CN112654297A - Main unit of ultrasonic equipment - Google Patents
Main unit of ultrasonic equipment Download PDFInfo
- Publication number
- CN112654297A CN112654297A CN201880097319.7A CN201880097319A CN112654297A CN 112654297 A CN112654297 A CN 112654297A CN 201880097319 A CN201880097319 A CN 201880097319A CN 112654297 A CN112654297 A CN 112654297A
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- host
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- mounting cavity
- motherboard
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- 239000000523 sample Substances 0.000 claims abstract description 39
- 238000009434 installation Methods 0.000 claims description 35
- 238000004891 communication Methods 0.000 claims description 19
- 108090000565 Capsid Proteins Proteins 0.000 claims description 6
- 238000012423 maintenance Methods 0.000 abstract description 15
- 239000000428 dust Substances 0.000 description 2
- 238000002565 electrocardiography Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
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- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Heart & Thoracic Surgery (AREA)
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- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
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- Veterinary Medicine (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
A motherboard of a main machine of ultrasonic equipment is arranged in a main shell, and the motherboard and a front shell form a front mounting cavity and a rear shell form a rear mounting cavity shell. One part of the circuit board, the probe adapter box, the power supply module, the input/output interface module, the hard disk and other modules of the host machine, which are provided with the control unit, are arranged in the front mounting cavity, and the other part of the modules are arranged in the rear mounting cavity. According to the layout, the modules are reasonably distributed on the front side and the rear side of the motherboard of the host, each module can be independently disassembled and assembled, when related modules need to be maintained or replaced, the corresponding modules can be assembled and disassembled only by opening the front shell or the rear shell, the disassembling and assembling steps are few, the operation is convenient, and the maintenance efficiency is greatly improved.
Description
The application relates to an ultrasonic device, in particular to a layout of a host of an ultrasonic device.
The internal modules of a general ultrasonic equipment host are distributed disorderly, and the disassembly and assembly steps are more and the working hours are longer during maintenance. For example, when removing some major modules, it is often necessary to remove multiple housings, and even in some cases, it is necessary to remove multiple other modules first, which results in a very cumbersome overall maintenance task.
The application mainly provides a host computer of supersound equipment, and it has different overall arrangement, the dismouting of each module of being convenient for.
An embodiment provides a host computer of ultrasonic equipment, including casing, host computer motherboard, the circuit board that is equipped with the control unit, probe switching box, power module, input/output interface module, hard disk and be used for carrying out radiating fan to the host computer: the shell comprises a main shell, a front shell facing a user and a rear shell opposite to the front shell, wherein the front shell is installed on the front side of the main shell, and the rear shell is installed on the rear side of the main shell; the main machine motherboard is arranged in the main shell, and the main machine motherboard and the front shell form a front installation cavity in a surrounding manner, and the main machine motherboard and the rear shell form a rear installation cavity in a surrounding manner; one part of the circuit board, the probe adapter box, the power module, the input/output interface module and the hard disk is arranged in the front mounting cavity, and the other part of the circuit board, the probe adapter box, the power module, the input/output interface module and the hard disk is arranged in the rear mounting cavity.
In one embodiment, the circuit board, the probe adapter box and the power module are positioned in the front mounting cavity and are mounted on a motherboard of the host; the input/output interface module is positioned in the rear mounting cavity and is mounted on the host motherboard.
In one embodiment, the main housing has a cavity opening in the front and rear directions, the main motherboard is located in the middle of the cavity, and the front housing and the rear housing respectively cover the cavity from the openings in the front and rear directions.
In one embodiment, the fan is located at the lower part of the main shell and below the circuit board, the probe adapter box, the hard disk and the input/output interface module.
In one embodiment, the front housing comprises a first front housing and a second front housing, the first front housing is located above the second front housing, the first front housing and the main housing enclose a first front mounting cavity, the probe adapter box is located in the first front mounting cavity, and the first front housing is provided with a socket corresponding to the probe adapter box; the second procapsid encloses into the installation cavity before the second with the main casing body, the installation cavity is located the below of installation cavity before the second, circuit board and power module are located installation cavity before the second.
In one embodiment, the front housing comprises a first front housing and a second front housing, the first front housing is located above the second front housing, the first front housing and the main housing enclose a first front mounting cavity, and the circuit board and the power supply module are located in the first front mounting cavity; the second procapsid encloses into the installation cavity before the second with the main casing body, the installation cavity is located the below of installation cavity before the second, the probe switching box is located the installation cavity before the second, the second procapsid has the socket that corresponds with the probe switching box.
In one embodiment, the electrocardiogram module is further included and is mounted in the front mounting cavity.
In one embodiment, the electrocardiogram module is mounted in the first front mounting cavity together with the probe adapter box.
In one embodiment, the front housing and the rear housing are fixedly mounted on the main housing by a detachable clamping structure or a screw fastening structure, respectively.
In one embodiment, the mobile terminal further comprises a communication module for communication, wherein the communication module is mounted on the host motherboard and located in the rear mounting cavity.
In one embodiment, the communication module includes at least one of a wifi module and a 4G module.
In one embodiment, the communication module is mounted on a lower portion of the host motherboard.
In one embodiment, the hard disk is mounted in the rear mounting cavity and is mounted together with the hard disk in the lower portion of the motherboard of the host.
In one embodiment, the computer system further comprises a case, wherein the circuit board is installed in the case, and the case is installed on a motherboard of the host.
In one embodiment, a battery module is also included, the battery module being mounted within the front mounting cavity.
In one embodiment, the chassis, the battery module and the power module are mounted side by side on a motherboard of the host.
In one embodiment, the sound box is further included and is installed in the rear installation cavity.
In one embodiment, the sound box is positioned at the upper part of the rear mounting cavity.
According to the ultrasonic equipment main unit of the above embodiment, the main unit motherboard is installed in the main casing, and the main unit motherboard and the front casing enclose a front installation cavity and the rear casing enclose a rear installation cavity casing. One part of the case, the probe adapter box, the power module, the input/output interface module, the hard disk and other modules of the host is arranged in the front mounting cavity, and the other part of the case, the probe adapter box, the power module, the input/output interface module, the hard disk and other modules of the host are arranged in the rear mounting cavity. According to the layout, the modules are reasonably distributed on the front side and the rear side of the motherboard of the host, each module can be independently disassembled and assembled, when related modules need to be maintained or replaced, the corresponding modules can be assembled and disassembled only by opening the front shell or the rear shell, the disassembling and assembling steps are few, the operation is convenient, and the maintenance efficiency is greatly improved.
In particular, some modules with larger volume, such as a case with a control unit, a probe adapter box, a power module and the like, in the host machine can be installed in the front installation cavity for disassembly, and some modules with smaller volume, such as an input/output interface module, can be installed in the rear installation cavity.
FIG. 1 is a schematic external view of a main body of an ultrasonic apparatus according to an embodiment of the present disclosure;
fig. 2 is an exploded view of a main unit of an ultrasound device according to an embodiment of the present disclosure.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).
An embodiment of the application provides a host of ultrasonic equipment. The ultrasonic equipment is equipment which utilizes ultrasonic imaging technology to carry out relevant application, such as medical diagnosis and the like. The main unit is an important component of the ultrasound apparatus, and a control unit, a probe adapter, and the like are usually mounted on the main unit.
Referring to fig. 1 and 2, in an embodiment, the host includes a housing 100, a host motherboard 200, a chassis 301, a probe adapter 302, a power module 303, an input/output interface module (IO module) 304, a hard disk 305, and a fan 306.
The housing 100 has a mounting cavity in which each module is mounted. The housing 100 includes a main housing 110, a front housing 120 facing a user, and a rear housing 130 opposite to the front housing 120, the front housing 120 being mounted on a front side of the main housing 110, and the rear housing 130 being mounted on a rear side of the main housing 110. The front and rear are the sides of the main body facing the user in the normal use state, i.e., the front and the rear.
Referring to fig. 1 and 2, in one embodiment, the main housing 110 has a cavity opened in the front-rear direction, and the front housing 120 and the rear housing 130 respectively seal the cavity in the front-rear direction, thereby forming a mounting cavity.
With continued reference to fig. 1 and 2, the host motherboard 200 is mounted in the main housing 110, which encloses a front mounting cavity with the front housing 120 and a rear mounting cavity with the rear housing 130. One part of the case 301, the probe adapter 302, the power supply module 303, the input/output interface module 304 and the hard disk 305 of the host computer is installed in the front installation cavity, and the other part is installed in the rear installation cavity.
According to the layout, the modules are reasonably distributed on the front side and the rear side of the motherboard of the host, each module can be independently disassembled and assembled, when related modules need to be maintained or replaced, the corresponding modules can be assembled and disassembled only by opening the front shell or the rear shell, the disassembling and assembling steps are few, the operation is convenient, and the maintenance efficiency is greatly improved. The modules can be separately arranged in the front mounting cavity and the rear mounting cavity to form reasonable layout.
The front housing 120 and the rear housing 130 can be easily assembled, for example, the front housing 120 and the rear housing 130 are respectively fixed on the main housing 110 by a detachable clamping structure or a screw fastening structure, and during maintenance, the front housing 120 and the rear housing 130 can be easily disassembled, further facilitating the maintenance work.
The casing 301 houses a circuit board and other components provided with a control unit, which includes a Central Processing Unit (CPU), a memory, and other components for implementing centralized control and data processing. The chassis 301 is located in the front mounting cavity and is mounted on the host motherboard 200. Besides the circuit board with the control unit being installed in the chassis 301, the circuit board with the control unit may be directly installed in the front installation cavity or the rear installation cavity, for example, the circuit board is directly installed on the front side or the rear side of the host motherboard 200, so that the chassis 301 may be omitted and the structure may be simplified.
The probe adapter 302 is used for docking an ultrasonic probe, and is also installed in a front installation cavity together with a power module 303, and can be fixed by being installed on the host motherboard 200. The case 301, the probe adapter box 302 and the power module 303 are large in size, so that the case, the probe adapter box 302 and the power module 303 are all installed in a front installation cavity, disassembly and assembly are facilitated, a host can keep balance of force, and the modules are installed in the front installation cavity, so that connection of lines is facilitated. The input/output interface module 304 is small and may be disposed in the rear mounting cavity and mounted on the host motherboard 200.
The hard disk 305 may be mounted in the chassis 301, in a front mounting cavity, or in a rear mounting cavity, as desired. In this embodiment, the hard disk 305 is mounted on the host motherboard 200 in a rear mounting cavity, as shown in FIG. 2. The fan 306 is installed in the main housing 110 for dissipating heat of the main housing.
Further, referring to fig. 2, in an embodiment, the fan 306 is located at the lower portion of the main housing 110 and below the chassis 301, the probe adapter 302, the hard disk 305, and the input/output interface module 304. The fan 306 may be disposed in the front mounting cavity, the rear mounting cavity, or both the front and rear mounting cavities, and blows air upward from the bottom of the main body to dissipate heat from the modules. The fan 306 can be fixed by quick-release screws or other quick-release means, and can be pulled out directly from the side surface after the quick-release screws are manually removed.
With continued reference to fig. 1 and 2, in one embodiment, the front housing 120 includes a first front housing 121 and a second front housing 122. The first front case 121 is positioned above the second front case 122. The first front housing 121 and the main housing 110 enclose a first front mounting cavity. The probe adapter box 302 is located within the first front mounting cavity and the first front housing 121 has a socket corresponding to the probe adapter box 302. The second front housing 122 encloses a second front mounting cavity with the main housing 110. The second front mounting cavity is located below the first front mounting cavity. Chassis 301 and power module 303 are located within the second front mounting cavity.
The front mounting cavity can be divided into at least two parts by the design of the first front housing 121 and the second front housing 122, and when the probe adapter box 302 needs to be maintained, the whole front housing 120 does not need to be disassembled, and only the first front housing 121 can be disassembled. When the chassis 301, the power module 303, and the like need to be maintained, only the second front case 122 needs to be detached. The structure can further simplify the maintenance workload and improve the working efficiency.
Of course, in other embodiments, the chassis 301 (or the circuit board on which the control unit is disposed) and the power module may be located in the first front mounting cavity. The probe adapter box 302 is positioned within a second front mounting cavity having a receptacle corresponding to the probe adapter box 302.
In addition, the front housing 120 may be an integral housing or may be separated into three or more components.
Further, in some embodiments, the host further comprises an electrocardiogram module (ECG module) 309 for implementing the electrocardiography function. Referring to fig. 2, the ecg module 309 is mounted in the front mounting cavity and can be fixed by being mounted on the motherboard 200 or the housing 100 of the host.
More specifically, the ecg module 309 is mounted with the probe adapter box 302 in the first front mounting cavity for easy removal and wiring.
Further, in some embodiments, the host further comprises a communication module for communication. The communication module is mounted on the host motherboard 200 in the rear mounting cavity. Referring to fig. 2, the communication module may include at least one of a wifi module 307 and a 4G module 308. Of course, the communication module may also be other forms of modules, such as a wired communication module, etc. Referring to fig. 2, in one embodiment, the communication modules (e.g., wifi module 307 and 4G module 308) may be mounted on the lower portion of the host motherboard 200 to fully utilize the space of the host motherboard 200. Of course, the communication module may be mounted on the middle and upper portions of the host motherboard 200.
With continued reference to fig. 2, in one embodiment, hard disk 305 is mounted in a rear mounting cavity and is mounted on the lower portion of host motherboard 200 along with communication modules (e.g., wifi module 307 and 4G module 308) for centralized maintenance and management.
Further, referring to fig. 2, in some embodiments, the host further includes a battery module 310, and the battery module 310 is installed in the front installation cavity. The battery module 310 may be mounted on the host motherboard 200. In one example configuration, the chassis 301, battery module 310, and power module 303 are mounted side-by-side on the host motherboard 200, such that the modules are arranged in an ordered array for ease of management, while maximizing the use of the front mounting cavity space. The front mounting cavity is arranged at the lower part of the front mounting cavity, namely in the second front mounting cavity, and the space of the second front mounting cavity is fully utilized. Meanwhile, a dust screen 312 may be further installed above the cabinet 301, the battery module 310, and the power module 303 for dust prevention.
Further, referring to fig. 2, in some embodiments, the main body further includes a speaker 311, and the speaker 311 is installed in the rear installation cavity. Specifically, the speaker 311 may be positioned at an upper portion of the rear mounting cavity to facilitate the transmission of sound.
As shown in fig. 2, the ecg module 309 and the probe adapter 302 can be divided into a region located in the first front mounting cavity, and when maintenance is required, only the first front housing 121 needs to be opened. The chassis 301, the battery module 310, and the power module 303 may be divided into a region located in the second front mounting cavity, and when maintenance is required, only the second front housing 122 needs to be opened. The sound 311, the wifi module 307, the 4G module 308, the hard disk 305, and the input/output interface module (IO module) 304 may be divided into an area, which is located in the rear installation cavity, and when maintenance is required, only the rear housing 130 needs to be opened. The fan 306 can be divided into a single area, which can be directly taken out from the bottom of the main housing 110.
The host layout structure shown in this embodiment can distribute the modules on the front and rear sides of the host motherboard, and the modules can be directly operated by only removing the corresponding front shell or rear shell during maintenance. In addition, the main module or the vulnerable module is designed at a higher position which is convenient for maintenance, so that the main module or the vulnerable module is convenient to disassemble and assemble, and the maintenance efficiency is greatly improved.
The present application has been described with reference to specific examples, which are provided only to aid understanding of the present application and are not intended to limit the present application. Variations of the above-described embodiments may occur to those of ordinary skill in the art in light of the teachings of this application.
Claims (18)
- The utility model provides a host computer of supersound equipment which characterized in that, includes casing, host computer motherboard, the circuit board that is equipped with the control unit, probe switching box, power module, input/output interface module, hard disk and is used for carrying out radiating fan to the host computer: the shell comprises a main shell, a front shell facing a user and a rear shell opposite to the front shell, wherein the front shell is installed on the front side of the main shell, and the rear shell is installed on the rear side of the main shell; the main machine motherboard is arranged in the main shell, and the main machine motherboard and the front shell form a front installation cavity in a surrounding manner, and the main machine motherboard and the rear shell form a rear installation cavity in a surrounding manner; one part of the circuit board, the probe adapter box, the power module, the input/output interface module and the hard disk is arranged in the front mounting cavity, and the other part of the circuit board, the probe adapter box, the power module, the input/output interface module and the hard disk is arranged in the rear mounting cavity.
- The host of claim 1, wherein the circuit board, probe adapter box, power module are located in the front mounting cavity and mounted on a host motherboard; the input/output interface module is positioned in the rear mounting cavity and is mounted on the host motherboard.
- A host computer according to claim 1 or 2, wherein the main housing has a cavity opening in the front and rear directions, the host motherboard is located in the middle of the cavity, and the front and rear housings cover the cavity from the openings in the front and rear directions, respectively.
- A host computer according to any one of claims 1-3, wherein the fan is located below the main housing and below the circuit board, the probe adapter box, the power module, the hard disk, and the input-output interface module.
- The host of any one of claims 1-4, wherein the front housing includes a first front housing and a second front housing, the first front housing positioned above the second front housing, the first front housing and the main housing enclosing a first front mounting cavity, the probe adapter box positioned within the first front mounting cavity, the first front housing having a receptacle corresponding to the probe adapter box; the second procapsid encloses into the installation cavity before the second with the main casing body, the installation cavity is located the below of installation cavity before the second, circuit board and power module are located installation cavity before the second.
- The host of any one of claims 1-4, wherein the front housing includes a first front housing and a second front housing, the first front housing positioned above the second front housing, the first front housing and the main housing enclosing a first front mounting cavity, the circuit board and power module positioned within the first front mounting cavity; the second procapsid encloses into the installation cavity before the second with the main casing body, the installation cavity is located the below of installation cavity before the second, the probe switching box is located the installation cavity before the second, the second procapsid has the socket that corresponds with the probe switching box.
- The host of claim 5, further comprising an electrocardiogram module mounted within the front mounting cavity.
- The host of claim 7, wherein the electrocardiogram module is mounted with the probe adapter box within the first front mounting cavity.
- A host computer according to any one of claims 1-8, wherein the front and rear housings are fixedly mounted to the main housing in a removable snap-fit arrangement or a screw-fastening arrangement, respectively.
- The host of any one of claims 1-9, further comprising a communication module for communication, the communication module mounted on a host motherboard within the rear mounting cavity.
- The host of claim 10, wherein the communication module comprises at least one of a wifi module and a 4G module.
- A host as claimed in claim 10 or 11, wherein the communication module is mounted on a lower portion of the host motherboard.
- The host of claim 12, wherein the hard disk is mounted in the rear mounting cavity and is mounted with the hard disk in a lower portion of a motherboard of the host.
- The host of any one of claims 1-13, further comprising a chassis, the circuit board mounted within the chassis, the chassis mounted on a motherboard of the host.
- The host of claim 14, further comprising a battery module mounted within the front mounting cavity.
- The host of claim 15, wherein the chassis, battery module, and power module are mounted side-by-side on a host motherboard.
- The host of any one of claims 1-16, further comprising a speaker mounted within the rear mounting cavity.
- A host computer according to claim 17, wherein the audio device is located in an upper portion of the rear mounting cavity.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/123799 WO2020132925A1 (en) | 2018-12-26 | 2018-12-26 | Main device for ultrasonic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112654297A true CN112654297A (en) | 2021-04-13 |
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ID=71126867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880097319.7A Pending CN112654297A (en) | 2018-12-26 | 2018-12-26 | Main unit of ultrasonic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112654297A (en) |
| WO (1) | WO2020132925A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN213850767U (en) * | 2020-10-20 | 2021-08-03 | 深圳邦健生物医疗设备股份有限公司 | Color ultrasonic instrument |
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| CN2935239Y (en) * | 2006-08-10 | 2007-08-15 | 原亮 | Reconfigurable compact flat computer |
| CN207571643U (en) * | 2017-11-02 | 2018-07-03 | 泰科电子(上海)有限公司 | Data center apparatus |
| CN107647884A (en) * | 2017-11-13 | 2018-02-02 | 无锡祥生医疗科技股份有限公司 | Medical ultrasound mainframe box, medical ultrasound imaging apparatus and system |
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2018
- 2018-12-26 WO PCT/CN2018/123799 patent/WO2020132925A1/en active Application Filing
- 2018-12-26 CN CN201880097319.7A patent/CN112654297A/en active Pending
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| DE4010545A1 (en) * | 1990-04-02 | 1991-10-10 | Tes Tappert Gmbh | Modular computer housing - has basic housing into which are inserted individual modules which can be tested discretely, e.g. CPU, ventilator unit modules |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020132925A1 (en) | 2020-07-02 |
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