CN112639661A

CN112639661A - Bendable electronic equipment

Info

Publication number: CN112639661A
Application number: CN201880094131.7A
Authority: CN
Inventors: 刘景�; 陈松亚
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2018-09-14
Filing date: 2018-09-14
Publication date: 2021-04-09
Also published as: WO2020051905A1

Abstract

A bendable electronic apparatus (100) includes a bending member (20), a circuit board member (30), and a covering member (40). The bending part (20) comprises a connecting piece (24), a first supporting frame (22) and a second supporting frame (26), and the connecting piece (24) is connected with the first supporting frame (22) and the second supporting frame (26). Bent part (20) is connected to cover part (40), cover part (40) including first covering (42), cladding piece (44) and second covering (46), first covering (42) and second covering (46) are connected in cladding piece (44), first covering (42) correspond first carriage (22) and set up, second covering (46) correspond second carriage (26) and set up, cladding piece (44) cover connecting piece (24), cladding piece (44) adopt graphite alkene silica gel to make. The circuit board component (30) is disposed between the first support frame (22) and the first cover (42).

Description

Bendable electronic equipment

Technical Field

The application relates to the field of electronic equipment, in particular to bendable electronic equipment.

Background

Electronic device's among the correlation technique mainboard generally is through the back lid of electronic device and dispels the heat, and the proportion of the total area of lid behind the part back that nevertheless the mainboard corresponds is less, and consequently the mainboard is less through the heat conduction area of back lid, causes the temperature of the back lid that the mainboard corresponds higher, influences user experience.

Disclosure of Invention

In view of this, the present application provides a bendable electronic device with good heat dissipation performance.

The bendable electronic equipment comprises a bending component, a circuit board component and a covering component. The bending part comprises a connecting piece, a first supporting frame and a second supporting frame, and the connecting piece is connected with the first supporting frame and the second supporting frame. The covering component is connected with the bending component. The covering part comprises a first covering part, a covering part and a second covering part, and the covering part is connected with the first covering part and the second covering part. The first covering piece is arranged corresponding to the first supporting frame, the second covering piece is arranged corresponding to the second supporting frame, and the covering piece covers the connecting piece. The cladding piece is made of graphene silica gel. The circuit board component is arranged between the first supporting frame and the first covering piece.

The cover part of the bendable electronic equipment of the embodiment of the application corresponds to the bending part, the cover part is connected with the bending part, the heat dissipation area of the circuit board part is increased by the cover part and the bending part, the cover part covers the connecting piece, the user can be prevented from being clamped by the connecting piece due to misoperation, and the connecting piece can be protected from being corroded and damaged by external water vapor, impurities and the like. And the cladding piece is made of graphene silica gel material with high thermal conductivity and strength, so that the performance and the heat dissipation capability of the covering assembly can be improved, the purpose of soaking and heat dissipation of the circuit board component through the integral covering component is realized, and the local over-high temperature of the covering component is avoided.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic view of a bendable electronic apparatus according to an embodiment of the present application.

Fig. 2 is an exploded perspective view of a bendable electronic device according to an embodiment of the present application.

Fig. 3 is a schematic perspective view of a bendable electronic device according to an embodiment of the present application when the device is unfolded.

Fig. 4 is a schematic cross-sectional view of the bendable electronic device of fig. 3.

Fig. 5 is a schematic perspective view of a foldable electronic device according to an embodiment of the present application when folded.

Fig. 6 is a schematic cross-sectional view of the bendable electronic device of fig. 5.

Fig. 7 is a perspective view of a bending member according to an embodiment of the present application.

Fig. 8 is a perspective view of a circuit board component according to an embodiment of the present application.

Fig. 9 is a schematic perspective view of a covering member according to an embodiment of the present application.

Description of the main element symbols: the flexible heat sink 10, the first heat conduction layer 12, the second heat conduction layer 14, the bending member 20, the first support frame 22, the third accommodating space 222, the connection member 24, the second support frame 26, the fourth accommodating space 262, the circuit board member 30, the first chip 31, the first shield cover 32, the first heat conductor 33, the motherboard 34, the second chip 35, the second shield cover 36, the second heat conductor 37, the covering member 40, the first covering member 42, the first accommodating space 422, the first inner surface 424, the covering member 44, the second covering member 46, the second accommodating space 462, the second inner surface 464, the battery 50, the flexible support member 60, the first support plate 62, the second support plate 64, the flexible display screen 70, and the foldable electronic device 100.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1, the present application provides a foldable electronic device 100. The bendable electronic device 100 of the present application includes, but is not limited to, smart terminals and display devices such as a flexible smart phone, a foldable smart computer, and a wearable smart product. The shape of the foldable electronic apparatus 100 may be set as appropriate, and may be, for example, a rectangular parallelepiped shape.

Referring to fig. 2, a foldable electronic device 100 according to an embodiment of the present disclosure includes a foldable member 20, a circuit board member 30 and a covering member 40. The bending member 20 includes a connecting member 24, a first supporting frame 22 and a second supporting frame 26, and the connecting member 24 connects the first supporting frame 22 and the second supporting frame 26. The covering member 40 is connected to the bending member 20. The covering member 40 includes a first covering member 42, a covering member 44, and a second covering member 46, and the covering member 44 connects the first covering member 42 and the second covering member 46. The first cover member 42 is disposed corresponding to the first support frame 22, the second cover member 26 is disposed corresponding to the second support frame 46, and the covering member 44 covers the connecting member 24. The covering member 44 is made of graphene silica gel. The circuit board component 30 is disposed between the first support frame 22 and the first cover 42.

The covering member 40 of the foldable electronic device 100 according to the embodiment of the present application is disposed corresponding to the bending member 20, and the covering member 40 and the bending member 20 are connected to each other, so that the heat dissipation area of the circuit board member 30 through the covering member 40 and the bending member 30 is increased. The covering member 44 connects the first covering member 42 and the second covering member 46, and heat conducted to the first covering member 42 may be conducted to the second covering member 46 through the covering member 44, and heat conducted to the second covering member 46 may be conducted to the first covering member 42 through the covering member 44. The covering member 44 is made of graphene silica gel material with high thermal conductivity and strength, and the performance and heat dissipation capability of the covering member 40 can be improved, so that the purpose of heat soaking and heat dissipation of the circuit board member 30 through the integral covering member 40 is achieved, and the local over-high temperature of the covering member 40 is avoided. The covering member 44 covers the connecting member 24, so that the user is prevented from being damaged by the connecting member 24 due to misoperation, and the connecting member 24 is protected from being corroded and damaged by external moisture, impurities and the like.

In one embodiment, the connecting member 24 may be a hinge, and the first supporting frame 22 and the second supporting frame 26 may be connected to the connecting member 24 by welding or screwing. In the present embodiment, the connecting member 24 is made of a metal material, so that the connecting member 24 has high strength and better heat conduction effect. In other embodiments, the connecting member 24 may be a structure with a certain bending capability, such as a structure made of plastic, polymer material, and metal material.

Specifically, the bendable electronic device 100 can be switched between bending and flattening, and the bending and flattening of the bendable electronic device 100 is realized by the deformation of the connecting element 24. In the present embodiment, the connecting member 24 is a hinge. When the foldable electronic device 100 is bent, the exposed connecting element 24 may hurt the user's hand, and the exposed connecting element 24 is also easily damaged by the external environment, such as moisture, impurities, etc. Therefore, the cover 44 is provided to connect the first cover 42 and the second cover 46 to cover the connector 24, thereby protecting the connector 24.

In one embodiment, the covering member 44 may be made of silicone, polymer, metal, or the like.

Specifically, for example, the Polyimide (PI) material is a polymer material, and has excellent heat resistance, excellent mechanical properties, good chemical stability, moist heat resistance, good radiation resistance, and good dielectric properties, and in addition, the Polyimide material has the characteristics of low temperature resistance, low expansion coefficient, flame retardancy, good biocompatibility, and the like, and can better isolate moisture and the like from entering the interior of the bendable electronic device 100, and better dissipate heat, thereby improving the strength of the covering member 40 and further improving the strength of the bendable electronic device 100.

It is understood that the covering member 44 is not limited to the materials mentioned above, such as silicone, polymer, and metal, and may be selected in specific embodiments. Preferably, in the embodiment of the present application, the covering member 44 is made of a graphene silica gel material with excellent heat dissipation performance.

The first cover 42 covers the first support frame 22 correspondingly, and the second cover 46 covers the second support frame 26 correspondingly. The connecting member 24 divides the bendable electronic device 100 into a first portion and a second portion, the first portion includes the first support frame 22 and the first cover 42, the second portion includes the second support frame 26 and the second cover 46, the connecting member 24 connects the first portion and the second portion, and the first portion and the second portion can be bent and flattened through the connecting member 24.

In one embodiment, the first support frame 22, the connecting member 24, and the second support frame 26 may be made of a metal material. As such, the first and second support frames 22 and 26 have higher strength to support the bendable electronic device 100 and have better heat conduction effect to facilitate heat dissipation.

It is understood that in other embodiments, the materials of the first support frame 22, the connecting member 24 and the second support frame 26 are not limited to metal, and may be specifically selected on the premise of ensuring the strength and the bearing effect of the first support frame 22, the connecting member 24 and the second support frame 26.

In one embodiment, the first cover 42 may be made of a 3D glass material, a plastic material, or a graphene plastic material, and the second cover 46 may be made of a 3D glass material, a plastic material, or a graphene plastic material.

Specifically, taking a 3D glass material as an example, the 3D glass material has good thermal conductivity, and has the advantages of being light, thin, transparent, clean, fingerprint-resistant, anti-glare, hard, scratch-resistant, and good in weather resistance, and the plastic can be used for making 3D appearances of various shapes, so that the formed product is more beautiful and outstanding and has differentiation, and the first covering element 42 and the second covering element 46 have good strength and beauty.

The graphene silica gel material can be formed by uniformly mixing graphene and silica gel through a solvent exchange method, the elastic modulus and the fracture toughness of the graphene silica gel material are greatly improved compared with those of graphene and silica gel, and the graphene silica gel material has other various characteristics such as higher thermal conductivity, better thermal stability, sulfuration resistance, moisture resistance, chemical stability and the like, the performances of the first covering part 42 and the second covering part 46 can be improved, the service life is prolonged, and the appearance of the bendable electronic device 100 is further beautified and the experience of a user is enhanced.

It is understood that the first cover 42 and the second cover 46 are not limited to the above-mentioned 3D glass material, plastic material and graphene plastic material, and may be selected in specific embodiments.

In some embodiments, the bendable electronic device 100 includes a flexible heat sink 10 located between the circuit board component 30 and the first cover 42, the flexible heat sink 10 thermally connecting the circuit board component 30, the first support frame 22, the first cover 42, and the cover 46, the flexible heat sink 10 covering the connector 24 and thermally connecting with the connector 24.

Specifically, the first cover 42 and the second cover 46 are connected using the flexible heat sink 10, and the cover 44 covers a portion of the flexible heat sink 10 corresponding to the connector 24. The flexible heat sink 10 may conduct heat generated by the circuit board component 30 to the flexible heat sink 10, and then conduct the heat to the first cover 42 and the second cover 46 through the flexible heat sink 10, so as to increase the heat dissipation area and facilitate uniform heat dissipation. The covering member 44 connects the first covering member 42 and the second covering member 46, and heat conducted to the first covering member 42 may be conducted to the second covering member 46 through the covering member 44, and heat conducted to the second covering member 46 may be conducted to the first covering member 42 through the covering member 44. Since the covering member 44 covers the portion of the flexible heat sink 10 corresponding to the connection member 24, the heat conducted to the flexible heat sink 10 can also be directly radiated through the covering member 44. The covering member 40 dissipates heat to the air outside the bendable electronic device 10 by heat radiation and natural convection heat dissipation, so that the circuit board member 30 achieves the purpose of uniform heat dissipation through the covering member 40 as a whole, and local over-temperature of the covering member 40 is avoided.

In certain embodiments, the flexible heat sink 10 includes a first heat conductive layer 12 and a second heat conductive layer 14 arranged in a stack. The second heat conductive layer 14 is provided on the covering member 40. The first heat conductive layer 12 is disposed on a side of the second heat conductive layer 14 away from the covering member 40. Specifically, the first thermally conductive layer 12 is attached to the connection member 24 and the circuit board member 30, and the second thermally conductive layer 14 is attached to the first cover member 42 and the second cover member 46.

In particular, the strength of the first heat conducting layer 12 is greater than the strength of the second heat conducting layer 14. The second layer 14 is stacked on top of the first layer 12 to protect the second layer 14 from damage. The first heat conduction layer 12 is attached to the connecting member 24 and the circuit board component 30, and the second heat conduction layer 14 is attached to the first covering member 42 and the second covering member 46, so that the contact area between the flexible heat dissipation member 10 and each component can be increased, the heat conduction and dissipation of the circuit board component 30 through the flexible heat dissipation member 10 are facilitated, and the tightness and the connection stability of the internal structure of the bendable electronic device 10 are also facilitated to be improved.

It will be appreciated that the flexible heat sink 10 may also comprise only the second heat conducting layer 14, i.e. both heat conducting and supporting by the second heat conducting layer 14, in which case the first heat conducting layer 12 may be omitted.

In certain embodiments, the orthographic area of first layer 12 on second layer 14 overlies second layer 14.

Specifically, the size of the first thermally conductive layer 12 may be the same as the size of the second thermally conductive layer 14, or the size of the first thermally conductive layer 12 may be slightly larger than the size of the second thermally conductive layer 14, so that the first thermally conductive layer 12 can sufficiently separate the second thermally conductive layer 14 from the battery 50, the connector 24 and the circuit board member 30 to reduce the wear of the second thermally conductive layer 14.

In some embodiments, first conductive layer 12 is made of metal and second conductive layer 14 is made of graphene or graphite material.

Thus, the first heat conducting layer 12 and the second heat conducting layer 14 have better heat conducting effect. In one example, the first heat conduction layer 12 may be made of a metal steel sheet, so that the first heat conduction layer 12 can enhance the strength of the flexible heat dissipation member 10, and further enhance the strength of the bendable electronic device 100.

Specifically, graphene materials such as graphene thin films and graphite materials such as graphite sheets. The graphene material and the graphite material have the advantages of stable structure, high strength, high toughness, flexibility, excellent electrical conductivity and thermal conductivity and the like, and have good thermal shock resistance, namely the graphite can withstand severe temperature change at normal temperature without being damaged, and when the temperature changes suddenly, the volume change of the graphite is not large, cracks are not generated, and a good second heat conduction layer 14 can be formed.

It will be appreciated that the first heat conducting layer 12 is not limited to being made of a metallic material, nor is the second heat conducting layer 14 limited to being made of the graphene and graphite materials mentioned above, and that in a specific embodiment a suitable material is specifically selected, but preferably the thermal conductivity of the second heat conducting layer 14 is greater than the thermal conductivity of the first heat conducting layer 12.

Referring to fig. 2, in some embodiments, the bendable electronic device 100 includes a battery 50, the battery 50 is disposed between the second support frame 26 and the second cover 46 and is fixedly connected to the flexible heat sink 10, and the battery 50 is located on the other side of the connector 24 away from the circuit board component 30.

It is understood that the flexible heat sink 10 is located between the battery 50 and the second cover 46, and the battery 50 is connected to the second cover 46 through the flexible heat sink 10 such that the battery 50 can dissipate heat through the second support frame 26 and the second cover 46. The circuit board component 30 generates a larger amount of heat due to a larger heat generating power, the battery 50 generates a smaller amount of heat than the circuit board component 30, and the heat generated by the flexible heat sink 30 can be conducted to the connector 24 and the second cover 46 corresponding to the battery 50 through the flexible heat sink 10, so as to dissipate the heat evenly and prevent the first cover 42 corresponding to the circuit board component 30 from having a higher temperature.

More specifically, the first heat conductive layer 12 is fixedly disposed with the battery 50, the connector 24, and the circuit board member 30, and the second heat conductive layer 14 is fixedly disposed with the cover member 40.

The first heat conducting layer 12 is fixedly arranged with the battery 50, the connector 24 and the circuit board member 30. it is understood that the battery 50, the connector 24 and the circuit board member 30 are connected with each other through the first heat conducting layer 12, on one hand, heat of the circuit board member 30 can be averaged to the battery 50 and the connector 24, and then the heat is conducted to the second heat conducting layer 14 to be radiated through the covering member 40; on the other hand, the first heat conducting layer 12 can carry the battery 50, the connector 24 and the circuit board assembly 30 to improve the stability of the bendable electronic device 100.

Referring to fig. 2, 4 and 9, the first supporting frame 22 and the first covering element 42 are connected to form a first accommodating space 422, and the second supporting frame 26 and the second covering element 46 are connected to form a second accommodating space 462. The first cover 42 is connected to the second cover 46 by the wrapping 44 and forms a continuous plane.

Further, the combination of the first receiving space 422, the plane and the second receiving space 462 can carry other components of the bendable electronic device 100, for example, the flexible heat sink 10 can be attached to the plane, the circuit board component 30 and the battery 50 are respectively received in the first receiving space 422 and the second receiving space 462, and the bending component 20 is carried on the sidewall of the periphery of the covering component 40, so that a more stable connection can be formed, the space utilization rate of the covering component 40 is improved, and the integration of the bendable electronic device 100 is improved.

Referring to fig. 2, 4 and 9, in some embodiments, the first covering element 42 includes a first inner surface 424 that conforms to the flexible heat dissipation element 10. The second cover 46 includes a second inner surface 464 that conforms to the flexible heat sink 10.

It will be appreciated that the second plate 14 is attached to the first and second

inner surfaces

424, 464. The greater the contact area of the flexible heat sink 10 with the first and second

inner surfaces

424, 464, the greater the area over which the flexible heat sink 10 can conduct heat through the first and second covers 42, 46.

In this embodiment, the area of the attachment of the flexible heat sink 10 to the first inner surface 424 is greater than two-thirds of the total area of the first inner surface 424. The area of attachment of the flexible heat sink 10 to the second inner surface 464 is greater than two-thirds of the total area of the second inner surface 464.

The ratio of the attachment area of the flexible heat dissipation member 10 to the areas of the first inner surface 424 and the second inner surface 464 is moderate, so that the flexible heat dissipation member 10 can be well attached to the first covering member 42 and the second covering member 46 for heat dissipation, and the material usage of the flexible heat dissipation member 10 is also saved.

In one embodiment, the flexible heat dissipation element 10 may cover the first inner surface 424 and the second inner surface 464 entirely, so as to increase the contact area between the flexible heat dissipation element 10 and the first cover 42 and the second cover 46, facilitate heat conduction, and further improve the heat dissipation effect of the flexible heat dissipation element 10. Of course, the attachment ratio of the flexible heat dissipation member 10 to the first and second

inner surfaces

424, 464 is not limited to the above-mentioned ratio, and may be selected in a specific embodiment.

Referring to fig. 4, 6 and 8, in some embodiments, the circuit board assembly 30 includes a first chip 31, a first shielding cover 32, a first heat conductor 33 and a main board (main board) 34. The first chip 31 is disposed on the main board 34. The first shielding can 32 covers the first chip 31, or the first chip 31 is accommodated in the first shielding can 32. The side of the first shield 32 remote from the main board 34 is attached to the flexible heat sink 10. The first heat conductor 33 is accommodated in the first shielding cover 32 and connects the first shielding cover 32 and the first chip 31.

Specifically, the first chip 31 and the first heat conductor 33 are stacked and accommodated in the first shielding cover 32. The provision of the first shield can 32 can increase the heat dissipation area of the main board 34 and serve to protect the first chip 31. The heat dissipation between the first chip 31 and the rest of the components in the bendable electronic device 100 will not affect each other, and thus the heat dissipation efficiency can be improved. The provision of the first heat conductor 33 can improve the efficiency of heat conduction between the first chip 31 and the first shield can 32.

More specifically, the first chip 31 may be, for example, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a Digital Signal Processor (DSP), a Modem (Modem), a navigation positioning chip, multimedia, or other chips or processing modules. The main Board 34 may be a Printed Circuit Board (PCB) and electrically connected to the battery 50 through a conductive wire, and the first chip 31 is electrically disposed on the main Board 34.

In some embodiments, the circuit board assembly 30 further includes a second chip 35, a second shield 36, and a second thermal conductor 37. The second chip 35 and the first chip 31 are respectively disposed on two opposite sides of the main board 34. The second shielding case 36 covers the second chip 35, or the second chip 35 is accommodated in the second shielding case 36. The surface of the second shielding case 36 away from the main board 34 is attached to the first supporting frame 22. The second heat conductor 37 is accommodated in the second shield case 36 and connects the second shield case 36 and the second chip 35.

Specifically, the second chip 35 and the second heat conductor 37 are stacked and contained in the second shielding cover 36, and the heat generated by the second chip 35 can be conducted to the first supporting frame 22 through the second shielding cover 36 and dissipated. The second shield 32 may be used to protect the second chip 35.

The provision of the second heat conductor 37 can improve the efficiency of heat conduction between the second chip 35 and the second shield can 36. More specifically, the second chip 35 may be, for example, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a Digital Signal Processor (DSP), a Modem (Modem), a navigation positioning module, a multimedia module, or the like, and the second chip 35 is electrically disposed on the main board 34. More specifically, the second chip 35 has a function different from that of the first chip 36.

In some embodiments, the thermal conductors include a first thermal conductor 33 and a second thermal conductor 37, and the materials used for the first thermal conductor 33 and the second thermal conductor 37 include thermally conductive silicone.

Specifically, the heat-conducting silica gel is a heat-conducting compound, has high heat conductivity and heat conductivity, cold and heat exchange resistance, aging resistance and electrical insulation, and has excellent moisture resistance, shock resistance, corona resistance, electric leakage resistance, wide use temperature, chemical medium resistance, low consistency and good use stability. The flexible electronic device 100 has good construction performance, good adhesion to most of metal and non-metal materials, good adhesion and protection effects on the first chip 31 and the second chip 35, improved safety of the circuit board component 30, and further guaranteed use safety and service life of the flexible electronic device 100.

In some embodiments, the bendable electronic device 100 is capable of switching between an unfolded state and a folded state, and the bending angle of the bendable electronic device 100 is between 0 ° and 180 °.

As shown in fig. 3 and fig. 4, when the bending angle of the bendable electronic apparatus 100 is 0 °, the bendable electronic apparatus 100 is in a flat state. As shown in fig. 5 and fig. 6, when the bendable electronic device 100 is bent at an angle of approximately 180 °, the first supporting frame 22 and the second supporting frame 26 are substantially overlapped, and at this time, the distance between the circuit board 30 and the battery 50 is small, and the heat dissipation between the circuit board 30 and the battery 50 may affect each other, so that the difficulty of heat dissipation of the bendable electronic device 100 is increased.

Therefore, the flexible heat sink 10 is provided to dissipate heat from the cover member 40 away from the first and second support frames 22 and 26 relatively quickly, thereby ensuring proper temperature and use of the foldable electronic device 100.

In some embodiments, the first support frame 22 and the second support frame 26 are close to each other when the bendable electronic device 100 is bent and are far away from each other when the bendable electronic device 100 is unfolded.

Specifically, when the bendable electronic device 100 is bent, the cover part 40 and the flexible heat sink 10 are located at the outer side of the bendable electronic device 100 relative to the bending part 20, so that even if the bendable electronic device 100 is bent and the circuit board part 30 and the battery 50 are close to each other, the first support frame 22 and the second support frame 26 in combination with the flexible heat dissipation assembly 10 and the cover part 30 located at the outer side can dissipate heat generated by the circuit board part 30 and heat generated by the battery 50;

when the electronic device 100 is unfolded, the first support frame 22 and the second support frame 26 are away from each other, so that heat generated by the circuit board member 30 and the battery 50 can be dissipated from the cover member 30 side and the bending member 20 side, which is beneficial for dissipating heat and preventing the bendable electronic device 100 from overheating.

In some embodiments, when the bendable electronic device 100 is bent, the first cover 42 and the second cover 46 are close to each other, and a distance between the first cover 42 and the second cover 46 is greater than a distance between the first support frame 22 and the second support frame 26.

It is understood that when the foldable electronic device 100 is bent, the covering part 40 is located at the outer side of the foldable electronic device 100 relative to the bending part 20, so that the heat dissipation is more facilitated when the foldable electronic device 100 is bent.

Referring to fig. 2, fig. 4 and fig. 6, in some embodiments, the bendable electronic device 100 includes a flexible supporting member 60 and a flexible display screen 70 disposed on the flexible supporting member 60. The flexible support member 60 is provided on the bending member 20. The flexible support member 60 includes a first support plate 62 and a second support plate 64 stacked on the first support plate 62. The first support plate 62 is fixedly disposed on the bending member 20. The flexible display screen 70 is fixedly disposed on the second support plate 64.

Specifically, the flexible supporting member 60 is disposed on the bending member 20, and on one hand, the flexible supporting member 60 may be used to bear the flexible display screen 70 to space the flexible display screen 70 from the bending member 20, so as to prevent the flexible display screen 70 from being directly pulled by the bending member 20 when the bending member 20 is deformed, thereby protecting the flexible display screen 70 from being damaged.

Referring to fig. 2 and fig. 7, the first support frame 22 and the second support frame 26 are disposed at the upper edge of the connecting member 26, the first support frame 22, the connecting member 24 and the second support frame 26 form a continuous plane, a third accommodating space 222 and a fourth accommodating space 262 are respectively formed in the first support frame 22 and the second support frame 24, and the flexible support member 60 and the flexible display screen 70 are accommodated in the third accommodating space 222 and the fourth accommodating space 262.

Thus, the flexible supporting member 60 and the flexible display 70 are stably disposed on the bending member 20, and the bendable electronic device 100 is formed.

In some embodiments, the first support plate 62 is made of a metal material and the second support plate 64 is made of a liquid metal material.

Thus, the first supporting plate 62 and the second supporting plate 64 have higher strength and better heat conductivity, so as to form the flexible supporting member 60 having higher strength and better heat conductivity, and improve the heat dissipation capability of the circuit board member 30 to the flexible display screen 70 through the flexible supporting member 60.

In summary, in the foldable electronic apparatus 100, the bending member 20 and the covering member 40 respectively form two heat dissipation paths, i.e., the bending member 20 and the covering member 40 can dissipate heat of the circuit board member 30 and the battery 50 in two different directions.

When the foldable electronic device 100 is in the unfolded state, the first support frame 22, the second support frame 26, the first cover 42 and the second cover 46 all dissipate heat as a main heat dissipation path. Since the heat of the circuit board 30 is higher than the heat of the battery 50, the heat of the circuit board 30 can be sequentially conducted to the first supporting frame 22 through the second heat conductor 37 and the second heat insulating cover 36, and the heat conducted to the first supporting frame 22 can be conducted to the second supporting frame 26 through the flexible supporting member 60, so as to achieve uniform temperature heat dissipation.

Meanwhile, the heat of the circuit board component 30 may also be sequentially conducted to the flexible heat sink 10 through the first heat conductor 33 and the first heat shield 32, and the heat conducted to the flexible heat sink 10 may be dissipated through the first rear cover 42 or conducted to the second rear cover 46 for uniform temperature heat dissipation.

However, when the foldable electronic device 100 is in the folded state, the first supporting frame 22 and the second supporting frame 26 are close to each other or even contact each other, so that the space for dissipating heat outwards is small, and the heat dissipation efficiency is low. Therefore, in the folded state, heat is mainly dissipated through an additional heat dissipation path, i.e., through the covering member 40 still located on the outside. A part of the heat of the circuit board component 30 is conducted to the first cover 42 through the flexible heat sink 10 to be radiated, another part is conducted to the second cover 46 through the flexible heat sink 10, and the heat of the battery 50 and the heat of the circuit board component 30 transferred from the flexible heat sink 10 are radiated through the second cover 46. The covering member 44 connects the first covering member 42 and the second covering member 46, and heat conducted to the first covering member 42 may be conducted to the second covering member 46 through the covering member 44, and heat conducted to the second covering member 46 may be conducted to the first covering member 42 through the covering member 44. Since the covering member 44 covers the portion of the flexible heat sink 10 corresponding to the connection member 24, the heat conducted to the flexible heat sink 10 can also be directly radiated through the covering member 44. The heat of the bendable electronic device 100 can be uniformly radiated and radiated in a large area by the entire heat radiation of the cover part 40, thereby ensuring the entire heat radiation efficiency.

Further, when the connector 24 is made of a metal material, it can also serve as a heat dissipation path for dissipating heat from the battery 50 and the circuit board assembly 30. Namely, the first support frame 22, the second support frame 26, the flexible heat sink 10, the first cover 42 and the second cover 46 may further transfer heat to the connection member 24, and then radiate the heat to the outside through the connection member 24, so as to further enhance the heat radiation effect.

In the embodiment of the present application, the flexible display 70 of the bendable electronic device 100 is in an inverted form, that is, after the bendable electronic device 100 is folded, the flexible display 70 is located at the inner side of the fold, and the covering member 40 is located at the outer side of the fold. Of course, it is to be understood that the bendable electronic device 100 of the present application is not limited to the inverted form, and the inverted bendable electronic device 100 is equally applicable.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

A bendable electronic device, comprising:

the bending component comprises a connecting piece, a first supporting frame and a second supporting frame, and the connecting piece is connected with the first supporting frame and the second supporting frame;

the covering part is connected with the bending part and comprises a first covering part, a covering part and a second covering part, the covering part is connected with the first covering part and the second covering part, the first covering part is arranged corresponding to the first supporting frame, the second covering part is arranged corresponding to the second supporting frame, the covering part covers the connecting part, and the covering part is made of graphene silica gel; and

a circuit board component disposed between the first support frame and the first cover.
The bendable electronic device of claim 1, comprising a flexible heat sink located between the circuit board component and the first cover, the flexible heat sink thermally connecting the circuit board component, the first support frame, the first cover, and the cover, the flexible heat sink covering and thermally connecting with the connector.
The bendable electronic device according to claim 2, wherein the covering member covers a portion of the flexible heat dissipating member corresponding to the connection member.
The bendable electronic device of claim 1, wherein the connector comprises a hinge.
The bendable electronic device according to claim 2, wherein the flexible heat dissipation member includes a first heat conductive layer and a second heat conductive layer arranged in a stack, the second heat conductive layer being disposed on the cover member, the first heat conductive layer being disposed on a side of the second heat conductive layer away from the cover member.
The bendable electronic device of claim 5, wherein the first thermally conductive layer is attached to the connector and the circuit board component, and the second thermally conductive layer is attached to the first cover, the wrap, and the second cover.
The bendable electronic device of claim 5, wherein the first thermally conductive layer has a lower thermal conductivity than the second thermally conductive layer, and wherein the first thermally conductive layer has a hardness greater than the second thermally conductive layer.
The bendable electronic device of claim 5, wherein the first heat conducting layer is made of a metal material and the second heat conducting layer is made of a graphene material or a graphite material.
The bendable electronic device of claim 2, wherein the bendable electronic device comprises a battery disposed between the second support frame and the second cover, the battery thermally conductively coupled with the flexible heat sink.
The bendable electronic device according to claim 9, wherein the first support frame and the first cover are connected to form a first accommodating space, and the circuit board component is accommodated in the first accommodating space;

the second supporting frame and the second covering piece are connected and form a second containing space together, and the battery is contained in the second containing space.
The bendable electronic device of claim 2, wherein the first cover comprises a first inner surface that is attached to the flexible heat dissipation element, wherein the second cover comprises a second inner surface that is attached to the flexible heat dissipation element, wherein the area of the flexible heat dissipation element attached to the first inner surface is greater than two-thirds of the total area of the first inner surface, and wherein the area of the flexible heat dissipation element attached to the second inner surface is greater than two-thirds of the total area of the second inner surface.
The bendable electronic device of claim 2, wherein the circuit board component comprises:

a main board;

the first chip is arranged on the mainboard; and

the cover is established the first shield cover of first chip, first shield cover is kept away from one side of mainboard with flexible heat dissipation spare heat conduction ground is connected.
The bendable electronic device of claim 12, wherein the circuit board component comprises a thermal conductor housed within the first shield can and thermally connecting the first shield can and the first chip.
The bendable electronic device of claim 12, wherein the circuit board component further comprises:

the second chip and the first chip are respectively arranged on two sides of the mainboard, which are opposite to each other; and

the second shielding case of second chip is established to the cover, the second shielding case is kept away from one side of mainboard with first carriage heat conduction ground is connected.
The bendable electronic device of claim 14, further comprising a thermal conductor housed within the second shield can and thermally connecting the second shield can and the second chip.
A bendable electronic device according to claim 13 or 15, wherein the heat conductor comprises a thermally conductive silicone.
The bendable electronic device according to claim 1, wherein the bendable electronic device is switchable between being bent and being flattened, and a distance between the first cover and the second cover is greater than a distance between the first support frame and the second support frame when the bendable electronic device is bent.
The bendable electronic device of claim 17, wherein the first support frame and the second support frame are proximate to each other when the bendable electronic device is bent;

when the bendable electronic equipment is unfolded and flattened, the first supporting frame and the second supporting frame are far away from each other.
The bendable electronic device of claim 1, wherein the bendable electronic device comprises a flexible support member and a flexible display screen disposed on the flexible support member, the flexible display screen being disposed on the bending member through the flexible support member.
The bendable electronic device according to claim 19, wherein the flexible supporting member comprises a first supporting plate and a second supporting plate which are stacked, the first supporting plate is fixedly disposed on the bendable member, the second supporting plate is disposed on a side of the first supporting plate away from the bendable member, and the flexible display screen is disposed on the second supporting plate.