CN112657921B - Cleaning device and cleaning method for deep hole and deep groove - Google Patents
Cleaning device and cleaning method for deep hole and deep groove Download PDFInfo
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- CN112657921B CN112657921B CN202011537083.XA CN202011537083A CN112657921B CN 112657921 B CN112657921 B CN 112657921B CN 202011537083 A CN202011537083 A CN 202011537083A CN 112657921 B CN112657921 B CN 112657921B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 65
- 239000010703 silicon Substances 0.000 claims abstract description 65
- 239000007788 liquid Substances 0.000 claims abstract description 60
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000003814 drug Substances 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims description 39
- 239000007921 spray Substances 0.000 claims description 30
- 238000005507 spraying Methods 0.000 claims description 14
- 238000000429 assembly Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 6
- 230000005484 gravity Effects 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 49
- 238000001039 wet etching Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a cleaning device and a cleaning method for deep holes and deep grooves, wherein the cleaning device comprises a basin-shaped hollow bracket with a front opening and a side opening, and a pivoting piece drives the basin-shaped hollow bracket to be arranged at an angle relative to a nozzle device; the rotating shaft drives the basin-shaped hollow bracket to rotate relative to the axis of the rotating shaft through the pivoting piece; the nozzle device comprises an upper nozzle perpendicular to the upper part of the basin-shaped hollow support, water on the silicon wafer is thrown out by utilizing gravity and centrifugal force, so that liquid medicine or water at the bottom of the deep groove or the bottom of the deep hole can be quickly dried, and the nozzle device has remarkable significance.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a device and a method for cleaning deep holes and deep grooves.
Background
With the continuous progress of the integrated circuit manufacturing process, the volume of the semiconductor device is becoming smaller and smaller, and the deep trench is widely used in the manufacturing process of the semiconductor device. In some devices, deep trenches have reached depths above 30 microns.
The general cleaning technique is to make the silicon chip face up and then immerse the silicon chip into a wet cleaning tank for cleaning. And after cleaning, removing the cleaning liquid medicine from the surface of the silicon wafer by spin-drying. For a deep groove or a deep hole with a large depth-to-width ratio, cleaning liquid medicine or water is accumulated at the bottom of the deep groove or the deep hole, the silicon wafer is difficult to move out through spin-drying, and the accumulated cleaning liquid medicine or water causes serious damage to a film in the deep groove or the deep hole structure, so that the reliability of a device is influenced.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a method and a device for cleaning deep holes and deep grooves.
In order to achieve the above object, a first aspect of the present invention provides a cleaning apparatus for deep holes and trenches, comprising: the silicon wafer bearing assembly is a basin-shaped hollow support with a front opening and a side opening, and a silicon wafer is loaded from the side opening, and the front side of the silicon wafer faces the front opening; the basin-shaped hollow support comprises a bottom plate and a plurality of clamping assemblies, the front surface of the bottom plate is opposite to the front opening, the clamping assemblies are arranged from bottom to top in a layered mode along the direction of the front opening from the front surface of the bottom plate and are fixed on the basin-shaped hollow support on the two sides of the side opening, and the clamping assemblies support and fix the silicon wafer; the first transmission piece comprises a pivoting piece and a rotating shaft; the first end of the pivoting piece is rotatably connected with the center of the bottom plate on the back of the bottom plate, and the second end of the pivoting piece is pivoted with the first end of the rotating shaft; the nozzle device comprises an upper nozzle which is arranged vertically above the basin-shaped hollow bracket, and the upper nozzle sprays cleaning liquid vertically downwards to the basin-shaped hollow bracket; the basin-shaped hollowed-out support rotates relative to the center of the bottom plate; the pivoting piece drives the basin-shaped hollow bracket to be arranged at an angle relative to the nozzle device; the rotating shaft drives the basin-shaped hollow support to rotate relative to the axis of the rotating shaft through the pivoting piece.
Preferably, the angle is 0 degrees, the upper nozzle sprays cleaning liquid, and the basin-shaped hollow support rotates relative to the center of the bottom plate; the cleaning liquid comprises one of liquid medicine or water, the upper nozzle comprises a liquid medicine upper nozzle and a water nozzle, the liquid medicine upper nozzle sprays liquid medicine, and the water nozzle sprays water.
Preferably, the nozzle device is including still setting up relatively the side nozzle of basin shape fretwork support both sides, the side nozzle is followed respectively the side opening with the relative side of side opening, along the horizontal direction to basin shape fretwork support sprays water.
Preferably, the angle is 180 degrees, the upper nozzle stops spraying the cleaning liquid, the side nozzles spray water, and the basin-shaped hollow support rotates relative to the center of the bottom plate.
Preferably, the method further comprises the following steps: the second transmission piece is rotatably connected with the second end of the rotating shaft; the second transmission piece drives the basin-shaped hollow support to rotate relative to the transmission center of the second transmission piece through the first transmission piece.
Preferably, the angle is greater than 90 degrees and less than 180 degrees, the side nozzles stop spraying water, the rotating shaft drives the basin-shaped hollow support to rotate relative to the axis of the rotating shaft through the pivoting piece, and the second transmission piece drives the basin-shaped hollow support to rotate relative to the transmission center of the second transmission piece through the first transmission piece.
Preferably, the clamping assembly includes a first clamping member and a second clamping member disposed in left-right opposition along the side opening.
Preferably, the first clamping piece and the second clamping piece are provided with recessed grooves, the grooves are provided with arcs matched with the outer edges of the silicon wafers, and the outer edges of the silicon wafers are clamped in the grooves.
The second aspect of the present invention provides a method for cleaning a deep hole and a deep trench, comprising:
step S01: loading a silicon wafer through the side opening, supporting and fixing the silicon wafer by the clamping assembly, and enabling the front surface of the silicon wafer to face the front opening;
step S02: the pivot joint part drives the basin-shaped hollow support to be arranged at an angle of 0 degree relative to the nozzle device, the upper nozzle vertically sprays cleaning liquid downwards to the basin-shaped hollow support, and the basin-shaped hollow support rotates relative to the center of the bottom plate;
step S03: the pivot joint piece drives the basin-shaped hollow support to be arranged at an angle of 180 degrees relative to the nozzle device, the upper nozzle stops spraying the cleaning liquid, and the basin-shaped hollow support rotates relative to the center of the bottom plate.
Preferably, step S02 and step S03 are repeated N times in a loop, where N is an integer equal to or greater than 1.
According to the technical scheme, the basin-shaped hollow bracket rotates relative to the center of the bottom plate; the pivot joint piece drives the basin-shaped hollow bracket to be arranged at an angle relative to the nozzle device; the rotating shaft drives the basin-shaped hollow support to rotate relative to the axis of the rotating shaft through the pivoting piece, so that the cleaning liquid is uniformly immersed in the front surface of the silicon wafer, the cleaning liquid is uniformly coated on the surface of the front surface of the silicon wafer, and the cleaning efficiency is improved; and then, the second transmission piece drives the basin-shaped hollow support to rotate relative to the transmission center of the second transmission piece through the first transmission piece, and water on the silicon wafer is thrown out by utilizing gravity and centrifugal force, so that liquid medicine or water at the bottom of the deep groove or the bottom of the deep hole is quickly dried, and the device has remarkable significance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a deep hole and deep trench cleaning device according to an embodiment of the invention
FIG. 2 is a plan view showing the cleaning apparatus in the front opening direction after the silicon wafer is loaded
FIG. 3 is a schematic diagram showing the basin-shaped hollow rack with its front opening facing upward and the upper nozzle spraying cleaning solution vertically downward onto the basin-shaped hollow rack
Detailed Description
In order to make the contents of the present invention more comprehensible, the present invention is further described below with reference to the accompanying drawings. The invention is of course not limited to this particular embodiment, and general alternatives known to those skilled in the art are also covered by the scope of the invention.
In the following detailed description of the embodiments of the present invention, in order to clearly illustrate the structure of the present invention and to facilitate explanation, the structure shown in the drawings is not drawn to a general scale and is partially enlarged, deformed and simplified, so that the present invention should not be construed as limited thereto.
In order to make the objects, technical solutions and advantages of the present invention more clear, a schematic structural diagram of a deep hole and deep trench cleaning device according to an embodiment of the present invention is further shown in the following with reference to fig. 1. As shown in fig. 1, the cleaning device for deep holes and trenches of the present invention comprises: the silicon wafer bearing assembly is a basin-shaped hollow support 1 with a front opening and a side opening, and a silicon wafer is loaded from the side opening, and the front side of the silicon wafer faces the front opening; basin form fretwork support 1 includes bottom plate and a plurality of centre gripping subassembly 2, the bottom of basin form fretwork support 1 is the basin form, and the lateral wall is the fretwork support, and the bottom plate is located the bottom of basin form, the front of bottom plate with the front opening is relative, the shape of bottom plate includes circular or polygon, specifically considers installation space and silicon chip size and decides here, does not do the injectly. The interior of the basin-shaped hollow support 1 is a hollow inner cavity, the clamping components 2 are arranged from the front side of the bottom plate along the front opening direction from bottom to top in a layered mode and are fixed on the basin-shaped hollow support 1 on two sides of the side opening, and the clamping components 2 support and fix the silicon wafer 3; a first transmission member including a pivot member (not shown) and a rotary shaft 4; the first end of the pivoting piece is rotatably connected with the center of the bottom plate on the back of the bottom plate, and the second end of the pivoting piece is pivoted with the first end of the rotating shaft 4; and the nozzle device (not shown) comprises an upper nozzle (not shown) which is arranged vertically above the basin-shaped hollow bracket 1, and the upper nozzle vertically sprays cleaning liquid downwards to the basin-shaped hollow bracket 1.
The basin-shaped hollow bracket 1 rotates relative to the center of the bottom plate; the pivoting member drives the basin-shaped hollow bracket 1 to be arranged at an angle relative to the nozzle device. The angle range is 0-180 degrees, wherein the angle is 0 degree, the front opening of the basin-shaped hollow support 1 faces upwards and faces the nozzle device, namely the front surface of the silicon wafer 3 is parallel to the horizontal plane and faces the nozzle device, the cleaning solution is sprayed perpendicular to the front surface of the silicon wafer 3, the rotating shaft drives the basin-shaped hollow support 1 to rotate relative to the axis of the rotating shaft through the pivot joint part, the cleaning solution rapidly infiltrates the silicon wafer 3 through centripetal force, and the cleaning efficiency is improved; the angle is 180 degrees, basin form fretwork support 1's front opening is down, and dorsad nozzle device, and the front of silicon chip 3 is on a parallel with the horizontal plane promptly, and dorsad nozzle device, the washing liquid that bears on the silicon chip 3 falls because of gravity, simultaneously, the rotation axis passes through the pin joint piece drives basin form fretwork support 1 for the axle center of rotation axis is rotatory, makes the washing liquid break away from silicon chip 3 fast through centripetal force, reaches the purpose of spin-drying fast.
As a preferred embodiment, the cleaning device for deep holes and deep grooves further comprises: a second transmission member 5. The second transmission part 5 is rotatably connected with the second end of the rotating shaft, and the basin-shaped hollow support 1 is driven to rotate relative to the transmission center of the second transmission part 5 through the first transmission part, so that the aim of quickly drying the silicon wafer is fulfilled, and the production efficiency is improved.
Referring to FIG. 2, FIG. 2 is a top view of the cleaning apparatus along the front opening direction after loading the silicon wafer. The clamping assembly 2 is fixedly connected with the basin-shaped hollow support 1 and comprises a first clamping piece and a second clamping piece which are oppositely arranged along the left side and the right side of the side opening. As shown in fig. 2, the clamping assembly 2 includes a first clamping member and a second clamping member, which are arranged symmetrically left and right and clamp the silicon wafer. As a preferred embodiment, the first clamping member and the second clamping member are provided with recessed grooves, the grooves are arc-shaped and matched with the outer edge of the silicon wafer, the outer edge of the silicon wafer is clamped in the grooves, the clamping assembly further comprises a third clamping member opposite to the side opening, and the third clamping member is also provided with a recessed groove. The silicon wafer fixing device is characterized in that the first clamping piece and the second clamping piece respectively support and fix the two symmetrical sides of the silicon wafer, the third clamping piece strengthens the fixing effect, and the silicon wafer is guaranteed to be stressed in a balanced manner and cannot be thrown out in the rotating process of the basin-shaped hollow support.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating that the front opening of the basin-shaped hollow bracket is upward, and the upper nozzle vertically sprays cleaning liquid downwards onto the silicon wafers loaded on the basin-shaped hollow bracket. The basin-shaped hollow bracket is driven by the pivot joint piece to be arranged at an angle relative to the nozzle device, so that the front opening is upward or downward. The angle is 0 degrees, the front opening of the basin-shaped hollow bracket faces upwards, the upper nozzle sprays cleaning liquid, and the basin-shaped hollow bracket rotates relative to the center of the bottom plate; the cleaning liquid comprises one of liquid medicine or water, the upper nozzle comprises a liquid medicine upper nozzle and a water nozzle, the liquid medicine upper nozzle sprays liquid medicine, and the water nozzle sprays water.
As a preferred embodiment, the nozzle device further comprises side nozzles oppositely arranged at two sides of the basin-shaped hollow support, and the side nozzles spray water to the basin-shaped hollow support along a horizontal direction from a direction in which the side openings are opposite to the side openings. Referring to fig. 2, the side nozzles are arranged on the left side and the right side of the basin-shaped hollow support. The angle is 180 degrees, the front opening of the basin-shaped hollow support faces downwards, the upper nozzle stops spraying cleaning liquid, the side nozzles spray water, and the rotating shaft drives the basin-shaped hollow support to rotate relative to the center of the bottom plate; the angle is greater than 90 degrees and less than 180 degrees, the side nozzle stops spraying water, the rotation axis drives the basin-shaped hollow support for bottom plate center rotary motion, just the second driving medium passes through first driving medium drives the basin-shaped hollow support for the transmission center of second driving medium is rotatory, thereby reaches the purpose of spin-drying fast, improves production efficiency.
The method for cleaning deep holes and trenches according to the present invention is described in detail with reference to fig. 1 and the following embodiments.
Step S01: and loading the silicon wafer through the side opening, supporting and fixing the silicon wafer by the clamping assembly, and enabling the front surface of the silicon wafer to face the front opening.
Step S02: the pivot joint piece drives the front opening of the basin-shaped hollow support to be arranged at an angle of 0 degrees relative to the horizontal plane, the upper nozzle vertically sprays cleaning liquid downwards to the basin-shaped hollow support, and the basin-shaped hollow support rotates relative to the center of the bottom plate.
In a preferred embodiment, the cleaning solution includes one of a chemical solution and water, the upper nozzle includes a chemical solution upper nozzle and a water nozzle, the chemical solution upper nozzle sprays the chemical solution to the silicon wafer, and the water nozzle sprays water to the silicon wafer. When the silicon wafer 1 is cleaned and processed by a wet method, the angle is 0 degree, the front opening of the basin-shaped hollow support is vertically upward, the liquid medicine is vertically sprayed downwards to the basin-shaped hollow support by the liquid medicine upper nozzle, and meanwhile, the basin-shaped hollow support is driven by the rotating shaft to rotate relative to the center of the bottom plate, so that the liquid medicine is quickly spread on the surface of the silicon wafer, the infiltration time of the liquid medicine is shortened, the front surface of the silicon wafer is immersed by the cleaning liquid, and the cleaning liquid is guaranteed to be uniformly coated on the front surface of the silicon wafer; then, the pin joint piece drives basin form fretwork support's preceding opening is for the horizontal plane in order to be equal to 0, perhaps is greater than 0 and be less than or equal to 90 degrees angle settings, the liquid medicine upper spray nozzle stops to spray the liquid medicine, nozzle on water to basin form fretwork support sprays water perpendicularly downwards, simultaneously, the rotation axis drives basin form fretwork support for bottom plate center rotary motion reaches the purpose of diluting the liquid medicine fast.
In another embodiment, the liquid medicine is wet etching liquid medicine, the liquid medicine upper nozzle is a wet etching liquid medicine upper nozzle, and the wet etching liquid medicine upper nozzle sprays wet etching liquid medicine to the silicon wafer. Spraying wet etching liquid medicine to the silicon wafer vertically downwards by adopting an upper nozzle of the wet etching liquid medicine; and then, vertically and downwards spraying water to the silicon wafer by using an over-water nozzle so as to shorten the etching time.
Step S03: the pivot piece drives the basin-shaped hollow support to be arranged at an angle of 180 degrees relative to the nozzle device, the upper nozzle stops spraying the cleaning solution, and the basin-shaped hollow support rotates relative to the center of the bottom plate.
In one embodiment, the upper nozzles stop spraying the cleaning solution, and the side nozzles spray water, so that the liquid medicine on the silicon wafer is further diluted through the side nozzles. And repeating the step S02 and the step S03 in N times of circulation, wherein N is an integer greater than or equal to 1.
In order to spin the clothes more quickly, in step S03 of the cleaning method, the upper nozzles stop spraying cleaning liquid, the side nozzles spray water, and the basin-shaped hollow bracket rotates relative to the center of the bottom plate. Further comprising: step S04: the pivot joint piece drives the basin-shaped hollow support to be arranged at an angle larger than 90 degrees and smaller than 180 degrees relative to the nozzle device, the rotating shaft drives the basin-shaped hollow support to rotate relative to the axis of the rotating shaft through the pivot joint piece, and the second transmission piece drives the basin-shaped hollow support to rotate relative to the transmission center of the second transmission piece through the first transmission piece. The basin-shaped hollow bracket is driven to rotate relative to the second transmission piece by the second transmission piece, and water on the silicon wafer is thrown out by utilizing the gravity of the basin-shaped hollow bracket and the centrifugal force generated by rotation, so that the water at the bottom of the deep groove or the bottom of the deep hole structure is dried. And repeating the step S02 to the step S04 for N times, wherein N is an integer greater than or equal to 1.
According to the cleaning device for the deep holes and the deep grooves, when a silicon wafer is cleaned and treated by a wet method, the front opening of the basin-shaped hollow support is driven to face upwards relative to the horizontal plane through the pivot piece, and meanwhile, the basin-shaped hollow support rotates relative to the center of the bottom plate, so that the cleaning liquid uniformly immerses the front surface of the silicon wafer, the cleaning liquid is uniformly coated on the front surface of the silicon wafer, and the cleaning efficiency is improved; then, the pivot piece drives the front opening of the basin-shaped hollow support to face downwards relative to the horizontal plane, the basin-shaped hollow support rotates relative to the center of the bottom plate, the rotating shaft drives the basin-shaped hollow support to rotate relative to the axis of the rotating shaft through the pivot piece, the second transmission piece drives the basin-shaped hollow support to rotate relative to the second transmission piece, and water on the silicon wafer is thrown out by utilizing gravity and centrifugal force, so that liquid medicine or water at the bottom of the deep groove or the bottom of the deep hole can be quickly dried.
The above description is only a preferred embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, so that any equivalent structural changes made by using the contents of the specification and the drawings should be included in the scope of the present invention.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A cleaning device for deep holes and deep grooves is characterized by comprising:
the silicon wafer bearing assembly is a basin-shaped hollow support with a front opening and a side opening, and a silicon wafer is loaded from the side opening, and the front side of the silicon wafer faces the front opening; the basin-shaped hollow support comprises a bottom plate and a plurality of clamping assemblies, the front side of the bottom plate is opposite to the front opening, the clamping assemblies are arranged from bottom to top in a layering mode along the direction of the front opening from the front side of the bottom plate and are fixed on the basin-shaped hollow support on the two sides of the side opening, and the clamping assemblies support and fix the silicon wafer;
the first transmission piece comprises a pivoting piece and a rotating shaft; the first end of the pivoting piece is rotatably connected with the center of the bottom plate on the back of the bottom plate, and the second end of the pivoting piece is pivoted with the first end of the rotating shaft;
the second transmission piece is rotatably connected with the second end of the rotating shaft; the second transmission piece drives the basin-shaped hollow support to rotate relative to the transmission center of the second transmission piece through the first transmission piece;
the nozzle device comprises an upper nozzle and side nozzles, the upper nozzle is perpendicular to the upper part of the basin-shaped hollow support, the side nozzles are oppositely arranged on two sides of the basin-shaped hollow support, the side nozzles respectively spray water to the basin-shaped hollow support from the side faces opposite to the side opening and the side opening along the horizontal direction, and the upper nozzle sprays cleaning liquid to the basin-shaped hollow support vertically and downwards; wherein,
the basin-shaped hollow bracket rotates relative to the center of the bottom plate; the pivot joint piece drives the basin-shaped hollow bracket to be arranged at an angle relative to the nozzle device, the front opening faces the upper nozzle, and the upper nozzle sprays cleaning liquid; the front opening faces away from the upper nozzle, and the upper nozzle stops spraying the cleaning solution; the rotating shaft drives the basin-shaped hollow bracket to rotate relative to the axis of the rotating shaft through the pivoting piece; wherein,
the angle is greater than 90 degrees and less than 180 degrees, the side nozzle stops spraying water, the rotating shaft drives the basin-shaped hollow support to rotate relative to the axis of the rotating shaft through the pivot joint part, and the second transmission part drives the basin-shaped hollow support to rotate relative to the transmission center of the second transmission part through the first transmission part.
2. The cleaning device for deep holes and trenches of claim 1, wherein said angle is 0 ° and said basin-shaped hollow bracket is rotated with respect to the center of said bottom plate; the cleaning liquid comprises one of liquid medicine or water, the upper nozzle comprises a liquid medicine upper nozzle and a water nozzle, the liquid medicine upper nozzle sprays liquid medicine, and the water nozzle sprays water.
3. The device for cleaning deep holes and trenches according to claim 1, wherein said angle is 180 °, said side nozzle sprays water, and said hollow-out basin-shaped support is rotated with respect to the center of said bottom plate.
4. The deep hole and trench cleaning apparatus of claim 1 wherein said clamp assembly includes first and second clamps disposed in left-right opposition along said side opening.
5. The deep hole and trench cleaning device of claim 4 wherein said first clamping member and said second clamping member are provided with recessed grooves having an arc shape that fits the outer edge of said silicon wafer, said outer edge of said silicon wafer being captured within said grooves.
6. A method for cleaning a deep hole and trench cleaning device according to any one of claims 1 to 5, comprising:
step S01: loading a silicon wafer through the side opening, supporting and fixing the silicon wafer by the clamping assembly, and enabling the front surface of the silicon wafer to face the front opening;
step S02: the pivot joint part drives the basin-shaped hollow bracket to be arranged at an angle of 0 degrees relative to the nozzle device, the upper nozzle vertically sprays cleaning liquid downwards to the basin-shaped hollow bracket, and the basin-shaped hollow bracket rotates relative to the center of the bottom plate;
step S03: the pivot joint piece drives the basin-shaped hollow support to be arranged at an angle of 180 degrees relative to the nozzle device, the upper nozzle stops spraying the cleaning liquid, and the basin-shaped hollow support rotates relative to the center of the bottom plate.
7. The cleaning method according to claim 6, wherein the steps S02 and S03 are repeated N times in a cycle, N being an integer of 1 or more.
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| CN202011537083.XA CN112657921B (en) | 2020-12-23 | 2020-12-23 | Cleaning device and cleaning method for deep hole and deep groove |
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| CN202011537083.XA CN112657921B (en) | 2020-12-23 | 2020-12-23 | Cleaning device and cleaning method for deep hole and deep groove |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113865311B (en) * | 2021-12-01 | 2022-02-18 | 中南大学湘雅医院 | Medical instrument drying device |
| CN115069639B (en) * | 2022-05-31 | 2023-11-14 | 江苏卓玉智能科技有限公司 | Cleaning device for semiconductor wafer |
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