CN112639393A

CN112639393A - Pair thickness recognition device, bundle thickness recognition method and handwriting input device

Info

Publication number: CN112639393A
Application number: CN201880095918.5A
Authority: CN
Inventors: 李丽
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2018-12-28
Filing date: 2018-12-28
Publication date: 2021-04-09
Anticipated expiration: 2038-12-28
Also published as: WO2020133191A1; CN112639393B

Abstract

A paper bundle thickness recognition device (13) comprises a controller (131) and a thickness sensing assembly (132), wherein the controller (131) is electrically connected with the thickness sensing assembly (132), the thickness sensing assembly (132) is horizontally arranged with a paper placing position (P) in parallel, the thickness sensing assembly (132) is used for sensing the thickness of a paper bundle and generating a corresponding thickness sensing signal when the paper bundle is placed on the paper placing position (P), and the controller (131) responds to the thickness sensing signal to recognize the thickness of the paper bundle. A method for identifying the thickness of a stack of paper and a handwriting input device (1) are provided. The handwriting input device (1) has good writing effect no matter the thickness of the paper stack.

Description

Pair thickness recognition device, bundle thickness recognition method and handwriting input device

Technical Field

The present application relates to the field of handwriting recognition, and in particular, to a device and a method for recognizing a thickness of a paper bundle, and a handwriting input device having the device for recognizing the thickness of the paper bundle.

Background

At present, with the continuous development of handwriting input devices and the convenience of recording, the handwriting input devices are widely applied to various occasions needing recording, such as conference recording and the like. The handwriting input device used at present is applied to laying paper above a writing board, people can write solid handwriting on the paper through a handwriting pen, and meanwhile, the handwriting pen and the writing board can detect the written content and control the written content to be displayed in other equipment. However, the existing writing board has different writing effects due to different thicknesses of paper bundles, the thicker the paper bundles are, the poorer the writing effect is, occasionally, the phenomenon of pen breaking or pen losing occurs, and the user experience is not good.

Disclosure of Invention

The embodiment of the application discloses a paper bundle thickness recognition device, a paper bundle thickness recognition method and a handwriting input device with the paper bundle thickness recognition device, which can recognize the paper bundle thickness so as to solve the problems.

The paper stack thickness recognition device disclosed in the embodiment of the application comprises a controller and a thickness sensing assembly, wherein the controller is electrically connected with the thickness sensing assembly, the thickness sensing assembly and a paper placing position are tiled in parallel, the thickness sensing assembly is used for sensing the thickness of a paper stack and generating a corresponding thickness sensing signal when the paper stack is placed on the paper placing position, and the controller responds to the thickness sensing signal to recognize the thickness of the paper stack.

The method for identifying the thickness of the paper bundle is applied to a paper bundle thickness identification device, the paper bundle thickness identification device comprises a thickness sensing component, and the thickness sensing component and a paper placement position are tiled in parallel. The method for identifying the thickness of the paper stack comprises the following steps: when the paper bundle is placed on the paper placing position, the thickness sensing component senses the thickness of the paper bundle and generates a corresponding thickness sensing signal; and responding to the thickness sensing signal to identify the thickness of the paper stack.

The handwriting input device comprises a writing board and a paper bundle thickness recognition device, wherein the paper bundle thickness recognition device is arranged on one side of the writing board, the writing board comprises a touch controller and a touch sensor, a paper placement position is arranged on the touch sensor, the paper bundle thickness recognition device recognizes the paper bundle thickness, and the touch controller adjusts a compensation capacitor which is adaptive to the paper bundle thickness and used for handwriting recognition between the touch sensor and a pen point of a handwriting pen according to the paper bundle thickness.

According to the paper bundle thickness recognition device, the paper bundle thickness recognition method and the handwriting input device with the paper bundle thickness recognition device, when a paper bundle is placed on the paper bundle placement position, the thickness sensing component of the paper bundle thickness recognition device senses the thickness of the paper bundle and generates a corresponding thickness sensing signal, the controller responds to the thickness sensing signal to recognize the thickness of the paper bundle, and the touch controller of the writing board calls out a compensation capacitor which is adaptive to the thickness of the paper bundle and used for recognition of handwriting between the touch sensor and a pen point of a handwriting pen according to the thickness of the paper bundle. Therefore, the paper stack has good writing effect no matter the thickness of the paper stack is thin.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a handwriting input device and a mobile terminal in an embodiment of the application;

FIG. 2 is a schematic structural diagram of a handwriting input device according to an embodiment of the present application;

fig. 3 is a table showing correspondence between the pile thickness and the linear table according to an embodiment of the present application;

fig. 4 is a schematic block diagram of a stack thickness recognition device according to an embodiment of the present application;

fig. 5 is a table showing the correspondence among the thickness sensor, the pile thickness, and the linear table according to an embodiment of the present application;

fig. 6 is a schematic front and side view of a stack thickness recognition device according to an embodiment of the present application;

fig. 7 is a schematic front and side view of a stack thickness recognition device according to another embodiment of the present application;

fig. 8 is a table showing a correspondence relationship between a detected range of a thickness of a bundle and a thickness sensor according to an embodiment of the present application;

fig. 9 is a flowchart illustrating a method for detecting a thickness of a bundle of paper according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "comprises" and "comprising," and any variations thereof, in the description and claims of this application and the drawings described above, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. The terms "first," "second," and "third," etc. in the description and claims of this application and the above-described drawings are used for distinguishing between different objects and not for describing a particular order.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a handwriting input device 1 according to an embodiment of the present application. The handwriting input device 1 is used for being in communication connection with a mobile terminal 2. The mobile terminal 2 may be, but is not limited to, a mobile phone, a notebook, a tablet computer, an electronic reader, a digital assistant, a wearable electronic device, a projector, a television, and other electronic devices having network communication, content display, and data processing functions.

The handwriting input apparatus 1 includes a tablet 11 and a stylus 12. Several sheets 3 are laid on the tablet 11. The stylus pen 12 is used to write on the paper 3 placed on the tablet 11. The tablet 11 is used for sensing writing handwriting of the stylus 12 when writing on the paper 3 placed on the tablet 1, obtaining corresponding writing content data according to the writing handwriting, storing the corresponding writing content data on the tablet 11 in real time, and sending the writing content data to the mobile terminal 2 so that the mobile terminal 2 displays the corresponding writing content data. The stylus 12 is a stylus pen having a writing core such as ink, and when the stylus 12 writes on the paper 3 placed on the tablet 11, an actual writing trace is formed on the paper 3.

Further, referring to fig. 2, the handwriting input device 1 further includes a stack thickness recognition device 13. The stack thickness recognition device 13 is provided on one side of the tablet 11. In one embodiment, the stack thickness recognition device 13 and the tablet 11 are two independent components and are fixed to each other by a retaining structure, that is, the stack thickness recognition device 13 is an accessory of the tablet 11. It is understood that, in one of the variant embodiments, the wad thickness recognition device 13 is provided integrally with the tablet 11.

Specifically, the tablet 11 includes a processor 111, a touch controller 112, and a touch sensor 113. The processor 111 is electrically connected to the touch controller 112, and the touch controller 112 is electrically connected to the touch sensor 113. In one embodiment, the touch sensor 113 is a touch screen, and is specifically a signal receiver. The touch sensor 113 is provided with a paper placement position P. The paper sheet placing position P is used for placing a plurality of paper sheets 3 in a stacked manner, and the plurality of paper sheets 3 are stacked to form a stack, which will be collectively referred to as a "stack" hereinafter for convenience of description. The stylus 12 is provided with a signal emitter at its tip. When the nib of the stylus pen 12 writes on the wad of paper placed on the paper placement position P, the electromagnetic wave signal emitted from the signal emitter of the nib of the stylus pen 12 is received by the touch sensor 113, and the processor 111 recognizes the handwriting when writing according to the electromagnetic wave signal received by the touch sensor 113.

The thickness of the stack placed on the paper placement position P of the touch sensor 113 is different in each case, the stack thickness recognition device 13 is used to recognize the stack thickness, and the touch controller 112 adjusts a compensation capacitance for handwriting recognition between the touch sensor 113 and the pen tip of the stylus 12, which is adapted to the stack thickness, according to the stack thickness recognized by the stack thickness recognition device 13.

Therefore, in the present application, when the stack is placed on the paper placing position P, the stack thickness recognition device 13 senses the stack thickness, and the touch controller 112 of the writing board 11 calls out the compensation capacitor adapted to the stack thickness and used for recognition of the handwriting between the touch sensor 113 and the pen tip of the writing pen 12 according to the stack thickness, and has a good writing effect no matter how thick the stack thickness is.

The stack thickness recognition device 13 transmits the stack thickness to the processor 111 when recognizing the stack thickness. The processor 111 calculates a writing distance between the nib of the stylus 12 and the touch sensor 113 of the tablet 11 according to the thickness of the stack, and transmits the writing distance to the touch controller 112. The touch controller 112 calls a linear table corresponding to the writing distance according to the writing distance, and adjusts a compensation capacitor for adapting to the recognition of the writing trace between the touch sensor 113 and the pen tip of the stylus 12 according to the linear table, so that the writing trace is smoother and the writing effect is better.

Specifically, in practical applications, the upper surface of the touch sensor 113 is covered with a protective plate, and the paper placing position P is provided on the protective plate. Therefore, the writing distance between the nib of the stylus 12 and the touch sensor 113 of the tablet 11 is the sum of the thickness of the wad and the thickness of the protective plate. Of course, in other embodiments, if the protective plate is not covered on the upper surface of the touch sensor 113, the writing distance between the nib of the stylus pen 12 and the touch sensor 113 of the tablet 11 is equal to the thickness of the wad.

Specifically, please refer to fig. 3 together, different pile thicknesses correspond to different linear tables. For example, when the thickness of the bundle is 0 to h1, the corresponding linear table is linear table 1; when the thickness of the paper bundle is h 1-h 2, the corresponding linear table is a linear table 2; when the thickness of the paper stack is hn-1-hn, the corresponding linear table is a linear table n. Wherein the linear table is a linear relation table between writing distance and compensation capacitance value. In an embodiment, the forming process of the linear table is as follows: placing a paper bundle with a preset paper bundle thickness on a paper placing position P of the touch sensor 113, writing on the topmost paper bundle by using a pen point of the stylus pen 12, sampling capacitance change of the position corresponding to the touch sensor 113 in the process of writing by using the stylus pen 12, comparing the capacitance change with an ideal capacitance value of the position corresponding to the touch sensor 113 to obtain a capacitance difference value between the ideal capacitance value and an actual capacitance value, and taking the capacitance difference value as a capacitance compensation value corresponding to the preset paper bundle thickness, thereby forming a linear relation table between a writing distance and the compensation capacitance value. That is, when the linear table is actually established, the actual capacitance value of each predetermined stack thickness needs to be sampled and compared with the ideal capacitance value to obtain the capacitance compensation value corresponding to the predetermined stack thickness, so that the capacitance compensation value under each stack thickness is obtained to obtain the linear table.

Thus, when the stack thickness recognition device 13 recognizes the stack thickness, the processor 111 calculates a writing distance between the pen tip of the stylus 12 and the touch sensor 113 of the tablet 11 according to the stack thickness, and the touch controller 112 calls a linear table corresponding to the writing distance according to the writing distance and adjusts a compensation capacitance for adapting to recognition of a written trace between the touch sensor 113 and the pen tip of the stylus 12 according to the linear table. No matter the thickness of the paper stack is thin, the capacitance compensation value corresponding to the thickness of the paper stack can be matched, so that the handwriting is smoother, and the writing effect is better.

Specifically, referring to fig. 2 and 4 together, the pile thickness recognition device 13 includes a controller 131 and a thickness sensing member 132. The controller 131 is electrically connected to the thickness sensing element 132. The thickness sensing unit 132 is laid flat in parallel with a paper placing position P. The thickness sensing unit 132 senses a thickness of the stack and generates a corresponding thickness sensing signal when the stack is placed on the paper placing position P. The controller 131 recognizes the thickness of the bundle in response to the thickness sensing signal.

Specifically, in one embodiment, the bundle thickness recognition device 13 further includes a storage unit 133, and the storage unit 133 prestores a plurality of bundle thickness detection ranges. Referring also to fig. 5, the thickness sensing assembly 132 includes a plurality of thickness sensors 1321. The thickness sensors 1321 are stacked at different heights and are respectively used for detecting different detection ranges of the thickness of the paper bundle. Specifically, the thickness sensors 1321 are respectively provided in one-to-one correspondence with the thickness detection ranges of the plurality of bundles. The controller 131 determines that the bundle is present within the bundle thickness detection range corresponding to one of the thickness sensors 1321 upon receiving the thickness sensing signal generated by the one of the thickness sensors 1321.

Specifically, referring to fig. 6 together, each thickness sensor 1321 includes a light-emitting tube E and a light-receiving tube R. The light emitting tube E is configured to emit an emission signal, and when the emission signal is reflected by a paper sheet within a monitoring range of the thickness of the bundle corresponding to the thickness sensor 1321, the light receiving tube R receives a reflection signal, which is a thickness sensing signal. The controller 131 determines whether there is a bundle within a bundle thickness detection range corresponding to the thickness sensor 1321 according to the reflected signal.

Specifically, when the light emitting tube E emits an emission signal and the light receiving tube R receives a reflection signal, the controller 131 determines whether there is a bundle within a bundle thickness detection range corresponding to the thickness sensor 1321 according to a time interval between the reflection signal received by the light receiving tube R and the emission signal and an illumination intensity of the reflection signal. Since the bundle and the thickness sensor 1321 are stacked, the distance between the thickness sensors 1321 and the bundle within the corresponding bundle thickness monitoring range is the same, and when there is a bundle within the corresponding bundle thickness monitoring range, the time intervals between the reflected signal and the emitted signal of the thickness sensors 1321 are substantially equal. When one of the thickness sensors 1321 does not receive the reflection signal within the preset time period or the illumination intensity of the received reflection signal does not conform to the preset illumination intensity range, it is determined that no paper or sundries are present within the corresponding monitoring range of the thickness of the paper bundle. Accordingly, the controller 131 can determine whether there is a bundle within a bundle thickness detection range corresponding to the thickness sensor 1321 based on the reflected signal.

Specifically, in one embodiment, the thickness sensors 1321 transmit the transmission signal and receive the reflection signal at the same time to identify whether there is paper in the thickness detection range corresponding to each thickness sensor 1321. Thus, the recognition speed of the thickness of the bundle is faster.

Alternatively, in one variant, the thickness sensors 1321 transmit the transmission signal and receive the reflection signal one by one, and each thickness sensor 1321 identifies whether there is a sheet in the thickness detection range corresponding to the thickness sensor. That is, for example, as shown in fig. 5, when the thickness sensor 1 transmits a signal and receives a reflected signal, the thickness sensor 1 starts to transmit and receive signals so as to reciprocate, and thus, interference between a plurality of signals can be avoided.

It is understood that, in one embodiment, the stack thickness recognition device 13 further includes a bracket 135, the bracket 135 is disposed at a side of the tablet 11, and the bracket 135 is perpendicular to the surface of the paper placement position P. The thickness sensors 1321 are respectively disposed at different heights of the bracket 135 to respectively correspond to the detection ranges of the thicknesses of the bundles, and light rays of the emission signals emitted from each thickness sensor 1321 are parallel to the surface of the paper.

Specifically, in one embodiment, the thickness sensors 1321 are arranged in a staggered manner in the horizontal direction, so that signal interference among the thickness sensors 1321 is avoided.

Specifically, in one embodiment, an optical spacer 137 is disposed between two adjacent thickness sensors 1321 of the plurality of thickness sensors 1321. The light spacer block 137 is opaque to light. The light spacer block 137 includes a lateral light spacer and a vertical light spacer such that each thickness sensor 1321 is enclosed in a separate space. Thus, signal interference between the plurality of thickness sensors 1321 can be effectively avoided.

Specifically, referring to fig. 8 together, in an embodiment, the detection ranges of the plurality of bundle thicknesses include n bundle thickness detection ranges sequentially arranged from small to large, for example, a bundle thickness detection range where the bundle thickness is in an interval of 0< h < h1, a bundle thickness detection range where the bundle thickness is in an interval of h1 ≤ h < h2, a bundle thickness detection range where the bundle thickness is in an interval of hn-1 ≤ h < hn, a bundle thickness detection range where the bundle thickness is greater than or equal to hn, and the like. Wherein h1, h2, hn-1 to hn are the thickness of the wad. The plurality of thickness sensors 1321 includes n thickness sensors 1321, e.g., a thickness sensor 1, a thickness sensor 2, a. The n thickness sensors 1321 are provided corresponding to the n bundle thickness detection ranges.

Specifically, in one embodiment, when none of the n thickness sensors 1321 receives a corresponding reflection signal within a preset time period, the controller 131 determines that the thickness of the bundle is zero.

When the 1 st thickness sensor 1321 to the n-1 th thickness sensor 1321 all receive the corresponding reflected signals, it is determined that paper exists in the range from the 1 st bundle thickness detection range to the n-1 th bundle thickness detection range, and the bundle thickness is determined to be the thickness value corresponding to the n-1 th bundle thickness detection range. It is understood that the thickness value corresponding to the n-1 th bundle thickness detection range may be a maximum value, a minimum value, an average value or other suitable values of the n-1 th bundle thickness detection range.

Specifically, in one embodiment, when the n thickness sensors 1321 all receive corresponding reflection signals within a preset time period, the controller 131 determines that the stack is excessively thick, and controls to send an excessive thickness prompt.

Specifically, in one embodiment, when the 1 st thickness sensor 1321 and the n-1 st thickness sensor 1321 of the n thickness sensors 1321 receive corresponding reflection signals, but at least one thickness sensor 1321 between the 1 st thickness sensor 1321 and the n-1 th thickness sensor 1321 does not receive corresponding reflection signals, the controller 131 determines that the thickness detection is failed and controls to issue a detection failure prompt.

Specifically, in one embodiment, the thickness sensor 1321 is an infrared sensor.

Fig. 9 is a flowchart illustrating a method for identifying a thickness of a bundle of paper according to an embodiment of the present application. The bundle thickness recognition method is applied to the bundle thickness recognition device 13. The bundle thickness recognition device 13 includes a thickness sensing element 132, and the thickness sensing element 132 is disposed in parallel with a paper sheet placement position P, and it is understood that the execution sequence of the bundle thickness recognition method is not limited to the sequence shown in fig. 9. Specifically, the method for identifying the thickness of the bundle of paper comprises the following steps:

when a paper bundle is placed on the paper placing position P, the thickness sensing component senses the thickness of the paper bundle and generates a corresponding thickness sensing signal (step 901); and

a stack thickness is identified responsive to the thickness sensing signal (step 902).

Further, "recognizing the thickness of the bundle of paper in response to the thickness sensing signal" includes:

when the 1 st thickness sensor 1321 to the n-1 th thickness sensor 1321 all receive corresponding reflected signals, determining that paper exists in a range from a 1 st bundle thickness detection range to an n-1 th bundle thickness detection range, wherein the reflected signals are the thickness sensing signals;

and determining the thickness of the paper bundle as a thickness value corresponding to the detection range of the thickness of the n-1 th paper bundle.

Further, the method for identifying the thickness of the paper bundle further comprises the following steps:

when none of the n thickness sensors 1321 receives a corresponding reflected signal within a preset time period, it is determined that the thickness of the bundle is zero.

and when the n thickness sensors 1321 all receive corresponding reflection signals within a preset time period, determining that the paper bundle is excessively thick, and controlling to send out an excessive thickness prompt.

when the 1 st thickness sensor 1321 and the n-1 th thickness sensor 1321 in the n thickness sensors 1321 receive corresponding reflection signals, but at least one thickness sensor 1321 between the 1 st thickness sensor 1321 and the n-1 th thickness sensor 1321 does not receive corresponding reflection signals, determining that the thickness detection is failed, and controlling to send out a detection failure prompt.

Further, before the thickness sensing module senses the thickness of the bundle and generates a corresponding thickness sensing signal when the bundle is placed on the paper placing position P, the bundle thickness recognition method further includes the steps of:

the plurality of thickness sensors 1321 are controlled to simultaneously transmit a transmission signal and receive a reflection signal, wherein the reflection signal is the thickness sensing signal. Thus, the recognition speed of the thickness of the bundle is faster.

the thickness sensors 1321 are controlled to transmit transmission signals and receive reflection signals one by one, wherein the reflection signals are the thickness sensing signals, and mutual interference among the signals is avoided.

Therefore, in the present application, the writing effect is excellent regardless of the thickness of the stack.

It should be noted that the Processor 111 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, a discrete hardware component, etc. The general purpose processor may be a microprocessor or a general purpose processor, any conventional processor, or the like. It will be appreciated that in other embodiments the processor 111 may also be built into the stack thickness recognition device 13.

It should be noted that the storage unit 133 can be used for storing computer programs and/or modules. In addition, the storage unit 133 may include a high-speed random access memory, and may also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), a plurality of magnetic disk storage devices, a Flash memory device, or other volatile solid state storage devices.

It should be noted that, for simplicity of description, the above-mentioned embodiments of the method are described as a series of acts or combinations, but those skilled in the art should understand that the present application is not limited by the order of acts described, as some steps may be performed in other orders or simultaneously according to the present application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required in this application.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.

The steps in the method of the embodiment of the application can be sequentially adjusted, combined and deleted according to actual needs.

It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware related to instructions of a computer program, and the program can be stored in a computer readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), or the like.

The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and embodiments of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

The device for identifying the thickness of the paper bundle is characterized by comprising a controller and a thickness sensing assembly, wherein the controller is electrically connected with the thickness sensing assembly, the thickness sensing assembly and a paper placing position are tiled in parallel, the thickness sensing assembly is used for sensing the thickness of the paper bundle and generating a corresponding thickness sensing signal when the paper bundle is placed on the paper placing position, and the controller responds to the thickness sensing signal to identify the thickness of the paper bundle.
The bundle thickness recognition device according to claim 1, further comprising a storage unit that prestores a plurality of bundle thickness detection ranges, wherein the thickness sensing component includes a plurality of thickness sensors that are respectively disposed at different heights and correspond to the plurality of bundle thickness detection ranges, and wherein the controller determines that a bundle is present within the bundle thickness detection range corresponding to one of the plurality of thickness sensors, upon receiving a thickness sensing signal generated by the one of the plurality of thickness sensors.
The bundle thickness recognition device according to claim 2, wherein each of the thickness sensors includes a light emitting tube for emitting a transmission signal, and a light receiving tube for receiving a reflection signal when the transmission signal is reflected by a sheet within a bundle thickness monitoring range corresponding to the thickness sensor, the reflection signal being a thickness sensing signal, and the controller determines whether there is a bundle within a bundle thickness detection range corresponding to the thickness sensor based on the reflection signal.
The stack thickness recognition device of claim 3, wherein the plurality of thickness sensors simultaneously perform emission of emission signals and reception of reflection signals to recognize whether there is a sheet within a thickness detection range corresponding to each thickness sensor; or the thickness sensors transmit the transmission signals and receive the reflection signals one by one, and whether paper exists in the thickness detection range corresponding to each thickness sensor is identified one by one.
The bundle thickness recognition device according to any one of claims 3 to 4, further comprising a support, wherein the plurality of thickness sensors are respectively disposed at different heights of the support to respectively correspond to the plurality of bundle thickness detection ranges, and wherein a light ray of an emission signal from each thickness sensor is parallel to a bundle surface.
The apparatus for discriminating between a thickness of a bundle of paper according to claim 5, wherein said plurality of thickness sensors are arranged to be offset in a horizontal direction; and/or an optical spacer block is arranged between two adjacent thickness sensors in the plurality of thickness sensors, wherein the optical spacer block is opaque to light.
The bundle thickness identifying device according to any one of claims 2 to 6, wherein the plurality of bundle thickness detection ranges include n bundle thickness detection ranges sequentially arranged from small to large, the plurality of caliper sensors include n caliper sensors sequentially arranged from low to high, the n caliper sensors being provided corresponding to the n bundle thickness detection ranges; and when the 1 st thickness sensor and the n-1 th thickness sensor all receive corresponding reflected signals, determining that paper exists in the range from the 1 st thickness detection range to the n-1 th thickness detection range, and determining the thickness of the paper bundle as the thickness value corresponding to the n-1 th thickness detection range.
The stack thickness recognition device of claim 7, wherein the controller determines that the thickness of the stack is zero when none of the n thickness sensors receives a corresponding reflected signal within a preset time period.
The web thickness recognition device of claim 7, wherein the controller determines that the web is excessively thick and controls the sending of an excessive thickness prompt when the n thickness sensors each receive a corresponding reflected signal within a preset time period.
The device for identifying a thickness of a bundle of papers according to claim 7, wherein said controller determines that the detection of the thickness is failed and controls the issuance of the detection failure notice when the 1 st thickness sensor and the n-1 st thickness sensor of said n thickness sensors receive the corresponding reflection signals but at least one thickness sensor between said 1 st thickness sensor and said n-1 st thickness sensor does not receive the corresponding reflection signal.
The device for identifying the thickness of a bundle according to any one of claims 2 to 10, wherein the thickness sensor is an infrared sensor.
A paper bundle thickness recognition method is applied to a paper bundle thickness recognition device, the paper bundle thickness recognition device comprises a thickness sensing component, and the thickness sensing component and a paper placement position are tiled in parallel, and the paper bundle thickness recognition method is characterized by comprising the following steps:

when the paper bundle is placed on the paper placing position, the thickness sensing component senses the thickness of the paper bundle and generates a corresponding thickness sensing signal; and

and identifying the thickness of the paper stack in response to the thickness sensing signal.
The bundle thickness recognition method according to claim 12, wherein the bundle thickness recognition device further includes a storage unit that prestores n bundle thickness detection ranges arranged in order from small to large, the thickness sensing elements include n thickness sensors arranged in order from low to high, the n thickness sensors being provided in correspondence with the n bundle thickness detection ranges; the step of identifying the thickness of the paper stack in response to the thickness sensing signal comprises the following steps:

when the 1 st thickness sensor and the n-1 th thickness sensor receive corresponding reflected signals, determining that paper exists in the range from the 1 st paper bundle thickness detection range to the n-1 th paper bundle thickness detection range, wherein the reflected signals are the thickness sensing signals;

and determining the thickness of the paper bundle as a thickness value corresponding to the detection range of the thickness of the n-1 th paper bundle.
The stack thickness recognition method according to claim 13, further comprising the steps of:

and when the n thickness sensors do not receive corresponding reflection signals within a preset time period, determining that the thickness of the paper bundle is zero.
The stack thickness recognition method according to claim 13, further comprising the steps of:

and when the n thickness sensors receive corresponding reflection signals within a preset time period, determining that the paper bundle is excessively thick, and controlling to send out an excessive thickness prompt.
The stack thickness recognition method according to claim 13, further comprising the steps of:

and when the 1 st thickness sensor and the n-1 st thickness sensor in the n thickness sensors receive corresponding reflection signals, but at least one thickness sensor between the 1 st thickness sensor and the n-1 st thickness sensor does not receive the corresponding reflection signals, determining that the thickness detection fails, and controlling to send out a detection failure prompt.
The bundle thickness recognition method according to claim 13, wherein the thickness sensing module includes a plurality of thickness sensors provided at different heights, and before the thickness sensing module senses a thickness of the bundle and generates a corresponding thickness sensing signal when the bundle is placed on the sheet placement position, the bundle thickness recognition method further includes the steps of:

and controlling the plurality of thickness sensors to simultaneously transmit a transmission signal and receive a reflection signal, wherein the reflection signal is the thickness induction signal.
The bundle thickness recognition method according to claim 13, wherein the thickness sensing module includes a plurality of thickness sensors provided at different heights, and before the thickness sensing module senses a thickness of the bundle and generates a corresponding thickness sensing signal when the bundle is placed on the sheet placement position, the bundle thickness recognition method further includes the steps of:

and controlling the thickness sensors to transmit transmission signals and receive reflection signals one by one, wherein the reflection signals are the thickness induction signals.
A handwriting input device, comprising a writing board and a pad thickness recognition device, wherein the pad thickness recognition device is arranged on one side of the writing board, the pad thickness recognition device is the pad thickness recognition device according to any one of claims 1-11, the writing board comprises a touch controller and a touch sensor, the paper placement position is arranged on the touch sensor, the pad thickness recognition device recognizes the pad thickness, and the touch controller calls out a compensation capacitor for handwriting recognition between the touch sensor and a pen nib according to the pad thickness, wherein the compensation capacitor is adapted to the pad thickness.
The handwriting input apparatus of claim 19, wherein the tablet comprises a processor, the processor calculates a writing distance between the touch sensor and a stylus pen tip when writing according to the thickness of the stack, the touch controller calls a linear table corresponding to the writing distance according to the writing distance, and adjusts a compensation capacitance for handwriting recognition between the touch sensor and the stylus pen tip according to the linear table.
The handwriting input apparatus of claim 19, wherein said stack thickness recognition apparatus further comprises a bracket, said bracket is arranged at a side of said tablet, and said bracket is perpendicular to a surface of said paper placing position.