CN105252687A - Manufacturing method for ultrasound backing blocks, ultrasound backing blocks and ultrasound probe - Google Patents
Manufacturing method for ultrasound backing blocks, ultrasound backing blocks and ultrasound probe Download PDFInfo
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- CN105252687A CN105252687A CN201510644803.5A CN201510644803A CN105252687A CN 105252687 A CN105252687 A CN 105252687A CN 201510644803 A CN201510644803 A CN 201510644803A CN 105252687 A CN105252687 A CN 105252687A
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Abstract
The invention discloses a manufacturing method for ultrasound backing blocks, the ultrasound backing blocks and an ultrasound probe and relates to the field of medical apparatuses and instruments. The method includes the steps that epoxy resins and solid powder containing at least two components are prepared for standby application; the epoxy resins and the solid powder are uniformly mixed and bubbles are removed to obtain a mixed solution; the mixed solution is put in a centrifugal device for primary centrifugation; rubber is added into the centrifugal device, the mixed solution of the epoxy resins, the solid powder and the rubber is centrifugated again, and an ultrasound backing block sample of a layered structure is obtained; and the ultrasound backing block sample is cut so as to obtain the independent ultrasound backing blocks. The epoxy resins, the solid powder, the rubber and other substance are effectively mixed and layered through the centrifugal device, so that the ultrasound backing blocks of a multi-layer structure with preset thickness and sound impedance are obtained, and the sound impedance and the thickness of a backing layer are changed so as to achieve the effects of improving bandwidth and sensitivity of an ultrasonic transducer. Compared with multiple-matching layer manufacturing methods, the method is easier to implement, and the difficulty of material selection, processing and preparation due to increase of the number of the matching layers is avoided.
Description
Technical field
The invention belongs to technical field of medical instruments, particularly a kind of preparation method of ultrasonic backing block, ultrasonic backing block structure and ultrasonic probe.
Background technology
Ultrasonic imaging is the diagnosis and detection means of current extensive use, there is the advantages such as harmless, convenient, reliable, produce ultrasonic signal by ultrasonic probe to propagate in light tight medium, and the information such as intensity, frequency, time, phase place of institute's reflection ultrasonic signal in light tight object is received by probe, by processing this information, the visual image of reflection institute detected object internal structure acoustic characteristic distribution can be obtained, and then obtain detection or diagnostic result.
As Fig. 1, supersonic imaging apparatus comprises probe 1, core texture in probe 1 is the hyperacoustic transducer 2 of transmitting and receiving, probe 1 launches ultrasonic signal to detected object 3 while keeping in touch with detected object 3, and receives the signal reflected by the detection target in detected object 3 body simultaneously.As Fig. 2, transducer 2 comprises: piezoelectric element 21, for transmitting and receiving ultrasonic wave; Matching layer 22, is arranged on the front surface of piezoelectric element 21, for reducing the impedance mismatching between detected object and piezoelectric element 21; Back sheet 23, is arranged on the rear surface of piezoelectric element 21, for the ultrasonic wave of the back-propagation of absorption pressure electric device 21.
The performance quality of ultrasonic transducer mainly contains two characterization parameters, i.e. frequency bandwidth and sensitivity.All the time, research staff does constantly exploration in matching layer, constantly promote frequency bandwidth and the sensitivity of ultrasonic transducer, the structure of matching layer develops into the even more multi-layered matching layer of present bilayer, three layers of matching layer from initial individual layer matching layer.But, along with the increase of the matching layer number of plies, be no matter both increase many difficulty, in succession also for the making of ultrasonic probe adds difficulty from the preparation of raw-material selection, matching layer and the follow-up aspect such as grinding, cutting of matching layer.
Summary of the invention
The object of the present invention is to provide a kind of preparation method of ultrasonic backing block, being intended to by making ultrasonic backing block, to improve frequency bandwidth and the sensitivity of ultrasonic transducer than the easier technique implemented of making matching layer.
The present invention is achieved in that a kind of preparation method of ultrasonic backing block, comprises the steps:
The solid state powder containing at least two kinds of compositions of extracting epoxy resin, micron dimension is stand-by;
Described epoxy resin is mixed with described solid state powder and removes bubble;
The mixed solution of described epoxy resin and solid state powder is inserted centrifugal device to carry out centrifugal first;
In described centrifugal device, add rubber, the mixed solution of described epoxy resin, solid state powder and rubber is carried out again centrifugal, obtain the ultrasonic backing block sample block of hierarchy;
Described ultrasonic backing block sample block is cut, obtains independently ultrasonic backing block.
Another object of the present invention is to provide a kind of ultrasonic backing block, comprise the first back sheet that the acoustic impedance that stacks gradually is different, second back sheet and the 3rd back sheet, described first back sheet comprises the first particulate and epoxy resin, described second back sheet comprises the second particulate and epoxy resin, described 3rd back sheet comprises the 3rd particulate and epoxy resin, described first particulate, the particle diameter of the second particulate and the 3rd particulate is all less than 40 microns, the density of described first back sheet is less than the density of described second back sheet, the density of described second back sheet is less than the density of the 3rd back sheet, described first back sheet, the thickness of the second back sheet and the 3rd back sheet is all less than 1/2nd of wavelength when ultrasonic wave transmits wherein.
Another object of the present invention is to provide a kind of ultrasonic probe, comprise transducer, described transducer comprises described ultrasonic backing block.
The present invention is mainly through effectively mixing materials such as epoxy resin, solid state powder, rubber and layering by centrifugal device, obtain the ultrasonic backing block of sandwich construction of preset thickness and acoustic impedance, and then improve the bandwidth of ultrasonic transducer, the effect of sensitivity by the acoustic impedance that changes every layer of back sheet, thickness to reach.This preparation method is easier to implement compared to the selection, processing, making, cutting etc. of many matching layers structure, and then effectively avoids because the matching layer number of plies increases and the difficulty of the selection of the material that brings, processing, preparation.Adopt the frequency bandwidth of the ultrasonic transducer of this backing block and sensitivity to be obviously better than the bandwidth sum sensitivity of the transducer adopting individual layer back sheet, be applicable to being widely used in supersonic imaging apparatus field.
Accompanying drawing explanation
Fig. 1 is the operation principle schematic diagram of supersonic imaging apparatus in prior art;
Fig. 2 is the structural representation of ultrasonic transducer in prior art;
Fig. 3 is the operation principle schematic diagram of the ultrasonic transducer that the embodiment of the present invention provides;
Fig. 4 is the preparation method flow chart of the ultrasonic backing block that the embodiment of the present invention provides;
Fig. 5 is the structural representation of the ultrasonic backing block that the embodiment of the present invention provides.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
First the embodiment of the present invention illustrates the performance parameter of ultrasonic transducer.Ultrasonic transducer as shown in Figure 3, in the piezoelectricity a period of time 02 including matching layer 01, backing block 03 and be positioned at therebetween, backing block 03 comprises three layers of back sheet, i.e. the first back sheet 031, second back sheet 032 and the 3rd back sheet 033.When the ultrasonic propagation backward produced when piezoelectricity a period of time 02 is to interface with the first back sheet 031, a part of ultrasonic wave T4 is because acoustic impedance difference is between the two back to piezoelectricity a period of time, and a part of ultrasonic wave T1 enters the first back sheet 031; With should T1 be transmitted to the interface of the first back sheet 031 and the second back sheet 032 time, a part of ultrasonic wave T5 is back to piezoelectricity a period of time 02 because of acoustic impedance difference, and a part of ultrasonic wave T2 enters the second back sheet 032; Also ultrasonic wave T6 and T3 can be produced accordingly.If back wave T4, T5, T6 are strong, sensitivity is just high, if transmitted wave T1, T2, T3 are strong, bandwidth is just wider, therefore according to the different demands for probe, the backing block of many back sheets structure can be designed, and then pass through acoustic impedance and the thickness of change every layer of back sheet, reach the object of the characteristic (bandwidth, sensitivity) improving ultrasonic transducer.Namely the embodiment of the present invention provides a kind of method making sandwich construction backing block.
Below in conjunction with specific embodiment, specific implementation of the present invention is described in detail:
Please refer to Fig. 4, the embodiment of the present invention provides a kind of preparation method of ultrasonic backing block, comprises the steps:
In step S101, extracting epoxy resin, stand-by containing the solid state powder of at least two kinds of compositions;
In step s 102, epoxy resin mixed with solid state powder and remove bubble;
In step s 103, the mixed solution of epoxy resin and solid state powder being inserted centrifugal device carries out centrifugal first;
In step S104, in centrifugal device, add rubber, the mixed solution of epoxy resin, solid state powder and rubber is carried out again centrifugal, obtain the ultrasonic backing block sample block of hierarchy;
In step S105, ultrasonic backing block sample block is cut, obtain independently ultrasonic backing block.
After above-mentioned steps, can obtain the backing block containing multilayer backing layer, different back sheet has predetermined thickness and acoustic impedance, and the acoustic impedance of every layer of back sheet is different.Frequency bandwidth and the sensitivity of ultrasonic transducer is regulated by designing this backing layer thickness and acoustic impedance.
In above-mentioned steps S101, have selected metal or nonmetal micro mist shape pressed powder that particle diameter is micron dimension, can by the solid powder particle bought from outside after ball mill fully grind, sieved with the sub-sieve of corresponding order number, the particle choosing the uniform particle sizes filtered out is stand-by.Choose particle diameter through for several times test and be less than 40 μm for good, be beneficial to follow-uply mix with centrifugal layering and then obtain preferably bandwidth sum sensitivity.Epoxy resin then select coefficient of viscosity lower be beneficial to vacuum degassing, and select the operating time longer to prevent its too fast solidification.The rubber used in above-mentioned steps S104 also can be got all the ready in the lump, and rubber then selects the kind that attenuation coefficient is larger, is beneficial to increase back sheet bandwidth.In addition, the composition that solid state powder contains can be two kinds, three kinds or more kind.
In above-mentioned steps S102, epoxy resin to be mixed with solid state powder and the step removing bubble is specially: epoxy resin is fully stirred wherein each component is mixed, then put it in getter and remove bubble; Then the solid state powder of micron dimension is added in epoxy resin, be stirred to and mix, then by the mixture vacuum degassing of solid state powder and epoxy resin to remove bubble wherein.
More specifically, each component (wherein comprising the component being beneficial to solidification) of appropriate epoxy resin is poured in glass beaker, is stirred well to each component and mixes, put it in getter a period of time removal bubble wherein of bleeding.Then add in epoxy resin by the solid state powder of sieved micron dimension, stirring a period of time mixes to it, is removed bubble wherein this mixture vacuum degassing a period of time.Remove the process of bubble through above-mentioned twice, mixture degassing effect can be made better, evenly.
In above-mentioned steps S103, specifically can by mixing, degasification complete after mixed solution pour in the centrifuge tube of corresponding size, centrifuge tube is put into the relevant position of centrifuge, through test for several times, selected centrifuge parameters is: rotating speed-3000 ~ 6000r/min, time-100 ~ 300s.If centrifugation time is too short, rotating speed is excessively slow, several different material will be caused not to be separated completely, so that do not reach the object of layering; Centrifugation time is long, and rotating speed is excessive, the interface between different material can be caused to be tending towards fuzzy, equally also can affect hierarchy.By controlling above-mentioned rotating speed and centrifugation time, selecting, can obtain the layering backing block of predetermined thickness and acoustic impedance in conjunction with above-mentioned material and mass ratio, the acoustic impedance of every layer of back sheet is different.
In the step S102 and S103 of the present embodiment, if solid state powder composition is too many, disposablely total material be added to the difficulty that can strengthen each materials stratify in centrifuge tube thus affect centrifugal effect, therefore, when the composition contained by solid state powder is greater than two kinds, first kind of the powder of two wherein and epoxy resin can be mixed, then through centrifugal treating.And then the powder of other compositions and the mixture of epoxy resin are added centrifugal device carry out centrifugal treating, thus reduce centrifugal difficulty, add success rate prepared by full-page proof block.
Centrifugal first in the embodiment of the present invention and again centrifugal selected centrifugal method are density gradient centrifugation, namely sample carries out centrifugal in density gradient media, a kind of zone separation method that this component being density is different is separated, the particle of centrifugal rear different densities forms several interfaces clearly zone of discontinuity in density gradient solution, and then obtains the sandwich construction backing block of clear layer.
In embodiments of the present invention, the material of following composition and mass ratio is have selected: as a specific embodiment through test of many times, solid state powder contains tungsten powder, alumina powder and Si powder, particle diameter is all less than 40 microns, the mass ratio of tungsten powder and epoxy resin is 8.0:1.0 ~ 12:1.0, the mass ratio of alumina powder and epoxy resin is 0.8:1.0 ~ 2.0:1.0, and the mass ratio of Si powder and epoxy resin is 0.15:1.0 ~ 0.5:1.0.More specifically, the mass ratio of tungsten powder and epoxy resin can be 8.0:1.0, can be 12:1.0, also can be 10:1.0; The mass ratio of alumina powder and epoxy resin can be 0.8:1.0, can be 2.0:1.0, also can be 1.5:1.0; The mass ratio of Si powder and epoxy resin can be 0.15:1.0, also can be 0.5:1.0, also can be 0.3:1.0.The backing block made contains the back sheet of three layers of not acoustic impedance, is followed successively by the first back sheet: tungsten-epoxy resin layer, the second back sheet: aluminium oxide-epoxy resin layer and the 3rd back sheet: silicon-epoxy resin layer.Each layer thickness is all less than 1/2nd of wavelength when ultrasonic wave transmits wherein.Above-mentioned mass ratio is the present embodiment preferred range, if mass ratio is greater than or less than above-mentioned scope, then each component can be caused to mix uneven, affect the preparation effect of backing block.
Table 1 is the performance parameter of the ultrasonic transducer adopting above-mentioned backing block:
Table 1
As another specific embodiment, solid state powder contains scandium oxide powder, alumina powder and glass powder, particle diameter is all less than 40 microns, the mass ratio of scandium oxide powder and epoxy resin is 0.8:1.0 ~ 1.5:1.0, the mass ratio of alumina powder and epoxy resin is 0.8:1.0 ~ 2.0:1.0, and the mass ratio of glass powder and epoxy resin is 0.2:1.0 ~ 1.0:1.0.More specifically, the mass ratio of scandium oxide powder and epoxy resin can be 0.8:1.0, can be 1.5:1.0, also can be 1.2:1.0; The mass ratio of alumina powder and epoxy resin can be 0.8:1.0, can be 2.0:1.0, also can be 1.5:1.0; The mass ratio of glass powder and epoxy resin is 0.2:1.0, can be 1.0:1.0, also can be 0.6:1.0.The backing block made contains three layers of back sheet, is followed successively by the first back sheet: scandium oxide-epoxy resin layer, the second back sheet: aluminium oxide-epoxy resin layer and the 3rd back sheet: glass-epoxy resin layer.Each layer thickness is all less than 1/2nd of wavelength when ultrasonic wave transmits wherein.Same, above-mentioned mass ratio is the present embodiment preferred range, if mass ratio is greater than or less than above-mentioned scope, then each component can be caused to mix uneven, affect the preparation effect of backing block.
Table 2 is the performance parameters of the ultrasonic transducer adopting above-mentioned backing block:
Table 2
Table 3 below shows the performance of the ultrasonic transducer of individual layer back sheet structure, the raw material that single back sheet is selected are the mixture of tungsten powder with epoxy resin, solid state powder is respectively with the mass ratio of epoxy resin: 8.0:1.0 ~ 15:1.0 (g), and thickness is 1-2cm.
Table 3
| Single back sheet | |
| Acoustic impedance | 14MRayl |
| Sensitivity dB, 1V/V | -57.8 |
| Bandwidth, 6dB% | 77 |
| Pulse length, 20dB μ s | 0.64 |
In table 4, the raw material that single back sheet is selected are the mixture of aluminium oxide with epoxy resin, and solid state powder is respectively with the mass ratio of epoxy resin: 0.8:1.0 ~ 2.0:1.0 (g), and thickness is 1-2cm.
Table 4
| Single back sheet | |
| Acoustic impedance | 3.5MRayl |
| Sensitivity dB, 1V/V | -52.4 |
| Bandwidth, 6dB% | 67 |
| Pulse length, 20dB μ s | 1.07 |
From above four forms, we can see clearly:
1), 14.0-5.0-3.5MRayl gradual change many back sheets structure of table 1 compares with the mono-back sheet structure of 3.5MRayl of table 4, and on the basis of loss of sensitivity 1.7dB, bandwidth improves 13%;
2), 5.0-4.0-2.5MRayl gradual change many back sheets structure of table 2 compares with the mono-back sheet structure of 3.5MRayl of table 4, and on the basis of loss of sensitivity 1dB, bandwidth improves 14%;
3), 14.0-5.0-3.5MRayl gradual change many back sheets structure of table 1 compares with the mono-back sheet structure of 14.0MRayl of table 3, promotes all to some extent on sensitivity and bandwidth.
The embodiment of the present invention, mainly through effectively being mixed and layering by centrifugal device by the materials such as epoxy resin, solid state powder, rubber, obtains the ultrasonic backing block of sandwich construction of preset thickness and acoustic impedance.Select and quality proportioning especially by above-mentioned material, in conjunction with the appropriate design of centrifugal rotational speed and centrifugation time, change the acoustic impedance of every layer of back sheet, thickness improves the bandwidth of ultrasonic transducer, the effect of sensitivity to reach.This preparation method is easier to implement compared to the selection, processing, making, cutting etc. of many matching layers structure, and then effectively avoids because the matching layer number of plies increases and the difficulty of the selection of the material that brings, processing, preparation.
With further reference to Fig. 5, the present invention further provides a kind of ultrasonic backing block 03, this ultrasonic backing block 03 can be prepared by said method, specifically comprise: the first back sheet 031 that the acoustic impedance stacked gradually is different, second back sheet 032 and the 3rd back sheet 033, first back sheet 031 comprises the first particulate and epoxy resin, second back sheet 032 comprises the second particulate and epoxy resin, 3rd back sheet 033 comprises the 3rd particulate and epoxy resin, first particulate, the particle diameter of the second particulate and the 3rd particulate is all less than 40 microns, the density of the first back sheet 031 is greater than the density of the second back sheet 032, the density of the second back sheet 032 is greater than the density of the 3rd back sheet 033, first back sheet 031, the thickness of the second back sheet 032 and the 3rd back sheet 033 is all less than 1/2nd of wavelength when ultrasonic wave transmits wherein.Every layer of back sheet of this ultrasonic backing block 03 has predetermined thickness and acoustic impedance, and every layer of acoustic impedance difference, frequency bandwidth and the sensitivity of ultrasonic transducer is changed by the thickness and acoustic impedance changing every layer of back sheet.
In this backing block, three kinds of different components of the solid state powder in the corresponding said method of the first particulate, the second particulate and the 3rd particulate difference, its particle diameter is preferably less than 40 microns.The mixture of three kinds of components and epoxy resin, by centrifugal method layering, forms above-mentioned first back sheet 031, second back sheet 032 and the 3rd back sheet 033.Certainly, this backing block is not limited to three layers of back sheet, also four layers, five layers even more multi-layered.
As a specific embodiment, the first back sheet 031 of this backing block comprises tungsten and epoxy resin that mass ratio is 8.0:1.0 ~ 12:1.0; Second back sheet 032 comprises the aluminium oxide and epoxy resin that mass ratio is 0.8:1.0 ~ 2.0:1.0; 3rd back sheet 033 comprises the silicon and epoxy resin that mass ratio is 0.15:1.0 ~ 0.5:1.0.More specifically, the mass ratio of tungsten and epoxy resin can be 8.0:1.0, can be 12:1.0, also can be 10:1.0; The mass ratio of aluminium oxide and epoxy resin can be 0.8:1.0, can be 2.0:1.0, also can be 1.5:1.0; The mass ratio of silicon and epoxy resin can be 0.15:1.0, also can be 0.5:1.0, also can be 0.3:1.0.
As another specific embodiment, the first back sheet 031 of this backing block 03 comprises scandium oxide and epoxy resin that mass ratio is 0.8:1.0 ~ 1.5:1.0; Second back sheet 032 comprises the aluminium oxide and epoxy resin that mass ratio is 0.8:1.0 ~ 2.0:1.0; 3rd back sheet 033 comprises the glass and epoxy resin that mass ratio is 0.2:1.0 ~ 1.0:1.0.More specifically, the mass ratio of scandium oxide and epoxy resin can be 0.8:1.0, can be 1.5:1.0, also can be 1.2:1.0; The mass ratio of aluminium oxide and epoxy resin can be 0.8:1.0, can be 2.0:1.0, also can be 1.5:1.0; The mass ratio of glass and epoxy resin is 0.2:1.0, can be 1.0:1.0, also can be 0.6:1.0.
Adopt the ultrasonic transducer of this backing block to have performance parameter described in above-mentioned table 1 and table 2, performance is obviously better than the performance of the ultrasonic transducer adopting conventional monolayers back sheet, improves ultrasonic imaging effect.Be appreciated that the ultrasonic probe including this ultrasonic transducer also belongs to protection scope of the present invention.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a preparation method for ultrasonic backing block, is characterized in that, comprise the steps:
Extracting epoxy resin, stand-by containing the solid state powder of at least two kinds of compositions;
Described epoxy resin is mixed with described solid state powder and removes bubble;
The mixed solution of described epoxy resin and solid state powder is inserted centrifugal device to carry out centrifugal first;
In described centrifugal device, add rubber, the mixed solution of described epoxy resin, solid state powder and rubber is carried out again centrifugal, obtain the ultrasonic backing block sample block of hierarchy;
Described ultrasonic backing block sample block is cut, obtains independently ultrasonic backing block.
2. preparation method as claimed in claim 1, it is characterized in that, the particle diameter of described solid state powder is micron dimension.
3. preparation method as claimed in claim 2, it is characterized in that, the particle diameter of described solid state powder is less than 40 microns.
4. the preparation method as described in claim 1,2 or 3, it is characterized in that, described solid state powder contains tungsten powder, alumina powder and Si powder, the mass ratio of described tungsten powder and described epoxy resin is 8.0:1.0 ~ 12:1.0, the mass ratio of described alumina powder and described epoxy resin is 0.8:1.0 ~ 2.0:1.0, and the mass ratio of described Si powder and described epoxy resin is 0.15:1.0 ~ 0.5:1.0.
5. the preparation method as described in claim 1,2 or 3, it is characterized in that, described solid state powder contains scandium oxide powder, alumina powder and glass powder, the mass ratio of described scandium oxide powder and described epoxy resin is 0.8:1.0 ~ 1.5:1.0, the mass ratio of described alumina powder and described epoxy resin is 0.8:1.0 ~ 2.0:1.0, and the mass ratio of described glass powder and described epoxy resin is 0.2:1.0 ~ 1.0:1.0.
6. preparation method as claimed in claim 1, is characterized in that, describedly to be mixed with described solid state powder by described epoxy resin and the step removing bubble is specially:
Described epoxy resin is fully stirred wherein each component is mixed, then put it in getter and remove bubble;
The solid state powder of described micron dimension is added in described epoxy resin, is stirred to and mixes, then by the mixture vacuum degassing of solid state powder and epoxy resin to remove bubble wherein.
7. a ultrasonic backing block, it is characterized in that, at least comprise the first back sheet that the acoustic impedance that stacks gradually is different, second back sheet and the 3rd back sheet, described first back sheet comprises the first particulate and epoxy resin, described second back sheet comprises the second particulate and epoxy resin, described 3rd back sheet comprises the 3rd particulate and epoxy resin, described first particulate, the particle diameter of the second particulate and the 3rd particulate is all less than 40 microns, the density of described first back sheet is greater than the density of described second back sheet, the density of described second back sheet is greater than the density of the 3rd back sheet, described first back sheet, the thickness of the second back sheet and the 3rd back sheet is all less than 1/2nd of wavelength when ultrasonic wave transmits wherein.
8. ultrasonic backing block as claimed in claim 7, is characterized in that, described first back sheet comprises the tungsten and epoxy resin that mass ratio is 8.0:1.0 ~ 12:1.0; Described second back sheet comprises the aluminium oxide and epoxy resin that mass ratio is 0.8:1.0 ~ 2.0:1.0; Described 3rd back sheet comprises the silicon and epoxy resin that mass ratio is 0.15:1.0 ~ 0.5:1.0.
9. ultrasonic backing block as claimed in claim 7, is characterized in that, described first back sheet comprises the scandium oxide and epoxy resin that mass ratio is 0.8:1.0 ~ 1.5:1.0; Described second back sheet comprises the aluminium oxide and epoxy resin that mass ratio is 0.8:1.0 ~ 2.0:1.0; Described 3rd back sheet comprises the glass and epoxy resin that mass ratio is 0.2:1.0 ~ 1.0:1.0.
10. a ultrasonic probe, comprises transducer, it is characterized in that, described transducer comprises the ultrasonic backing block described in claim 7,8 or 9.
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| WO2020062257A1 (en) * | 2018-09-30 | 2020-04-02 | 深圳迈瑞生物医疗电子股份有限公司 | Backing block of ultrasonic probe, manufacturing method of backing block, and ultrasonic probe |
| CN111203374A (en) * | 2018-11-21 | 2020-05-29 | 美国西门子医疗系统股份有限公司 | Composite acoustic absorber for ultrasound transducer array |
| CN113926681A (en) * | 2021-10-12 | 2022-01-14 | 陕西博纵电子科技有限公司 | Large-bandwidth ultrasonic transducer and manufacturing method of back lining layer thereof |
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| CN114308600A (en) * | 2021-12-16 | 2022-04-12 | 国网山东省电力公司烟台供电公司 | Air coupling ultrasonic transducer for non-contact detection of insulation defects of switch cabinet |
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| WO2020062257A1 (en) * | 2018-09-30 | 2020-04-02 | 深圳迈瑞生物医疗电子股份有限公司 | Backing block of ultrasonic probe, manufacturing method of backing block, and ultrasonic probe |
| CN112638271A (en) * | 2018-09-30 | 2021-04-09 | 深圳迈瑞生物医疗电子股份有限公司 | Backing block for ultrasonic probe, method for manufacturing backing block, and ultrasonic probe |
| CN111203374A (en) * | 2018-11-21 | 2020-05-29 | 美国西门子医疗系统股份有限公司 | Composite acoustic absorber for ultrasound transducer array |
| CN110819073A (en) * | 2019-11-25 | 2020-02-21 | 飞依诺科技(苏州)有限公司 | Backing material, preparation method thereof and ultrasonic probe |
| CN113926681A (en) * | 2021-10-12 | 2022-01-14 | 陕西博纵电子科技有限公司 | Large-bandwidth ultrasonic transducer and manufacturing method of back lining layer thereof |
| CN114106518A (en) * | 2021-10-28 | 2022-03-01 | 中广核检测技术有限公司 | Slice type ultrasonic sensor |
| CN114308600A (en) * | 2021-12-16 | 2022-04-12 | 国网山东省电力公司烟台供电公司 | Air coupling ultrasonic transducer for non-contact detection of insulation defects of switch cabinet |
| CN115138547A (en) * | 2022-06-30 | 2022-10-04 | 中国工程物理研究院电子工程研究所 | Piezoelectric micromechanical ultrasonic transducer back lining material, preparation method and filling method |
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