CN112638271A - Backing block for ultrasonic probe, method for manufacturing backing block, and ultrasonic probe - Google Patents
Backing block for ultrasonic probe, method for manufacturing backing block, and ultrasonic probe Download PDFInfo
- Publication number
- CN112638271A CN112638271A CN201880097306.XA CN201880097306A CN112638271A CN 112638271 A CN112638271 A CN 112638271A CN 201880097306 A CN201880097306 A CN 201880097306A CN 112638271 A CN112638271 A CN 112638271A
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- manufacturing
- ultrasonic probe
- backing block
- carbon fiber
- fiber cloth
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- 239000000523 sample Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title description 11
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 41
- 239000004917 carbon fiber Substances 0.000 claims description 41
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 41
- 239000004744 fabric Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 28
- 239000002952 polymeric resin Substances 0.000 claims description 16
- 229920003002 synthetic resin Polymers 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 6
- 239000004800 polyvinyl chloride Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000005470 impregnation Methods 0.000 claims description 5
- 229920001897 terpolymer Polymers 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000010345 tape casting Methods 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 230000001965 increasing effect Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 8
- 230000006872 improvement Effects 0.000 description 4
- 230000005284 excitation Effects 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
Abstract
A backing block (100) of an ultrasonic probe, a manufacturing method of the backing block (100) and the ultrasonic probe are provided, the backing block (100) manufactured by the manufacturing method of the backing block (100) of the ultrasonic probe not only has good attenuation and adjustable acoustic impedance, but also has high thermal conductivity, and is simple to manufacture and easy to produce in batches. When the heat dissipation structure is applied to the ultrasonic probe, the heat generated by the front end of the ultrasonic probe during working can be effectively conducted to the rear end of the probe, the heat dissipation structure of the front end of the ultrasonic probe is simplified, and the size and the structural complexity of the ultrasonic probe cannot be increased additionally.
Description
The present application relates to medical devices, and more particularly to the manufacture of backing blocks for ultrasonic probes.
The ultrasonic probe is an important part of ultrasonic diagnosis imaging equipment, and the working principle of the ultrasonic probe is that excitation electric pulse signals of an ultrasonic complete machine are converted into ultrasonic signals by utilizing a piezoelectric effect to enter a patient body, and then ultrasonic echo signals reflected by tissues are converted into electric signals, so that the tissues are detected. The ultrasonic probe mainly comprises a lens, a matching material, a piezoelectric material, a signal and grounded FPC, a backing block and the like. The backing block is used as an acoustic attenuation material to absorb adverse ultrasonic waves propagated backwards by the ultrasonic probe on one hand, and is used as a structural supporting block on the other hand to ensure the structural reliability of the ultrasonic probe array element array.
During the conversion of the electro-acoustic signals, the operating ultrasound probe generates a large amount of heat. Because the traditional backing material is mainly made of epoxy resin and filler, the heat conductivity coefficient is very small, and the heat can not be effectively conducted and dissipated, so that the temperature of the front end of the probe is increased. Heating of the probe may affect the personal safety of the patient, and thus legislation has established a clear regulation on the temperature at which the probe is in contact with the patient. Moreover, if the probe is operated at a higher temperature for a long time, the aging of the probe is accelerated, and the service life of the probe is shortened.
However, on the other hand, from the viewpoint of medical examination and diagnosis, it is desired to increase the examination depth of the probe. The improvement of the excitation voltage of the whole machine to the probe is an effective means for increasing the detection depth of the probe, and the improvement of the excitation voltage inevitably causes the probe to generate larger heat. Therefore, the probe generates heat seriously, which not only affects the comfort of a patient and the service life of the probe, but also affects the performance improvement of the probe.
In order to maximize the heat conduction from the front end of the probe to the back end of the probe, the backing block typically has an increased thermal conductivity. The current solution to increase the thermal conductivity of the backing block is to insert some heat sink or array of heat sinks into the backing block. These solutions, while increasing the thermal conductivity of the backing mass to some extent, have a magnitude that is related to the number of fins inserted into the backing mass. If the number of insertions is small, the effect of increasing the thermal conductivity of the backing mass is insignificant. If the number of the insertion holes is large, the reflection effect of the interface of the cooling fin and the backing adhesive on the ultrasonic wave can greatly influence the acoustics of the ultrasonic probe. Therefore, it is difficult to achieve both the performance and the heat dissipation of the ultrasonic probe. Meanwhile, the preparation processes of the schemes are complex and are not beneficial to mass production.
The present application generally provides a method of manufacturing a backing block for an ultrasonic probe and a backing block manufactured by the method. The backing block has a good heat conduction effect and can be used for reducing the temperature of the front end of the probe. The application also provides an ultrasonic probe adopting the backing block.
In one embodiment, a method of manufacturing a backing mass of an ultrasound probe is provided, comprising:
and (3) dipping: soaking the carbon fiber cloth in high molecular resin to distribute the high molecular resin to the inside and the surface of the carbon fiber cloth;
a laminating step: a plurality of carbon fiber cloths impregnated with polymer resin are stacked and pressed to be fixed into a whole to form the backing block.
In one embodiment, the method further comprises:
coating: coating a mixture on the surface of the carbon fiber cloth treated by the impregnation step, wherein the mixture is mixed with high polymer resin and a filler;
the laminating step is performed after the coating step.
In one embodiment, the filler includes metal powder and/or inorganic powder.
In one embodiment, the metal powder comprises tungsten powder and/or copper powder.
In one embodiment, the inorganic powder comprises alumina.
In one embodiment, in the coating step, the manner of coating the mixture is implemented by using a doctor blading, screen printing or casting process.
In one embodiment, the polymer resin includes at least one of epoxy resin, polyurethane, terpolymer ABS, polyvinyl chloride PVC, and polymethylmethacrylate PMMA.
In one embodiment, the thickness of the carbon fiber cloth is less than or equal to 2 mm.
In one embodiment, the thickness of the carbon fiber cloth is less than or equal to 0.2 mm.
In one embodiment, a backing block for an ultrasonic probe is provided, the backing block being made by a method of manufacture as described in any one of the preceding claims.
An embodiment provides an ultrasonic probe comprising a sound head and a sound head shell, wherein the sound head is installed in the sound head shell, a part of the sound head is exposed, the sound head comprises a piezoelectric material layer, a circuit board and a backing block as described in any one of the above items, the piezoelectric material layer is electrically connected with the circuit board, and the piezoelectric material layer is installed on the backing block; the circuit board is mounted between the piezoelectric material layer and the backing block or outside the piezoelectric material layer.
In one embodiment, the carbon fiber cloth of the backing block is laminated in a direction perpendicular to the crystal arrangement direction of the piezoelectric material layer.
The manufacturing method of the above embodiment and the backing block manufactured by the manufacturing method adopt a method of impregnating carbon fiber cloth with polymer resin, so that the polymer resin is distributed in the carbon fiber cloth and on the surface of the carbon fiber cloth, and then a plurality of carbon fiber cloths are integrally manufactured by laminating and curing to form the backing block. The backing block made of the material has the advantages of good attenuation, adjustable acoustic impedance, high thermal conductivity, simple manufacture and easy batch production. When the heat dissipation structure is applied to the ultrasonic probe, the heat generated by the front end of the ultrasonic probe during working can be effectively conducted to the rear end of the probe, the heat dissipation structure of the front end of the ultrasonic probe is simplified, and the size and the structural complexity of the ultrasonic probe cannot be increased additionally.
FIG. 1 is a schematic flow chart of a method of making a backing block according to one embodiment of the present disclosure;
FIG. 2 is a schematic flow chart of another method of making a backing block according to one embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a backing mass according to an embodiment of the present disclosure;
fig. 4 is a schematic view of a partial structure of an ultrasonic probe according to a second embodiment of the present application.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).
The present embodiment provides a method of manufacturing a backing block. The backing block is applied to the ultrasonic probe, and on one hand, the backing block is used as an acoustic attenuation material to absorb adverse ultrasonic waves propagated backwards by the ultrasonic probe, and on the other hand, the backing block is used as a structural supporting block to ensure the structural reliability of the array element array of the ultrasonic probe.
Referring to fig. 1 and 3, the manufacturing method includes:
impregnation step S02: the carbon fiber cloth 101 is immersed in the high molecular resin, so that the high molecular resin is distributed in the carbon fiber cloth 101 and on the surface of the carbon fiber cloth;
lamination step S04: a plurality of carbon fiber cloths 101 impregnated with a polymer resin are stacked and pressed to be fixed as a whole, thereby forming a backing block 100.
In the impregnation step S02, the carbon fiber cloth 101 is immersed in a polymer resin liquid, and the polymer resin is introduced into the carbon fiber cloth 101 by capillary pressure and adheres to the surface of the carbon fiber cloth 101.
Referring to fig. 3, in the laminating step S04, a plurality of carbon fiber cloths 101 may be stacked, and then the carbon fiber cloths 101 may be bonded by applying a pressing force from the stacking direction, so as to form an integral body. In the laminating step S04, it is preferable that all the carbon fiber cloths 101 are laminated and then integrally bonded, so that the backing block formed by this method has better overall performance. Of course, in other embodiments, one or more layers of carbon fiber cloth may be added to the bottom layer of carbon fiber cloth before lamination and curing.
In the laminating step S04, after the carbon fiber cloth 101 is impregnated with the polymer resin, the carbon fiber cloth may be laminated and cured before the polymer resin is dried. Of course, the dried carbon fiber cloth 101 may be laminated and cured, and in this case, the dried polymer resin may be softened by heating and then press-cured.
The backing block 100 made of the material has the advantages of good attenuation, adjustable acoustic impedance, high thermal conductivity, simple manufacture and easy batch production. When the heat dissipation structure is applied to the ultrasonic probe, the heat generated by the front end of the ultrasonic probe during working can be effectively conducted to the rear end of the probe, the heat dissipation structure of the front end of the ultrasonic probe is simplified, and the size and the structural complexity of the ultrasonic probe cannot be increased additionally.
Repeated experiments and analysis show that by selecting a thinner carbon fiber cloth 101, the resulting backing block 100 has better attenuation and heat conduction effects, for example, in an embodiment, the thickness of the carbon fiber cloth is less than or equal to 2 mm. In one embodiment, the carbon fiber cloth has a thickness of less than or equal to 0.2 mm.
Wherein the high polymer resin comprises at least one of epoxy resin, polyurethane, terpolymer ABS, polyvinyl chloride PVC and polymethyl methacrylate PMMA. The terpolymer can be a terpolymer of acrylonitrile (A), butadiene (B) and styrene (S).
Further, referring to fig. 2, in an embodiment, the manufacturing method may further include:
coating step S03: the surface of the carbon fiber cloth 101 treated in the impregnation step S02 is coated with a mixture material in which a polymer resin and a filler are mainly mixed. In other embodiments, the blend may also contain antioxidants and the like.
This coating step S03 is performed after the dipping step S02, and after the coating step S03 is completed, the laminating step S04 is performed. The backing block 100 processed in the coating step S03 is more attenuated, and a high thermal conductivity coefficient with adjustable acoustic impedance can be obtained.
Wherein the filler may include metal powder and/or inorganic powder. The metal powder may include tungsten powder and/or copper powder, etc. The inorganic powder may include alumina and the like.
Further, in the coating step S03, the powder mixture may be applied by a doctor blading process, a screen printing process, or a casting process.
In one embodiment, an ultrasonic probe is provided as a part of an ultrasonic apparatus, and is mainly used for sending and receiving ultrasonic waves, so that the ultrasonic apparatus can form an image of a detection part of a detected person for an operator to refer to.
The ultrasonic probe includes a sound head and a sound head case. The sound head is arranged in the sound head shell, and a part of the sound head is exposed and is used for being in contact with an object to be detected. As for other configurations of the ultrasonic probe, it will not be redundant here, and the following mainly describes features related to the improvements of the present application.
Referring to fig. 3 and 4, the acoustic head 1 includes a backing block 100, a circuit board 200, and a piezoelectric material layer 300. Of course, the acoustic head 1 also includes a matching layer 400, an acoustic lens layer 500, and the like, and details of these structures will not be described here.
The piezoelectric material layer 300 is electrically connected to the circuit board 200, and the piezoelectric material layer 300 is mounted on the backing block 100, for example, on the outermost carbon fiber cloth 101. The circuit board 200 is installed between the piezoelectric material layer 300 and the backing block 100, or is installed outside the piezoelectric material layer 300. Of course, as shown in fig. 4, the circuit board 200 may also extend to both lateral sides of the backing block 100.
In one embodiment, the stacking direction of the carbon fiber cloth 101 (i.e., the stacking direction of the carbon fiber cloth 101) of the backing block 100 is perpendicular to the crystal alignment direction of the piezoelectric material layer 200. Such an arrangement is advantageous in enhancing the heat dissipation effect of the heat generated by the piezoelectric material layer 200. The carbon fiber cloth 101 of the backing block 100 may be stacked in a direction perpendicular to the crystal arrangement direction of the piezoelectric material layer 200, or may be disposed in parallel or at a certain angle, which can also achieve a heat dissipation effect.
The backing block 100 is manufactured by any one of the manufacturing methods in embodiment 1, so that the backing block 100 has good attenuation, adjustable acoustic impedance, high thermal conductivity, simple manufacturing and easy mass production. When the heat dissipation structure is applied to the ultrasonic probe, the heat generated by the front end of the ultrasonic probe during working can be effectively conducted to the rear end of the probe, the heat dissipation structure of the front end of the ultrasonic probe is simplified, and the size and the structural complexity of the ultrasonic probe cannot be increased additionally.
The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. Variations of the above-described embodiments may be made by those skilled in the art, consistent with the principles of the invention.
Claims (12)
- A method of manufacturing a backing mass of an ultrasonic probe, comprising:and (3) dipping: soaking the carbon fiber cloth in high molecular resin to distribute the high molecular resin to the inside and the surface of the carbon fiber cloth;a laminating step: a plurality of carbon fiber cloths impregnated with polymer resin are stacked and pressed to be fixed into a whole to form the backing block.
- The method of manufacturing of claim 1, further comprising:coating: coating a mixture on the surface of the carbon fiber cloth treated by the impregnation step, wherein the mixture is mixed with high polymer resin and a filler;the laminating step is performed after the coating step.
- The manufacturing method according to claim 2, wherein the filler includes metal powder and/or inorganic powder.
- The manufacturing method according to claim 3, wherein the metal powder comprises tungsten powder and/or copper powder.
- The method of manufacturing according to claim 3, wherein the inorganic powder comprises alumina.
- The manufacturing method according to any one of claims 2 to 5, wherein in the coating step, the manner of coating the mix is performed by a doctor blading, screen printing, or casting process.
- The manufacturing method according to any one of claims 1 to 6, wherein the polymer resin includes at least one of epoxy resin, polyurethane, terpolymer ABS, polyvinyl chloride PVC, and polymethyl methacrylate PMMA.
- The manufacturing method according to any one of claims 1 to 7, wherein the carbon fiber cloth has a thickness of 2mm or less.
- The manufacturing method according to any one of claims 1 to 7, wherein the carbon fiber cloth has a thickness of 0.2mm or less.
- A backing block for an ultrasonic probe, characterized in that it is manufactured using a manufacturing method according to any one of claims 1 to 7.
- An ultrasonic probe comprising a sound head and a sound head case, the sound head being mounted in the sound head case with a portion of the sound head exposed, the sound head comprising a layer of piezoelectric material electrically connected to a circuit board, a backing block according to claim 10, the layer of piezoelectric material being mounted on the backing block; the circuit board is mounted between the piezoelectric material layer and the backing block or outside the piezoelectric material layer.
- The ultrasonic probe of claim 11, wherein a lamination direction of the carbon fiber cloth of the backing block is perpendicular to a crystal arrangement direction of the piezoelectric material layer.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/109129 WO2020062257A1 (en) | 2018-09-30 | 2018-09-30 | Backing block of ultrasonic probe, manufacturing method of backing block, and ultrasonic probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112638271A true CN112638271A (en) | 2021-04-09 |
Family
ID=69949258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880097306.XA Pending CN112638271A (en) | 2018-09-30 | 2018-09-30 | Backing block for ultrasonic probe, method for manufacturing backing block, and ultrasonic probe |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112638271A (en) |
| WO (1) | WO2020062257A1 (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3552382A (en) * | 1968-01-11 | 1971-01-05 | Hoffmann La Roche | Ultrasonic transducer assembly for biological inspections |
| US6051913A (en) * | 1998-10-28 | 2000-04-18 | Hewlett-Packard Company | Electroacoustic transducer and acoustic isolator for use therein |
| US20030125629A1 (en) * | 2002-01-02 | 2003-07-03 | Ustuner E. Tuncay | Ultrasound system and method |
| JP2006129965A (en) * | 2004-11-04 | 2006-05-25 | Toshiba Corp | Ultrasonic probe and ultrasonic diagnostic equipment |
| JP2007134767A (en) * | 2005-11-08 | 2007-05-31 | Hitachi Medical Corp | Ultrasonic probe |
| CN101172044A (en) * | 2006-10-31 | 2008-05-07 | 株式会社东芝 | Ultrasonic probe and ultrasonic diagnostic apparatus |
| CN101325241A (en) * | 2007-06-12 | 2008-12-17 | 富士胶片株式会社 | Composite piezoelectric material, ultrasonic probe, ultrasonic endoscope, and ultrasonic diagnostic apparatus |
| CN101444430A (en) * | 2007-09-03 | 2009-06-03 | 富士胶片株式会社 | Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic device, and ultrasonic endoscope device |
| US20140057096A1 (en) * | 2012-08-27 | 2014-02-27 | Hexcel Holding Gmbh | Prepreg materials |
| CN105252687A (en) * | 2015-10-08 | 2016-01-20 | 深圳市理邦精密仪器股份有限公司 | Manufacturing method for ultrasound backing blocks, ultrasound backing blocks and ultrasound probe |
| CN108410136A (en) * | 2018-05-02 | 2018-08-17 | 北京大学 | Novel high heat conduction graphene or graphite film/carbon fibre composite preparation method |
| CN108461623A (en) * | 2018-01-23 | 2018-08-28 | 长沙芬贝电子科技有限公司 | A kind of back lining materials and its manufacturing method for array probe |
-
2018
- 2018-09-30 CN CN201880097306.XA patent/CN112638271A/en active Pending
- 2018-09-30 WO PCT/CN2018/109129 patent/WO2020062257A1/en active Application Filing
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3552382A (en) * | 1968-01-11 | 1971-01-05 | Hoffmann La Roche | Ultrasonic transducer assembly for biological inspections |
| US6051913A (en) * | 1998-10-28 | 2000-04-18 | Hewlett-Packard Company | Electroacoustic transducer and acoustic isolator for use therein |
| US20030125629A1 (en) * | 2002-01-02 | 2003-07-03 | Ustuner E. Tuncay | Ultrasound system and method |
| JP2006129965A (en) * | 2004-11-04 | 2006-05-25 | Toshiba Corp | Ultrasonic probe and ultrasonic diagnostic equipment |
| JP2007134767A (en) * | 2005-11-08 | 2007-05-31 | Hitachi Medical Corp | Ultrasonic probe |
| CN101172044A (en) * | 2006-10-31 | 2008-05-07 | 株式会社东芝 | Ultrasonic probe and ultrasonic diagnostic apparatus |
| CN101325241A (en) * | 2007-06-12 | 2008-12-17 | 富士胶片株式会社 | Composite piezoelectric material, ultrasonic probe, ultrasonic endoscope, and ultrasonic diagnostic apparatus |
| CN101444430A (en) * | 2007-09-03 | 2009-06-03 | 富士胶片株式会社 | Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic device, and ultrasonic endoscope device |
| US20140057096A1 (en) * | 2012-08-27 | 2014-02-27 | Hexcel Holding Gmbh | Prepreg materials |
| CN105252687A (en) * | 2015-10-08 | 2016-01-20 | 深圳市理邦精密仪器股份有限公司 | Manufacturing method for ultrasound backing blocks, ultrasound backing blocks and ultrasound probe |
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| CN108410136A (en) * | 2018-05-02 | 2018-08-17 | 北京大学 | Novel high heat conduction graphene or graphite film/carbon fibre composite preparation method |
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| Publication number | Publication date |
|---|---|
| WO2020062257A1 (en) | 2020-04-02 |
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