be cut into a plurality of LGA module regions according to the parameter information of a preset LGA fingerprint chip module, and each of the LGA module regions formed after cutting has a first concave step with a first preset depth around, then the large board chip is cleaned and sprayed and baked, due to the existence of the first concave step, a coating can be formed on the side wall of each of the LGA modules in the large board chip after spraying in the spraying process, the large board chip after spraying and baking is subjected to LGA module cutting along the side wall of each of the first concave steps, and is cut to the bottom of the large board chip to obtain a plurality of single LGA modules with coatings on the side walls, the single LGA module with a coating on the side wall can be manufactured in the using process of the embodiment of the present invention, and the manufacturing efficiency can be improved compared with the existing spraying method, effectively avoiding the problems of salient points and oil accumulation at the edge of the product and improving the product quality.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed in the prior art and the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic flow chart illustrating a method for manufacturing a fingerprint chip module according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a large chip with multiple LGA module areas according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a full-board chip material according to an embodiment of the invention;

fig. 4 is a schematic structural diagram of a side fingerprint chip module according to an embodiment of the present invention;

FIG. 5 is a side view of a single LGA module according to an embodiment of the present invention;

FIG. 6 is a top view of a single LGA module according to an embodiment of the present invention;

FIG. 7 is a rear view of a single LGA module according to an embodiment of the present invention.

Detailed Description

The embodiment of the invention provides a method and equipment for manufacturing a fingerprint chip module, which can manufacture a single LGA module with a coating on the side wall in the using process, can improve the manufacturing efficiency compared with the existing spraying mode, effectively avoids the problems of salient points and oil accumulation on the edge of a product, and improves the product quality.

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a manufacturing method of a fingerprint chip module according to an embodiment of the present invention. The method comprises the following steps:

s110: cutting a large board chip to be processed according to parameter information of preset LGA fingerprint chip modules to form a plurality of LGA module areas on the large board chip, wherein a first concave step with the depth being a first preset value is arranged around each LGA module area;

it should be noted that, in practical application, the parameter information of the LGA fingerprint chip module can be preset, and specifically, the external dimension information of the LGA module can be set, and the external dimension information of the LGA module can be set according to the external dimension of the finished LGA module. After obtaining the large board chip to be processed, performing cutting processing (i.e. half-cutting processing on the large board) on the large board chip to be processed, specifically performing cutting processing by using a laser cutting method, cutting a plurality of LGA module regions (see fig. 2) and a first concave step around each LGA module region along the thickness direction of the large board chip to be processed, specifically, a circle of runway step, wherein the step depth of each first concave step is a first preset value, the first preset value is smaller than the thickness of the large board chip, the specific value can be determined according to the width of the side wall of the LGA module when the housing is actually assembled with the LGA module, because the side wall of the first concave step needs to be attached with a coating in the subsequent spraying process and the interference of a right angle position is considered, the first preset value can be slightly larger than 0.05mm of the attachment depth of the coating, for example, the first preset value can be 0.72mm to 0.8mm, the first preset value and the specific numerical value of the coating adhesion depth can be determined according to actual needs, and special limitation is not required in the application, so that the edge of the fingerprint chip module is free from black leakage under the test light of 700-1000 lux and 45-75% RH of the light source after the complete machine is assembled.

It should be noted that, since the LGA module is manufactured by wire-cutting a plurality of LGA module regions, then, the spraying mode is carried out, therefore, the influence of the total thickness of the side wall coating of the first concave step in the LGA module area after spraying on the size of the finished product must be considered in the process of cutting the outline, generally, the total thickness of the side wall in the three-coating process is not more than 60 μm, the total thickness of the side wall in the four-coating process is not more than 80 μm, therefore, when the large chip to be processed is cut to form a plurality of LGA module areas in the present application, the width of the first concave step should not be larger than 0.04mm, that is, the single LGA module area is shrunk by 0.04mm on one side, the total outline of the single LGA module is shrunk by 0.08mm, that is, the thickness of the sidewall coating reserved on one side of the LGA module area is less than or equal to 0.04mm, thereby avoiding the problem that the assembly at the rear end cannot be carried out because the maximum value of the total thickness of the coating adhered to the side wall is larger than the inner size of the shell or the metal ring after the subsequent spraying. Of course, in practical applications, the specific value of the width of the first concave step may be determined according to actual needs, and this is not specifically limited in this application.

Further, a groove with the radius of R is arranged at the right-angled position of the first concave step, and R is smaller than 0.1 mm.

In particular, in order to avoid the side coating from accumulating at the right angle position of the first concave step in the LGA module area during the spraying process to influence the rear end assembly, in the application, when the first concave step is cut, an R angle is cut at the right angle position, and the radius corresponding to the R angle is R, that is, the junction position of the side wall of the first concave step in the LGA module area and the lower substrate is chamfered, the obtained chamfer is the R angle, so as to form a ring of water channel effect at the interface, thereby managing and controlling the depth of the coating, particularly enabling the coating to flow into the groove after reaching the position in the spraying process, and avoiding exceeding the horizontal plane of the first concave step after the coating is leveled, thereby effectively avoiding the problem of influence on assembly caused by overhigh accumulation of the coating, wherein, the R angle is less than or equal to 0.1mm, and the specific numerical value can be determined according to the actual requirement.

In addition, before the large board chip to be processed is cut according to the parameter information of the preset LGA fingerprint chip module, the whole chip material (as shown in fig. 3) with a plurality of chips packaged therein is cut and separated to obtain the large board chip to be processed. It should be noted that, in practical application, the strip-shaped whole chip material can be cut into two pieces in the middle in the length direction (the dotted line in fig. 3) according to the maximum turning diameter allowed by the existing automatic spraying equipment, so that the length of the obtained large chip to be processed is reduced to half of the length of the whole chip material. Of course, under the condition that the maximum turning diameter allowed by the spraying equipment (such as the space between the clamp and the line body turning position) allows, and under the condition that no interference is generated between continuously conveyed products, the whole board chip material can be directly cut as a large board chip to be processed to form a plurality of LGA module areas with first concave steps on the periphery without cutting the whole board chip material.

S120: cleaning, spraying and baking the cut large plate chip to enable the side wall of each first concave step to be provided with a coating;

it should be noted that, after a plurality of LGA module regions are cut on the large board chip, the cut large board chip is cleaned first, then the cleaned large board chip is sprayed and baked, and finally the side wall of the first concave step in each LGA module region in the large board chip has a coating with a certain thickness, so that the side wall of each single LGA module after cutting has a coating, and the requirement of the side fingerprint module chip is met, wherein the coating thickness can be less than or equal to 20 μm, and specific values can be determined according to actual needs, and the assembly adaptation of the module and the housing is not affected. In addition, set up first spill step in this application and can make the single LGA module that obtains after follow-up spraying is accomplished reach the finished product module effect of single spraying promptly, can avoid again that single spraying is long-pending oily and bad problems such as FPC shirt rim oil slick can be avoided, be favorable to improving production efficiency promptly and can improve product quality again.

Further, in the step S120, the step of cleaning, spraying, and baking the cut large board chip to make the side wall of each first concave step have a coating may specifically be:

carrying out ultrasonic cleaning on the cut large-plate chip;

drying the large-plate chip subjected to ultrasonic cleaning;

carrying out plasma cleaning on the large plate chip after drying treatment;

It is specific, in order effectively to get rid of the dust behind the radium-shine cutting in practical application, the spot, paint floats on its surface when avoiding the product surface to remain the spot dust and lead to the spraying, the big board chip after specifically can adopting ultrasonic cleaning's mode to cutting washs, the big board chip after specifically can putting into five groove ultrasonic cleaner washs with the FCR cleaner in, it toasts at least 90 ℃/120Min to put into vertical oven after the washing finishes, so that get rid of the inside moisture of each LGA module, avoid the moisture to remain and lead to the finished product poor function to lead to the fingerprint unidentifiable to appear during reliability test.

After the drying treatment is finished, Plasma cleaning is carried out on the large-plate chip, the large-plate chip can be specifically clamped and then put into a cavity type Plasma vacuum Plasma cleaning machine for cleaning, specifically argon (oxygen is 50 sccm: 100 sccm) mixed cleaning can be adopted, after cleaning, the timeliness is 2H, the water drop angle on the surface of the LGA module is less than or equal to 40 degrees, and the two gases are adopted to form a cleaning solution with the following formula 1: 2 after vacuum cleaning, the adhesive force effect of the coating of the LGA module, especially the coating on the side wall, is improved after subsequent spraying.

After plasma cleaning, performing primer spraying on the cleaned large-plate chip, and specifically spraying a layer of primer on the large-plate chip through electrostatic spraying; then carrying out colored paint spraying, and specifically spraying a layer of colored paint on the cured primer through electrostatic spraying; then, the product is off-line and baked, specifically, the product is off-line and baked by a vertical oven at 90 ℃/30Min, the process can be properly adjusted according to the characteristics of different coatings, and also can be evaluated according to the actual effect, and the link is cancelled; then, spraying finish paint; and then, carrying out offline baking, putting the product offline, and then baking the product in a vertical oven at the temperature of 90 ℃/120Min, wherein the process is mainly used for improving the adhesive force of the coating, parameters in the offline baking can be properly adjusted according to the model and the characteristics of the actual coating, and the large panel chip after spraying and baking can be obtained after the offline baking is finished.

It should be further noted that, in the present application, the ultrasonic cleaning and plasma cleaning are adopted, wherein the adopted ultrasonic cleaning machine is mainly composed of a cleaning tank and an ultrasonic generator, an ultrasonic transducer oscillator is installed at the bottom of the ultrasonic cleaning tank, the ultrasonic generator generates high frequency and high voltage, the high frequency and high voltage are transmitted to the transducer through a cable connection line, the transducer and a vibrating plate generate high frequency resonance together, and therefore the solvent in the cleaning tank is subjected to the action of ultrasonic waves to clean dirt. Specifically, the principle of ultrasonic cleaning is as follows: the cavitation, acceleration and direct current action of the ultrasonic waves in the liquid are utilized to directly and indirectly act on the liquid and dirt, so that the dirt layer is dispersed, emulsified and stripped, and the cleaning purpose is achieved.

In addition, the plasma cleaning is also called plasma cleaning, and is to introduce Ar or O2 or dry Air and other gases (different gases are used for different processes) into the equipment cavity, and can be used for the surface modification, cleaning and other processes of glass, plastic workpieces, metal-based workpieces, ceramics and other workpieces. The plasma cleaning purpose of the LGA fingerprint module mainly is to remove pollutants on the surface of a product, reduce surface tension and improve the adhesive force of a primer coating on the surface of a module material. Generally, the traditional module cleaning is to perform cleaning and modification by adopting O2 single gas, is a chemical treatment process and is essentially an oxidation reaction, the principle is to burn off hydrocarbon pollutants by utilizing high-energy oxygen ions at a low temperature, the cleaning time is about 300S, the method has the defects that the method cannot remove a metal oxide film but can generate the metal oxide film, and the Ar cleaning belongs to a physical treatment process and is essentially an impact action, the action principle is to utilize the potential difference between plasma and a substrate to impact the substrate at a high speed, and the impact force is used for sputtering off the pollutants and even breaking chemical bonds of the hydrocarbon pollutants to form gas volatilization, so that the metal oxide film can be sputtered off. In order better to module material surface clean, modify, specifically can adopt the mode of two kinds of gas mixture processing of argon gas, oxygen in this application, verify through the experiment when argon gas: oxygen gas 50 sccm: when the flow rate is 100sccm, the cleaning time is 100s, the water drop angle on the surface of the cleaned material is less than or equal to 40 degrees, and the adhesive force effect of the coating on the front surface and the side wall of the sprayed product is optimal.

S130: and cutting the large board chip after spraying and baking along the side wall of each first concave step by using the LGA module, and cutting the large board chip to the bottom of the large board chip to obtain a plurality of single LGA modules.

Specifically, when the LGA module is cut, the cutting can be performed along the right-angled position of the first concave step (i.e. the runway step), the cutting is performed to the bottom of the substrate, and then the single LGA module with the coating on one side can be obtained after blanking. The specific cutting position can be determined according to the size and shape of the actual single LGA module. After obtaining a single LGA module, the fabrication of the whole side fingerprint chip module can be completed through the processes of SMT mounting, function testing, auxiliary material attachment, etc., wherein the structural schematic diagram of the side fingerprint chip module is shown in fig. 4, and a in fig. 4 represents the front coating portion of the LGA module.

It should be noted that, in the embodiment of the present invention, the large board chip is subjected to the spraying treatment after the large board half-cutting treatment, the single LGA module area completely removes the paint mist during the spraying, and the effects of drainage, shielding, rebounding and the like with respect to the fixture are not involved, and the paint mist can be naturally and uniformly attached to the surface and the side wall of the product, so that the oil accumulation phenomenon does not occur, and the redundant parts between the single LGA module areas can be cut off during the LGA module cutting after the spraying and baking treatment is completed, so that the white mist problem does not exist, thereby improving the product quality while ensuring the product manufacturing efficiency.

Further, before the cutting of the LGA module is performed on the large board chip after the baking by spraying to obtain a plurality of single LGA modules in the present application, the method may further include:

Specifically, after a second concave step with a depth of a second preset value (for example, 0.2mm) is cut on the PAD surface on the back of each LGA module in the large board chip after the spraying and baking, cutting a single LGA module, and obtaining the cut single LGA module, wherein the side view structure diagram of the single LGA module is shown in fig. 5; the surface A is the LGA front surface (including a coating), the surface A1 is a first concave step of the LGA module, the surface B is the PAD (PAD) surface, the surface B1 is a second concave step, the R is an R angle, the front surface, the side surfaces and the first concave step are all coated, the depth h1 of the first concave step can be 0.78 +/-0.05 mm, the depth h2 of the second concave step can be 0.2mm, and the specific numerical values can be determined according to actual conditions; a top view of a single LGA module is shown in FIG. 6; a rear view of a single LGA module is shown in FIG. 7, where the shaded portion in FIG. 7 is the second concave step B1 on the back side of the single LGA module.

It should be further noted that the second concave step in the embodiment of the present invention is favorable for the subsequent dispensing operation after the fingerprint chip is attached to the FPC, and can perform attraction and prevent overflow of the glue during the dispensing process, and specifically, even if the glue overflows to the periphery of the LGA module on the premise of ensuring that the red ink test is qualified, the glue overflowing due to the second concave step cannot release the root of the FPC, and the phenomenon of bonding the root of the FPC with the LGA does not occur, so that the problem that the root of the FPC cannot be normally folded when the module is assembled with the chassis is avoided, and the internal circuit of the FPC is damaged or even the FPC is torn due to forced folding, and the function of the module fails due to circuit damage.

In addition, it should be noted that by using the manufacturing method provided in the present application, the yield of mass production spraying single station (that is, the yield of a product in a single station of the four stations of cutting, spraying, SMT surface mounting and assembling) can reach more than 99.5%, which is higher than the yield of a conventional single station of single spraying (about 95% on average) and large board spraying (about 97% on average), and the loss of manpower, jigs and man-hour is low, the spraying jig is general, 112pcs products are provided on the large board chip to be processed, 23pcs are consumed when 1 ten thousand products are folded, the clamping or removing man-hour of the large board chip to be processed is 27.257s, the production efficiency is equivalent to that of the existing Strip large board spraying, and the production efficiency is much higher compared with that of single spraying. In addition, the spraying appearance of the product achieves the effect of a single spraying process, the front surface and the side surface are sprayed with adhesion, the film thickness is in a required range, and various indexes related to the coating can meet the requirements of users.

Therefore, in the present application, a large board chip to be processed can be cut into a plurality of LGA module areas according to the parameter information of the preset LGA fingerprint chip module, and the periphery of each LGA module area formed after cutting is provided with a first concave step with the depth being a first preset value, then the large plate chip is cleaned, sprayed and baked, and due to the existence of the first concave step, in the spraying process, the side wall of each LGA module in the large board chip after spraying is provided with a coating, the large board chip after being sprayed and baked is cut according to the LGA module area along the side wall of each first concave step, and cutting to the bottom of the large-board chip to obtain a plurality of single LGA modules with the side walls provided with the coatings.

On the basis of the above embodiment, the embodiment of the present invention further provides a device for manufacturing a fingerprint chip module, which includes:

the first cutting device is used for cutting the large board chip to be processed according to the parameter information of the preset LGA fingerprint chip module, so that a plurality of LGA module areas are formed on the large board chip, and a first concave step with the depth being a first preset value is arranged around each LGA module area;

the cleaning and spraying baking device is used for cleaning and spraying baking treatment on the cut large plate chip to enable the side wall of each first concave step to be provided with a coating;

Specifically, the manufacturing apparatus of the fingerprint chip module provided in this embodiment has the same beneficial effects as the manufacturing method of the fingerprint chip module provided in the above embodiment, and for the specific description of the manufacturing method of the fingerprint chip module related in this embodiment, please refer to the above embodiment, which is not described herein again.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A manufacturing method of a fingerprint chip module is characterized by comprising the following steps:

2. The method for manufacturing a fingerprint chip module according to claim 1, wherein before the cutting process of the large board chip to be processed according to the parameter information of the preset LGA fingerprint chip module, the method further comprises:

3. The method for manufacturing a fingerprint chip module according to claim 2, wherein the step of cleaning, spraying and baking the cut large plate chip to make the side wall of each first concave step have a coating is as follows:

carrying out ultrasonic cleaning on the cut large-plate chip;

drying the large-plate chip cleaned by the ultrasonic wave;

4. The method for manufacturing the fingerprint chip module according to claim 3, wherein the ultrasonic cleaning of the cut large chip is performed by:

5. The method for manufacturing a fingerprint chip module of claim 3, wherein the step of performing plasma cleaning on the dried large plate chip comprises:

6. The method for manufacturing a fingerprint chip module according to claim 1, wherein the process of cutting the large chip to be processed according to the parameter information of the preset LGA fingerprint chip module comprises:

7. The method for manufacturing a fingerprint chip module of claim 1, wherein the first predetermined value is 0.72mm to 0.8mm, and the width of the first concave step is 0.04 mm.

8. The method for manufacturing a fingerprint chip module of claim 1, wherein the first concave step has a groove with a radius R at a right angle position, and R is smaller than 0.1 mm.

9. The method for manufacturing a fingerprint chip module according to claim 1, wherein before the cutting of the LGA module on the large board chip after the spraying and baking process to obtain a plurality of single LGA modules, the method further comprises:

10. The utility model provides a preparation equipment of fingerprint chip module which characterized in that includes: