CN112638130A

CN112638130A - Electronic equipment and heat dissipation device thereof

Info

Publication number: CN112638130A
Application number: CN202011558718.4A
Authority: CN
Inventors: 张明豪
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-12-24
Filing date: 2020-12-24
Publication date: 2021-04-09

Abstract

The application provides a heat dissipation device, which is used for dissipating heat for electronic equipment and is characterized in that the heat dissipation device comprises a heat dissipation mechanism and a driving mechanism, wherein the heat dissipation mechanism is arranged on the electronic equipment; the driving mechanism drives the heat dissipation cover to be fully or partially retracted into the shell of the electronic equipment, so that the heat dissipation holes are fully or partially stored in the shell. The radiating holes are closed, so that dust or liquid in the external environment can be prevented from entering the inner cavity of the shell through the radiating holes, and the probability that the dust or liquid in the external environment enters the electronic equipment is reduced; the heat dissipation hole is opened to dissipate heat normally. The application also provides an electronic device with the heat dissipation device.

Description

Electronic equipment and heat dissipation device thereof

Technical Field

The present application relates to the field of heat dissipation of electronic devices, and more particularly, to a heat dissipation device and an electronic device having the same.

Background

At present, electronic products such as routers and the like generally have heat dissipation holes arranged at the top of the products for heat dissipation of internal heating elements of the electronic products, so that the internal heat of the electronic products can be reduced to ensure that the electronic products can work normally. The adoption sets up the louvre at the top of product is the key of natural heat dissipation, the process of natural heat dissipation usually is: the heat generated by the main heating element in the electronic product, such as a main control board chip and the like, during working is conducted to the heat dissipation fins, and then natural convection is formed in the internal cavity of the electronic product through a chimney effect, so that cold air enters the internal cavity from the air inlet hole in the bottom of the electronic product, the cold air is subjected to heat exchange with the heat dissipation fins and then carries most of the heat to be discharged from the heat dissipation holes in the top, and in addition, a small part of the heat is transmitted to the surrounding space in a heat radiation mode. However, since the heat dissipation holes are exposed all the time, dust or liquid in the external environment easily enters the electronic product through the heat dissipation holes, which may cause problems such as failure of the internal electronic devices or short circuit of the electronic product.

Disclosure of Invention

An object of the application is to provide a heat abstractor and be equipped with heat abstractor's electronic equipment, heat abstractor can reduce the dust of external environment or the inside probability of liquid entering electronic equipment.

In order to solve the above technical problem, the present application provides a heat dissipation apparatus for dissipating heat from an electronic device, the heat dissipation apparatus includes a heat dissipation mechanism and a driving mechanism installed on the electronic device, the heat dissipation mechanism includes a heat dissipation cover slidably connected to the electronic device, the heat dissipation cover is provided with a plurality of heat dissipation holes communicating with an inner cavity of the electronic device, the driving mechanism drives the heat dissipation cover to be able to fully or partially extend out of a housing of the electronic device, so that the heat dissipation holes are fully exposed and in a fully open state or partially exposed and in a partially open state; the driving mechanism drives the heat dissipation cover to be capable of being fully or partially retracted into the shell of the electronic equipment, so that the heat dissipation hole is fully stored in the shell to be in a fully closed state or partially stored in the shell to be in a partially closed state.

The application also provides an electronic device, which comprises an outer shell, a main control board and a heat dissipation device, wherein the main control board is arranged in the outer shell, at least one end of the outer shell is provided with a containing frame, the heat dissipation device is contained in the containing frame, and a driving mechanism of the heat dissipation device drives a heat dissipation cover of the heat dissipation device to stretch out or shrink the outer shell so as to enable heat dissipation holes in the heat dissipation cover to be opened or closed.

The heat dissipation cover of the electronic equipment can be slidingly accommodated in the accommodating frame of the shell, the heat dissipation cover is provided with a plurality of heat dissipation holes communicated with the inner cavity of the shell, and the driving mechanism can drive the heat dissipation cover to slide relative to the accommodating frame so as to enable the heat dissipation cover to accommodate or stretch out the accommodating frame. When the electronic equipment needs to dissipate heat during working, the driving mechanism drives the heat dissipation cover to wholly or partially extend out of the accommodating frame, so that the heat dissipation holes of the heat dissipation cover are wholly or partially opened, and heat generated by working of elements such as the main control board is discharged from the heat dissipation holes after passing through the accommodating frame, so that the temperature of the elements such as the main control board is reduced, and the working of the electronic equipment is more stable. When the electronic equipment stops working or heat generated by working is low, the driving mechanism drives the heat dissipation cover to be wholly or partially contracted into the containing frame, so that the heat dissipation holes of the heat dissipation cover are wholly or partially closed, dust or liquid in the external environment can be prevented or reduced from penetrating through the heat dissipation holes to enter an inner cavity of the shell, the problems that the main control board and electronic devices on the main control board fail or a machine is short-circuited and the like are prevented, and therefore the probability that the dust or the liquid in the external environment enters the inside of the electronic equipment is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic perspective view of an electronic device in a first embodiment of the present application;

fig. 2 is an exploded perspective view of the main body and the heat sink of the electronic device in fig. 1;

FIG. 3 is an exploded perspective view of the electronic device of FIG. 1;

FIG. 4 is an exploded perspective view of the electronic device of FIG. 3 from another perspective;

fig. 5 is an enlarged perspective view of the heat-dissipating cover of fig. 4;

FIG. 6 is an enlarged perspective view of the support frame of FIG. 3;

FIG. 7 is a perspective view of the support frame of FIG. 6 from another perspective;

FIG. 8 is an enlarged perspective view of the drive mechanism of FIG. 3;

FIG. 9 is an exploded perspective view of the heat sink of FIG. 2;

fig. 10 is a perspective view of another perspective view of the heat dissipation device in fig. 2;

FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 1;

FIG. 12 is an enlarged view of a portion of the structure of FIG. 11;

FIG. 13 is a top view of the electronic device of FIG. 1;

FIG. 14 is a cross-sectional view taken along line XIV-XIV of FIG. 13;

FIG. 15 is an enlarged view of a portion of the structure of FIG. 14;

fig. 16 is a schematic perspective view of another state of the electronic device in fig. 1;

FIG. 17 is a cross-sectional view taken along line XVII-XVII in FIG. 16;

FIG. 18 is an enlarged view of a portion of the structure of FIG. 17;

FIG. 19 is a top view of the electronic device of FIG. 16;

FIG. 20 is a cross-sectional view taken along line XX-XX in FIG. 19;

FIG. 21 is an enlarged view of a portion of the structure of FIG. 20;

fig. 22 is a schematic perspective view illustrating a heat dissipation state of a heat dissipation device of an electronic apparatus according to a second embodiment of the present application;

FIG. 23 is a perspective view of the electronic device of FIG. 22 from another perspective;

fig. 24 is a schematic perspective view of the electronic device in fig. 22 with the heat sink closed;

fig. 25 is a perspective view of the electronic device in fig. 24 from another perspective.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.

In addition, the following description of the various embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the application may be practiced. Directional phrases used in this application, such as, for example, "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," and the like, refer only to the orientation of the appended drawings and are, therefore, used herein for better and clearer illustration and understanding of the application and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the application.

In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed at … …" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1 to 4, an electronic device 100 in a first embodiment of the present application includes a housing 20, a main control board 30 disposed in the housing 20, and a heat dissipation device 50 for dissipating heat of the electronic device 100, wherein at least one end of the housing 20 is disposed with a receiving frame 22, and the heat dissipation device 50 is received in the receiving frame 22. The heat sink 50 includes a heat dissipation mechanism 51 and a driving mechanism 55 mounted on the housing frame 22. The heat dissipation mechanism 51 includes a heat dissipation cover 52 slidably connected to the electronic device 100, and the heat dissipation cover 52 can be accommodated in the accommodating frame 22, or the heat dissipation cover 52 can extend out of the accommodating frame 22. The heat dissipation cover 52 is provided with a plurality of heat dissipation holes 521 communicated with the inner cavity of the electronic device 100, and the driving mechanism 55 is configured to drive the heat dissipation cover 52 to slide relative to the electronic device 100, so that the plurality of heat dissipation holes 521 are in a closed state or an open state.

In this embodiment, the top of the housing 20 is provided with the receiving frame 22, the heat dissipation cover 52 is slidably disposed in the receiving frame 22, and the driving mechanism 55 drives the heat dissipation cover 52 to extend out of or retract the receiving frame 22, so as to open or close the heat dissipation hole 521 on the heat dissipation cover 52. Specifically, when the heat generated by the main control board 30 and the heating elements thereon needs to be dissipated during operation, the driving mechanism 55 drives the heat dissipating cover 52 to extend out of the accommodating frame 22, so that the heat dissipating holes 521 are exposed out of the accommodating frame 22 and open. The heat generated by the operation of the main control board 30 and the heating elements thereon forms natural convection in the inner cavity of the housing 23 through the chimney effect, so that the cold air enters the inner cavity from the air inlet 201 at the bottom of the electronic device 100, the cold air exchanges heat with the main control board 30 and the heating elements thereon, and then carries most of the heat to be discharged from the heat dissipation holes 521 after passing through the receiving frame 22, and in addition, a small part of the heat is transmitted to the surrounding space through a heat radiation mode. When the electronic device 100 stops working or the heat generated by the main control board 30 is low, the driving mechanism 55 drives the heat dissipation cover 52 to retract into the receiving frame 22, so that the heat dissipation hole 521 of the heat dissipation cover 52 is collected into the receiving frame 22 and closed, thereby preventing dust or liquid in the external environment from entering the inner cavity of the electronic product 100 through the heat dissipation hole 521.

The heat dissipation cover 52 of the electronic device 100 of the present application is slidably received in the receiving frame 22 of the housing 20, the heat dissipation cover 52 is provided with a plurality of heat dissipation holes 521 communicated with the inner cavity of the housing 20, and the driving mechanism 55 can drive the heat dissipation cover 52 to slide relative to the receiving frame 22, so that the heat dissipation cover 52 receives or extends out of the receiving frame 22. When the heat dissipation cover 52 extends out of the receiving frame 22, the heat dissipation holes 521 are opened; when the heat dissipation cover 52 is retracted to the receiving frame 22, the heat dissipation holes 521 are closed. When the electronic device 100 needs to dissipate heat during operation, the driving mechanism 55 drives the heat dissipation cover 52 to extend out of the accommodating frame 22, so that the heat dissipation holes 521 of the heat dissipation cover 52 are opened, and heat generated by operation of the components such as the main control board 30 is discharged from the heat dissipation holes 521 after passing through the accommodating frame 22, so as to reduce the temperature of the components such as the main control board 30, and thus the electronic device 100 can stably operate. When the electronic device 100 stops working or the heat generated by the main control board 30 during working is low, the driving mechanism 55 drives the heat dissipation cover 52 to retract into the housing frame 22, so that the heat dissipation hole 521 is closed, thereby preventing dust or liquid in the external environment from entering the inner cavity of the housing 20 through the heat dissipation hole 521, and preventing the main control board 30 and electronic devices thereon from failing or causing short circuit of the machine, and the like, thereby reducing the probability of the dust or liquid in the external environment entering the inside of the electronic device. In addition, when the heat dissipation cover 52 is retracted into the receiving frame 22, the heat dissipation hole 521 is hidden in the receiving frame 22, that is, the housing 20 of the electronic device 100 has no heat dissipation hole 521, so that the appearance of the electronic device 100 is improved.

The term "connected" in the description of the embodiments of the present application includes both direct connection and indirect connection, for example, a connection between a and B includes a direct connection between a and B or a connection between a third element C or more and other elements. The connection also includes both the case of integral connection and the case of non-integral connection, the integral connection means that A and B are integrally formed and connected, and the non-integral connection means that A and B are non-integrally formed and connected. It is to be understood that unless defined by means of modifiers, prefixes, suffixes, or the like, reference to "coupled" in the embodiments of the present application is to be interpreted to include, but not limited to, fixed couplings, rotational couplings, sliding couplings, pivotal couplings, threaded couplings, movable couplings, interference couplings, frictional couplings, elastic couplings, rigid couplings, adhesive couplings, and the like. It will be understood that the embodiments of the present application are not limited to two elements being directly secured, but may be secured by a third party element or more.

The housing 20 includes a casing 23 and a base 25 clamped to the bottom of the casing 23, and the receiving frame 22 is disposed on the top of the casing 23. The accommodating frame 22 is provided with a plurality of air outlet holes 222 communicated with the inner cavity 231 of the shell 23. Specifically, the housing 23 includes an outer peripheral wall 230 and a support plate 234 disposed at an end inside the outer peripheral wall 230, and the support plate 234 and an end of the outer peripheral wall 230 away from the base 25 form the receiving frame 22. The peripheral wall 230 encloses an inner cavity 231 of the housing 23. The air outlet holes 222 are formed in the supporting plate 234, and preferably, the air outlet holes 222 are formed around the supporting plate 234. The supporting plate 234 is provided with a plurality of first sliding guide holes 2342, a plurality of second sliding guide holes 2344 and a plurality of fixing holes 2346, the plurality of guide posts 526 are slidably inserted into the plurality of second sliding guide holes 2344, the plurality of sliding posts 527 are slidably inserted into the plurality of first sliding guide holes 2342, and the plurality of fixing holes 2346 correspond to the plurality of connecting holes 5328. Specifically, the supporting plate 234 is provided with four first sliding guide holes 2342, four second sliding guide holes 2344 and four fixing holes 2346, the four first sliding guide holes 2342, the four second sliding guide holes 2344 and the four fixing holes 2346 are respectively located at four corners of the supporting plate 234, and a gap is formed between each adjacent first sliding guide hole 2342, second sliding guide hole 2344 and fixing hole 2346. The middle of the supporting plate 234 is provided with a through hole 2347, the through hole 2347 is communicated with the inner cavity 231 of the housing 23, and the through hole 2347 is used for inserting the driving mechanism 55. A plurality of fasteners 235 are disposed at an end of the inner peripheral surface of the outer peripheral wall 230 away from the supporting plate 234, and the plurality of fasteners 235 are used for fastening the base 25 to the bottom end of the housing 23. One side of the peripheral wall 230 is provided with a plurality of through holes 236, and the plurality of through holes 236 are arranged along the length direction of the housing 23.

The middle part of base 25 is equipped with and is used for the joint to fix main control board 30's joint piece 252, be equipped with a plurality of around base 25 the fresh air inlet 201. Preferably, a plurality of the air inlet holes 201 are arranged around the main control panel 30. The periphery wall of base 25 is equipped with a plurality of connector links 245, and is a plurality of connector link 245 with a plurality of buckles 235 one-to-one of casing 23.

The main control board 30 is connected to the base 25, so that the main control board 30 extends along the length direction of the housing 23, that is, one end of the main control board 30 is vertically connected to the base 25. Specifically, one end of the main control board 30 is vertically connected to the clamping piece 252 of the base 25. The end of the main control board 30 away from the base 25 is provided with a conductive contact piece 32, and the conductive contact piece 32 is used for electrically connecting to the driving mechanism 55. A plurality of connector interfaces 34 are disposed on one side of the main control board 30, and each connector interface 34 is electrically connected to the main control board 30. When the main control board 30 is installed in the housing 23, the connector interfaces 34 correspond to the through holes 236 one by one. The heat dissipation device 50 further includes a temperature sensor 58 electrically connected to the main control board 30, wherein the temperature sensor 58 is configured to detect a temperature of air near the main control board 30. The main control board 30 is preset with a first preset temperature value T1 and a second preset temperature value T2, and the first preset temperature value T1 is higher than the second preset temperature value T2. The first preset temperature value T1 and the second preset temperature value T2 can be set as required, in this embodiment, the first preset temperature value T1 is set to 45 degrees, and the second preset temperature value T2 is set to 35 degrees. In other embodiments, the first preset temperature value T1 may be set to any value between 40 and 60 degrees, and the second preset temperature value T2 may be set to any value between 30 and 40 degrees. In this embodiment, the temperature sensor 58 is disposed on the main control board 30. In other embodiments, the temperature sensor 58 may also be disposed in the housing 23 and communicate with the inner cavity of the housing 23, and the temperature sensor 58 is electrically connected to the main control board 30 through a wire.

When more heat is needed in the housing 20 and all the heat dissipation holes 521 need to be opened for heat dissipation, the driving mechanism 55 drives the heat dissipation cover 52 to extend out of the housing 20 of the electronic device 100, so that all the heat dissipation holes 521 are exposed out of the housing 20, and all the heat dissipation holes 521 are opened, thereby facilitating the rapid heat dissipation of the electronic device 100. When the heat in the housing 20 is less, and only a portion of the heat dissipation holes 521 needs to be opened for heat dissipation, the driving mechanism 55 drives the heat dissipation cover 52 to partially extend out of the housing 20, so that the portion of the heat dissipation holes 521 is exposed out of the housing 20, and the heat dissipation holes 521 are partially opened to satisfy the heat dissipation of the electronic device 100. When the electronic device 100 does not work or generates little heat during work and does not require the heat dissipation hole 521 for heat dissipation, the driving mechanism 55 drives the heat dissipation cover 52 to be fully retracted into the housing 20, so that the heat dissipation hole 521 is fully stored in the storage frame 22, and the heat dissipation hole 521 is fully closed. After the electronic device is completely opened through the heat dissipation holes 521 for heat dissipation, the heat in the housing 20 is reduced, and only a part of the heat dissipation holes 521 are needed, the driving mechanism 55 drives the heat dissipation cover 52 to partially retract into the housing 20, so that the heat dissipation holes 521 are partially closed, and the heat dissipation requirement of the electronic device 100 is met.

The heat dissipation mechanism 51 further includes a support frame 53, the heat dissipation cover 52 is connected to the housing 20 through the support frame 53, and the driving mechanism 55 drives the heat dissipation cover 52 to slide relative to the support frame 53. Specifically, the heat dissipation cover 52 is connected to the receiving frame 22 through the supporting frame 53, that is, the supporting frame 53 is fixedly connected to the receiving frame 22, the heat dissipation cover 52 is slidably connected to the supporting frame 53, and the driving mechanism 55 is configured to drive the heat dissipation cover 52 to approach the supporting frame 53 or to be away from the supporting frame 53.

In this embodiment, the housing 20 is a rectangular casing, the receiving frame 22 is a rectangular frame, and the heat dissipation cover 52 and the supporting frame 53 are both rectangular. In other embodiments, the housing 20 may be a cylindrical case, a kidney-shaped case, a polygonal case, or the like, the housing frame 22 may be a circular frame, an elliptical frame, a polygonal frame, or the like, and the heat dissipation cover 52 and the support frame 53 may be circular, elliptical, polygonal, or the like. That is, the housing 20, the receiving frame 22, the heat dissipating cover 52, and the supporting frame 53 may be designed to have corresponding shapes as needed.

The support frame 53 is provided with a vent hole 531 communicating with an inner cavity of the electronic device 100, and the support frame 53 is fixed in the housing 23 of the electronic device 100. Specifically, the supporting frame 53 is fixed in the housing frame 22 of the housing 23, and the heat dissipation cover 52 is slidably coupled to the supporting frame 53. The driving mechanism 55 drives the heat dissipation cover 52 to slide away from the support frame 53 until the heat dissipation hole 521 is communicated with the air flow channel between the ventilation holes 531, so that heat generated by the main control board 30 and other elements in the inner cavity of the housing 23 during working can be dissipated along the air flow channel. The driving mechanism 55 drives the heat dissipation cover 52 to slide toward the support frame 53 until the airflow channel between the heat dissipation hole 521 and the ventilation hole 531 is closed, i.e. the heat dissipation hole 521 is collected in the housing frame 22, so as to prevent dust or liquid in the external environment from entering the inner cavity of the housing 20 through the heat dissipation hole 521.

In this embodiment, the heat dissipation cover 52 and the support frame 53 are slidably sleeved with each other, the heat dissipation cover 52 includes a cover plate 522 and a first peripheral wall 524 surrounding the cover plate 522, and the plurality of heat dissipation holes 521 are opened in the first peripheral wall 524. The supporting frame 53 includes a connecting plate 532 and a second peripheral wall 534 surrounding the connecting plate 532, and the first peripheral wall 524 and the second peripheral wall 534 are slidably sleeved. The first peripheral wall 524 and the second peripheral wall 534 slide to be displaced from each other, so that the airflow channel between the heat dissipation hole 521 and the ventilation hole 531 is open, and the first peripheral wall 524 and the second peripheral wall 534 slide to be stacked with each other, so that the airflow channel between the heat dissipation hole 521 and the ventilation hole 531 is closed.

As shown in fig. 3 to 5, specifically, the heat dissipation cover 52 is a rectangular cover, that is, the cover plate 522 is a rectangular plate, the first peripheral wall 524 surrounds the periphery of the rectangular plate, and the cover plate 522 and the first peripheral wall 524 surround a housing space. The cover 522 includes a front surface 5221 and a rear surface 5223, and the first peripheral wall 524 is disposed around the rear surface 5223. Preferably, the plurality of heat dissipation holes 521 are uniformly arranged on the first peripheral wall 524 along the circumferential direction of the cover plate 522. A connecting cylinder 525 is provided in the middle of the back surface 5223 of the cover plate 522 along the sliding direction of the heat dissipating cover 52, and an internal thread 5251 is provided on the inner circumferential surface of the connecting cylinder 525, that is, the connecting cylinder 525 is provided with an internal thread hole along the axial direction thereof. The heat sink cover 52 has a plurality of guide posts 526 and a plurality of sliding posts 527, and each guide post 526 and each sliding post 527 extend along the sliding direction of the heat sink cover 52. Specifically, the back surface 5223 of the cover plate 522 is provided with four guide posts 526 and four sliding posts 527, the four guide posts 526 and the four sliding posts 527 are respectively located at four corners of the cover plate 522, and a gap is formed between each adjacent guide post 526 and each adjacent sliding post 527.

In other embodiments, the back surface 5223 of the cover 522 is provided with at least one guide post 526 and at least one sliding post 527; alternatively, the back 5223 of the cover 522 may be provided with two, three or more guide posts 526 and sliding posts 527.

The first snap 528 is disposed on a side of the first peripheral wall 524 away from the cover plate 522, in this embodiment, a plurality of first snap 528 is protruded from an inner peripheral surface of the first peripheral wall 524, and the plurality of first snap 528 are uniformly spaced along a circumferential direction of the first peripheral wall 524. Specifically, the first peripheral wall 524 is a rectangular frame, 8 first hooks 528 are disposed on an inner peripheral surface of the first peripheral wall 524, and two first hooks 528 are disposed on each side of the first peripheral wall 524. Each first buckle 528 is a clamping bar, and a side edge of the clamping bar, which faces away from the back surface 5223, is provided with a guiding sliding surface 5281.

In other embodiments, at least two first catches 528 are disposed on the inner circumferential surface of the first circumferential wall 524, and the two first catches 528 are symmetrically disposed along the center of the cover plate 522.

In other embodiments, the inner circumferential surface of the first circumferential wall 524 is provided with 4 first hooks 528, and the 4 first hooks 528 are respectively disposed on four sides of the first circumferential wall 524.

Referring to fig. 3-4 and 6-7, in the present embodiment, the supporting frame 53 is a rectangular frame, that is, the connecting plate 532 is a rectangular plate, the second peripheral wall 534 is disposed around the rectangular plate, and the connecting plate 532 and the second peripheral wall 534 enclose a ventilation space. Specifically, the connecting plate 532 includes a front surface 5321 and a rear surface 5323, the second peripheral wall 534 is disposed on the periphery of the front surface 5321, and the plurality of ventilation holes 531 are opened in the connecting plate 532. Preferably, a plurality of vent holes 531 are formed around the connection plate 532. A through hole 5320 is formed in the middle of the connecting plate 532, a connecting cylinder 5324 is arranged on the front surface 5321 of the connecting plate 532 and around the through hole 5320, and the axis of the through hole 5320 is collinear with the axis of the connecting cylinder 5324. A positioning box 535 is disposed on a side of the supporting frame 53 facing away from the heat dissipating cover 52, and the positioning box 535 is used for fixedly mounting the driving mechanism 55. An opening 5351 communicated with an inner cavity of the positioning box 535 is formed in one side of the positioning box 535, a clamping groove 5353 is formed in one side of the opening 5351 of the positioning box 535, the clamping groove 5353 is close to the connecting plate 532, and the clamping groove 5353 is communicated with the opening 5351. Specifically, the positioning box 535 is disposed on the back surface 5323 of the connecting plate 532 around the through hole 5320, and the through hole 5320 is communicated with the inner cavity of the positioning box 535. In this embodiment, the positioning box 535 is a rectangular box, the opening 5351 is disposed on one side of the rectangular box, and the slot 5353 and the opening 5351 are located on the same side of the positioning box 535.

The front surface 5321 of the supporting frame 53 is provided with a plurality of guiding holes 5326, a plurality of sliding holes 5327 and a plurality of connecting holes 5328, the plurality of guiding posts 526 are respectively slidably inserted into the plurality of guiding holes 5326, and the plurality of sliding posts 527 are respectively slidably inserted into the plurality of sliding holes 5327. Specifically, the front surface 5321 of the connecting plate 532 is provided with four guide holes 5326, four sliding holes 5327 and four connecting holes 5328, the four guide holes 5326, the four sliding holes 5327 and the four connecting holes 5328 are respectively located at four corners of the connecting plate 532, and a gap is formed between every two adjacent guide holes 5326, sliding holes 5327 and connecting holes 5328. The front surface 5321 of the connecting plate 532 is provided with a guide cylinder 536 around each guide hole 5326, the axis of the guide hole 5326 is collinear with the axis of the guide cylinder 536, and the inner diameter of the guide cylinder 536 is larger than the diameter of the guide hole 5326. The front surface 5321 of the connecting plate 532 is provided with a sliding cylinder 537 around each sliding hole 5327, and the axis of the sliding hole 5327 is collinear with the axis of the sliding cylinder 537. The front surface 5321 of the connecting plate 532 is provided with a plurality of reinforcing ribs 538, and the plurality of reinforcing ribs 538 are used for increasing the strength of the connecting plate 532. Specifically, a rib 538 is connected between two adjacent guide cylinders 536, a rib 538 is connected between each guide cylinder 536 and the second peripheral wall 534, and a rib 538 is connected between the connecting cylinder 5324 and the rib 538 between each two adjacent guide cylinders 536.

In other embodiments, the front surface 5321 of the connecting plate 532 is provided with at least one guiding hole 5326, at least one sliding hole 5327 and at least one connecting hole 5328; alternatively, the number of the guide holes 5326, the sliding holes 5327 and the connecting holes 5328 on the front surface 5321 of the connecting plate 532 may be two, three or more.

A stopping mechanism is disposed between the first peripheral wall 524 and the second peripheral wall 534, and the stopping mechanism is used for stopping the heat dissipation cover 52 from being detached from the support frame 53. Specifically, the second circumferential wall 534 is away from the second latch 5342 on the side of the connecting plate 532, and the first latch 528 and the second latch 5342 constitute the stopping mechanism. The first latch 528 and the second latch 5342 are latched to each other to prevent the heat dissipation cover 52 from being separated from the support frame 53. Specifically, the second latch 5342 is a locking edge provided on the outer peripheral surface of the second peripheral wall 534 away from the side of the connecting plate 532, and the locking edge extends along the edge of the second peripheral wall 534.

As shown in fig. 3 and 4, the heat dissipation mechanism 51 further includes elastic supporting members 54 and locking members 59. Specifically, each guiding post 526 is sleeved with the abutting member 54, when the heat dissipating cover 52 is slidably connected to the supporting frame 53, one end of the abutting member 54 elastically abuts against the heat dissipating cover 52, and the other end of the abutting member 54 elastically abuts against the supporting frame 53, so as to prevent the heat dissipating cover 52 from swinging relative to the supporting frame 53. In this embodiment, each spring of the abutting member 54 is sleeved on the guide post 526, one end of the spring elastically abuts against the cover plate 522, and the other end of the spring opposite to the spring elastically abuts against the connecting plate 532. A plurality of locking members 59 are used to connect the supporting frame 53 to the receiving frame 22, and in this embodiment, the locking members 59 are screws.

As shown in fig. 3-4 and 8, the driving mechanism 55 includes a driving member 551 and a transmission member 553 connected to the driving member 551, one end of the transmission member 553 is connected to the driving member 551, the other end of the transmission member 553 is connected to the heat dissipation cover 52, and the driving member 551 drives the transmission member 553 to drive the heat dissipation cover 52 to slide relative to the supporting frame 53. In this embodiment, the driving member 551 is a stepping motor electrically connected to the main control board 30, the stepping motor has a driving shaft 5512, the driving member 553 is a driving rod connected to the driving shaft 5512, and the driving rod has an external thread 5532 screwed with the internal thread 5251 of the heat dissipating cover 52. The driving member 551 drives the transmission member 553 to rotate, so as to drive the heat dissipation cover 52 to slide relative to the supporting frame 53. The end of the driving shaft 5512 is provided with a clamping hole 5514, and the end of the driving rod is provided with a clamping block 5534 clamped in the clamping hole 5514. The outer peripheral surface of the stepping motor is provided with a conductive sheet 5516, and the stepping motor is electrically connected to the main control board 30 through the conductive sheet 5516.

Referring to fig. 2 to 10, when the electronic apparatus 100 is assembled, the driving mechanism 55 is installed in the positioning box 535 of the supporting frame 53, specifically, the driving member 551 is accommodated in the positioning box 535 from the opening 5351 of the positioning box 535, and the conductive sheet 5516 of the driving member 551 is exposed out of the opening 5351. The driving element 553 passes through the connecting tube 5324 and the through hole 5320 of the supporting frame 53 and is connected to the driving element 551, i.e., the clamping block 5534 of the driving element 553 is clamped in the clamping hole 5514 of the driving element 551. The supporting frame 53 is mounted on the receiving frame 22 of the housing 20, and specifically, the positioning box 535 is inserted into the through hole 2347 of the supporting plate 234, such that the plurality of sliding holes 5327 of the supporting frame 53 correspond to the plurality of first sliding guide holes 2342 one by one, the plurality of guide holes 5326 correspond to the plurality of second sliding guide holes 2344 one by one, the plurality of connecting holes 5328 correspond to the plurality of fixing holes 2346 one by one, and the plurality of ventilation holes 531 communicate with the plurality of air outlet holes 222. The plurality of locking members 59 are respectively inserted through the plurality of connecting holes 5328 and locked to the corresponding fixing holes 2346, so that the supporting frame 53 is fixedly connected to the receiving frame 22. After the supporting members 54 are respectively sleeved on the guide posts 526, the heat dissipation cover 52 is covered on the supporting frame 53; specifically, the external thread 5532 of the transmission member 553 is screwed to the internal thread 5251 of the connecting cylinder 525, the plurality of guide posts 526 are respectively slidably inserted into the plurality of guide cylinders 536, the corresponding guide holes 5326 and the corresponding second slide guide holes 2344, the plurality of slide posts 527 are respectively slidably inserted into the plurality of slide holes 5327 of the slide cylinders 537 and the corresponding first slide guide holes 2342, each abutting member 54 elastically abuts between the supporting frame 53 and the heat dissipating cover 52, and the first buckle 528 of the heat dissipating cover 52 abuts against the second buckle 5342 of the supporting frame 53. The main control board 30 installed on the base 25 is inserted into the inner cavity 231 from the bottom of the housing 23, so that one end of the main control board 30, which is far away from the base 25, is clamped into the clamping groove 5353 of the positioning box 535, and the conductive contact piece 32 of the main control board 30 passes through the opening 5351 and is attached to the conductive piece 5516 of the driving mechanism 55, so that the driving piece 551 is electrically connected to the main control board 30, namely, the plurality of connecting buckles 245 of the base 25 are respectively clamped to the buckles 235 of the housing 23.

In other embodiments, the first peripheral wall 524 of the heat dissipation cover 52 may also be slidably connected to the inner circumferential surface of the second peripheral wall 534 of the support frame 53, and a stopping mechanism is disposed between the first peripheral wall 524 and the second peripheral wall 534 to prevent the heat dissipation cover 52 from being detached from the support frame 53.

Referring to fig. 1 and 11-15, when the electronic device 100 is not in use, the heat dissipation cover 52 is sleeved on the supporting frame 53, and the heat dissipation cover 52 is accommodated in the inner cavity of the accommodating frame 22. At this time, the first peripheral wall 524 is sleeved on the outer peripheral surface of the second peripheral wall 534, the vent hole 531 of the first peripheral wall 524 is accommodated in the inner cavity of the accommodating frame 22, the front surface 5221 of the cover plate 522 is coplanar with the top surface of the accommodating groove 22, and the cover plate 522 is in sealing fit with the accommodating frame 22, i.e., there is no gap between the cover plate 522 and the accommodating frame 22. Therefore, dust or liquid in the external environment cannot enter the inner cavity of the electronic product 100 through the heat dissipation hole 521.

Referring to fig. 16 to fig. 21, when heat generated by the electronic device 100 needs to be dissipated, the main control board 30 controls the driving member 551 to drive the transmission member 553 to rotate, so as to drive the heat dissipation cover 52 to slide outward relative to the support frame 53, and expose the heat dissipation hole 521 of the heat dissipation cover 52 out of the support frame 53 until the first buckle 528 of the heat dissipation cover 52 is stopped by the second buckle 5342 of the support frame 53. At this time, the heat dissipating holes 521 on the heat dissipating cover 52 are all exposed, and the heat dissipating holes 521 are communicated with the air vent 531, the air outlet 222, the inner cavity 231 of the housing 23 and the air inlet 201 of the base 25, that is, an air flow channel for dissipating heat from the air inlet 201 to the inner cavity 231 of the housing 23 is formed through the air outlet 222, the air vent 531 and the heat dissipating holes 521, that is, natural convection is formed through the air flow channel. The cold air enters the inner cavity 231 of the housing 23 through the air inlet 201 at the bottom of the electronic device 100, and after the cold air exchanges heat with the main control board 30 and the heating elements thereon, the cold air carries most of the heat to be discharged from the heat dissipation holes 521 through the airflow channel, so that the temperature of the main control board 30 and the heating elements thereon is reduced.

Specifically, when the electronic device 100 is just started, the heat generated by the electronic devices such as the main control board 30 during operation is relatively low, that is, the heat generated by the electronic devices such as the main control board 30 during operation is transmitted to the surrounding space of the main board 30 in a heat radiation manner, so that the heat dissipation requirement can be met. With the increase of heat generated by the electronic devices such as the main control board 30, when the temperature sensor 58 detects that the temperature near the main control board 30 is higher than the first preset temperature value T1, the temperature sensor 58 sends a signal to the main control board 30, and the main control board 30 receives the signal and controls the stepping motor 55 to drive the transmission member 553 to rotate, so as to drive the heat dissipation cover 52 to slide away from the support frame 53, so that the heat dissipation hole 521 of the heat dissipation cover 52 is exposed out of the support frame 53, until the first buckle 528 of the heat dissipation cover 52 is stopped by the second buckle 5342 of the support frame 53. The cold air enters the inner cavity 231 of the housing 23 through the air inlet 201 at the bottom of the electronic device 100, and after the cold air exchanges heat with the main control board 30 and the heating elements thereon, the cold air carries heat to pass through the air outlet 222 and the air vent 531, and then is emitted from the heat dissipation hole 521.

If the external environment temperature of the electronic device 100 is decreased, the temperature of the air near the electronic device, such as the main control board 30, is decreased, that is, when the temperature sensor 58 detects that the temperature of the air near the main control board 30 is lower than or equal to the second preset temperature value T2, the temperature sensor 58 sends a signal to the main control board 30, the main control board 30 receives the signal and controls the stepping motor 55 to drive the transmission member 553 to rotate in the reverse direction, so as to drive the heat dissipation cover 52 to slide toward the support frame 53 until the heat dissipation cover 52 is accommodated in the accommodating frame 22, so that the heat dissipation hole 521 is accommodated in the accommodating frame 22, that is, the heat dissipation hole 521 is closed. At this time, dust or liquid in the external environment can be prevented from entering the inner cavity of the electronic product 100 through the heat dissipation hole 521.

In the working process of the electronic device 100, when the temperature sensor 58 detects that the temperature of the air near the main control board 30 is higher than the first preset temperature value T1, the temperature sensor 58 sends a signal to the main control board 30, and the main control board 30 receives the signal and controls the stepping motor 55 to drive the transmission member 553 to rotate, so as to drive the heat dissipation cover 52 to slide away from the support frame 53, so that the heat dissipation holes 521 of the heat dissipation cover 52 are exposed out of the support frame 53; when the temperature sensor 58 detects that the temperature of the air near the main control board 30 is lower than or equal to the second preset temperature value T2, the temperature sensor 58 sends a signal to the main control board 30, and the main control board 30 receives the signal and controls the stepping motor 55 to drive the transmission member 553 to rotate in the reverse direction, so as to drive the heat dissipation cover 52 to slide close to the support frame 53 until the heat dissipation cover 52 is accommodated in the accommodating frame 22, so that the heat dissipation hole 521 is accommodated in the accommodating frame 22 and closed. Therefore, the heat dissipation device 50 of the present application can not only effectively dissipate heat to the motherboard 30 and the electronic devices thereon, but also reduce the probability of dust or liquid from the external environment entering the electronic device 100.

In other embodiments, the base 25 in the first embodiment may be replaced by the heat dissipation device 50, and the heat dissipation devices 50 are respectively disposed at two opposite ends of the housing 20, that is, the heat dissipation devices 50 are respectively disposed at the top end and the bottom end of the housing 20. Specifically, two opposite ends of the housing 20 are respectively provided with a receiving frame 22, a supporting frame 53 is disposed in each receiving frame 22, a heat dissipating cover 52 is slidably connected to the supporting frame 53, and the heat dissipating cover 52 slides relative to the supporting frame 53 by being driven by a transmission member 553 electrically connected to the main control board. When the temperature sensor 58 detects that the temperature of the air near the main control board 30 is higher than the first preset temperature value T1, the temperature sensor 58 sends a signal to the main control board 30, and the main control board 30 receives the signal and controls the stepping motors 55 of the two heat dissipation devices 50 to respectively drive the transmission members 553 to rotate, so as to drive the two heat dissipation covers 52 to respectively slide away from the corresponding support frames 53, so that the heat dissipation holes 521 of the two heat dissipation covers 52 are respectively exposed out of the corresponding support frames 53, thereby facilitating convection heat dissipation; when the temperature sensor 58 detects that the temperature of the air near the main control board 30 is lower than or equal to the second preset temperature value T2, the temperature sensor 58 sends a signal to the main control board 30, and the main control board 30 receives the signal and controls the two stepping motors 55 to respectively drive the transmission members 553 to rotate in opposite directions, so as to drive the two heat dissipation covers 52 to respectively slide toward the corresponding support frames 53 until the two heat dissipation covers 52 are respectively accommodated in the corresponding accommodating frames 22, so that the heat dissipation holes 521 on the two heat dissipation covers 52 are both accommodated in the corresponding accommodating frames 22 and closed. Therefore, the heat dissipation devices 50 are respectively disposed at the two opposite ends of the housing 20, so that heat can be effectively dissipated from the main board 30 and the electronic devices thereon, and the probability of dust or liquid in the external environment entering the electronic device 100 can be further reduced.

In other embodiments, two opposite ends of the housing 20 are respectively provided with one receiving frame 22, each receiving frame 22 is provided with a supporting frame 53, the supporting frame 53 is slidably connected with a heat dissipating cover 52, the two heat dissipating covers 52 are respectively screwed to two opposite ends of a bidirectional screw rod, the bidirectional screw rod is driven by a driving member to rotate, so that the two heat dissipating covers 52 synchronously extend out of the corresponding receiving frames 22 or are synchronously received in the corresponding receiving frames 22. During use, when the temperature sensor 58 detects that the temperature of the air near the main control board 30 is higher than the first preset temperature value T1, the temperature sensor 58 sends a signal to the main control board 30, the main control board 30 receives the signal and controls the driving piece to drive the bidirectional screw rod to rotate so as to synchronously drive the two heat dissipation covers 52 to respectively slide away from the corresponding support frames 53, so that the heat dissipation holes 521 of the two heat dissipation covers 52 are synchronously exposed out of the corresponding support frames 53, and convection heat dissipation is facilitated. When the temperature sensor 58 detects that the temperature near the main control board 30 is lower than or equal to the second preset temperature value T2, the temperature sensor 58 sends a signal to the main control board 30, the main control board 30 receives the signal and controls the driving member to drive the bidirectional screw rod to rotate in the opposite direction, so as to synchronously drive the two heat dissipation covers 52 to respectively slide close to the corresponding support frames 53 until the two heat dissipation covers 52 are synchronously accommodated in the corresponding accommodating frames 22, so that the heat dissipation holes 521 on the two heat dissipation covers 52 are both accommodated in the corresponding accommodating frames 22 and closed. Therefore, in this embodiment, a driving member drives a bidirectional screw rod to rotate, so that the heat dissipation covers 52 at the two opposite ends of the housing 20 synchronously extend to the corresponding accommodating frames 22 or contract to the corresponding accommodating frames 22, thereby not only effectively dissipating heat for the motherboard 30 and the electronic devices thereon, but also further reducing the probability that dust or liquid in the external environment enters the electronic device 100, and also saving a driving member and reducing the manufacturing cost.

Preferably, a waterproof structure is provided between the receiving frame 22 and the corresponding heat sink 50. Specifically, a waterproof structure is disposed between the heat dissipation cover 52 and the corresponding receiving frame 22, for example, a sealing ring is disposed between the heat dissipation cover 52 and the receiving frame 22. When the heat dissipation cover 52 is accommodated in the accommodating frame 22, the heat dissipation cover 52 is hermetically connected with the accommodating frame 22 through the sealing ring, so as to prevent dust or liquid from entering the housing 20 from a gap between the heat dissipation cover 52 and the accommodating frame 22.

Referring to fig. 22-25, the electronic device 100a in the second embodiment of the present application is similar to the first embodiment, except that: the structure of the housing 20a and the structure of the drive mechanism 55a in the second embodiment are slightly different from those in the first embodiment. Specifically, the method comprises the following steps: the housing 20a includes a cylindrical housing 23a, circular receiving frames 22a are respectively disposed at two opposite ends of the housing 23a, and a supporting frame (not shown) and a heat dissipating cover 52a slidably connected to each supporting frame are respectively disposed in the two receiving frames 22 a. Each heat dissipation cover 52a includes a circular cover plate 522a and a peripheral wall 524a surrounding the cover plate 522, and the peripheral wall 524a is provided with a plurality of heat dissipation holes 521 along the circumferential direction thereof. The peripheral wall 524a is slidably connected to the inner peripheral surface of the housing frame 22 a. When each heat dissipation cover 52a slides relative to the corresponding support frame and extends out of the receiving frame 22a, the heat dissipation holes 521 are exposed to communicate with the inner cavity of the housing 23 a. Be equipped with a plurality of ports 236 and through-hole 237 on the periphery wall of casing 23a, a plurality of ports 236 are just right respectively the connector interface of the main control board in casing 23a, through-hole 237 is just right the charging power source interface of main control board. The housing 20a further includes a shielding cylinder 203 rotatably disposed outside the casing 23a, and the shielding cylinder 203 can cover the plurality of through holes 236 and the through holes 237 when rotating relative to the casing 23a, so as to prevent dust or liquid in the external environment from entering the inner cavity of the housing 20a through the through holes 236 and the through holes 237.

The driving mechanism 55a includes a driving member 551a and a transmission member 553a connected to the driving member 551a, opposite ends of the transmission member 553a are respectively connected to the heat dissipation covers 52a at two ends of the housing 23a, and the shielding cylinder 203 is connected to the transmission member 553 a. The driving member 551a drives the two heat dissipating covers 52a to synchronously extend out of the two receiving frames 22a through the transmission member 553a, so that the heat dissipating holes 521 of the two heat dissipating covers 52a are exposed and opened, and meanwhile, the transmission member 553a drives the shielding cylinder 203 to rotate relative to the housing 23a to expose the through hole 236 and the through hole 237, so as to conveniently charge the rechargeable battery inside the electronic device 100a through the charging power interface and/or use the connector interface. The driving member 551a drives the two heat dissipating covers 52a to synchronously retract into the two receiving frames 22a through the transmission member 553a, so that the heat dissipating holes 521 of the two heat dissipating covers 52a are collected and closed, and meanwhile, the transmission member 553a drives the shielding cylinder 203 to reversely rotate relative to the housing 23a to cover the through hole 236 and the through hole 237. In this embodiment, the driving member 551a is a motor electrically connected to the main control board, the driving member 553a is a bidirectional screw rod, the external threads at the two opposite ends of the bidirectional screw rod are respectively screwed to the internal threads of the connecting cylinders 525 of the two heat dissipation covers 52a, and the motor is connected to the middle of the bidirectional screw rod and drives the bidirectional screw rod to rotate.

When the electronic device 100a is not used, the heat dissipation covers 52a at the two opposite ends of the housing 23a are respectively accommodated in the two accommodating frames 22a, the heat dissipation holes 521 of each heat dissipation cover 52a are accommodated and closed, and the shielding cylinder 203 covers the plurality of through holes 236 and the through holes 237. At this time, the outer surface of the electronic device 100a is in a non-open state, and dust or liquid in the external environment cannot enter the inner cavity of the electronic device 100 a.

In the working process of the electronic device 100a, when the temperature sensor detects that the temperature of the air near the main control board 30 is higher than the first preset temperature value T1, the temperature sensor sends a signal to the main control board 30, the main control board 30 receives the signal and controls the driving member 551a to drive the transmission member 553a to rotate, so as to drive the heat dissipation covers 52a at the two ends of the housing 23a to synchronously slide away from the corresponding accommodating frames 22a, such that the heat dissipation holes 521 of each heat dissipation cover 52a are exposed out of the corresponding accommodating frame 22a, and at the same time, the transmission member 553a drives the shielding cylinder 203 to rotate relative to the housing 23a, such that the through hole 236 and the through hole 237 are exposed. When the temperature sensor detects that the temperature near the main control board 30 is lower than or equal to the second preset temperature value T2, the temperature sensor sends a signal to the main control board 30, the main control board 30 receives the signal and controls the driving member 551a to drive the transmission member 553a to rotate in reverse, so as to drive the two heat dissipation covers 52a to slide towards the corresponding accommodating frames 22 synchronously, so that the two heat dissipation covers 52a contract into the two accommodating frames 22a synchronously, so as to store and close the heat dissipation holes 521 of the two heat dissipation covers 52a, and at the same time, the transmission member 553a drives the shielding cylinder 203 to rotate in reverse relative to the housing 23a to cover the through hole 236 and the through hole 237.

Optionally, at least one guide post 526 and/or at least one sliding post 527 is disposed between each heat dissipating cover 52a and the receiving frame 22a along the sliding direction of the heat dissipating cover 52 a.

In other embodiments, the shielding cylinder 203 may not be connected to the transmission member 553a, that is, the rotation of the transmission member 553a does not rotate the shielding cylinder 203 relative to the housing 23 a. The shielding cylinder 203 is rotated relative to the housing 23a by a manual method, and when a user needs to use a connector interface and/or a charging power interface of the electronic device 100a, the shielding cylinder 203 is manually rotated until the through hole 236 and the through hole 237 are exposed. When the user does not need to use the connector interface and/or the charging power interface of the electronic device 100a, the shielding cylinder 203 is manually rotated in the reverse direction until the shielding cylinder 203 covers the through hole 236 and the through hole 237.

In other embodiments, the supporting frame 53 may be omitted, the heat dissipating cover is directly slidably connected to the receiving frame, and a stopping mechanism is disposed between the heat dissipating cover and the receiving frame, and is used for stopping the heat dissipating cover from being separated from the receiving frame. In the electronic device in this embodiment, the supporting frame 53 is omitted, so that the manufacturing cost is reduced, the supporting frame 53 is omitted from occupying the inner space of the housing, and the layout of other elements is facilitated.

The foregoing is an implementation of the embodiments of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the embodiments of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.

Claims

1. A heat dissipation device is used for dissipating heat of electronic equipment and is characterized by comprising a heat dissipation mechanism and a driving mechanism, wherein the heat dissipation mechanism is installed on the electronic equipment and comprises a heat dissipation cover connected to the electronic equipment in a sliding mode, the heat dissipation cover is provided with a plurality of heat dissipation holes communicated with an inner cavity of the electronic equipment, and the driving mechanism drives the heat dissipation cover to extend out of a shell of the electronic equipment completely or partially so that the heat dissipation holes are exposed completely and are in a completely open state or partially and are in a partially open state; the driving mechanism drives the heat dissipation cover to be capable of being fully or partially retracted into the shell of the electronic equipment, so that the heat dissipation hole is fully stored in the shell to be in a fully closed state or partially stored in the shell to be in a partially closed state.

2. The heat dissipating device of claim 1, wherein the heat dissipating mechanism further comprises a supporting frame, the heat dissipating cover is connected to the housing of the electronic device through the supporting frame, and the driving mechanism drives the heat dissipating cover to slide relative to the supporting frame.

3. The heat dissipation device of claim 2, wherein the support frame has a vent hole communicating with the inner cavity of the electronic device, the support frame is fixed in the housing of the electronic device, the heat dissipation cover is slidably connected to the support frame, and the driving mechanism can drive the heat dissipation cover to slide away from the support frame until the vent hole is communicated with the air flow channel; the driving mechanism can also drive the heat dissipation cover to slide to the position close to the support frame and close to the air flow channel between the heat dissipation hole and the ventilation hole.

4. The heat dissipating device of claim 3, wherein the heat dissipating cover and the supporting frame are slidably sleeved with each other, the heat dissipating cover includes a cover plate and a first peripheral wall surrounding the cover plate, and a plurality of heat dissipating holes are formed in the first peripheral wall; the supporting frame comprises a second peripheral wall, the first peripheral wall and the second peripheral wall are sleeved in a sliding mode, the first peripheral wall and the second peripheral wall slide to be staggered mutually to enable the airflow channel to be opened, and the first peripheral wall and the second peripheral wall slide to be stacked mutually to enable the airflow channel to be closed.

5. The heat dissipating device of claim 4, wherein a plurality of heat dissipating holes are uniformly arranged on the first peripheral wall along the circumferential direction of the cover plate.

6. The heat dissipating device of claim 4, wherein the supporting frame further comprises a connecting plate, the second peripheral wall is disposed around the connecting plate, the vent hole is disposed on the connecting plate, and a stopping mechanism is disposed between the first peripheral wall and the second peripheral wall and used for stopping the heat dissipating cover from separating from the supporting frame.

7. The heat dissipating device of claim 6, wherein the stopping mechanism comprises a first latch disposed on a side of the first peripheral wall away from the cover plate and a second latch disposed on a side of the second peripheral wall away from the connecting plate, and the first latch and the second latch are latched to each other to prevent the heat dissipating cover from being separated from the supporting frame.

8. The heat dissipating device of claim 2, wherein the driving mechanism comprises a driving member and a transmission member connected to the driving member, the transmission member is connected to the driving member and the heat dissipating cover, and the driving member drives the transmission member to drive the heat dissipating cover to slide relative to the supporting frame.

9. The heat dissipating device of claim 8, wherein the driving member has an external thread, the heat dissipating cover has an internal thread hole screwed to the external thread, and the driving member drives the driving member to rotate so as to slide the heat dissipating cover relative to the supporting frame.

10. The heat dissipating device as claimed in claim 8, wherein the heat dissipating cap is provided with a plurality of guide posts each extending along a sliding direction of the heat dissipating cap, and the support frame is provided with a plurality of guide holes, and a plurality of the guide posts are slidably inserted into the plurality of guide holes, respectively.

11. The heat dissipating device as claimed in claim 10, wherein each of the guiding posts is sleeved with an elastic supporting member, one end of the supporting member elastically supports against the heat dissipating cover, and the other end of the supporting member elastically supports against the supporting frame.

12. The heat dissipation device as claimed in claim 8, wherein the driving member is fixed to the support frame, the driving member is a stepping motor electrically connected to a main control board of the electronic device, and the stepping motor is fixed to the support frame.

13. The heat dissipating device of claim 12, wherein a conductive sheet is disposed on an outer peripheral surface of the stepping motor, and when the heat dissipating device is connected to the electronic device, the conductive sheet is electrically connected to the main control board.

14. The heat dissipating device as claimed in claim 13, wherein a positioning box is disposed on a side of the supporting frame facing away from the heat dissipating cover, the driving member is fixed in the positioning box, the positioning box has an opening corresponding to the conductive sheet, and the conductive sheet passes through the opening and is connected to the main control board.

15. The heat dissipation device of claim 12, further comprising a temperature sensor electrically connected to the main control board, wherein a first preset temperature value is preset in the main control board, and when the temperature detected by the temperature sensor is higher than the first preset temperature value, the temperature sensor sends a signal to the main control board, and the main control board receives the signal and controls the stepping motor to drive the transmission member to drive the heat dissipation cover to move away from the support frame.

16. The heat dissipation device of claim 15, wherein the main control board further has a second preset temperature value, and when the temperature detected by the temperature sensor is lower than or equal to the second preset temperature value, the temperature sensor sends a signal to the main control board, and the main control board receives the signal and controls the stepping motor to drive the transmission member to drive the heat dissipation cover to approach the support frame.

17. An electronic device, comprising a housing, a main control board disposed in the housing, and the heat dissipation apparatus according to any one of claims 1 to 16, wherein at least one end of the housing is provided with a receiving frame, the heat dissipation apparatus is received in the receiving frame, and a driving mechanism of the heat dissipation apparatus drives a heat dissipation cover of the heat dissipation apparatus to extend out of or retract into the housing, so as to open or close a heat dissipation hole on the heat dissipation cover.

18. The electronic device according to claim 17, wherein the housing frames are respectively disposed at two opposite ends of the housing, each housing frame is connected to a heat dissipation cover, and the driving mechanism drives the two heat dissipation covers to synchronously extend out of the two housing frames or to be synchronously housed in the corresponding housing frames.

19. The electronic device of claim 17, wherein the housing further comprises a housing and a shielding cylinder rotatably disposed outside the housing, wherein a plurality of through openings are disposed on an outer peripheral wall of the housing, and the shielding cylinder rotates relative to the housing to cover the plurality of through openings.