CN112643219A - Laser wafer cutting equipment - Google Patents

Laser wafer cutting equipment Download PDF

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Publication number
CN112643219A
CN112643219A CN202011447540.6A CN202011447540A CN112643219A CN 112643219 A CN112643219 A CN 112643219A CN 202011447540 A CN202011447540 A CN 202011447540A CN 112643219 A CN112643219 A CN 112643219A
Authority
CN
China
Prior art keywords
wall
chamber
cutting
laser
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011447540.6A
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Chinese (zh)
Inventor
乔金彪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Superlight Microelectronics Co ltd
Original Assignee
Suzhou Superlight Microelectronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Superlight Microelectronics Co ltd filed Critical Suzhou Superlight Microelectronics Co ltd
Priority to CN202011447540.6A priority Critical patent/CN112643219A/en
Publication of CN112643219A publication Critical patent/CN112643219A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses laser wafer cutting equipment which comprises a support, wherein a controller is installed on the outer wall of the support, a control panel is installed on the outer wall of the support, a cutting chamber is installed at the top of the support, a moving chamber is installed on the inner wall of the cutting chamber, a laser cutting head is movably installed on the outer wall of the moving chamber, an electromagnetic sliding rail is installed on the inner wall of the cutting chamber, a clamping chamber is installed at the top of the electromagnetic sliding rail, and a first motor is installed on the inner wall of the clamping chamber. According to the invention, the wafer to be cut can be clamped through the arrangement of the clamping blocks, the clamping chamber can slide through the arrangement of the electromagnetic slide rail, the laser machine can move according to the requirement through the arrangement of the moving chamber, and the parts in the laser machine can be conveniently controlled by a user through the arrangement of the controller and the control panel.

Description

Laser wafer cutting equipment
Technical Field
The invention relates to the technical field of cutting, in particular to laser wafer cutting equipment.
Background
The wafer laser cutting equipment is special laser cutting equipment for semiconductor wafers such as integrated circuits, LED wafers, gallium arsenide wafers and the like. Wafer dicing is an indispensable process in semiconductor packaging process, and in recent years, with rapid development of the optoelectronic industry, demand for highly integrated and high-performance semiconductor wafers is increasing.
Among the prior art, original wafer laser cutting equipment is not convenient for fix the wafer, and the inconvenient suitable angle of adjusting wafer laser cutting equipment of staff carries out work, and original wafer laser cutting equipment is not convenient for people's daily use, and the problem that the aforesaid appears is solved to the laser wafer cutting device that now urgently needs.
Disclosure of Invention
The present invention is directed to a laser wafer dicing apparatus to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: laser wafer cutting equipment, which comprises a bracket, install the controller on the outer wall of support, install control panel on the outer wall of support, the cutting room is installed at the top of support, install on the inner wall of cutting room and remove the room, movable mounting has the laser cutting head on the outer wall of removal room, install the electromagnetism slide rail on the inner wall of cutting room, the centre gripping room is installed at the top of electromagnetism slide rail, install first motor on the inner wall of centre gripping room, the gear is installed to the output of first motor, the center department of gear installs the connecting rod, install the telescopic link on the connecting rod, the clamp splice is installed to the one end of connecting rod, the inner wall of removal room is installed the second motor, the threaded rod is installed to the output of second motor.
Preferably, the threaded rod is connected with the inner wall of the moving chamber through a shaft rod, and a threaded hole matched with the threaded rod in size is formed in the laser cutting head.
Preferably, the number of connecting rods is two, two the connecting rods are connected through the telescopic link, the number of gears is two and mesh mutually.
Preferably, the inner wall of the cutting chamber is provided with a sliding groove matched with the size of the clamping chamber, and the outer wall of the cutting chamber is provided with an anticorrosive coating.
Preferably, the sliding blocks are installed on two sides of the laser cutting head, and a sliding groove matched with the size of the upper sliding block of the laser cutting head is formed in the inner wall of the moving chamber.
Preferably, the number of the clamping blocks is two, and the two clamping blocks are connected with the inner wall of the clamping chamber through springs.
Compared with the prior art, the invention has the beneficial effects that: this laser wafer cutting equipment, through the setting of clamp splice for by the wafer of cutting can be held, through the setting of electromagnetism slide rail, make the centre gripping room can slide, through the setting that removes the room, make the laser machine can remove as required, through the setting of controller and control panel, the person of facilitating the use can control its inside part, this device structural design is simple ingenious, is applicable to on the laser cutting wafer.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a schematic view of the internal structure of the filtration apparatus of the present invention.
In the figure: 1. a support; 2. a controller; 3. a control panel; 4. a cutting chamber; 5. a mobile chamber; 6. a laser cutting head; 7. an electromagnetic slide rail; 8. a clamping chamber; 9. a first motor; 10. a gear; 11. a connecting rod; 12. a telescopic rod; 13. a clamping block; 14. a second motor; 15. a threaded rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides an embodiment: laser wafer cutting equipment comprises a support 1, a controller 2 is installed on the outer wall of the support 1, a control panel 3 is installed on the outer wall of the support 1, a cutting chamber 4 is installed at the top of the support 1, a sliding groove matched with the size of a clamping chamber 8 is formed in the inner wall of the cutting chamber 4, an anticorrosive layer is installed on the outer wall of the cutting chamber 4, a moving chamber 5 is installed on the inner wall of the cutting chamber 4, a laser cutting head 6 is movably installed on the outer wall of the moving chamber 5, sliding blocks are installed on two sides of the laser cutting head 6, a sliding groove matched with the size of an upper sliding block of the laser cutting head 6 is formed in the inner wall of the moving chamber 5, an electromagnetic sliding rail 7 is installed on the inner wall of the cutting chamber 4, the clamping chamber 8 is installed at the top of the electromagnetic sliding rail 7, a first motor 9 is installed on the inner wall of the clamping chamber 8, install telescopic link 12 on connecting rod 11, clamp splice 13 is installed to the one end of connecting rod 11, the quantity of connecting rod 11 is two, two connecting rods 11 are connected through telescopic link 12, the quantity of clamp splice 13 is two, two clamp splices 13 all are connected through the inner wall of spring and centre gripping room 8, the quantity of gear 10 is two and mesh mutually, the inner wall of removal room 5 is installed second motor 14, threaded rod 15 is installed to the output of second motor 14, threaded rod 15 is connected through axostylus axostyle and the inner wall of removal room 5, set up the screw hole with 15 size looks adaptations of threaded rod on the laser cutting head 6.
The working principle is as follows: firstly, the wafer to be cut is clamped by the clamping block 13, when the wafer is required to be cut, the first motor 9 is started through the controller 2 and the control panel 3, the first motor 9 drives the gear 10 to rotate, the gear 10 drives the connecting rod 11 to move in opposite directions in the rotating process, the connecting rod 11 drives the clamping block 13 to move in opposite directions, the wafer is further clamped, the wafer is cut after the clamping is finished, in the cutting process, the second motor 14 needs to be started, the second motor 14 drives the threaded rod 15 to rotate, the threaded rod 15 drives the laser cutting head 6 to move in the rotating process, then the clamping chamber 8 is pushed by the electromagnetic slide rail 7 to move inside the cutting chamber, when the laser cutting head 6 is located at the top of the wafer clamped on the clamping chamber 8, the cutting is carried out, and the cutting of the laser wafer can be realized.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or scope of the present invention. Accordingly, the embodiments of the invention are exemplary, but not limiting. The scope of the invention is indicated by the appended claims rather than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. Laser wafer cutting equipment, including support (1), its characterized in that: the cutting machine is characterized in that a controller (2) is installed on the outer wall of the support (1), a control panel (3) is installed on the outer wall of the support (1), a cutting chamber (4) is installed at the top of the support (1), a moving chamber (5) is installed on the inner wall of the cutting chamber (4), a laser cutting head (6) is movably installed on the outer wall of the moving chamber (5), an electromagnetic sliding rail (7) is installed on the inner wall of the cutting chamber (4), a clamping chamber (8) is installed at the top of the electromagnetic sliding rail (7), a first motor (9) is installed on the inner wall of the clamping chamber (8), a gear (10) is installed at the output end of the first motor (9), a connecting rod (11) is installed at the center of the gear (10), a telescopic rod (12) is installed on the connecting rod (11), and a clamping block (13) is installed at one end, the inner wall of the moving chamber (5) is provided with a second motor (14), and the output end of the second motor (14) is provided with a threaded rod (15).
2. The laser wafer dicing apparatus of claim 1, wherein: the threaded rod (15) is connected with the inner wall of the moving chamber (5) through the shaft rod, and the laser cutting head (6) is provided with a threaded hole matched with the threaded rod (15) in size.
3. The laser wafer dicing apparatus of claim 1, wherein: the number of connecting rods (11) is two, two connecting rods (11) are connected through telescopic link (12), the number of gear (10) is two and mesh mutually.
4. The laser wafer dicing apparatus of claim 1, wherein: the inner wall of the cutting chamber (4) is provided with a sliding groove matched with the size of the clamping chamber (8), and the outer wall of the cutting chamber (4) is provided with an anticorrosive coating.
5. The laser wafer dicing apparatus of claim 1, wherein: the slider is installed to the both sides of laser cutting head (6), set up the spout with laser cutting head (6) top sliding block size looks adaptation on the inner wall of removal room (5).
6. The laser wafer dicing apparatus of claim 1, wherein: the number of the clamping blocks (13) is two, and the two clamping blocks (13) are connected with the inner wall of the clamping chamber (8) through springs.
CN202011447540.6A 2020-12-09 2020-12-09 Laser wafer cutting equipment Pending CN112643219A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011447540.6A CN112643219A (en) 2020-12-09 2020-12-09 Laser wafer cutting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011447540.6A CN112643219A (en) 2020-12-09 2020-12-09 Laser wafer cutting equipment

Publications (1)

Publication Number Publication Date
CN112643219A true CN112643219A (en) 2021-04-13

Family

ID=75353741

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011447540.6A Pending CN112643219A (en) 2020-12-09 2020-12-09 Laser wafer cutting equipment

Country Status (1)

Country Link
CN (1) CN112643219A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104913751A (en) * 2015-06-19 2015-09-16 江苏阳明船舶装备制造技术有限公司 Bending pipe correction tooling platform and pipe correction method
CN206382713U (en) * 2016-12-29 2017-08-08 蓝晶科技（义乌）有限公司 Chip abnormal shape window laser cutting machine
WO2019082959A1 (en) * 2017-10-27 2019-05-02 リンテック株式会社 Film for protective film formation use, composite sheet for protective film formation use, and method for manufacturing semiconductor chip
CN208812120U (en) * 2018-09-14 2019-05-03 山东商务职业学院 A kind of chucking power adjustable six degree of freedom haul robot

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104913751A (en) * 2015-06-19 2015-09-16 江苏阳明船舶装备制造技术有限公司 Bending pipe correction tooling platform and pipe correction method
CN206382713U (en) * 2016-12-29 2017-08-08 蓝晶科技（义乌）有限公司 Chip abnormal shape window laser cutting machine
WO2019082959A1 (en) * 2017-10-27 2019-05-02 リンテック株式会社 Film for protective film formation use, composite sheet for protective film formation use, and method for manufacturing semiconductor chip
CN208812120U (en) * 2018-09-14 2019-05-03 山东商务职业学院 A kind of chucking power adjustable six degree of freedom haul robot

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